EP3003583B1 - Specific process for cleaning electronic components and/or circuits - Google Patents

Specific process for cleaning electronic components and/or circuits Download PDF

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Publication number
EP3003583B1
EP3003583B1 EP14731754.9A EP14731754A EP3003583B1 EP 3003583 B1 EP3003583 B1 EP 3003583B1 EP 14731754 A EP14731754 A EP 14731754A EP 3003583 B1 EP3003583 B1 EP 3003583B1
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EP
European Patent Office
Prior art keywords
fluid
nozzles
electronic components
process according
cleaning
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EP14731754.9A
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German (de)
French (fr)
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EP3003583A1 (en
Inventor
Michel Bourdat
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Individual
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/048—Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/20—Mixing gases with liquids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/20—Mixing gases with liquids
    • B01F23/23—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
    • B01F23/232—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids using flow-mixing means for introducing the gases, e.g. baffles
    • B01F23/2323—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids using flow-mixing means for introducing the gases, e.g. baffles by circulating the flow in guiding constructions or conduits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/20—Mixing gases with liquids
    • B01F23/23—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
    • B01F23/235—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids for making foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/30—Injector mixers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/30—Injector mixers
    • B01F25/31—Injector mixers in conduits or tubes through which the main component flows
    • B01F25/313—Injector mixers in conduits or tubes through which the main component flows wherein additional components are introduced in the centre of the conduit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/50—Circulation mixers, e.g. wherein at least part of the mixture is discharged from and reintroduced into a receptacle
    • B01F25/53—Circulation mixers, e.g. wherein at least part of the mixture is discharged from and reintroduced into a receptacle in which the mixture is discharged from and reintroduced into a receptacle through a recirculation tube, into which an additional component is introduced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids

