^ M369541 五、新型說明： 【新型所屬之技術領域】 一種應用白努利 差’而能對於光 本創作是關於一種载台裝置，尤指 (Bernoulli)原理，可以噴出氣體形成壓 電半導體薄片形工件進行吸附之載台裝置 【先前技術】 • 在電子產業或光學產業中，對於光電半導體薄片形工 件進行姓刻作業，是將光電半導體薄片形工件置放於旋塗 機之載台裝置上進行旋轉，並於上方喷麗敍刻液，而可藉 由旋轉離心力，使银刻液能以離心力向外流動而均佈於光 電半導體薄片形工件表面進行蝕刻作業。 上述旋塗機之載台裝置中設置吸氣定位件，該吸氣定 位件外接吸氣裝置，而可於操作使用上，藉由吸氣裝置所 提供的吸力吸附定位待蝕刻之光電半導體薄片形工件，使 _ 該光電半導體薄片形工件能穩定旋轉，而讓钱刻液能向外 、流動進行塗佈，其利用吸氣裝置作用，使吸氣定位件能吸 -附光電半導體薄片形工件，然而，當光電半導體薄片形工 件製造而產生裂痕時，會造成光電半導體薄片形工件上之 蝕刻液滲入而被吸進吸氣裝置中，導致吸氣裝置管路腐蝕 受損。 另外，旋塗機之操作使用，必需將待蝕刻之光電半導 體薄片形工件對正中心的置放於旋塗機之載台裝置上，才 能使旋塗機之心軸能穩定旋轉，如果待蝕刻之光電半導體 3 M369541 薄片形工件置放，沒有完成精確對位，即易造成心轴於旋 轉時產生晃動，而容易造成心軸損壞，因此，習知技術之 載台裝置，仍未儘理想而確有加以改良之必要。 【新型内容】 本創作設計目的在於，提供一種「載台裝置」，其係 - 以喷氣方式形成壓差，而能吸附定位光電半導體薄片形工 • 件以避免對於羌電半導體薄片形工件進行餘刻的姓刻液 鲁 被吸入載台裝置中，造成内部管路腐被受損。 為達成上述目的之結構特徵及技術内容，本創作「載 台裝置」包括： 一載座，該載座包含一作用面位於頂部，該載座於作 用面處形成一錐形狀的容置槽，該容置槽包含位於作用面 處形成擴大開口，以及相對於該擴大開口端形成縮小部， 於該縮小部處設置一喷氣道與外界連通； 數個支持塊，其分佈設置於上述容置槽面； 籲' 一噴頭’其包含一平面及位於該平®周圍的錐面，該 噴頭設置於上述容置槽中’係以錐面定位於上述數個支持 塊項端，使平面位於上述載座作用面下側而形成一高度 差’而在該錐面與容置槽面之間形成氣流通道； 數個抵壓塊’該數個抵壓塊形成水滴形柱桿狀，該數 個抵壓塊一端設置於上述載座之作用面周緣，且該數個水 滴形柱桿狀的抵壓塊周圍一側形成寬弧面，該寬弧面係面 向於上述載座之作用面中間處。 藉此設計’可將氣體由載座之喷頭處由氣流通道朝周 4 M369541 圍傾斜向外喷出Μ吏光電半導體薄片形工件能與載座作用 面之間形成負壓，而與周圍空氣壓形成壓差，使光電半導 體薄片形工件能向下引動，且令光電半導體薄片形工件周 緣能抵壓於該載座作用面所設置之數個抵壓塊頂面，而能 穩定的吸附住光電半導體薄片形工件。 此 且由於該數個抵壓塊形成水滴形柱桿狀，使喷出之氣 流流經該數個抵壓塊時能流暢的通過，以避免壓差遭到破 壞，故能穩定吸附定位光電半導體薄片形工件。 以及喷出之氣流，能使成型蝕刻光電半導體薄片形工 件之钱刻液不會吸入載台袭置中，而能避免載台裝 遭到蝕刻液侵蝕破壞。 【實施方式】^ M369541 V. New description: [New technical field] A kind of application of Bainuoli's can be used for a light-based creation of a stage device, especially the Bernoulli principle, which can eject gas to form a piezoelectric semiconductor sheet. A stage device for adsorbing workpieces [Prior Art] • In the electronics industry or the optical industry, the electro-semiconductor sheet-shaped workpiece is placed on the stage device of the spin coater for the electro-semiconductor sheet-shaped workpiece. Rotating and spraying the engraving liquid on the upper side, and by rotating the centrifugal force, the silver engraving liquid can flow outward by centrifugal force to be evenly distributed on the surface of the optoelectronic semiconductor sheet-shaped workpiece for etching. The suction device of the spin coater is provided with an air suction positioning member, and the air suction positioning member is externally connected to the air suction device, and can be used for absorbing and absorbing the shape of the photoelectric semiconductor sheet to be etched by the suction force provided by the air suction device. The workpiece enables the photoelectric semiconductor sheet-shaped workpiece to stably rotate, and allows the money engraving liquid to be coated outwardly and flowingly, and the suction positioning device can absorb and attach the photoelectric semiconductor sheet-shaped workpiece by using the suction device. However, when the photo-semiconductor sheet-shaped workpiece is manufactured to cause cracks, the etching liquid on the photo-semiconductor-like sheet-shaped workpiece is infiltrated and sucked into the getter device, resulting in corrosion of the suction device piping. In addition, in the operation of the spin coater, it is necessary to place the photoelectric semiconductor sheet-shaped workpiece to be etched on the center of the spin coater, so that the spinner of the spin coater can be stably rotated if it is to be etched. Photoelectric semiconductor 3 M369541 The sheet-shaped