M355006 八、新型說明： 【新型所屬之技術領域】 本創作係一種有關於散熱模組之技術領域，尤指—種 可有效提咼散熱效果之散熱模組結構。 【先前技術】 >胃 > 閱第五圖所不’一般針對會發熱的電子元件而設 十的U置，係針對一發熱元件（丄3 〇 )言史置複數個 散熱鰭片nn、+ & ^ UU)來進行散熱或是於散熱鰭片（1〇〇) 上f配一冷卻風扇（1 1 〇 )來加強散熱效果’習用的散 熱破置，係以金屬材料或以陶瓷材料所製成，於一底座（i 2 Μ上設置複數個散熱·鰭片（1 0 ◦)，該散熱裝置的 係係透過一散熱膏（1 3 1 )接合於該發熱元件（工 3 〇 )上，使得該散熱裝置來散逸該發熱元件（i 3 〇 ) 所產生的熱’藉著該複數個散熱鰭片（100)擴大散埶 區域，來達到散熱的功效。 ，、”、、 簡吕之，習用散熱裝置主要係以一底座（丄2 〇 )透 、放熱膏（131)與一發熱元件（130)相接合， 再㈣固設於底座（1 2 G )上的複數個散熱鰭片（丄〇 〇)來擴大散熱區域，增加與空氣接觸的面積該散熱鰭 片（1〇〇)上可再設置一冷卻風扇（11〇)，藉由該 ”八1扇（1 1 〇 )吹風產生氣流，使得該散熱鲒片（1 〇 〇)的熱流往四周流動，來加強散熱的效果，惟，該冷 部風扇（1 1 0)無可避免會產生嗓音與震動等問題。習 用的散熱装置—般係以金屬材料加工而成，其底座（i 2 5 M355006 〇)具有相當的厚度，底座（12〇)吸收的熱要熱傳導 至該複數個散熱鰭片（i 0 0)的速度較慢，且主要熱傳 導方向為往上的單一方向，散熱效果有限，所以習用金屬 製的散熱鰭片（1〇〇)無法迅速吸收底座（12〇)的 熱源，導致該底座（1〇 〇)容易囤積大部分之熱，造成 散熱效果不佳等情形，實有改良之必要。 【新型内容】 欲解決之技術問題點：習用的散熱裝置係以金屬材料 加工而成，其底座具有相當的厚度，底座吸收的熱要熱傳 導至該複數個散熱鰭片的速度較慢，所以習用金屬材料加 工的散熱鰭片無法迅速吸收底座的熱源，導致該底座容易 囤積大部分之廢熱，造成散熱效果不佳等情形，實有改良 之必要。 解決問題的技術特點：提供一種散熱模組結構，係包 括：一導熱盒體、一錫膏層、一銦層、一溫度擴散板、— 導熱矽酮膠層與一碳化矽陶瓷片體。其中，該導熱盒體係 透過一散熱膏與一發熱元件相接合；該錫膏層係塗佈設於 該導熱盒體内；該銦層係設於該錫膏層上；該溫度擴散板 包括一頂面與一底面，該溫度擴散板係為一導熱用的溫度 擴散板’該溫度擴散板的該底面係與該銦層相接合.节導 熱矽酮膠層係設於該温度擴散板的該頂面上；該碳化石夕陶 瓷片體係向下凸設複數個散熱鰭片，該碳化矽陶竟片體係 以該複數個散熱鰭片與該導熱矽酮膠層相接合而蓋設於溫 度擴散板上’各散熱鰭片係與該溫度擴散板形成可提供空 6 M355006 氣對流作用的複數個空氣通道。 ’、中，δ亥$熱盒體係為一銅盒體、一鋼合金人 鋁盒體、一鋁合金盒體或一陶瓷盒體。 π體、 鋁 板 其中，該溫度擴散板係為一銅板、一鋼合 一艇合金板或一陶瓷板。 其中，該發熱元件可為電腦的中央處理器（ 電腦的電源供應器（P 〇We r s u p p ! PU)、 二極體（LED)裝置❶ y)或發光 其中，該導熱盒體包括一頂部，該頂部係向 成一彎折部，該彎折部内係容置有該錫膏層。 / 其中，該導熱盒體更包括一金屬薄片環，該導熱盒體 概呈U形肖大’該金屬薄片環係容置於該導熱盒體内，該金 屬薄片環與該導熱盒體之間係容置有該錫膏層。 ^ 其中，該碳化矽陶瓷片體係等距排列地向下凸設有該 複數個散熱鰭片。 °Χ μ 對照先前技術之功效： 一、本創作係利用碳化石夕陶竟片體的微孔道形成空氣通 道孔道内的空氣吸收熱源後，可以有效形成對流作 用吸入孔道外的空氣來進行對流散熱，再加上該導熱 盒體與該溫度擴散板可往各方向進行熱傳導作用與輻 射作用’使得熱交換更有效率，可以有效提高散熱效 果。 本創作藉著本身的結構與結構材料較佳之導熱特性’ 可以有效將該散熱盒體吸收的熱源，快速地將熱源進 7 M355006 行政逸可以有效達到散熱之功效，有效解決習用散 熱裝置中冷卻風扇所產生的α桑音與震動等問題。 有關本創作所採用之技術、手段及其功效，兹舉一較 佳實把例並配。®式詳細說明如后，相信本創作上述之目 的、構造及其特徵，當可由之得—深人而具體的瞭解。 【實施方式】 請參閱第-圖至第四圖所示，本創作係提供一種散熱 模組結構，係包括：—導熱盒體（1 〇)、-錫膏層（2 0 )、-銦層（3 〇 )、一溫度擴散板（4 〇 )、二導熱 矽酮膠層（50)與一碳化矽陶瓷片體（6〇)。其中， 該導熱盒體（1 〇 )係透過一散熱膏（7丄）肖一發熱元 件（7 0 )相接合；該錫膏層（2 〇 )係均勻分散地塗佈 於該導熱盒體（1 0 ) β ;該麵層（3 0 )係設於該錫膏 層（20)上；該溫度擴散板（4〇)包括一頂面與_底 面，該溫度擴散板（40)料-導μ的溫度擴散板（4 0 ) ’該溫度擴散板（4 0)的該底面係與該銦層（3 〇 ) 相接合；該導熱㈣膠層（5 G )係設於該溫度擴散板（4 0 )的該頂面上；該碳化矽陶莞片體（6 〇 )係向下凸机 複數個散熱縛片（61) ’該碳切陶竟片體（60): 以該複數個散熱鰭“61)與該導熱石夕酮勝層（5〇) 相接合而蓋設於溫度擴散板（4())丨，各散㈣片（6 丄）係與該溫度擴散板（4〇)形成可提供空氣對流作用 的複數個空氣通道（62)。 銅盒體、一銅合金 其中，該導熱盒體（1 〇 )係為M355006 VIII. New Description: [New Technology Field] This creation is a technical field related to heat dissipation modules, especially a heat dissipation module structure that can effectively improve the heat dissipation effect. [Prior Art] >Stomach> See the fifth figure, 'Usually set the U for the electronic components that generate heat, and set a number of heat dissipation fins nn for a heating element (丄3 〇). + & ^ UU) for heat dissipation or a cooling fan (1 1 〇) on the heat sink fin (1〇〇) to enhance the heat dissipation effect. The conventional heat dissipation is made of metal or ceramic material. A plurality of heat dissipation fins (10 ◦) are disposed on a base (i 2 ,), and the heat dissipation device is coupled to the heat generating component through a heat dissipating paste (1 3 1 ) The heat dissipation device is configured to dissipate the heat generated by the heat generating component (i 3 〇) to expand the heat dissipation region by the plurality of heat dissipation fins (100) to achieve the heat dissipation effect. , , , , , The conventional heat dissipating device mainly comprises a base (丄2 〇) through, a heat releasing paste (131) and a heating