Definitions

  • the present invention relates to a specific device for cleaning electronic components and/or circuits such as, for example, electronic cards or silicon-based substrates.
  • the present invention can find its application for example, but not exclusively, in the field of microelectronic production.
  • the invention can also find applications in the field of electronic production. Indeed, during, for example, a phase of soldering Surface Mounted Components "CMS" in a soldering oven, residues of cream or soldering are formed and remain stuck either to the surface of the board or to the components that may cause malfunctions of the electronic card. It is therefore advisable to clean the board after the soldering operations.
  • CMS Surface Mounted Components
  • Solder residues on an electronic card are particularly difficult to remove due to the complex topography of an electronic card but also due to its fragility.
  • the document WO-95/28235 which is considered the state of the art closest to claim 1, discloses a washing and immersion tank which contains a cleaning liquid.
  • a plurality of fluid injection nozzles are provided for spraying a fluid which forces the cleaning liquid to flow, for example, a cleaning liquid, compressed air and a mixed fluid thereof.
  • Said fluid injection nozzles are placed parallel to a tank wall, for example a bottom surface of the washing and immersion tank.
  • Fluid injection nozzles are divided into two groups. In this way, the fluid injection synchronization alternates from one group to another under the action of an injection synchronization control device which thus substantially reverses the direction of the forced flow of the cleaning. Furthermore, the fluid injection nozzles can move to substantially reverse the direction of the forced flow of the cleaning liquid. Therefore, it is possible to uniformly wash an entire surface of a washed article regardless of the part and the position of the washed article.
  • the patent no. US 6,454,867 named “Method and Machine for Cleaning Objects in Plate Form” presents a machine and its cleaning process for cleaning electronic boards of their residue using an immersion technique.
  • Said machine comprises a washing tank where the object to be washed is completely immersed in a vertical position and is parallel to the walls of the washing tank. The latter is filled with a cleaning liquid of the azeotropic liquid type.
  • a recovery system and a cleaning liquid filtering system allow the circulation and filtering of the liquid in a closed loop.
  • the invention aims to overcome these drawbacks. More particularly, the invention aims to enable the cleaning of electronic components and/or circuits soiled by residues of different densities, sizes and natures, and in particular glue or solder paste. In particular, the invention aims to allow the elimination of residues placed in places that are difficult to access, such as under an integrated circuit of an electronic card.
  • the invention can be implemented in the field of avionics. It will also preferably make it possible to eliminate residues in via holes in printed circuits. The invention thus aims to increase the performance of cleaning and elimination of residues on electronic cards for applications in avionics for example or on semiconductor components deposited on substrates based on flexible Kapton.
  • the invention proposes a method for cleaning electronic components and/or circuits according to claim 1.
  • the mixer proposed here for the cleaning device makes it possible to produce a two-phase fluid within which the gas is intimately mixed with the liquid and forms microbubbles therein.
  • the use of a jet of such a two-phase fluid for cleaning components and/or electronic circuits soiled by solder residues makes it possible, thanks to the properties of the two-phase fluid, to greatly improve cleaning yields. Indeed, when the two-phase fluid comes into contact with the surface to be cleaned of components and/or electronic circuits, a phenomenon of release of microbubbles on the surface of the components and/or electronic circuits comparable to an ultrasound cavitation phenomenon occurs. This technique makes it possible to remove even glue residues while avoiding the use of ultrasound and can thus be used in the field of avionics.
  • the injection system is such that the pressure at the nozzles is less than or equal to 5 bars, which makes it possible to obtain effective cleaning without degrading the components and/or electronic circuits of a very brittle.
  • the mixer injector injects the pressurized gas into the center of the internal pipe of the fluid mixer.
  • the concentric position of the injector with respect to the internal pipe prevents the formation of packets of gas bubbles in the two-phase fluid.
  • the difference between the pressure of the fluid and the pressure of the gas inside the mixer of fluids is between 0.5 and 2 bars, the gas being under overpressure with respect to the liquid. It has in fact been observed that this pressure difference makes it possible to produce a two-phase fluid that is very homogeneous and therefore very effective for cleaning.
  • the cleaning device comprises a tank of overflow to recover the liquid from the first tank. Said liquid which thus flows into the overflow tank is cleared of the heavy residues which remain at the bottom of the first tank.
  • a suction of liquid inside the overflow tank is advantageously carried out using a hydraulic device which connects the overflow tank to the fluid mixer. The latter is then supplied by one of these inlets with liquid already cleared of the largest washing residues.
  • the mixer is advantageously placed downstream of a filter.
  • the fluid mixer has a Y-shape facilitating the mixing between the gas and the liquid inside it. This shape thus allows the creation of gas microbubbles in the liquid coming from the overflow tank.
  • the fluid mixer is advantageously placed upstream of the first tank in order to facilitate the integration of the mixer within the cleaning device.
  • An embodiment of the present invention provides that the means allowing the nozzles to carry out the sweeping of the surface of the components and/or of the electronic circuits to be cleaned include means for vertically moving the support means. It is also possible to provide, possibly in addition to this embodiment, in order to carry out effective cleaning, that these means allowing the nozzles to carry out the scanning of the surface of the components and/or of the electronic circuits to be cleaned comprise means for horizontally displacing the nozzles.
  • a preferred embodiment provides for the combination of the movements of the support of the components and/or of the electronic circuits and of the nozzles to greatly increase the effectiveness of the cleaning. It is then possible to remove residues more easily from electronic boards and/or components.
  • an advantageous embodiment of the invention further provides that the system injection of a two-phase fluid on the components and/or the electronic circuits to be cleaned comprises two networks of nozzles connected to each other and placed on both sides of the components and/or the electronic circuits, thus allowing simultaneous cleaning of the two faces of the components and/or the electronic circuits .
  • the distance which separates said components and/or electronic circuits to be cleaned from the networks of nozzles is adjustable.
  • the fluid mixer comprises a conical constriction making it possible to make the distribution of the gas bubbles in the fluid homogeneous.
  • the two-phase fluid does not include groups or packets of gas bubbles.
  • the pressurized gas injected into the second inlet of the fluid mixer is an inert gas.
  • the pressurized gas injected into the second inlet of the fluid mixer is an inert gas.
  • the diameter of the internal pipe of the fluid mixer has a diameter of between 15 and 25 mm.
  • the injector of the mixer has for its part, for example, an internal diameter of less than 4 mm.
  • an internal diameter of less than 4 mm it is easier to produce a homogeneous two-phase fluid and to control the characteristic parameters of the two-phase fluid.
  • the Figure 1 shows a device 1 comprising a first tank 2, a second tank called overflow tank 4, both of generally parallelepipedic shapes and adapted to contain a liquid.
  • Support means 8 arranged inside the first tank 2 hold components and/or electronic circuits 6 to be cleaned immersed in the liquid contained therein.
  • Said electronic components and/or circuits 6 to be cleaned are for example substrates based on flexible silicon or semiconductor-based chip assemblies. It can also be electronic cards or screen printing stencils.
  • the first tank 2 also called the cleaning tank, consists of metal walls made of stainless steel. It comprises among other things a first external vertical wall 21, a lower horizontal bottom 22 and an internal vertical wall 23, called overflow wall with an upper extreme edge 231 at a height lower than that of an upper extreme edge 211 of the vertical wall external 21.
  • the internal vertical wall 23 is designed so that the liquid contained in the first tank 2 overflows above the upper extreme edge 231 to flow into the overflow tank 4 adjacent to the first tank 2.
  • the overflow tank 4 also consists of metal walls in stainless steel. It comprises, among other things, a first external vertical wall 42, a horizontal bottom 41 and a second vertical wall which corresponds to the upper part of the internal vertical wall 23 of the first tank 2. In addition, the two tanks are open upwards and the lower horizontal bottom 22 of the first tank 2 is at an altitude lower than the altitude of the horizontal bottom 41 of the overflow tank 4.
  • the electronic components and/or circuits 6 to be cleaned are placed parallel to the outer vertical wall 21 of the first tank 2 so that they cannot come into contact with the lower horizontal bottom 22 of the first tank 2 so as not to disturb the flow of the liquid in said first tank 2.
  • the components and/or the electronic circuits 6 to be cleaned are held by the support means 8.
  • the latter can be a hook or arm system allowing the total immersion of the components and/or the electronic circuits 6 in clean in the first tank 2.
  • the support means 8 can perform a vertical movement (represented by a double arrow on the Figure 1 ) controlled by a suitable control device not shown on the Figure 1 .
  • the device 1 also comprises two hydraulic devices allowing the circulation of the liquid contained in the two tanks.
  • a first hydraulic device 12 is associated with the first tank 2. It allows the circulation of the liquid in the first tank 2 using a suction mouth 121 placed at the bottom of the first tank 2 and a return via one end 122 of the first hydraulic device 12 preferably placed at the top of the external vertical wall 21 of the first tank 2, thus allowing the reinjection of the liquid into the first tank 2.
  • This first hydraulic device 12 allows the recovery, filtering and injection of the liquid contained in the first tank 2. It comprises for this purpose a valve V1, a pump P1 and a filter F1.
  • the valve V1 can be controlled electrically or manually and allows, among other things, during potential incidents to isolate the first tank 2.
  • the filter F1 is arranged within the first hydraulic device 12 and is placed for example downstream of the valve V1, to ensure filtering and thereby even elimination of cleaning residues from the liquid coming from the first tank 2.
  • the pump P1 can be a vane pump or a magnetic drive pump for example and is used for the circulation of the liquid in the first hydraulic device 12.
  • a manually or electrically controlled valve V5 is positioned here downstream of the pump P1 to allow the liquid contained in the first tank 2 to be purged into a recovery tank (not shown in the figure). Figure 1 ) for example using the pump P1.
  • This valve V5 is mounted on a bypass of the first hydraulic device 12.
  • a second hydraulic device 14 comprises a valve V2, a pump P2, a filter F2 and a mixer 16.
  • This second hydraulic device 14 makes it possible, among other things, to suck the liquid into the overflow tank 4 and to reinject it into the first tank 2
  • a suction mouth 142 is placed so that the suction of the liquid preferably occurs at the bottom of the wall 42 of the overflow tank 4.
  • the return of the liquid is made by means of a fluid injection system placed in the first tank 2.
  • the valve V2 placed on the second hydraulic device 14 can be manually operated or electrically operated, for example a solenoid valve. This valve V2 makes it possible during an incident potential to isolate the overflow tank 4 for safety reasons.
  • the liquid contained in the overflow tank 4 is sucked up using pump P2, placed here downstream of valve V2.
  • the filter F2 placed downstream of the pump P2 allows the filtering, that is to say the elimination of cleaning residues from the liquid coming from the overflow tank 4, these residues coming inter alia from the components and/or the circuits electronics 6 to clean.
  • the mixer 16 is placed downstream of the filter F2 on the second hydraulic device 14 and is placed upstream of the first tank 2. It comprises a first inlet 161 adapted to receive a liquid under pressure coming from the filter F2 powered by the pump P2 in the second hydraulic device 14, a second inlet 162 adapted to receive a pressurized gas and an outlet 163.
  • the Figure 2 is an enlarged schematic view of mixer 16.
  • the first input 161 is coupled to the output 163 using an internal pipe of the mixer 16.
  • the second inlet 162 is connected outside the mixer 16 to a source of pressurized gas.
  • the second inlet 162 is connected to an injector to inject said gas within the internal pipe.
  • the inside diameter of the injector is for example of the order of 2 mm with an outside diameter of the order of 4 mm.
  • the mixer 16 thus has a Y shape.
  • the injector is positioned in the center of the internal pipe of the mixer 16, that is to say concentrically with respect to the internal pipe.
  • the injector penetrates sufficiently into the internal pipe and its end in the internal pipe is close to the conical constriction 164 of the internal pipe so that the injection of the pressurized gas at the center of the internal pipe allows the creation of a two-phase fluid. Thanks to this conical constriction 164 the two-phase fluid is accelerated which homogenizes the distribution of the gas bubbles.
  • the gas injected into the second inlet 162 can be a neutral gas such as nitrogen, which makes it possible to clean bare or highly oxidizable copper parts such as power-modules used for energy management in vehicles. electrical. Also, the injected gas can be a protective or reducing gas.
  • the pressure of the gas injected into the second inlet 162 is greater by 0.5 to 2 bars, preferably of the order of 1 bar, above the pressure of the liquid and has a flow rate of the order of 10 liters/min .
  • the flows and the pressures of the inlets of the mixer 16 are adjustable.
  • the flow rate and the pressure within the second hydraulic device 14 as well as at the level of the second inlet 162 of the mixer 16 are sufficient to meet the needs for cleaning the components and/or the electronic circuits 6 to be cleaned.
  • the fluid injection system comprises two networks of nozzles 1001 and 1003 immersed in the first tank 2. These two networks of nozzles 1001 and 1003 have nozzles 10 placed so that the jets coming from these nozzles 10 are jets of liquid laminars of cylindrical shape and arrive perpendicular to the surface of the components and/or electronic circuits 6 to be cleaned (cf. Figure 1 ).
  • Said networks of nozzles 1001 and 1003 consist of at least one line comprising at least one nozzle 10 and of at least one column comprising at least one nozzle 10.
  • the number of nozzles 10, that is to say the number of rows and columns, on the networks of nozzles 1001 and 1003 can be modified according to the size of the components and/or the electronic circuits 6 to be cleaned.
  • the networks of nozzles 1001 and 1003 are placed parallel to the components and/or the electronic circuits 6 to be cleaned on either side of these (cf. Figure 1 ).
  • the distance separating the components and/or the electronic circuits 6 to be cleaned from the nozzle is of the order of 2 to 5 cm.
  • the network of nozzles 1003 is supplied with two-phase fluid coming from the hydraulic device 14 using a hydraulic supply device 1002 connecting the first network of nozzles 1001 to the second network of nozzles 1003.
  • the pressure of the two-phase fluid jet at the level of the nozzles 10 is preferably less than 5 bars. Although relatively low, this pressure allows effective cleaning of the components or cards to be cleaned while guaranteeing not to damage the cleaned objects.
  • the hydraulic supply device 1002 is preferably located at the bottom of the first tank 2 without however touching its lower horizontal bottom 22 so as not to hinder the circulation of the liquid in the first tank 2.
  • first network of nozzles 1001 and the second network of nozzles 1003 can, using a scanning device not shown in the Figure 1 make a movement perpendicular to the plane of the Figure 1 . This movement thus makes it possible to sweep, using the jets of fluids, the faces of the components and/or of the electronic circuits 6 to be cleaned using the two networks of nozzles.
  • This scanning device can also be coupled to the movement of the support means 8.
  • the combined movements then favor the elimination of the residues placed under the integrated circuits.
  • the removal of residues placed in via holes is also improved using this technique.
  • the distance between each network of nozzles and the components and/or the electronic circuits 6 to be cleaned is determined so that the efficiency of the two-phase fluid jets is maximum: this can be for example of the order from 5 to 10 cm.
  • a pressure regulating device (not shown in the figures), using for example pressure sensors, is used to control the pressure of the liquid as well as that of the gas.
  • a device for regulating the temperature of the liquid using, for example, a temperature sensor.
  • the gas may for example be at room temperature.
  • gas temperature control can also be considered. Thus, it is possible to perfectly control the characteristics of the two-phase fluid.
  • the effectiveness of the two-phase jet being independent of the nature of the materials such as, for example, glue or solder paste, the cleaning of screen printing masks is optimized thanks to such a device. It was noticed that the presence of microbubbles in the fluid injected by the nozzles on the components and/or the electronic circuits to be cleaned allowed a very high cleaning efficiency even against products such as glue known as not being able to be removed by cleaning.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Detergent Compositions (AREA)

