M366695 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種工業電腦，特別是一種五面防水之 工業電腦。 【先前技術】 一般工業用途之工業電腦，例如超商或是餐飲店等使 用於櫃檯點餐或結帳用的工業電腦，由於使用上容易潑及 液體，故對於防水性的要求較高。目前業界的標準是「五 面防水」，也就是前、後、左、右及上面等五面須達到防水 效果。 然而為了達到五面防水的效果，封閉的外殼反而容易 造成電腦内部高溫不易散熱。工業用途之工業電腦開機時 間長，甚至可能需要24小時運作，電腦内部很容易因為零 件運作產生高溫，因此非常需要有良好的散熱機制。目前 一般的散熱機制通常是利用後殼設置數條散熱鰭，使電腦 内部的高溫散熱，然而此一機制的散熱效果有限，實有必 要提供一種可更有效散熱的工業電腦，以避免零件運作的 高溫而造成零件毀損或當機。 【新型内容】 本創作之主要目的係在提供一種可更有效散熱的工業 電腦。本創作之另一目的係提供一種可避免零件毀損或當 機的工業電腦。本創作之再一目的係提供一種具有限制機 3 M366695 板南度的工業電腦。 為達成上述之目的，本創作提供一種工業電腦，其包 括一前框、一後殼、一機板及一顯示榮幕，其中該機板係 鎖附在該後殼，且顯示螢幕係位在前框與機板之間，將前 框與後殼彼此鎖附，以形成五面防水之工業電腦。本創作 之特徵在於：該後殼包括一記憶體散熱塊；以及該機板包 括一焊接面與一零件面，其中該零件面包括一輸入/輸出連 ‘ 接埠(I/O port)，該焊接面包括一記憶體，藉此降低該機板 I 的整體厚度，且該記憶體之位置係對應該記憶體散熱塊， 以降低該記憶體的使用溫度。 在一實施例中，該記憶體散熱塊係與該後殼一體成形 ， 者。在另一實施例中，該記憶體散熱塊係一銅塊附著固定 在該後殼。 該後殼更包括一散熱空間，該散熱空間是位於該機板 之一邊緣至該後殼之一頂面之間。 在本實施例中，該後殼更包括一凹槽通道，該凹槽通 φ 道係延伸至該後殼之一底面，以使該輸入/輸出連接埠被包 覆在該凹槽通道之内。 顯示螢幕為15吋之顯示螢幕時，散熱空間之一高度實 質約為6.0公分，且該凹槽通道之一高度實質約為5.6公分。 該後殼更包括複數散熱鰭，該複數散熱鰭係位於該後 * 殼之一外表面，以降低該記憶體的使用溫度。較佳者，該 ‘ 複數散熱鰭係自該後殼之該頂面之一中間處延伸至該外表 面底部。 4 M366695 在-較佳實施例中，後殼更包括 硬碟蓋。硬碟容置空間係供容置一硬碟，間 係位於後殼的外表面，且硬碟鋪由複數彈性體固定在硬 碟；置空I1:，係覆蓋硬碟容置空間，以使該後殼之 外表面形成防水©。者，該散熱墊片係 該硬碟蓋之間。複數彈性體實㈣防熱橡膠或防埶3與 亦或者複數彈性體實質可以係彈簧或彈片固定在硬】容 空間之四周，以提供彈力錢硬碟被固定在硬碟容置空置 間，而無需使用任何的螺絲鎖附硬碟，而且還可利ς 體所提供的彈力，提供更好的避震效果。 【實施方式】 為能讓本創作之上述和其他目的、特徵和優點能 顯易懂，下文特舉出本創作之具體實施例，並配 式，作詳細說明如下。 、園 本創作之主要目的係在提供一種可更有效散熱的 電腦。本創作之另一目的係提供一種可避免零件毀損ς 機的工業電腦。本創作之再—目的係提供—種限^ 板高度的工業電腦。 制機 請同時參考圖1與圖2,本創作提供一種工業電腦 100 ’其包括一前才匡卜―後殼2、一機板4及一顯'示榮^ 3。機板4係鎖附在後殼2。顯示螢幕3係位在前框i與機 板4之間，將前樞丨與後殼2彼此鎖附，即形成五面防水 之工業電腦。 7 請參考圖2，本創作之後殼2包括一記憶體散熱塊22 5 M366695 項技藝者當可了解，利用後殼2 -體成形的晶體散熱塊21 或非-體成形的散熱銅塊9，亦可提供各種發熱零件(像是 如上所述的南、北橋等晶體或處理器）達到散熱效果。 如圖2顯示處理器散熱銅塊9係固定在後殼2的凹槽 210，而非與後殼2 一體成形。較佳者，各零射記憶體、 處理器或晶體)係藉由一零件散熱墊片91_93而分別與散熱 塊22、21及散熱銅塊9相接觸，以提供較佳之散熱效果。 零件散熱墊片91-93可以是彈性橡膠材質，不僅提散熱 φ 效果’亦提供彈性避震效果。 請參考圖2 ’本創作之後殼2更包括—散熱空間26。 請參考圖3，該散熱空間26是位於機板4之一邊緣4〇〇至 ' 後殼2之頂面29之間。較佳者，顯示螢幕3為15吋之顯 • 示螢幕時’散熱空間26之高度L1實質約為6.〇公分，以 使機板4到後殼2之頂面的間距加大’提供對流空間，而 達到更佳之散熱效果。 請先回到圖2 ’在本實施例中，該後殼2更包括一凹槽 • 通道23。如圖3所示，該凹槽通道23係延伸至該後殼2 之底面27,以使輸入/輸出連接埠421被包覆在該凹槽通道 23之内。較佳者，顯示螢幕3為15吋之顯示螢幕時，該 凹槽通道23之高度L2實質約為5·6公分。由於凹槽通道 23的高度較高，因此，雖然工業電腦1〇〇提供五面防水的 功能’然而凹槽通道23的牆面高度當可使此未防水之底面 •也能有避免液體由下方潑及的功能。 請同時參考圖3與圖4,本創作之後殼2更包括複數散 熱鰭28，該複數散熱鰭28係位於後殼2之一外表面，以 7 M366695 降低處理器411或該記憶體421(圖2)的使用溫度。較佳者， 散熱鰭28係自s亥後殼2之頂面29之一中間處延伸至外表 面的底部。由於本創作之散熱鰭28的線條拉長，熱流上升 時的路徑加長’因此散熱鰭28的散熱效果當可較傳統更 好0 在一較佳實施例中，如圖4所示，後殼2更包括一硬 碟容置空間24與一硬碟蓋25。硬碟容置空間24係供容置 一硬碟5。本創作之硬碟容置空間24係位於後殼2的外表 面’且硬碟5係藉由複數彈性體61_62固定在硬碟容置空 間24。複數彈性體61_62實質伽熱橡膠或防熱海綿放置 在硬碟容置空間24之四周，以提供彈力而使硬碟5被固定 =碟谷置空間24内。亦或者複數彈性體實質可以係彈 二或彈片（圖未示）固定在硬碟容置空間％之四周，以提供 5而使硬碟5被固^在硬碟容置空間24内。因此本創作 =使用任何的螺絲鎖附硬碟5，而且還可利用彈性體 所提供的彈力，提供更好的避震效果。 面來HI 25係、覆蓋硬碟容置空間24,以使後殼2之外表 水面。較佳者’後殼2更包括一散孰勢片8，且 片8係位於該硬碟5與該硬碟蓋25之間。此外， 包二另一散熱塾片81位於硬碟5與硬碟容置空 熱替片。曰散.、、、塾片8 $ 81亦可以是彈性橡膠材質的散 綜上所陳，本創作無論就 顯示其迥異於習知技術之特徵 查委員明察，早曰賜准專利， 目的、手段及功效，在在均 ，為—大突破，懇請貴審 俾嘉惠社會，實感德便。惟 8 M366695 須注意，上述實施例僅為例示性說明本創作之原理及其功 效，而非用於限制本創作之範圍。任何熟於此項技藝^人 士均可在不違背本創作之技術原理及精神下，對實施例作 修改與變化。本創作之權利保護範圍應如後述之申請專利 範圍所述。 【圖式簡單說明】 圖1係本創作之工業電腦外觀立體圖。 • 圖2係本創作之工業電腦的機板與後殼爆炸圖。 圖3係依據圖一，顯示其局部剖面圖。 圖4係依據本創作之後喊’顯不硬碟與後殼之組裝立體圖。 【主要元件符號說明】 工業電腦1〇〇 後殼2 機板4 晶體散熱塊21 記憶體散熱塊22 機板的零件面42 處理器411 散熱空間26 後殼之頂面29 該後殼之底面27 硬碟容置空間24 前框1 顯示螢幕3 處理器散熱銅塊9 機板的焊接面41 輪入/輸出連接埠421 記憶體412 機板之邊緣400 凹槽通道23 散熱鰭28 硬碟蓋25 M366695 硬碟5 彈性體61-62 散熱墊片8、91-93、63M366695 V. New description: [New technical field] This creation is about an industrial computer, especially a five-sided waterproof industrial computer. [Prior Art] Industrial computers for general industrial use, such as supermarkets or food and beverage stores, are used in industrial computers for counter ordering or checkout, and are highly resistant to water repellency because they are easily splashed and liquid. At