M350209 八 新型說明： 【新型所屬之技術領域】 I創作是有電 元 件封褒用基板，以及封特別疋有關於一 •電子 ，【先前技術】 裝有電子讀之魏板模組。 .單獨業能日益複雜，牽涉技術層面越來越廣， •功能模組，例如注於某項技術領域面研發生產相應 將這此功鮮㈣μ 全球定位純模組。而下遊業者 子產口起來即可向用戶提供高整合度、多功能之電 個引==:裝於一電基板内，電路基板内具有複教 (例如最常見:表面貼將可通過姻裝技w 〜 凌技術）將这些功旎模組與電路板組裝到 周ϋ_·^ι卩I期的電路紐關面上形财結獅似於郵票 π ?“郵票孔，，)的引腳。此種引腳側面可與焊錫 略其杯卵此與焊錫間結合力強’然而由於這種引腳分伟在電 =基板周圍，佔用電路基板的佈線面積，不利於縮小電路基板面 為提升電路基板利用率，人們開發出將引腳設置在電路基板 =面/式（即四方扁平式）。此種引腳不佔用電路板佈線面積， 了路土板可W作減小。然而由於此種引腳側面無法吃錫，因此 、焊錫之間結合力弱，可能導舰麟輸_度較低。 有雲于此’有必要提供一種即可提升電路基板有效佈線兩 積，亦可提升其引腳與焊錫之間結合力之電路基板。 【新型内容】 5 ‘M3 50209 提升升有效佈線面積 提井===目的是提供—種即可提升有效佈線面積’亦可 &升其引腳與卜錫之間結合力之電路板模組。 食广t創種電路基板，其包括分別位其相對兩側的頂部 減和_部與底部分別包括至少—層線路層，該底部之至少 n面上軸有複數_狀_，該頂部對齊於該相狀 之區域係配置使得可分佈導電線路或電子元件。 '在本創作的較佳實施例中，上述之引腳呈凹弧狀。 =本_的較佳實施财，上叙㈣兩 部，及底面相接’或與底部中的—層或數層線路相上、= 只與底面的輸出引腳層相接。 或疋 在本創作的實關巾，上述之底部之側㈣ 個凹壁面，該引腳包括形成於該凹壁面之導電層。 成有複數 本創作還提出一種電路板模組，其包括^ 基板包括分別位其㈣兩侧的頂部與底部， y，該電路 括至少-層線路層，該底部之至少—個側面分別包 ::該頂部對齊於該些凹狀引腳之區域分佈有導電線^ 本創作在電路餘底部_面細成凹狀 引腳側面有助於提高與焊錫之間結合力；其次，Α頁先，凹狀 狀引腳之區域内仍然可以佈設導電線 C頂，齊於該凹 有效佈線面積增加。 /电兀件，電路基板 為讓本創作之上述和其他目的、牲 下文特舉較佳實施例，並配合所式更明顧易懂， 7囘武，作砰細說明如下。 6 M350209 【實施方式】 參閱圖1、圖2及圖3，其分別為根據本創作之一實施例的電 路基板側面圖、俯視圖及分解示意圖。由圖可見，本實施例提供 的電路基板100包括相互疊合之頂部1〇及底部12。頂部1〇與底 邛12分別位於電路基板1〇〇頂面與底面。頂部1〇與底部12大體 呈矩形。頂部10具有四個側面110、頂面111及底面112，底部 12具有四個侧面12〇、頂面12ι以及底面122。頂部10與底部12 外輪廓形狀大小約略相同，且頂部與底部12之側面相互對齊。 亦即，底部12之四個侧面丨2〇分別與頂部10相應之側面11〇位 於電路基板1〇〇的同一側。頂部1〇與底部12分別可包括一層或 多層線路層或者功能層（例如屏蔽層、電源供應層、接地平面層、 電路連接層或模組的輸出引腳層等等）。頂部1〇與底部12内包 3之線路層或功能層之層數可相同，亦可不同。例如，底部12也 可僅包括一層線路層，而頂部1〇包括多層線路層以及功能層。 在本實施例中’底部12之頂面121貼合於頂部10之底面 112/四個側面12〇與頂面121以及底面丨22垂直。每個側面 内形成有複數個凹壁面13〇，凹壁面13〇從頂面121延伸至底面 122亦即’凹壁面130兩端分別與底部12之頂面12ι以及底面 122相接。 " 面13^個凹壁面130上形成有引腳132。引腳132係由沉積於凹壁 d上之導電層（例如銅鑛層）所形成。引腳132可用於各類 號的傳輸’例如向電路基板⑽提供電源、輸入或者輸出 ^虎專。由於頂部1Q與底部12對齊設置，因此凹壁面130以及 部：132 垂直於底部12之頂面121的方向上之投影會落入於頂 可#之底面U2内。可以理解的是，凹壁面130以及引腳132還 形成於底部12之部分側面12Q上，而非在全部的侧面12〇上 7 M350209 都需提供凹壁面130以及引腳132。 珂述之凹壁面130可相互平行排列，每個侧面12〇内之凹壁 面130可等間距設置，每個凹壁面13〇可呈凹弧狀，例如半圓柱 面（即將圓柱沿軸線方向切開之形狀）。相應地，引腳132同樣 呈凹弧狀。然而，可以理解的是，在使本實施例的電路基板 與其他電^板進行組料在㈣m與焊制結合力增強的前提 下，除了前述的凹弧狀之外，還可將凹壁面13〇設為稜柱面或其 他$狀。^底部I2包括多層線路層*者功能層時，可以理解，凹 壁面13G實際上由每騎路層或功能層之側面内形成之凹面共同 形成。由於製程技術之限制’實際上每層線路層或功能層侧面内 之凹面可能無法完全對齊。 本實施例所提供之電路基板削中，底部12之側面12〇内具 複數個凹壁面13G ’其内形成有凹狀引腳132，是以，當電路基 ϋ!0與其他電路板以焊錫之方式進行組裝時，該凹狀引腳132 =供更好的焊錫結合力。另一方面，由於頂部u〇之側面並M350209 VIII New Description: [New Technology Field] I Creation is a substrate for electrical component packaging, and the module is specially related to an electronic device. [Prior Art] A Wei-Board module equipped with an electronic reading. Separate business can become more and more complex, involving more and more technical aspects. • Functional modules, such as those involved in a certain technical field, will develop this (4) μ global positioning pure module. The downstream industry can provide users with high integration and multi-function electricity. ==: Installed in an electric substrate, the circuit board has re-education (for example, the most common: surface stickers will be passed through装 w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w The side of the pin can be soldered to the cup and the bonding force between the solder and the solder is strong. However, since the lead is