Description

La présente invention concerne un dispositif spécifique de nettoyage de composants et/ou de circuits électroniques tels que par exemple des cartes électroniques ou des substrats à base de silicium.The present invention relates to a specific device for cleaning electronic components and/or circuits such as, for example, electronic cards or silicon-based substrates.

La présente invention peut trouver son application par exemple, mais pas exclusivement, dans le domaine de la production microélectronique. L'invention peut également trouver des applications dans le domaine de la production électronique. En effet, lors par exemple d'une phase de soudure de Composants Montés en Surface « CMS » dans un four à soudure, des résidus de crème ou de soudure se forment et restent collés soit à la surface de la carte ou sur les composants pouvant provoquer des disfonctionnements de la carte électronique. Il convient donc de nettoyer la carte après les opérations de soudure.The present invention can find its application for example, but not exclusively, in the field of microelectronic production. The invention can also find applications in the field of electronic production. Indeed, during, for example, a phase of soldering Surface Mounted Components "CMS" in a soldering oven, residues of cream or soldering are formed and remain stuck either to the surface of the board or to the components that may cause malfunctions of the electronic card. It is therefore advisable to clean the board after the soldering operations.

Le nettoyage de composants et/ou de circuits électroniques ayant subi au préalable par exemple des étapes de soudure ou de collage, nécessite des appareils et des processus de nettoyage performants.The cleaning of electronic components and/or circuits which have previously undergone, for example, soldering or gluing steps, requires high-performance cleaning devices and processes.

Les résidus de soudure sur une carte électronique sont particulièrement difficiles à supprimer de par la topographie complexe d'une carte électronique mais également de par sa fragilité.Solder residues on an electronic card are particularly difficult to remove due to the complex topography of an electronic card but also due to its fragility.

Le document WO-95/28235 , qui est considéré comme l'état de la technique le plus proche de la revendication 1, divulgue une cuve de lavage et d'immersion qui contient un liquide de nettoyage. Plusieurs buses d'injection de fluide sont prévues pour pulvériser un fluide qui provoque l'écoulement en force du liquide de nettoyage, par exemple un liquide de nettoyage, de l'air comprimé et un fluide mélangé de ces derniers. Lesdites buses d'injection de fluide sont placées en parallèle à une paroi de cuve, par exemple une surface de fond de la cuve de lavage et d'immersion. Les buses d'injection de fluide sont divisées en deux groupes. De cette manière, la synchronisation de l'injection du fluide alterne d'un groupe à l'autre sous l'action d'un dispositif de commande de synchronisation d'injection qui inverse ainsi sensiblement le sens de l'écoulement forcé du liquide de nettoyage. Par ailleurs, les buses d'injection du fluide peuvent se déplacer pour inverser sensiblement le sens de l'écoulement forcé du liquide de nettoyage. Par conséquent, il est possible de laver avec uniformité la totalité d'une surface d'un article lavé quelles que soient la partie et la position de l'article lavé.The document WO-95/28235 , which is considered the state of the art closest to claim 1, discloses a washing and immersion tank which contains a cleaning liquid. A plurality of fluid injection nozzles are provided for spraying a fluid which forces the cleaning liquid to flow, for example, a cleaning liquid, compressed air and a mixed fluid thereof. Said fluid injection nozzles are placed parallel to a tank wall, for example a bottom surface of the washing and immersion tank. Fluid injection nozzles are divided into two groups. In this way, the fluid injection synchronization alternates from one group to another under the action of an injection synchronization control device which thus substantially reverses the direction of the forced flow of the cleaning. Furthermore, the fluid injection nozzles can move to substantially reverse the direction of the forced flow of the cleaning liquid. Therefore, it is possible to uniformly wash an entire surface of a washed article regardless of the part and the position of the washed article.

Le brevet n° US 6,454,867 nommé « Method and Machine for Cleaning Objects in Plate Form » présente une machine et son procédé de nettoyage permettant de nettoyer des cartes électroniques de leurs résidus à l'aide d'une technique d'immersion. Ladite machine comporte un bac de lavage où l'objet à laver est totalement immergé en position verticale et est parallèle aux parois du bac de lavage. Ce dernier est rempli d'un liquide de nettoyage de type liquide azéotropique. Afin de diminuer les coûts mais également l'impact sur l'environnement d'un tel dispositif un système de récupération et un système de filtrage du liquide de nettoyage permettent la circulation et le filtrage du liquide en boucle fermée.The patent no. US 6,454,867 named “Method and Machine for Cleaning Objects in Plate Form” presents a machine and its cleaning process for cleaning electronic boards of their residue using an immersion technique. Said machine comprises a washing tank where the object to be washed is completely immersed in a vertical position and is parallel to the walls of the washing tank. The latter is filled with a cleaning liquid of the azeotropic liquid type. In order to reduce the costs but also the impact on the environment of such a device, a recovery system and a cleaning liquid filtering system allow the circulation and filtering of the liquid in a closed loop.

Afin d'améliorer l'efficacité du lavage, le procédé proposé par le brevet n° US 6,454,867 met en oeuvre un générateur d'ultrasons dans le bac de lavage pour faciliter le décrochage des particules à éliminer. Cette technique améliore fortement la qualité des nettoyages mais ne peut être utilisée pour le nettoyage de cartes électroniques dédiées à l'avionique. En effet, la présence de nombreux composants électroniques de hautes technicités et surtout de composants tels que des quartz rend l'utilisation d'ultrasons interdite par la réglementation.In order to improve the washing efficiency, the process proposed by patent no. US 6,454,867 implements an ultrasound generator in the washing tank to facilitate the removal of the particles to be eliminated. This technique greatly improves the quality of cleaning but cannot be used for cleaning electronic boards dedicated to avionics. Indeed, the presence of many high-tech electronic components and especially components such as quartz makes the use of ultrasound prohibited by the regulations.

En outre, de telles techniques rencontrent des difficultés lors de la suppression de certains résidus comme par exemple de la colle sur des masques de sérigraphie ou dans des parties difficiles d'accès telles que par exemple sous un circuit intégré.In addition, such techniques encounter difficulties during the removal of certain residues such as for example glue on screen printing masks or in parts that are difficult to access such as for example under an integrated circuit.