present, the industry standard is "five-sided waterproof", that is, the front, rear, left, right and top five sides must achieve waterproof effect. However, in order to achieve the effect of five-sided waterproofing, the closed casing is likely to cause high temperature inside the computer and is not easy to dissipate heat. Industrial PCs for industrial use have a long boot time and may even require 24 hours of operation. The internals of the computer are prone to high temperatures due to part operation, so a good heat dissipation mechanism is required. At present, the general heat dissipation mechanism usually uses a plurality of heat dissipating fins in the rear case to heat the internal heat of the computer. However, the heat dissipation effect of this mechanism is limited, and it is necessary to provide an industrial computer that can more effectively dissipate heat to avoid the operation of the parts. High temperature causes parts to be damaged or crashed. [New Content] The main purpose of this creation is to provide an industrial computer that can dissipate heat more efficiently. Another object of the creation is to provide an industrial computer that can prevent parts from being damaged or crashed. A further object of the present invention is to provide an industrial computer with a limit of 3 M366695. In order to achieve the above object, the present invention provides an industrial computer comprising a front frame, a rear case, a machine board and a display screen, wherein the board is locked to the rear case and the display screen is in the position Between the front frame and the machine board, the front frame and the rear case are locked to each other to form a five-sided waterproof industrial computer. The present invention is characterized in that the rear case comprises a memory heat sink block; and the machine board comprises a soldering surface and a part surface, wherein the part surface comprises an input/output port (I/O port), The soldering surface includes a memory, thereby reducing the overall thickness of the board I, and the location of the memory is corresponding to the memory heat sink to reduce the operating temperature of the memory. In one embodiment, the memory heat sink block is integrally formed with the rear case. In another embodiment, the memory heat sink block is attached to the back shell by a copper block. The rear case further includes a heat dissipating space between the edge of one of the plates and a top surface of the rear case. In this embodiment, the rear case further includes a groove passage extending through the φ system to a bottom surface of the rear case such that the input/output port is covered in the groove channel . When the screen is displayed with a screen of 15 inches, one of the heat dissipation spaces is approximately 6.0 cm in height, and one of the groove channels is substantially 5.6 cm in height. The back shell further includes a plurality of heat sink fins, the plurality of heat sink fins being located on an outer surface of the back shell to reduce the use temperature of the memory. Preferably, the 'plural heat sink fins extend from the middle of one of the top faces of the rear case to the bottom of the outer face. 4 M366695 In the preferred embodiment, the rear case further includes a hard disk cover. The hard disk accommodating space is for accommodating a hard disk, and the middle portion is located on the outer surface of the rear case, and the hard disk is fixed on the hard disk by a plurality of elastic bodies; the empty space I1: covers the hard disk accommodating space, so that The outer surface of the rear case is