distributed around the substrate, the wiring area of the circuit board is occupied, which is disadvantageous for reducing the surface of the circuit board. Circuit board utilization, people have developed to set the pin on the circuit board = face / type (that is, quad flat). This pin does not occupy the board wiring area, the road board can be reduced. However, due to this The side of the pin can't eat tin, so the bonding force between the solder is weak, and it may be lower. The cloud is here. It is necessary to provide a way to improve the effective wiring of the circuit board and improve it. A circuit board that combines the force between the pin and the solder. Contents] 5 'M3 50209 Lifting the effective wiring area to raise the well === The purpose is to provide a circuit board module that can increase the effective wiring area' and also increase the bonding force between the pin and the tin. Generating a circuit substrate comprising: a top portion of the opposite sides and a bottom portion respectively including at least a layer circuit layer, the at least n planes of the bottom portion having a plurality of _ _, the top being aligned with the phase The area is configured such that conductive lines or electronic components can be distributed. In the preferred embodiment of the present invention, the above-mentioned pins are concavely curved. = The preferred implementation of the present invention, the above-mentioned (four) two parts, and the bottom surface Docking 'or with the layer- or layer-by-layer line in the bottom, = only connected to the output pin layer of the bottom surface. Or the actual closing towel of this creation, the bottom side (four) concave wall surface of the above, The pin includes a conductive layer formed on the concave wall surface. The present invention also provides a circuit board module including a substrate including a top portion and a bottom portion on both sides of the (four), y, the circuit including at least a layer line Layer, at least one side of the bottom is packaged separately: The top is aligned with the conductive pins in the area of the concave pins. The surface of the circuit is thinned to the side of the concave lead to help improve the bonding force with the solder. Secondly, the first page is concave. The area of the conductive pin C can still be disposed in the area of the pin, and the effective wiring area is increased. The electric circuit board and the circuit board are preferred embodiments of the present invention and other objects. 6 M350209 [Embodiment] Referring to FIG. 1, FIG. 2 and FIG. 3, respectively, a side view of a circuit board according to an embodiment of the present invention is shown. The top view and the bottom 12 are respectively disposed on the top surface and the bottom surface of the circuit substrate 1, respectively. The top 1 and bottom 12 are generally rectangular. The top portion 10 has four sides 110, a top surface 111 and a bottom surface 112. The bottom portion 12 has four sides 12, a top surface 12i and a bottom surface 122. The top 10 and bottom 12 outer contours are approximately