element (130), and (4) a plurality of heat dissipating fins fixed on the base (1 2 G ). (丄〇〇) to expand the heat dissipation area and increase the area in contact with the air on the heat dissipation fin (1〇〇) A cooling fan (11〇) is further disposed, and the air flow is generated by the “eight 1 fan (1 1 〇) blowing, so that the heat flow of the heat dissipation fin (1 〇〇) flows around to enhance the heat dissipation effect, however, The cold fan (1 1 0) is inevitably causing problems such as noise and vibration. The conventional heat sink is generally made of metal material, and its base (i 2 5 M355006 〇) has a considerable thickness, the base ( 12〇) The heat absorbed by the heat is transmitted to the plurality of heat dissipation fins (i 0 0) at a slower speed, and the main heat conduction direction is a single direction upward, and the heat dissipation effect is limited, so the metal heat dissipation fins are used (1) 〇〇) It is impossible to quickly absorb the heat source of the base (12〇), which causes the base (1〇〇) to easily accumulate most of the heat, resulting in poor heat dissipation, etc., which is necessary for improvement. [New content] Technical problem points: The conventional heat sink is made of metal material, the base has a considerable thickness, and the heat absorbed by the base is transmitted to the plurality of fins at a slower speed, so the metal material is processed. The hot fins cannot quickly absorb the heat source of the base, which makes the base easy to accumulate most of the waste heat, resulting in poor heat dissipation, etc. It is necessary to improve. Technical features of the problem: Provide a heat dissipation module structure, including: a thermal conductive box body, a solder paste layer, an indium layer, a temperature diffusion plate, a thermal conductive ketone rubber layer and a tantalum carbide ceramic sheet body, wherein the thermal conductive box system is coupled to a heating element through a thermal grease; The solder paste layer is coated in the heat conducting box; the indium layer is disposed on the solder paste layer; the temperature diffusing plate includes a top surface and a bottom surface, and the temperature diffusion plate is a temperature for heat conduction The bottom surface of the diffusion plate is bonded to the indium layer. The thermal conductive ketone layer is disposed on the top surface of the temperature diffusion plate; the carbonized stone ceramic film system is protruded downwardly. a heat dissipating fin, the carbonized ceramic tile system is formed by the plurality of heat dissipating fins being bonded to the heat conductive sulphur layer, and the heat dissipating fins are formed on the temperature diffusion plate. 6 M355006 A plurality of air convection channels. In the middle, the δ海$ heat box system is a copper box body, a steel alloy human aluminum box body, an aluminum alloy box body or a ceramic box body. π body, aluminum plate, wherein the temperature diffusion plate is a copper plate, a steel alloy boat alloy plate or a ceramic plate. Wherein, the heating element can be a central processing unit of a computer (a power supply of a computer (P 〇 We supp ! PU), a diode device ( ) y y)) or a light-emitting device, the heat-conductive box body comprising a top, The top portion is formed into a bent portion, and the solder paste layer is accommodated in the bent portion. The heat conducting box body further comprises a foil ring, and the heat conducting