formed to be waterproof ©. The heat sink is between the hard disk covers. The plurality of elastomers (4) heat-proof rubber or tamper-proof 3 and or a plurality of elastomers may be fixed by springs or shrapnel around the hard space to provide a stretch hard disk to be fixed in the hard disk vacant space without Use any screw to attach the hard drive, and also provide the spring force provided by the body to provide better shock absorption. [Embodiment] The above-described and other objects, features and advantages of the present invention will become apparent from the following description. The main purpose of this creation is to provide a computer that can dissipate heat more efficiently. Another object of the creation is to provide an industrial computer that avoids damage to parts. The re-creation of this creation is to provide an industrial computer with a height limit. Machines Please refer to Fig. 1 and Fig. 2 at the same time. The present invention provides an industrial computer 100' which includes a front cover, a rear case 2, a machine board 4, and a display 'Zheng Rong^3. The plate 4 is attached to the rear case 2. The display screen 3 is positioned between the front frame i and the board 4, and the front pivot and the rear case 2 are locked to each other to form a five-sided waterproof industrial computer. 7 Referring to FIG. 2, after the creation, the shell 2 includes a memory heat sink 22 5 M366695. As can be understood, the crystal heat sink 21 formed by the rear shell 2 body or the non-body formed heat sink copper block 9 can be understood. A variety of heat-generating parts (such as the South and North Bridge crystals or processors as described above) can also be provided to achieve heat dissipation. As shown in Fig. 2, the processor heat-dissipating copper block 9 is fixed to the recess 210 of the rear case 2 instead of being integrally formed with the rear case 2. Preferably, each of the zero-shot memory, processor or crystal is contacted with the heat-dissipating blocks 22, 21 and the heat-dissipating copper block 9 by a heat-dissipating spacer 91_93, respectively, to provide a better heat dissipation effect. The part cooling pad 91-93 can be made of elastic rubber, which not only provides heat dissipation φ effect but also provides elastic suspension effect. Please refer to FIG. 2' After the creation, the shell 2 further includes a heat dissipation space 26. Referring to FIG. 3, the heat dissipation space 26 is located between one edge 4 of the board 4 to the top surface 29 of the rear case 2. Preferably, the display screen 3 is 15 inches. When the screen is displayed, the height L1 of the heat dissipation space 26 is substantially about 6. centimeters, so that the spacing between the top surface of the plate 4 and the rear case 2 is increased to provide convection. Space for better heat dissipation. Please return to Fig. 2'. In the present embodiment, the rear case 2 further includes a groove/channel 23. As shown in FIG. 3, the groove passage 23 extends to the bottom surface 27 of the rear case 2 so that the input/output port 421 is covered in the groove passage 23. Preferably, when the screen 3 is displayed as a display screen of 15 inches, the height L2 of the groove passage 23 is substantially about 5.6 cm. Due to the high height of the groove channel 23, although the industrial computer provides a five-sided waterproof function, the wall height of the groove channel 23 can be used to prevent the liquid from being underneath. Splashing function. Referring to FIG. 3 and FIG. 4 simultaneously, after the creation, the shell 2 further includes a plurality of heat-dissipating