L'invention vise donc à pallier ces inconvénients. Plus particulièrement l'invention vise à permettre le nettoyage de composants et/ou de circuits électroniques souillés par des résidus de densités, de tailles et de natures différentes et notamment de la colle ou de la crème à braser. En particulier, l'invention vise à permettre la suppression de résidus placés dans des endroits difficiles d'accès tels que sous un circuit intégré d'une carte électronique. Avantageusement, l'invention pourra être mise en œuvre dans le domaine de l'avionique. Elle permettra aussi de préférence d'éliminer des résidus dans des trous de via dans des circuits imprimés. L'invention vise ainsi à l'augmentation des performances de nettoyage et d'élimination des résidus sur des cartes électroniques pour des applications dans l'avionique par exemple ou sur composants semi-conducteurs déposés sur des substrats à base de Kapton souple.The invention therefore aims to overcome these drawbacks. More particularly, the invention aims to enable the cleaning of electronic components and/or circuits soiled by residues of different densities, sizes and natures, and in particular glue or solder paste. In particular, the invention aims to allow the elimination of residues placed in places that are difficult to access, such as under an integrated circuit of an electronic card. Advantageously, the invention can be implemented in the field of avionics. It will also preferably make it possible to eliminate residues in via holes in printed circuits. The invention thus aims to increase the performance of cleaning and elimination of residues on electronic cards for applications in avionics for example or on semiconductor components deposited on substrates based on flexible Kapton.

À cet effet, l'invention propose un procédé de nettoyage de composants et/ou circuits électroniques selon la revendication 1.To this end, the invention proposes a method for cleaning electronic components and/or circuits according to claim 1.

Le mélangeur proposé ici pour le dispositif de nettoyage permet de réaliser un fluide diphasique au sein duquel le gaz est intimement mélangé au liquide et forme dans celui-ci des microbulles. L'utilisation d'un jet d'un tel fluide diphasique pour le nettoyage de composants et/ou de circuits électroniques souillés par des résidus de soudure permet grâce aux propriétés du fluide diphasique d'améliorer très fortement les rendements de nettoyage. En effet, lorsque le fluide diphasique vient en contact avec la surface à nettoyer des composants et/ou de circuits électroniques, un phénomène de libération de microbulles à la surface des composants et/ou des circuits électroniques comparable à un phénomène de cavitation d'ultrasons se produit. Cette technique permet de retirer même des résidus de colle tout en évitant l'utilisation d'ultrasons et peut ainsi être utilisée dans le domaine de l'avionique.The mixer proposed here for the cleaning device makes it possible to produce a two-phase fluid within which the gas is intimately mixed with the liquid and forms microbubbles therein. The use of a jet of such a two-phase fluid for cleaning components and/or electronic circuits soiled by solder residues makes it possible, thanks to the properties of the two-phase fluid, to greatly improve cleaning yields. Indeed, when the two-phase fluid comes into contact with the surface to be cleaned of components and/or electronic circuits, a phenomenon of release of microbubbles on the surface of the components and/or electronic circuits comparable to an ultrasound cavitation phenomenon occurs. This technique makes it possible to remove even glue residues while avoiding the use of ultrasound and can thus be used in the field of avionics.

Dans un exemple de réalisation avantageux, le système d'injection est tel que la pression au niveau des buses est inférieure ou égale à 5 bars, ce qui permet d'obtenir un nettoyage efficace sans dégrader les composants et/ou circuits électroniques de nature très fragile.In an advantageous embodiment, the injection system is such that the pressure at the nozzles is less than or equal to 5 bars, which makes it possible to obtain effective cleaning without degrading the components and/or electronic circuits of a very brittle.

Afin d'obtenir un fluide diphasique homogène l'injecteur du mélangeur injecte le gaz sous pression au centre de la canalisation interne du mélangeur de fluides. La position concentrique de l'injecteur par rapport à la canalisation interne permet d'éviter la formation de paquets de bulles de gaz dans le fluide diphasique.In order to obtain a homogeneous two-phase fluid, the mixer injector injects the pressurized gas into the center of the internal pipe of the fluid mixer. The concentric position of the injector with respect to the internal pipe prevents the formation of packets of gas bubbles in the two-phase fluid.

La différence entre la pression du fluide et la pression du gaz à l'intérieur du mélangeur de fluides est comprise entre 0,5 et 2 bars, le gaz étant en surpression par rapport au liquide. On a en effet remarqué que cette différence de pression permettait de réaliser un fluide diphasique très homogène et de ce fait très efficace pour le nettoyage.The difference between the pressure of the fluid and the pressure of the gas inside the mixer of fluids is between 0.5 and 2 bars, the gas being under overpressure with respect to the liquid. It has in fact been observed that this pressure difference makes it possible to produce a two-phase fluid that is very homogeneous and therefore very effective for cleaning.

Avantageusement, le dispositif de nettoyage comporte une cuve de débordement permettant de récupérer le liquide provenant de la première cuve. Ledit liquide qui s'écoule ainsi dans la cuve de débordement est débarrassé des résidus lourds qui restent au fond de la première cuve.Advantageously, the cleaning device comprises a tank of overflow to recover the liquid from the first tank. Said liquid which thus flows into the overflow tank is cleared of the heavy residues which remain at the bottom of the first tank.

Une aspiration de liquide à l'intérieur de la cuve de débordement est avantageusement effectuée à l'aide d'un dispositif hydraulique qui connecte la cuve de débordement au mélangeur de fluides. Ce dernier est alors par une de ces entrées alimenté en liquide déjà débarrassé des plus gros résidus de lavage.A suction of liquid inside the overflow tank is advantageously carried out using a hydraulic device which connects the overflow tank to the fluid mixer. The latter is then supplied by one of these inlets with liquid already cleared of the largest washing residues.

Afin de protéger mieux encore le mélangeur de fluides des résidus de nettoyage provenant de la cuve de débordement, le mélangeur est avantageusement placé en aval d'un filtre.In order to further protect the fluid mixer from cleaning residues originating from the overflow tank, the mixer is advantageously placed downstream of a filter.

Selon un mode de réalisation de l'invention, le mélangeur de fluides a une forme en Y facilitant le mélange entre le gaz et le liquide à l'intérieur de celui-ci. Cette forme permet ainsi la création de microbulles de gaz dans le liquide provenant de la cuve de débordement. De plus, le mélangeur de fluides est avantageusement placé en amont de la première cuve afin de faciliter l'intégration du mélangeur au sein du dispositif de nettoyage.According to one embodiment of the invention, the fluid mixer has a Y-shape facilitating the mixing between the gas and the liquid inside it. This shape thus allows the creation of gas microbubbles in the liquid coming from the overflow tank. In addition, the fluid mixer is advantageously placed upstream of the first tank in order to facilitate the integration of the mixer within the cleaning device.

Une forme de réalisation de la présente invention prévoit que les moyens permettant aux buses de réaliser le balayage de la surface des composants et/ou des circuits électroniques à nettoyer comportent des moyens pour déplacer verticalement les moyens de support. On peut également prévoir, éventuellement en complément de cette forme de réalisation, pour réaliser un nettoyage efficace, que ces moyens permettant aux buses de réaliser le balayage de la surface des composants et/ou des circuits électroniques à nettoyer comportent des moyens pour déplacer horizontalement les buses. Une forme de réalisation préférée prévoit la combinaison des mouvements du support des composants et/ou des circuits électroniques et des buses pour augmenter grandement l'efficacité du nettoyage. Il est alors possible de supprimer plus aisément les résidus sur des cartes électroniques et/ou composants.An embodiment of the present invention provides that the means allowing the nozzles to carry out the sweeping of the surface of the components and/or of the electronic circuits to be cleaned include means for vertically moving the support means. It is also possible to provide, possibly in addition to this embodiment, in order to carry out effective cleaning, that these means allowing the nozzles to carry out the scanning of the surface of the components and/or of the electronic circuits to be cleaned comprise means for horizontally displacing the nozzles. A preferred embodiment provides for the combination of the movements of the support of the components and/or of the electronic circuits and of the nozzles to greatly increase the effectiveness of the cleaning. It is then possible to remove residues more easily from electronic boards and/or components.

Afin de diminuer le temps de nettoyage mais également afin de préserver les composants et/ou les circuits électroniques à nettoyer de toutes contraintes mécaniques créées par la projection d'un fluide, une forme de réalisation avantageuse de l'invention prévoit en outre que le système d'injection d'un fluide diphasique sur les composants et/ou les circuits électroniques à nettoyer comporte deux réseaux de buses reliés entre eux et placés des deux cotés des composants et/ou des circuits électroniques permettant ainsi un nettoyage simultané des deux faces des composants et/ou des circuits électroniques.In order to reduce the cleaning time but also in order to preserve the components and/or the electronic circuits to be cleaned from all mechanical stresses created by the projection of a fluid, an advantageous embodiment of the invention further provides that the system injection of a two-phase fluid on the components and/or the electronic circuits to be cleaned comprises two networks of nozzles connected to each other and placed on both sides of the components and/or the electronic circuits, thus allowing simultaneous cleaning of the two faces of the components and/or the electronic circuits .