workpiece is placed without precise alignment, which is easy to cause the spindle to shake when rotating, which is easy to cause the spindle to be damaged. Therefore, the conventional stage device is still not ideal. There is indeed a need to improve. [New content] The purpose of this creation is to provide a "stage device" which is capable of forming a pressure difference by means of a jet method, and capable of adsorbing and positioning an optoelectronic semiconductor sheet-shaped workpiece to avoid a surplus of a semiconductor wafer-shaped workpiece. The engraved name of the engraved liquid was sucked into the stage device, causing damage to the internal pipe rot. In order to achieve the structural features and technical contents of the above-mentioned purposes, the "stage device" of the present invention comprises: a carrier having an active surface at the top, the carrier forming a tapered shaped receiving groove at the active surface, The accommodating groove includes an enlarged opening at the working surface, and a narrowing portion is formed with respect to the enlarged opening end, and a jet channel is disposed at the narrowing portion to communicate with the outside; a plurality of supporting blocks are disposed in the accommodating groove a nozzle having a plane and a tapered surface located around the flat®, the nozzle being disposed in the accommodating groove ′ is positioned at a tapered surface on the end of the plurality of support blocks, such that the plane is located Forming a height difference ′ on the lower side of the seating surface and forming an air flow passage between the tapered surface and the accommodating groove surface; and the plurality of pressing blocks forming the drop-shaped column shape, the plurality of One end of the pressing block is disposed on a periphery of the active surface of the carrier, and a side of the plurality of drop-shaped column-shaped pressing blocks forms a wide curved surface, and the wide curved surface faces the middle of the working surface of the carrier. By this design, the gas can be ejected from the nozzle of the carrier by the airflow channel toward the periphery of the M369541. The photoelectric semiconductor chip-shaped workpiece can form a negative pressure between the workpiece and the carrier surface, and the surrounding air is formed. The air pressure forms a pressure difference, so that the photoelectric semiconductor sheet-shaped workpiece can be pulsed downward, and the periphery of the photoelectric semiconductor sheet-shaped workpiece can be pressed against the top surface of the plurality of pressing blocks provided on the working surface of the carrier, and can be stably adsorbed. Photoelectric semiconductor sheet-shaped workpiece. Therefore, since the plurality of pressing blocks form a drop-shaped column shape, the jetted airflow can smoothly pass through the plurality of pressing blocks, so as to prevent the pressure difference from being damaged, thereby stably adsorbing and positioning the photoelectric semiconductor. Sheet-shaped workpiece. And the ejected airflow can prevent the money engraving of the etched optoelectronic semiconductor sheet-shaped workpiece from being inhaled into the stage, and can prevent the stage assembly from being eroded by the etching solution. [Embodiment]