box body is substantially U-shaped. The metal foil ring system is received in the heat conducting box body, and between the sheet metal ring and the heat conducting box body The solder paste layer is placed in the system. Wherein, the tantalum carbide ceramic sheet system has the plurality of heat dissipation fins convexly arranged equidistantly. °Χ μ Compared with the efficacy of the prior art: 1. This creation system uses the microporous channels of the carbonized stone yutao ceramics to form the air absorbing heat source in the air passage tunnel, which can effectively form the convection air outside the suction channel for convection. The heat dissipation, together with the heat conduction box and the temperature diffusion plate, can conduct heat conduction and radiation in all directions, which makes the heat exchange more efficient and can effectively improve the heat dissipation effect. The creation of the heat transfer characteristics of the structure by the structure and the structure material can effectively effectively absorb the heat source of the heat-dissipating box body, and quickly transfer the heat source into the heat dissipation effect of the battery, thereby effectively solving the cooling fan in the conventional heat sink. The resulting alpha sang and vibration problems. Regarding the techniques, means and functions used in this creation, it is better to use a better example. The detailed description of the ® formula is as follows. I believe that the above-mentioned purpose, structure and characteristics of the creation can be obtained from the deep-rooted and concrete understanding. [Embodiment] Please refer to the figures - to 4, the creation of a thermal module structure, including: - thermal box (1 〇), - solder paste layer (20), - indium layer (3 〇), a temperature diffuser (4 〇), a two-layer thermal conductive ketone layer (50) and a tantalum carbide ceramic sheet (6 〇). Wherein, the heat conducting box body (1 〇) is joined by a heat dissipating paste (7 丄), and the solder paste layer (2 〇) is uniformly dispersed and applied to the heat conducting box body ( 1 0) β; the surface layer (30) is disposed on the solder paste layer (20); the temperature diffusion plate (4〇) includes a top surface and a bottom surface, and the temperature diffusion plate (40) is material-guided μ of the temperature diffusion plate (40) 'the bottom surface of the temperature diffusion plate (40) is bonded to the indium layer (3 〇); the thermal conductive (4) adhesive layer (5 G) is disposed on the temperature diffusion plate ( The top surface of the 40 ) ; 莞 ; ; 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 向下 向下 向下 向下 向下 向下 向下 向下 向下 向下 向下 向下 向下 向下 向下 向下 向下 向下 向下 向下 向下 向下 向下 向下 向下 向下 向下The fin "61" is joined to the heat conduction layer (5 〇) and is placed on the temperature diffusion plate (4 ()) 丨, each of the scattered (four) pieces (6 丄) and the temperature diffusion plate (4 〇) Forming a plurality of air passages (62) capable of providing air convection. The copper case, a copper alloy, wherein the heat conducting box (1 〇) is