Avantageusement, en fonction de l'épaisseur des composants et/ou des circuits électroniques à nettoyer, la distance qui sépare lesdits composants et/ou circuits électroniques à nettoyer des réseaux de buses est réglable.Advantageously, depending on the thickness of the components and/or electronic circuits to be cleaned, the distance which separates said components and/or electronic circuits to be cleaned from the networks of nozzles is adjustable.

Dans un mode de réalisation préféré, le mélangeur de fluides comporte un rétrécissement conique permettant de rendre homogène la répartition des bulles de gaz dans le fluide. Ainsi, le fluide diphasique ne comporte pas de groupes ou de paquets de bulles de gaz.In a preferred embodiment, the fluid mixer comprises a conical constriction making it possible to make the distribution of the gas bubbles in the fluid homogeneous. Thus, the two-phase fluid does not include groups or packets of gas bubbles.

Avantageusement, le gaz sous pression injecté dans la seconde entrée du mélangeur de fluides est un gaz neutre. Ainsi, il est possible de nettoyer des composants et ou des circuits électroniques utilisant des matériaux très facilement oxydables comme par exemple du cuivre.Advantageously, the pressurized gas injected into the second inlet of the fluid mixer is an inert gas. Thus, it is possible to clean electronic components and/or circuits using very easily oxidizable materials such as, for example, copper.

Dans un exemple de réalisation, le diamètre de la canalisation interne du mélangeur de fluides présente un diamètre compris entre 15 et 25 mm.In an exemplary embodiment, the diameter of the internal pipe of the fluid mixer has a diameter of between 15 and 25 mm.

L'injecteur du mélangeur présente quant à lui par exemple un diamètre intérieur inférieur à 4 mm. Ainsi avec un diamètre relativement faible de l'injecteur, il est plus facile de réaliser un fluide diphasique homogène et de contrôler les paramètres caractéristiques du fluide diphasique.The injector of the mixer has for its part, for example, an internal diameter of less than 4 mm. Thus, with a relatively small diameter of the injector, it is easier to produce a homogeneous two-phase fluid and to control the characteristic parameters of the two-phase fluid.

D'autres caractéristiques et avantages de l'invention apparaîtront encore à la lecture de la description qui va suivre. Celle-ci est purement illustrative et doit être lue en regard du dessin annexé dans lequel :

  • La Figure 1 est un schéma fonctionnel du dispositif de l'invention, et
  • La Figure 2 est une vue schématique à échelle agrandie d'une partie du dispositif de la figure 1.
Other characteristics and advantages of the invention will become apparent on reading the description which follows. This is purely illustrative and should be read in conjunction with the attached drawing in which:
  • The Figure 1 is a block diagram of the device of the invention, and
  • The Figure 2 is a schematic view on an enlarged scale of part of the device of the figure 1 .

La Figure 1 montre un dispositif 1 comprenant une première cuve 2, une seconde cuve dite cuve de débordement 4, toutes deux de formes globalement parallélépipédiques et adaptées pour contenir un liquide.The Figure 1 shows a device 1 comprising a first tank 2, a second tank called overflow tank 4, both of generally parallelepipedic shapes and adapted to contain a liquid.

Des moyens de support 8 disposés à l'intérieur de la première cuve 2 maintiennent des composants et/ou des circuits électroniques 6 à nettoyer immergés dans le liquide contenu dans celle-ci. Lesdits composants et/ou circuits électroniques 6 à nettoyer sont par exemple des substrats à base de silicium pouvant être souples ou d'assemblages de puces à base de semiconducteur. Il peut s'agir également de cartes électroniques ou encore de pochoirs de sérigraphie.Support means 8 arranged inside the first tank 2 hold components and/or electronic circuits 6 to be cleaned immersed in the liquid contained therein. Said electronic components and/or circuits 6 to be cleaned are for example substrates based on flexible silicon or semiconductor-based chip assemblies. It can also be electronic cards or screen printing stencils.

La première cuve 2, dite également cuve de nettoyage, est constituée de parois métalliques en acier inoxydable. Elle comprend entre autres une première paroi verticale externe 21, un fond horizontal inférieur 22 et une paroi verticale interne 23, dite paroi de débordement avec un bord extrême supérieur 231 à une hauteur inférieure à celle d'un bord extrême supérieur 211 de la paroi verticale externe 21. La paroi verticale interne 23 est conçue de telle sorte que le liquide contenu dans la première cuve 2 déborde au-dessus du bord extrême supérieur 231 pour s'écouler dans la cuve de débordement 4 adjacente à la première cuve 2.The first tank 2, also called the cleaning tank, consists of metal walls made of stainless steel. It comprises among other things a first external vertical wall 21, a lower horizontal bottom 22 and an internal vertical wall 23, called overflow wall with an upper extreme edge 231 at a height lower than that of an upper extreme edge 211 of the vertical wall external 21. The internal vertical wall 23 is designed so that the liquid contained in the first tank 2 overflows above the upper extreme edge 231 to flow into the overflow tank 4 adjacent to the first tank 2.

La cuve de débordement 4 est également constituée de parois métalliques en acier inoxydable. Elle comprend entre autres une première paroi verticale externe 42, un fond horizontal 41 et une seconde paroi verticale qui correspond à la partie supérieure de la paroi verticale interne 23 de la première cuve 2. De plus, les deux cuves sont ouvertes vers le haut et le fond horizontal inférieur 22 de la première cuve 2 est à une altitude inférieure à l'altitude du fond horizontal 41 de la cuve de débordement 4.The overflow tank 4 also consists of metal walls in stainless steel. It comprises, among other things, a first external vertical wall 42, a horizontal bottom 41 and a second vertical wall which corresponds to the upper part of the internal vertical wall 23 of the first tank 2. In addition, the two tanks are open upwards and the lower horizontal bottom 22 of the first tank 2 is at an altitude lower than the altitude of the horizontal bottom 41 of the overflow tank 4.

Les composants et/ou les circuits électroniques 6 à nettoyer, comme présenté sur la Figure 1, sont placés parallèlement à la paroi verticale externe 21 de la première cuve 2 de telle sorte qu'ils ne puissent pas venir en contact avec le fond horizontal inférieur 22 de la première cuve 2 afin de ne pas déranger l'écoulement du liquide dans ladite première cuve 2. Les composants et/ou les circuits électroniques 6 à nettoyer sont maintenus par les moyens de support 8. Ces derniers peuvent être un système à crochets ou à bras permettant l'immersion totale des composants et/ou des circuits électroniques 6 à nettoyer dans la première cuve 2. De plus, les moyens de support 8 peuvent effectuer un mouvement vertical (représenté par une double flèche sur la Figure 1) contrôlé par un dispositif de commande adapté non représenté sur la Figure 1.The electronic components and/or circuits 6 to be cleaned, as shown in the Figure 1 , are placed parallel to the outer vertical wall 21 of the first tank 2 so that they cannot come into contact with the lower horizontal bottom 22 of the first tank 2 so as not to disturb the flow of the liquid in said first tank 2. The components and/or the electronic circuits 6 to be cleaned are held by the support means 8. The latter can be a hook or arm system allowing the total immersion of the components and/or the electronic circuits 6 in clean in the first tank 2. In addition, the support means 8 can perform a vertical movement (represented by a double arrow on the Figure 1 ) controlled by a suitable control device not shown on the Figure 1 .

Le dispositif 1 comprend également deux dispositifs hydrauliques permettant la circulation du liquide contenu dans les deux cuves.The device 1 also comprises two hydraulic devices allowing the circulation of the liquid contained in the two tanks.