本創作設計，是在載座作 可傾斜朝向周圍噴氣，使光電 用面之間形成壓差狀態，藉此 件穩定的吸附定位在載座上， 件進行後續加工處理作業。 用面上設置一噴頭，該噴頭 半導體薄片％1#與载座作 ，能使光電半導體薄片形工 以方便光電半導體薄片形工 配合參看第-圖、第二圖及第三圖所示，本創作「載 台裝置」包括-載座(10)、一喷頭⑽及數個設置於載座 (10)上之抵壓塊（15)，該喷頭（20)可傾斜朝外喷出 產生壓S ’使其形成白努力（Ber_lu)吸附手段，、而能 對於光電半導體薄片形工件產生吸附定位，其中： 該載座（10)包含一作用面⑴），該作用面⑴）位於該 載座（1G)頂端，並㈣作用面（⑴處形成—錐形狀的容置 M369541 槽（12)’該容置槽（12)包含位於作用面處形成擴大開 口（121)，以及相對於該擴大開口（121)端形成縮小部 (122)，並於該縮小部（122)處設置一喷氣道（13)與外界連 通。 配合參看第二圖及第三圖所示，上述載座（1〇)作用面 (11)為矩形狀，於圖式之較佳實施例係顯示為正方形狀， ' 而在作用面（11)上所設置的容置槽（12)中心部位是位於該 * 作用面（11)中心處，使容置槽（12)的擴大開口（121)至正方 • 形狀的作用面（11)各側邊為相等距離。 本創作之載台裝置尚包含數個支持塊（23)，該數個支 持塊（23)—端設置於上述噴頭（20)之錐面（22)上。 該噴頭（20)包含一平面（21)及位於該平面（21)周圍的 錐面（22)，該喷頭（20)設置於上述容置槽（12)中，係以錐 面（22)定位於上述數個支持塊（23)頂端，使平面（21)位於 上述載座（10)作用面（11)下侧而形成一數微米高度差，而 在該錐面（22)與容置槽（12)面之間形成氣流通道（14)。 上述喷頭（20)之平面（21)為圓形狀，其與周圍錐面（22) 形成圓錐狀錐體結構。 該數個抵壓塊（15)係形成水滴形柱桿狀，該數個抵壓 塊（15)—端設置於上述載座（1〇)之作用面（11)周緣，且該 數個水滴形柱桿狀的抵壓塊（15)周圍一側形成寬弧面 (151)，該寬弧面（15)係面向於上述載座（10)之作用面（11) 中間處。 所述之數個支持塊（23)係形成水滴形柱桿狀，且該數 個支持塊（23)周圍一侧形成寬弧面’該寬弧面係面向於噴 6 M369541 氣道（13)。 配合參看第四圖所示，該載台裝置之操作使用，是將 载座（10)之噴氣道（13)與外界喷氣裝置相連接，並於載座 (10)上方置放薄片形的光電半導體薄片形卫件（3Q)，而藉 由喷軋裝置所噴出的氣體喷入噴氣道(13)中，且經由連通 的氣Μ通道（14)朝載座（丨〇)作用面（丨丨）與光電半導體薄片 -形工件（3 0)之間朝四面八方向外喷出，使光電半導體薄片 •形工件（30)可因麼差而向下引動，而讓光電半導體薄片形 •工件（30)周緣下侧可抵於抵壓塊（15)頂面完成光電半導體 薄片形工件（3〇)吸附定位操作。 由於載座（10)作用面（11)周緣所設置之數個抵壓塊 (15)係形成水滴形柱桿狀，且該數個抵壓塊（15)周圍一側 所形成之寬弧面（151)係迎向氣流通道（14)，藉此能使噴 出之氣體經由寬弧面（151)後，能同時沿著寬弧面（151)兩 側流至抵壓塊（15)末端而順暢的接續流出，亦即，本創作 设汁能符合流體力學原理，使氣流能順暢的流過抵壓塊 > (15)，以確保流經該處之氣流不會產生亂流牵引，而抵減 了壓差作用，故本創作設計，可達到穩定吸附定位光電半 導體薄片形工件（30)之實用功效。 配合參看第五圖所示，其係本創作又一形式載座（丨〇) 及噴頭（20)外觀示意圖，該載座（1〇)作用面（丨丨）及噴頭（2〇) 平面（21)係形成矩形狀，於圖式之較佳實施例中係顯示為 長方形狀，即噴頭（20)形成長方形的角錐形狀，並於該長 方形狀的作用面（11)處形成一長方形角錐狀的容置槽 (12)’該角錐狀的容置槽（12)亦包含位於作用面（u)處形 ^ M369541 成擴大開口，以及相對於該擴大開口端形成縮小部， 1 琢縮 小部位於容置槽（12)中心部位，並於該縮小部處設置—嘴 氣道（13)與外界連通’該長方形的角錐體之噴頭（2〇)設置 於該長方形的容置槽（12)中，於該喷頭（2〇)之錐面（22)與 容置槽（12)面之間形成氣流通道（14)。 第五圖所示之作用面（u)上所設置的容置槽（12)中心The design of the design is that the carrier can be tilted toward the surrounding air jet to form a pressure difference between the photovoltaic surfaces, and the stable adsorption is positioned on the carrier, and the workpiece is subjected to subsequent processing operations. A nozzle is arranged on the surface, and the semiconductor wafer %1# of the nozzle is used as a carrier to enable the photoelectric semiconductor sheet to be shaped to facilitate the cooperation of the photoelectric semiconductor sheet. Referring to the first, second and third figures, The "stage device" is composed of a carrier (10), a nozzle (10) and a plurality of pressing blocks (15) disposed on the carrier (10). The nozzle (20) can be ejected obliquely outward. The pressure S' is such that it forms a white-strength (Ber_lu) adsorption means, and can generate adsorption positioning for the photoelectric semiconductor sheet-shaped workpiece, wherein: the carrier (10) comprises an active surface (1)), the active surface (1) is located at the load a (1) top end, and (d) an active surface (formed at (1) - a tapered shaped housing M369541 slot (12) 'the receiving recess (12) includes an enlarged opening (121) at the active surface, and relative to the enlarged The opening (121) end forms a narrowing portion (122), and a jet channel (13) is disposed at the narrowing portion (122) to communicate with the outside. Referring to the second and third figures, the carrier (1〇) The action surface (11) is rectangular, and the preferred embodiment of the figure is shown as a square shape, ' The