S M355006 盒體、一鋁盒體、一鋁合金盒體或一陶瓷盒體。 其中’該溫度擴散板（4 0 )係為一銅板、_銅人☆ 板、一鋁板、一鋁合金板或一陶瓷板。 其中’該發熱元件（7 0)可為電腦的中央處理器（c PU)、電腦的電源供應器（P〇we r Supp i y) 發光二極體（LED)裝置、電磁爐中的發熱電子元件， 飲水機中的發熱電子元件或相機中的發熱元件等。 Φ 其中，該導熱盒體（1 〇)包括一頂部，該頂部係向 内彎折夹緊形成一彎折部（i i )，該彎折部（1 1 )= 係容置有該錫膏層（20);其中，該導熱盒體（10) 的設計亦可設計成不具彎折部（11)，而是透過一金屬 薄片環，容置於概呈u形狀的該導熱盒體（i 0)内，該 金屬薄片環與該導熱盒體（i 〇 )之間係容置有該錫膏層 (2 0 )，藉此，來取代該彎折部（丄i )的設計。 ▲其中’該碳切陶U冑（6 0 )係等距排列地向下 _ 凸設有該複數個散熱鰭片（61)。 、、’m而α首先，本創作係利用礙化石夕陶瓷片體的微S M355006 Box, an aluminum case, an aluminum case or a ceramic case. Wherein the temperature diffusing plate (40) is a copper plate, a copper man ☆ plate, an aluminum plate, an aluminum alloy plate or a ceramic plate. The 'heating component (70) can be a computer's central processing unit (cPU), a computer power supply (P〇we r Supp iy) light emitting diode (LED) device, and a heating electronic component in the induction cooker. Heated electronic components in the water dispenser or heating elements in the camera. Φ wherein the heat conducting box body (1 〇) includes a top portion, and the top portion is bent inwardly to form a bent portion (ii), and the bent portion (1 1 )= is configured to receive the solder paste layer (20); wherein the heat conducting box body (10) is also designed not to have a bent portion (11), but is received through a foil ring to accommodate the heat conducting box body having an u shape (i 0 The solder paste layer (20) is accommodated between the foil ring and the heat conducting box (i), thereby replacing the design of the bent portion (丄i). ▲ wherein the carbon cut ceramic U 胄 (60) is equidistantly arranged downwardly _ convexly provided with the plurality of heat radiating fins (61). ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,
行散逸 ，可以有效達到散熱之功效 熱源，快速地將熱源進 ’並有效解決習用散熱 9 M355006 裝置中冷卻風扇所產生的噪音與震動等問題。 前文係針對本創作之可行ft 進行具體說明；惟，孰采“斗 个钔作之技術特徵 創作之精神與原則下對 脫離本 ,./4r 十本創作進行變更與修改，而該等變 更與修改，皆應涵荼於上τ山 Γ ^ ^ 蓋於如下申請專利範圍所界定之範疇中。 【圖式簡單說明】 疋&軌对甲Dissipating the line can effectively achieve the effect of heat dissipation. The heat source can quickly heat the heat source and effectively solve the problem of noise and vibration generated by the cooling fan in the M M35006 device. The previous section is specific to the feasible ft of this creation; however, it is subject to the changes and modifications of the creation of the syllabus under the spirit and principle of the technical characteristics of the creation of the actor, and the changes and modifications Modifications should be included in the upper τ 山Γ ^ ^ Covered in the scope of the following patent application scope. [Simple diagram] 疋 & rail-to-arm
第圖.係本創作可行實施例之立體外觀示意圖。 第二圖：係本創作可行實施例之剖面狀態示意圖。 第三圖：係本創作可行實施例之爆炸示意圖。 第四圖·係本創作可行實施例之散熱狀態示意圖。 第五圖：係習用散熱裝置之散熱狀態示意圖。 【主要元件符號說明】 •習用部份.Figure 3 is a perspective view of a three-dimensional appearance of a possible embodiment of the present invention. Second: A schematic diagram of the cross-sectional state of a possible embodiment of the present invention. The third figure is a schematic diagram of the explosion of the feasible embodiment of the present invention. The fourth figure is a schematic diagram of the heat dissipation state of the presently feasible embodiment. Figure 5: Schematic diagram of the heat dissipation state of the conventional heat sink. [Main component symbol description] • Conventional part.
(100)散熱鰭片 (1 2 0 )底座 (1 3 1 )散熱膏 •本創作部份. (1 0)導熱盒體 (2 0 )锡膏層 (4 0 )溫度擴散板 (6 0 )碳化石夕陶曼片體 (6 2 )空氣通道 (7 1 )散熱膏 (110)冷卻風扇 (130)發熱元件 (11)彎折部 (3 0 )銦層 (50)導熱矽酮膠層 (6 1 )散熱鰭片 (7 0 )發熱元件(100) Heat sink fin (1 2 0) base (1 3 1) heat sink paste • This creation part. (1 0) Thermally conductive box body (20) Solder paste layer (40) Temperature diffusion plate (60) Carbonized stone 陶陶曼片 (6 2 ) Air channel (7 1 ) Thermal grease (110) Cooling fan (130) Heating element (11) Bending part (30) Indium layer (50) Thermally conductive ketone layer ( 6 1) Heat sink fin (7 0) heating element