Un premier dispositif hydraulique 12 est associé à la première cuve 2. Il permet la circulation du liquide dans la première cuve 2 à l'aide d'une bouche d'aspiration 121 placée au fond de la première cuve 2 et d'un retour par une extrémité 122 du premier dispositif hydraulique 12 placée de préférence en haut de la paroi verticale externe 21 de la première cuve 2, permettant ainsi la réinjection du liquide dans la première cuve 2.A first hydraulic device 12 is associated with the first tank 2. It allows the circulation of the liquid in the first tank 2 using a suction mouth 121 placed at the bottom of the first tank 2 and a return via one end 122 of the first hydraulic device 12 preferably placed at the top of the external vertical wall 21 of the first tank 2, thus allowing the reinjection of the liquid into the first tank 2.

Ce premier dispositif hydraulique 12 permet la récupération, le filtrage et l'injection du liquide contenu dans la première cuve 2. Il comporte à cet effet une vanne V1, une pompe P1 et un filtre F1.This first hydraulic device 12 allows the recovery, filtering and injection of the liquid contained in the first tank 2. It comprises for this purpose a valve V1, a pump P1 and a filter F1.

La vanne V1 peut être commandée électriquement ou manuellement et permet entre autres lors de potentiels incidents d'isoler la première cuve 2.The valve V1 can be controlled electrically or manually and allows, among other things, during potential incidents to isolate the first tank 2.

Le filtre F1 est disposé au sein du premier dispositif hydraulique 12 et est placé par exemple en aval de la vanne V1, pour assurer un filtrage et par là même une élimination de résidus de nettoyage du liquide provenant de la première cuve 2.The filter F1 is arranged within the first hydraulic device 12 and is placed for example downstream of the valve V1, to ensure filtering and thereby even elimination of cleaning residues from the liquid coming from the first tank 2.

La pompe P1 peut être une pompe à ailettes ou à entrainement magnétique par exemple et est utilisée pour la circulation du liquide dans le premier dispositif hydraulique 12.The pump P1 can be a vane pump or a magnetic drive pump for example and is used for the circulation of the liquid in the first hydraulic device 12.

Une vanne V5 commandée manuellement ou électriquement est positionnée ici en aval de la pompe P1 pour permettre de purger le liquide contenu dans la première cuve 2 dans une cuve de récupération (non représentée sur la Figure 1) par exemple à l'aide de la pompe P1. Cette vanne V5 est montée sur une dérivation du premier dispositif hydraulique 12.A manually or electrically controlled valve V5 is positioned here downstream of the pump P1 to allow the liquid contained in the first tank 2 to be purged into a recovery tank (not shown in the figure). Figure 1 ) for example using the pump P1. This valve V5 is mounted on a bypass of the first hydraulic device 12.

Un second dispositif hydraulique 14 comporte une vanne V2, une pompe P2, un filtre F2 et un mélangeur 16. Ce second dispositif hydraulique 14 permet entre autres d'aspirer le liquide dans la cuve de débordement 4 et de le réinjecter dans la première cuve 2. Pour ce faire, une bouche d'aspiration 142 est placée de sorte que l'aspiration du liquide se produise de préférence en bas de la paroi 42 de la cuve de débordement 4. Le retour du liquide est fait par le biais d'un système d'injection de fluide placé dans la première cuve 2.A second hydraulic device 14 comprises a valve V2, a pump P2, a filter F2 and a mixer 16. This second hydraulic device 14 makes it possible, among other things, to suck the liquid into the overflow tank 4 and to reinject it into the first tank 2 To do this, a suction mouth 142 is placed so that the suction of the liquid preferably occurs at the bottom of the wall 42 of the overflow tank 4. The return of the liquid is made by means of a fluid injection system placed in the first tank 2.

La vanne V2, placée sur le second dispositif hydraulique 14, peut être à commande manuelle ou bien à commande électrique de type par exemple électrovanne. Cette vanne V2 permet lors d'un potentiel incident d'isoler la cuve de débordement 4 pour des raisons de sécurité.The valve V2, placed on the second hydraulic device 14, can be manually operated or electrically operated, for example a solenoid valve. This valve V2 makes it possible during an incident potential to isolate the overflow tank 4 for safety reasons.

Le liquide contenu dans la cuve de débordement 4 est aspiré à l'aide de la pompe P2, placée ici en aval de la vanne V2. Le filtre F2 placé en aval de la pompe P2 permet le filtrage, c'est-à-dire l'élimination de résidus de nettoyage du liquide provenant de la cuve de débordement 4, ces résidus provenant entre autres des composants et/ou des circuits électroniques 6 à nettoyer..The liquid contained in the overflow tank 4 is sucked up using pump P2, placed here downstream of valve V2. The filter F2 placed downstream of the pump P2 allows the filtering, that is to say the elimination of cleaning residues from the liquid coming from the overflow tank 4, these residues coming inter alia from the components and/or the circuits electronics 6 to clean..

Le mélangeur 16 est placé en aval du filtre F2 sur le second dispositif hydraulique 14 et est placé en amont de la première cuve 2. Il comporte une première entrée 161 adaptée pour recevoir un liquide sous une pression provenant du filtre F2 propulsé par la pompe P2 dans le second dispositif hydraulique 14, une seconde entrée 162 adaptée pour recevoir un gaz sous pression et une sortie 163. La Figure 2 est une vue schématique à échelle agrandie du mélangeur 16.The mixer 16 is placed downstream of the filter F2 on the second hydraulic device 14 and is placed upstream of the first tank 2. It comprises a first inlet 161 adapted to receive a liquid under pressure coming from the filter F2 powered by the pump P2 in the second hydraulic device 14, a second inlet 162 adapted to receive a pressurized gas and an outlet 163. The Figure 2 is an enlarged schematic view of mixer 16.

Toutes les valeurs numériques données ici sont indiquées à titre purement illustratif et non limitatif.All the numerical values given here are given for purely illustrative and non-limiting purposes.

La première entrée 161 est couplée à la sortie 163 à l'aide d'une canalisation interne du mélangeur 16. Le diamètre de la canalisation interne est par exemple de l'ordre de 16 mm (1 mm = 0,001 m) jusqu'à un rétrécissement conique 164 permettant de passer d'un diamètre de canalisation de 16 mm (du côté de la première entrée 161) à un diamètre de canalisation de 13 mm (du côté de la sortie 163) (Figure 2).The first input 161 is coupled to the output 163 using an internal pipe of the mixer 16. The diameter of the internal pipe is for example of the order of 16 mm (1 mm=0.001 m) up to a conical narrowing 164 making it possible to pass from a pipe diameter of 16 mm (on the side of the first inlet 161) to a pipe diameter of 13 mm (on the side of the outlet 163) ( Figure 2 ).

La seconde entrée 162 est reliée à l'extérieur du mélangeur 16 à une source de gaz sous pression. Dans le mélangeur 16, la seconde entrée 162 est raccordée à un injecteur pour injecter ledit gaz au sein de la canalisation interne. Le diamètre intérieur de l'injecteur est par exemple de l'ordre de 2 mm avec un diamètre extérieur de l'ordre de 4 mm. Le mélangeur 16 présente ainsi une forme de Y.The second inlet 162 is connected outside the mixer 16 to a source of pressurized gas. In the mixer 16, the second inlet 162 is connected to an injector to inject said gas within the internal pipe. The inside diameter of the injector is for example of the order of 2 mm with an outside diameter of the order of 4 mm. The mixer 16 thus has a Y shape.

L'injecteur est positionné au centre de la canalisation interne du mélangeur 16, c'est-à-dire de manière concentrique par rapport à la canalisation interne. En outre, l'injecteur pénètre suffisamment dans la canalisation interne et son extrémité dans la canalisation interne est proche du rétrécissement conique 164 de la canalisation interne de sorte que l'injection du gaz sous pression au centre de la canalisation interne permet la création d'un fluide diphasique. Grâce à ce rétrécissement conique 164 le fluide diphasique est accéléré ce qui homogénéise la répartition des bulles de gaz.The injector is positioned in the center of the internal pipe of the mixer 16, that is to say concentrically with respect to the internal pipe. In addition, the injector penetrates sufficiently into the internal pipe and its end in the internal pipe is close to the conical constriction 164 of the internal pipe so that the injection of the pressurized gas at the center of the internal pipe allows the creation of a two-phase fluid. Thanks to this conical constriction 164 the two-phase fluid is accelerated which homogenizes the distribution of the gas bubbles.