central portion of the accommodating groove (12) provided on the active surface (11) is located at the center of the *-acting surface (11), so that the enlarged opening (121) of the accommodating groove (12) has a square shape. Each side of the surface (11) is equidistant. The stage device of the present invention further includes a plurality of support blocks (23), and the plurality of support blocks (23) are disposed at the tapered surface (22) of the nozzle (20). The nozzle (20) comprises a plane (21) and a tapered surface (22) located around the plane (21), and the nozzle (20) is disposed in the accommodating groove (12) and has a tapered surface ( 22) positioning on the top ends of the plurality of support blocks (23) such that the plane (21) is located on the lower side of the active surface (11) of the carrier (10) to form a height difference of several micrometers, and the cone surface (22) is An air flow passage (14) is formed between the faces of the receiving grooves (12). The plane (21) of the nozzle (20) has a circular shape, and forms a conical pyramid structure with the surrounding tapered surface (22). The pressing block (15) is formed in a shape of a drop-shaped column, and the plurality of pressing blocks (15) are disposed at a periphery of the working surface (11) of the carrier (1〇), and the plurality of drops are shaped like a rod of A wide arc surface (151) is formed on one side of the compact (15), and the wide curved surface (15) faces the middle of the active surface (11) of the carrier (10). The plurality of support blocks (23) ) forming a drop-shaped column shape, and a side of the plurality of support blocks (23) forms a wide curved surface. The wide curved surface faces the air jet 6 M369541 (13). Referring to the fourth figure, the The operation of the stage device is to connect the air passage (13) of the carrier (10) with the external air jet device, and place a sheet-shaped photoelectric semiconductor sheet-shaped guard member (3Q) above the carrier (10). The gas ejected by the spraying device is injected into the jet channel (13), and via the communicating gas channel (14) toward the carrier (丨丨) and the optoelectronic semiconductor sheet-shaped workpiece ( 3 0) is ejected in the direction of all directions, so that the optoelectronic semiconductor sheet-shaped workpiece (30) can be pulsed downward due to the difference, and the lower side of the periphery of the optoelectronic semiconductor sheet-shaped workpiece (30) can withstand the pressing The top surface of the block (15) completes the adsorption positioning operation of the photo-semiconductor sheet-shaped workpiece (3 〇). The plurality of pressing blocks (15) disposed on the periphery of the acting surface (11) of the carrier (10) form a drop-shaped column shape, and the wide curved surface formed on one side of the plurality of pressing blocks (15) (151) converges toward the air flow passage (14), whereby the discharged gas can pass through the wide curved surface (151) and simultaneously flow to the end of the pressing block (15) along both sides of the wide curved surface (151). Smooth continuous outflow, that is, the creation of the juice can conform to the principle of fluid mechanics, so that the airflow can smoothly flow through the pressure block > (15), to ensure that the airflow through the place does not cause turbulent