the same size and the top and bottom sides 12 are aligned with each other. That is, the side faces 11 of the bottom portion 12 and the side faces 11 corresponding to the top portion 10 are respectively positioned on the same side of the circuit substrate 1A. The top 1 and bottom 12, respectively, may include one or more layers or functional layers (e.g., a shield, a power supply layer, a ground plane layer, a circuit connection layer, or an output pin layer of a module, etc.). The number of layers of the circuit layer or the functional layer of the top 1 and the bottom 12 may be the same or different. For example, the bottom portion 12 may also include only one layer of wiring, while the top portion 1 includes multiple layers of wiring layers and functional layers. In the present embodiment, the top surface 121 of the bottom portion 12 is attached to the bottom surface 112 of the top portion 10 / the four side surfaces 12 垂直 are perpendicular to the top surface 121 and the bottom surface 丨 22 . A plurality of concave wall surfaces 13 are formed in each side surface, and the concave wall surface 13 extends from the top surface 121 to the bottom surface 122. That is, both ends of the concave wall surface 130 are respectively in contact with the top surface 12i of the bottom portion 12 and the bottom surface 122. " The surface 13 is formed with a pin 132 on the concave wall surface 130. The lead 132 is formed by a conductive layer (e.g., a copper ore layer) deposited on the concave wall d. Pin 132 can be used for the transmission of various types, for example, providing power, input or output to the circuit substrate (10). Since the top 1Q is aligned with the bottom 12, the projection of the concave wall surface 130 and the portion 132 perpendicular to the top surface 121 of the bottom portion 12 will fall within the bottom surface U2 of the top surface #2. It can be understood that the concave wall surface 130 and the lead 132 are also formed on a portion of the side surface 12Q of the bottom portion 12, rather than on all of the side surfaces 12, and the M350209 is required to provide a concave wall surface 130 and a lead 132. The concave wall surfaces 130 can be arranged in parallel with each other, and the concave wall surfaces 130 in each side surface 12 can be equally spaced, and each concave wall surface 13 can be concavely curved, for example, a semi-cylindrical surface (that is, the cylinder is cut along the axial direction). shape). Accordingly, the pins 132 are also concavely curved. However, it can be understood that, under the premise that the circuit board of the present embodiment and the other electric board are combined with the (iv) m and the welding bonding force, the concave wall surface 13 can be added in addition to the concave arc shape described above. 