Le gaz injecté dans la seconde entrée 162 peut être un gaz neutre comme par exemple de l'azote ce qui permet de nettoyer des pièces en cuivre nu ou hautement oxydables comme par exemple des power-modules utilisés pour la gestion d'énergie dans des véhicules électriques. Également, le gaz injecté peut être un gaz protecteur ou réducteur.The gas injected into the second inlet 162 can be a neutral gas such as nitrogen, which makes it possible to clean bare or highly oxidizable copper parts such as power-modules used for energy management in vehicles. electrical. Also, the injected gas can be a protective or reducing gas.

La pression du liquide injecté dans la première entrée 161 est de l'ordre de 3 à 5 bars (1 bar = 105 Pascals) avec un débit de 20 litres/min. La pression du gaz injecté dans la seconde entrée 162 est supérieure de 0,5 à 2 bars, préférentiellement de l'ordre de 1 bar, au-dessus de la pression du liquide et a un débit de l'ordre de 10 litres/min. Avantageusement, les débits et les pressions des entrées du mélangeur 16 sont réglables.The pressure of the liquid injected into the first inlet 161 is of the order of 3 to 5 bars (1 bar=10 5 Pascals) with a flow rate of 20 liters/min. The pressure of the gas injected into the second inlet 162 is greater by 0.5 to 2 bars, preferably of the order of 1 bar, above the pressure of the liquid and has a flow rate of the order of 10 liters/min . Advantageously, the flows and the pressures of the inlets of the mixer 16 are adjustable.

Le débit et la pression au sein du second dispositif hydraulique 14 ainsi qu'au niveau de la deuxième entrée 162 du mélangeur 16 sont suffisants pour répondre aux besoins de nettoyage des composants et/ou des circuits électroniques 6 à nettoyer.The flow rate and the pressure within the second hydraulic device 14 as well as at the level of the second inlet 162 of the mixer 16 are sufficient to meet the needs for cleaning the components and/or the electronic circuits 6 to be cleaned.

Le système d'injection de fluide comporte deux réseaux de buses 1001 et 1003 immergés dans la première cuve 2. Ces deux réseaux de buses 1001 et 1003 présentent des buses 10 placées de sorte que les jets provenant de ces buses 10 soient des jets de liquide laminaires de forme cylindrique et arrivent perpendiculairement à la surface des composants et/ou des circuits électroniques 6 à nettoyer (cf. Figure 1).The fluid injection system comprises two networks of nozzles 1001 and 1003 immersed in the first tank 2. These two networks of nozzles 1001 and 1003 have nozzles 10 placed so that the jets coming from these nozzles 10 are jets of liquid laminars of cylindrical shape and arrive perpendicular to the surface of the components and/or electronic circuits 6 to be cleaned (cf. Figure 1 ).

Lesdits réseaux de buses 1001 et 1003 sont constitués d'au moins une ligne comportant au moins une buse 10 et d'au moins une colonne comportant au moins une buse 10. Le nombre de buses 10, c'est-à-dire le nombre de lignes et de colonnes, sur les réseaux de buses 1001 et 1003 est modifiable en fonction de la taille des composants et/ou des circuits électroniques 6 à nettoyer.Said networks of nozzles 1001 and 1003 consist of at least one line comprising at least one nozzle 10 and of at least one column comprising at least one nozzle 10. The number of nozzles 10, that is to say the number of rows and columns, on the networks of nozzles 1001 and 1003 can be modified according to the size of the components and/or the electronic circuits 6 to be cleaned.

De plus, afin de préserver les composants et/ou les circuits électroniques 6 à nettoyer de toutes contraintes mécaniques crées par la pulvérisation de liquide sur ses deux faces opposées les réseaux de buses 1001 et 1003 sont placés parallèlement aux composants et/ou aux circuits électroniques 6 à nettoyer de part et d'autre de ceux-ci (cf. Figure 1). Afin de protéger des composants et/ou des circuits électroniques 6 fragiles comme par exemple des semi-conducteurs sur Kapton souple la distance séparant les composants et/ou les circuits électroniques 6 à nettoyer de la buse est de l'ordre de 2 à 5 cm. Le réseau de buses 1003 est alimenté en fluide diphasique provenant du dispositif hydraulique 14 à l'aide d'un dispositif d'alimentation hydraulique 1002 reliant le premier réseau de buses 1001 au second réseau de buses 1003. La pression du jet de fluide diphasique au niveau des buses 10 est de préférence inférieure à 5 bars. Bien que relativement faible, cette pression permet un nettoyage efficace des composants ou cartes à nettoyer tout en garantissant de ne pas endommager les objets nettoyés.In addition, in order to preserve the components and/or the electronic circuits 6 to be cleaned from all mechanical stresses created by the spraying of liquid on its two opposite faces, the networks of nozzles 1001 and 1003 are placed parallel to the components and/or the electronic circuits 6 to be cleaned on either side of these (cf. Figure 1 ). In order to protect fragile electronic components and/or circuits 6 such as for example semiconductors on flexible Kapton the distance separating the components and/or the electronic circuits 6 to be cleaned from the nozzle is of the order of 2 to 5 cm. The network of nozzles 1003 is supplied with two-phase fluid coming from the hydraulic device 14 using a hydraulic supply device 1002 connecting the first network of nozzles 1001 to the second network of nozzles 1003. The pressure of the two-phase fluid jet at the level of the nozzles 10 is preferably less than 5 bars. Although relatively low, this pressure allows effective cleaning of the components or cards to be cleaned while guaranteeing not to damage the cleaned objects.

Le dispositif d'alimentation hydraulique 1002 est situé de préférence en bas de la première cuve 2 sans toutefois toucher son fond horizontal inférieur 22 afin de ne pas gêner la circulation du liquide dans la première cuve 2.The hydraulic supply device 1002 is preferably located at the bottom of the first tank 2 without however touching its lower horizontal bottom 22 so as not to hinder the circulation of the liquid in the first tank 2.

De plus, le premier réseau de buses 1001 et le second réseau de buses 1003 peuvent à l'aide d'un dispositif de balayage non représenté sur la Figure 1 effectuer un mouvement perpendiculaire au plan de la Figure 1. Ce mouvement permet ainsi de balayer à l'aide des jets de fluides les faces des composants et/ou des circuits électroniques 6 à nettoyer à l'aide des deux réseaux de buses.In addition, the first network of nozzles 1001 and the second network of nozzles 1003 can, using a scanning device not shown in the Figure 1 make a movement perpendicular to the plane of the Figure 1 . This movement thus makes it possible to sweep, using the jets of fluids, the faces of the components and/or of the electronic circuits 6 to be cleaned using the two networks of nozzles.

Ce dispositif de balayage peut également être couplé au mouvement des moyens de support 8. Les mouvements combinés favorisent alors l'élimination des résidus placés sous des circuits intégrés. De plus, l'élimination de résidus placés dans des trous de via est également améliorée à l'aide de cette technique.This scanning device can also be coupled to the movement of the support means 8. The combined movements then favor the elimination of the residues placed under the integrated circuits. In addition, the removal of residues placed in via holes is also improved using this technique.

En outre, la distance entre chaque réseau de buses et les composants et/ou les circuits électroniques 6 à nettoyer est déterminée de telle sorte que l'efficacité des jets de fluide diphasique soit maximale : celle-ci peut être par exemple de l'ordre de 5 à 10 cm.In addition, the distance between each network of nozzles and the components and/or the electronic circuits 6 to be cleaned is determined so that the efficiency of the two-phase fluid jets is maximum: this can be for example of the order from 5 to 10 cm.