traction, and The pressure difference effect is deducted, so the design of the design can achieve the practical effect of stably adsorbing and positioning the photoelectric semiconductor sheet-shaped workpiece (30). Referring to the fifth figure, it is a schematic diagram of another form of the carrier (丨〇) and the nozzle (20). The carrier (1〇) acting surface (丨丨) and the nozzle (2〇) plane ( 21) is formed into a rectangular shape, which is shown as a rectangular shape in the preferred embodiment of the drawings, that is, the shower head (20) forms a rectangular pyramid shape, and a rectangular pyramid shape is formed at the rectangular action surface (11). The accommodating groove (12)' of the pyramid-shaped accommodating groove (12) also includes an enlarged opening at the working surface (u), and a narrowing portion is formed with respect to the enlarged opening end, and the 琢 reduction portion is located The central portion of the receiving groove (12) is disposed at the narrowing portion - the mouth air passage (13) is in communication with the outside; the nozzle (2) of the rectangular pyramid is disposed in the rectangular receiving groove (12), An air flow passage (14) is formed between the tapered surface (22) of the nozzle (2) and the surface of the receiving groove (12). Center of the receiving groove (12) provided on the active surface (u) shown in the fifth figure
部位是對位於該作用面（11)中心處，使容置槽（12)之長方 形狀的擴大開口周邊至長方形狀的作用面（11)各邊為相等 距離，且該數個水滴形柱桿狀的抵壓塊（15)一端設置於上 述載座（10)之長方形的作用面（11)周緣，而當外界噴氣裝 置連接喷氣道（13)且噴氣進入氣流通道（14)後，亦可對於 噴頭（20)周圍形成負壓狀態，使光電半導體薄片形工件周 緣能被吸附定位於數個抵壓塊（15)頂面。 配合參看第六圖及第七圖所示，其係本創作另一形式 載座(1〇)及噴頭(20)外觀示意圖，該載座(1〇)作用面⑼ 係形成矩形狀，於圖式之較佳實施例顯示為長方形狀，以 及噴頭（20)平面（21)係形成圓形 體形式，並於該長方形狀的作用 狀’即喷頭（20)形成圓錐 面（11)處形成一圓錐形狀 的容置槽（12) ’該圓錐形狀的容置槽（12)至長方形狀的載 座（⑻左右二側邊與前後二端邊為不等距離，於載座（1〇) 作用面C1U鄰近左右二側邊緣分別設置—侧邊噴氣通道 (16) ’該側邊喷氣通道（丨6 )且右 .5 ^ 、叫”有一傾斜段，該傾斜段形成向外傾斜狀，且於該傾斜J5· 士 茨傾斜段末端形成喷出口（161)穿出上 述作用面（11)。 而在上述另 形式之長方形的載座（10)二側邊緣所設 8 M369541 置的抵磨塊（15)與二端邊所設置的抵麼塊（15)，與圓形喷 頭（2〇)周圍之氣流通道（14)係呈不等距離，而由該載座⑽ 作用面（）左右一側邊緣所設置之側邊喷氣通道（16 )喷出 之虱流’可對位於薄片形的光電半導體薄片形工件(3〇)二 側邊使噴灑於光電半導體薄片形工件⑽上的液體如蝕 刻液於机向一侧邊時，仍可以二側邊喷氣通道（⑻之喷出 (161)所噴出的氣流加以帶開，此時二側邊噴氣通道(Μ) -之喷出口（161)所噴出的氣流，即如風刀-般可以刮掉流 #肖光電半導體薄片形工件⑽二側邊之液體，而可以彌補 長方形的作用面⑴）二側邊與圓形喷頭⑽周圍氣流通道 (⑷形成較遠距離’如此亦可使㈣液不會進人氣流通道 (14)，而能保持載台裝置内部不受蝕刻液之侵蝕破壞。 ^因此，經由上述結構特徵、技術内容及操作使用上之 詳細說明，可清楚看出本創作設計特點在於： 提供一種「載台裝置」，其係於載座的作用面處設置 -錐形的容置槽，並於其中設置—錐形的噴頭，使喷頭周 籲.目與容置槽面間形成氣流通道，並於容置槽中心位置設置 連通外界的噴氣道，且於載座作用面周緣設置數個水滴 形柱桿狀之抵壓塊，該數個水滴形柱桿狀的抵塵塊周圍一 側形成寬弧面，該寬弧面係面向於上述吸嘴座之作用面中 間處，而當外界喷氣裝置所噴出之氣體由喷氣道嘴入載座 中，且經由氣流通道而由喷頭周圍傾斜向外噴出時，能使 置放在載座上方的光電半導體薄片形工件與載座作用面間 :成負壓狀態，藉此形成壓差’使光電半導體薄片形工件 貪b向下引動且周緣抵於抵壓塊頂面而吸附住該光電半導體 M369541 薄片形工件。 、 本幻作在載座作用面周緣所設置之數個抵壓 鬼係开/成水滴形柱桿狀’且於周圍一侧形成寬弧面，該 面迎向喷出氣流’使喷出之氣流流經該數個抵壓塊時 仍能保持流暢通過，以避免噴出之氣流的壓差作用，於流 該數個抵μ塊時遭到破壞，故本創作設計可達到穩定吸 附光電半導體薄片形工件之實用功效。 、且由於本創作疋以噴出氣流、开^成壓差，而能對於光 電半導體薄片形工件進行定位吸附，使光電半導體薄片形 工件能定位於載台裝置上’故於喷灑蝕刻液進行表面蝕刻 作業時，即使钱刻液流向光電半導體薄片形工件周緣，亦 可X噴出之氣體將其向外帶開，而不會被吸入載台裝置 中，亦即，本創作為喷出氣流形式，而有別於習用吸盤吸 氣定位形式，故能避免載台裝置内部遭到蝕刻液侵蝕破 壞。 【圖式簡單說明】 第一圖：本創作外觀示意圖。 第二圖：本創作仰視圖。 第三圖：本創作剖視圖。 第四圖：本創作吸附光電半導體薄片形工件之實施例 示意圖。 . 第五圖：本創作又一形式外觀示意圖。 第六圖：本創作另一形式外觀示意圖。 第七圖：本創作另一形式吸附光電半導體薄片形工件 10 M369541 之實施例示意圖。