fins 28, which are located on an outer surface of the rear shell 2, and the processor 411 or the memory 421 is lowered by 7 M366695 (Fig. 2) The operating temperature. Preferably, the heat sink fins 28 extend from the middle of one of the top faces 29 of the rear cover 2 to the bottom of the outer face. Since the line of the heat sink fin 28 of the present invention is elongated, the path when the heat flow rises is lengthened. Therefore, the heat dissipation effect of the heat sink fin 28 can be better than the conventional one. In a preferred embodiment, as shown in FIG. 4, the rear case 2 is shown. Furthermore, a hard disk accommodating space 24 and a hard disk cover 25 are included. The hard disk accommodating space 24 is for housing a hard disk 5. The hard disk accommodating space 24 of the present invention is located on the outer surface of the rear case 2, and the hard disk 5 is fixed to the hard disk accommodating space 24 by a plurality of elastic bodies 61_62. The plurality of elastic bodies 61_62 are substantially placed around the hard disk accommodating space 24 to provide an elastic force to fix the hard disk 5 in the dish space 24. Alternatively, the plurality of elastic bodies may be attached to the hard disk accommodating space by fixing the elastic disk 2 or the elastic piece (not shown) around the % of the hard disk accommodating space to provide the hard disk 5 in the hard disk accommodating space 24. Therefore, this creation = use any screw to attach the hard disk 5, and also use the elastic force provided by the elastic body to provide better shock absorption. The surface is HI 25, covering the hard disk accommodation space 24 so that the rear case 2 is outside the surface. Preferably, the rear case 2 further includes a diffuser sheet 8, and the sheet 8 is located between the hard disk 5 and the hard disk cover 25. In addition, the other heat dissipating film 81 of the package 2 is located on the hard disk 5 and the hard disk receiving empty heat piece.曰散,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, And the efficacy, in the mean, for the big breakthrough, I ask you to review the Jiahui society, the real sense of virtue. 8 M366695 It should be noted that the above-described embodiments are merely illustrative of the principles of the present invention and its effects, and are not intended to limit the scope of the present invention. Anyone who is familiar with this skill can modify and change the embodiment without violating the technical principles and spirit of this creation. The scope of protection of this creation should be as described in the scope of the patent application described later. [Simple description of the diagram] Figure 1 is a perspective view of the industrial computer appearance of the creation. • Figure 2 is an exploded view of the machine and rear casing of the industrial computer of this creation. Figure 3 is a partial cross-sectional view of Figure 1 in accordance with Figure 1. Figure 4 is an assembled perspective view of the hard disk and the rear case after the creation. [Main component symbol description] Industrial computer 1〇〇 Backshell 2 Board 4 Crystal heat sink 21 Memory heat sink 22 Part of the machine board 42 Processor 411 Heat dissipation space 26 Top surface of the back shell 29 The bottom surface of the back shell 27 Hard disk accommodating space 24 Front frame 1 Display screen 3 Processor cooling copper block 9 Machine board welding surface 41 Wheel input/output connection 埠 421 Memory 412 Board edge 400 Groove channel 23 Heat sink fin 28 Hard disk cover 25 M366695 Hard disk 5 Elastomer 61-62 Thermal pad 8, 91-93, 63