Dans un autre exemple de réalisation, un dispositif de régulation de pression (non représenté sur les figures), utilisant par exemple des capteurs de pression, est utilisé pour contrôler la pression du liquide ainsi que celle du gaz. Afin d'améliorer les performances ainsi que la reproductibilité des nettoyages il peut être également utilisé un dispositif de régulation en température du liquide utilisant par exemple un capteur de température. Le gaz peut être par exemple à température ambiante. Toutefois, un contrôle de température du gaz peut aussi être envisagé. Ainsi, il est possible de contrôler parfaitement les caractéristiques du fluide diphasique.In another exemplary embodiment, a pressure regulating device (not shown in the figures), using for example pressure sensors, is used to control the pressure of the liquid as well as that of the gas. In order to improve the performance as well as the reproducibility of the cleanings, it is also possible to use a device for regulating the temperature of the liquid using, for example, a temperature sensor. The gas may for example be at room temperature. However, gas temperature control can also be considered. Thus, it is possible to perfectly control the characteristics of the two-phase fluid.

Un nettoyage efficace de cartes électroniques, et plus spécialement de cartes électroniques pour des applications avioniques, est maintenant possible grâce à un dispositif tel que décrit ci-dessus. En effet, l'utilisation d'un jet de fluide diphasique en lieu et place d'un générateur d'ultrasons permet au dispositif d'être efficace lors du nettoyage sans détériorer ou endommager les composants électroniques, même ceux contenant un quartz.Efficient cleaning of electronic cards, and more especially of electronic cards for avionic applications, is now possible thanks to a device as described above. Indeed, the use of a two-phase fluid jet instead of an ultrasound generator allows the device to be effective during cleaning without damaging or damaging the electronic components, even those containing quartz.

De plus, l'efficacité du jet diphasique étant indépendante de la nature des matériaux comme par exemple de la colle ou de la crème à braser, le nettoyage de masques de sérigraphie est optimisé grâce à un tel dispositif. Il a été remarqué que la présence de microbulles dans le fluide injecté par les buses sur les composants et/ou les circuits électroniques à nettoyer permettait une très grande efficacité de nettoyage même à l'encontre de produits tels la colle réputés comme ne pouvant pas être éliminés par nettoyage.In addition, the effectiveness of the two-phase jet being independent of the nature of the materials such as, for example, glue or solder paste, the cleaning of screen printing masks is optimized thanks to such a device. It was noticed that the presence of microbubbles in the fluid injected by the nozzles on the components and/or the electronic circuits to be cleaned allowed a very high cleaning efficiency even against products such as glue known as not being able to be removed by cleaning.

Claims (11)

  1. Process for cleaning electronic components and/or circuits (6), using a specific cleaning device (1) comprising:
    - a first vessel (2) containing a liquid,
    - support means (8) for keeping the electronic components and/or circuit (6) immersed in the first vessel (2),
    - a fluid injection system comprising nozzles (10) enabling the projection of jets of fluid onto the electronic components and/or circuit (6) to be cleaned,
    - means enabling the jets from the nozzles (10) to sweep the surface of the electronic components and/or circuit (6) to be cleaned,
    - a fluid mixer (16) comprising a first inlet (161) adapted to receive a pressurised liquid, a second inlet (162) adapted to receive a pressurised gas, an outlet (163) designed to supply the injection system with two-phase fluid, the first inlet (161) being coupled with the outlet (163) by means of an inner pipe, the second inlet (162) being supplied with pressurised gas and connected to an injector for injecting said gas into the inner pipe,
    said cleaning process comprising the following steps:
    - keeping the electronic components and/or circuits (6) immersed in the first vessel (2) using the support means (8),
    - projecting jets of fluid onto the electronic components and/or circuit (6) using the fluid injection system comprising the nozzles (10),
    - sweeping the surface of the electronic components and/or circuit (6) by the jets of fluid from nozzles (10) using the sweeping means,
    characterised in that the process further comprises a step of injecting pressurised gas at the centre of the inner pipe of the fluid mixer (16) with a difference between the pressure of the fluid and the pressure of the gas inside the fluid mixer (16) between 0.5 and 2 bar, the gas pressure being higher than the liquid pressure.
  2. Process according to claim 1, characterised in that the pressure of the liquid injected into the fluid mixer (16) is between 3 bar and 5 bar with a flow rate of 20 l/min and the gas is injected into the fluid mixer (16) with a flow rate of the order of 10 l/min.
  3. Process according to one of claims 1 or 2, characterised in that the pressure at the nozzles (10) is less than or equal to 5 bar.
  4. Process according to one of claims 1 to 3, characterised in that the fluid contained in the first vessel (2) overflows into an overflow vessel (4).
  5. Process according to claim 4, characterised in that the fluid contained in the overflow vessel (4) is rerouted to the fluid mixer (16) using a hydraulic device (14).
  6. Cleaning process according to one of claims 1 to 5, characterised in that a step of filtering the fluid at the outlet of the fluid mixer (16) is carried out using a filter (F2).
  7. Cleaning process according to one of claims 1 to 6, characterised in that the injection into the fluid mixer (16) is carried out upstream from the first vessel (2).
  8. Cleaning process according to one of claims 1 to 7, characterised in that a vertical sweep of the surface of the electronic components and/or circuit (6) by the jets of fluid from the nozzles is carried out by means for moving the support means (8) vertically.
  9. Cleaning process according to one of claims 1 to 8, characterised in that the horizontal sweep of the surface of the electronic components and/or circuit (6) by the jets of fluid from the nozzles is carried out by means for moving the nozzles (10) horizontally.
  10. Process according to one of claims 1 to 9, characterised in that the jets of fluid from the nozzles are produced on both sides of the electronic components and/or circuits (6) to be cleaned by two arrays of nozzles (1001, 1003) connected to one another and placed on both sides of the electronic components and/or circuits (6).
  11. Process according to one of claims 1 to 10, characterised in that the pressurised gas injected into the second inlet (162) of the fluid mixer (16) is an inert gas.
EP14731754.9A 2013-05-31 2014-05-28 Specific process for cleaning electronic components and/or circuits Active EP3003583B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SI201432004T SI3003583T1 (en) 2013-05-31 2014-05-28 Specific process for cleaning electronic components and/or circuits

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1355011A FR3006209B1 (en) 2013-05-31 2013-05-31 DEVICE AND METHOD FOR CLEANING PLATE-SHAPED OBJECTS
PCT/FR2014/051270 WO2014191690A1 (en) 2013-05-31 2014-05-28 Specific device for cleaning electronic components and/or circuits

Publications (2)

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EP3003583A1 EP3003583A1 (en) 2016-04-13
EP3003583B1 true EP3003583B1 (en) 2022-11-09

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US (1) US10099262B2 (en)
EP (1) EP3003583B1 (en)
CN (1) CN105408032A (en)
ES (1) ES2934153T3 (en)
FI (1) FI3003583T3 (en)
FR (1) FR3006209B1 (en)
HK (1) HK1222821A1 (en)
SI (1) SI3003583T1 (en)
WO (1) WO2014191690A1 (en)

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CN106862215B (en) * 2017-02-22 2020-05-08 京东方科技集团股份有限公司 Method for rinsing display panel by using rinsing machine
CN116021426A (en) * 2021-10-26 2023-04-28 联芯集成电路制造(厦门)有限公司 Cleaning and manufacturing process of wafer polishing pad and polishing pad cleaning spray head
CN115621803B (en) * 2022-01-18 2023-11-03 荣耀终端有限公司 Electronic equipment slot cleaning tool and electronic equipment slot cleaning method
CN116347784B (en) * 2023-04-03 2024-05-31 上海铭控传感技术有限公司 Electronic circuit board cleaning system and method

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FR2785558B1 (en) 1998-11-06 2001-01-12 Michel Pierre Bernard Bourdat CLEANING MACHINE FOR PLATES, ESPECIALLY SCREEN STENCILS
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CN105408032A (en) 2016-03-16
EP3003583A1 (en) 2016-04-13
US20160114358A1 (en) 2016-04-28
US10099262B2 (en) 2018-10-16
FI3003583T3 (en) 2023-01-13
FR3006209B1 (en) 2016-05-06
HK1222821A1 (en) 2017-07-14
ES2934153T3 (en) 2023-02-17
FR3006209A1 (en) 2014-12-05
SI3003583T1 (en) 2023-01-31
WO2014191690A1 (en) 2014-12-04

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