The portion is located at the center of the active surface (11) such that the circumference of the rectangular enlarged opening of the receiving groove (12) is equal to each side of the rectangular acting surface (11), and the plurality of drop-shaped columns One end of the pressing block (15) is disposed at a periphery of the rectangular action surface (11) of the carrier (10), and when the external air jet device is connected to the air passage (13) and the air jet enters the air flow passage (14), A negative pressure state is formed around the shower head (20) so that the periphery of the optoelectronic semiconductor sheet-shaped workpiece can be adsorbed and positioned on the top surfaces of the plurality of pressing blocks (15). Referring to the sixth and seventh figures, it is a schematic view showing the appearance of another type of carrier (1〇) and the nozzle (20), and the working surface (9) of the carrier (9) is formed into a rectangular shape. The preferred embodiment of the embodiment is shown in the form of a rectangle, and the plane (21) of the showerhead (20) is formed into a circular body form, and is formed at the shape of the rectangular shape, that is, the nozzle (20) forms a conical surface (11). a conical shaped receiving groove (12) 'the conical shaped receiving groove (12) to the rectangular carrier ((8) left and right sides and the front and rear two ends are unequal distance, in the carrier (1〇) The action surface C1U is respectively disposed adjacent to the left and right side edges - the side air passage (16) 'the side air passage (丨6) and the right .5^, ???" has an inclined section, the inclined section is formed to be inclined outward, and A discharge port (161) is formed at the end of the inclined J5·Szcz section to pass through the action surface (11). On the other side of the rectangular carrier (10), 8 M369541 is provided. (15) The abutment block (15) provided with the two end edges, and the air flow passage (14) around the circular nozzle (2〇) At unequal distances, the turbulent flow ejected from the side jet passages (16) provided by the left and right edges of the acting surface (10) of the carrier (10) can be placed on the sheet-shaped optoelectronic semiconductor sheet-shaped workpiece (3〇) When the liquids sprayed on the optoelectronic semiconductor sheet-shaped workpiece (10), such as the etching liquid, are on one side, the air flow from the two side jet passages ((8) is ejected (161). At the time of the two side jet passages (Μ) - the air flow ejected from the discharge port (161), that is, the air knife can scrape off the liquid on the two sides of the flow-shaped workpiece (10), and can make up the rectangular shape. The working surface (1)) and the air flow passage around the circular spray head (10) (the distance formed by (4) is such that the liquid can not enter the air flow passage (14), and the inside of the stage device can be kept free from the etching liquid. Erosion damage. ^ Therefore, through the above detailed description of the structural features, technical content and operation, it can be clearly seen that the design of the creation is characterized by: Providing a "stage device" which is disposed at the active surface of the carrier - a tapered receiving groove, and The middle-conical nozzle is arranged to form an air flow passage between the nozzle and the receiving groove surface, and a jet channel connecting the outside is arranged at the center of the receiving groove, and a plurality of water droplets are arranged on the periphery of the bearing surface. a rod-shaped pressing block, the side of the plurality of teardrop-shaped rod-shaped dust-removing blocks forming a wide arc surface facing the middle of the action surface of the nozzle holder, and when the outside is jetted When the gas ejected by the device enters the carrier from the nozzle of the nozzle and is ejected obliquely from the periphery of the nozzle via the air passage, it can be placed between the optoelectronic semiconductor sheet-shaped workpiece above the carrier and the acting surface of the carrier: In a negative pressure state, a pressure difference is formed thereby causing the photo-semiconductor sheet-shaped workpiece to be pulled downward and the periphery abutting against the top surface of the resisting block to adsorb the photo-electric semiconductor M369541 sheet-shaped workpiece. The illusion is set on the periphery of the seating surface of the carrier, and a plurality of pressing ghosts are opened/formed into a drop-shaped column-shaped shape, and a wide curved surface is formed on the peripheral side, and the surface is spurted toward the discharge airflow to make the discharge When the airflow flows through the plurality of pressing blocks, the flow can still be smoothly passed, so as to avoid the pressure difference of the ejected airflow, and the plurality of anti-μ blocks are destroyed when the airflow flows, so the design can achieve stable adsorption of the optoelectronic semiconductor wafer. The practical effect of the shaped workpiece. And because the present invention is capable of positioning and adsorbing the photoelectric semiconductor sheet-shaped workpiece by the discharge air flow and the opening pressure difference, the photoelectric semiconductor sheet-shaped workpiece can be positioned on the stage device, so the surface is sprayed with the etching liquid. During the etching operation, even if the money engraving liquid flows to the periphery of the optoelectronic semiconductor sheet-shaped workpiece, the X-sprayed gas can be taken out to the outside without being sucked into the stage device, that is, the creation is in the form of a jet stream. Different from the suction suction positioning form of the conventional suction cup, it can avoid the erosion of the etchant inside the stage device. [Simple description of the diagram] The first picture: the appearance of the creation. The second picture: the bottom view of this creation. The third picture: a cross-sectional view of the creation. Fig. 4 is a schematic view showing an embodiment of the present invention for adsorbing an optoelectronic semiconductor sheet-shaped workpiece. Figure 5: Another form of appearance of this creation. Figure 6: Schematic diagram of another form of the creation. Figure 7: Schematic diagram of another embodiment of the present invention for adsorbing an optoelectronic semiconductor sheet-shaped workpiece 10 M369541.
【主要元件符號說明】 (10)載座 (12)容置槽 (122)縮小部 (14)氣流通道 (151)寬弧面 (161)喷出口 (21)平面 (23)支持塊 (11)作用面 (121)擴大開口 (13)喷氣道 (15) 抵壓塊 (16) 側邊喷氣通道 (20)喷頭 (22)錐面 (30)光電半導體薄片形工件 11[Description of main component symbols] (10) Carrier (12) accommodating groove (122) reduction portion (14) Air flow passage (151) Wide curved surface (161) Spray outlet (21) Plane (23) Support block (11) Action surface (121) enlargement opening (13) air passage (15) pressure block (16) side air passage (20) nozzle (22) cone surface (30) optoelectronic semiconductor sheet-shaped workpiece 11