〇 Set to prism face or other $ shape. When the bottom portion I2 includes a multi-layer wiring layer* functional layer, it is understood that the concave wall surface 13G is actually formed by a concave surface formed in each side of the riding layer or the functional layer. Due to limitations in process technology, the surface of each layer or functional layer may not be perfectly aligned. In the circuit substrate cutting provided in this embodiment, the side surface 12 of the bottom portion 12 has a plurality of concave wall surfaces 13G' having concave pins 132 formed therein, so that when the circuit is based on ϋ!0 and other circuit boards are soldered In the manner of assembly, the female pin 132 = for better solder bonding. On the other hand, due to the side of the top u〇
土面目此頂部UG巾靠近側面UG處的部分，或者說 132之部分仍然可以佈設各種電路，例如導電線路、 十，積體電路等。相較於先前技術中之“郵票孔，，之設計方 二Γ。之面積被充分利用，因此電路基板100可製作 ΐ提供更i之3樣面積之電路基板，採用本實施例之設計者將 電路ίΓϋ’本實施例提供之電路板模組係在上述實施例之 上封裝複數個電路201所形成。由於凹壁面130僅 ill針眘π 土^ 100之底部12,因此電路基板100頂部10之頂面 項部W之内層線路^仍然可以似電路201。可以理解， 對應於凹壁面130之區域同樣可以佈設電 •M350209 路。電路观係可為導線、電阻、電容、電感、積體電路、 元件或是其他的主動或被動元件等等。 、 又盪 請參照® 5,其為本_另—實施綱提供的電 視圖。與圖4所示之實施例不同者在於，本實 電ς = 組3〇〇僅在其中-側面設置有前述的凹壁面13Q，並=== 130來設置引腳；相對的，電路板模組3〇〇的其他側面可採^ 於習知技術處所提及的方式，亦即，將引腳設置 : 的形式，來設置相對的引腳。 S板底面 接下來請參照圖6八與犯，其中，圖6八為根據本創作一 例之電路板模組的下視圖，而圖6B則為沿著圖6A中之二 DD’所得的側面剖視圖。電路板模組⑼具有底部_與頂部 670。在底部6GG的侧面62設置有多個輸人/輸出腳位612或、614。 其中，輸入/輸出腳位612包括了由底部導電部分612&與凹壁面上 塗布的導電層612b所組成的凹狀引腳；類似的，輸人/輸出腳位 614包括了由底部導電部分61乜與凹壁面上塗布的導電層μ牝所 組成的凹狀引腳。在頂部67〇上可設置有多個電路672與674。而 在底部6GG則包括-個凹槽61Q。在凹槽61Q中可以設置有電路 620以及控制端子63〇。一般而言，電路62〇、672與674可為積 體電路、電子元件或導線之任一者或其組合。 雖然如圖6B所示，凹槽610的四周側面65〇是平坦的，但在 另一個實施例中，凹槽的四周側面也可以使用凹狀引腳做為輸入/ 輸出腳位。請參見圖7A與圖7B，其中，圖7A為根據本創作一實 施例之電路基板的下視圖，而圖7B則為沿著圖7A中之剖面線 EE所得的側面剖視圖。本實施例大致上的架構與圖八及b所示 之實施例相同，在此不予贅述。其不同處在於，在凹槽61〇的四 周側面650上，包括了至少一個以上的凹狀引腳，此凹狀引腳包 9 M350209 括了底部導電部分720a與凹壁面上塗布的導電層72%。換言之， ，凹槽610的四周侧面65〇上也可以使用類似郵票孔的設計結構 來形成輸入/輪出腳位。 ’在本創作之桃板模財，通過僅在電路基板底 或多個側面處形成凹狀引腳，使得電路板模組 二，電路板組裝時可以在引腳與焊錫間提供良好結合力， 格便传電路板核組可製作得更小。 創作雖;〒以較佳實施例揭露如上’然其並非用以限定本 可作些許之^1技#者，在不脫離本創作之精神和範圍内，當 專利範圍所界ί者:::因此本創作之保護範圍當咖 【圖式簡單說明】 ^ ^本只知例提供之電路基板侧面示意圖。 圖為圖1的電路基板俯視圖。 圖3為®1的電路基板分解示意圖。 圖4為根據本創作之一實施例提 圖5為根摅太j抚伢之電路板模組俯視圖。 圖路板柄組俯視圖。 圖紐為沿著圖Γ中之：Γηη "組的下視圖。 圖7Α為根據ϋ # ^ 所得的側面剖視圖。 圖化為沿著圖Μ中之叫面綠ΡΡ路板极組的下視圖。 【主要元件符號說明】 、、' 所得的側面剖視圖。 100 :電路基板 10、670 ··頂部 12、600 :底部 M350209 62、120 :底部的侧面 111 :頂部的頂面 112 :頂部的底面 110 :頂部的側面 121 :底部的頂面 122 :底部的底面 130 :凹壁面 132 :引腳 200、 300 :電路板模組 201、 620、672、674 :電路 612、614 :輸入/輸出腳位 612a、614a、720a :底部導電部分 612b、614b、720b :凹壁面上的導電層The top surface of the UG towel near the side UG, or the portion of the 132 can still be arranged with various circuits, such as conductive lines, ten, integrated circuits and the like. Compared with the "design of the stamp hole" in the prior art, the area of the design is fully utilized, so that the circuit substrate 100 can be fabricated to provide a circuit board having a larger area of 3, and the designer using the embodiment will The circuit board module provided in this embodiment is formed by encapsulating a plurality of circuits 201 on the above embodiment. Since the concave wall surface 130 is only ill pin π soil 100, the top portion 10 of the circuit substrate 100 The inner layer line of the top surface portion W can still be similar to the circuit 201. It can be understood that the electric field M350209 can also be disposed corresponding to the area of the concave wall surface 130. The circuit view can be a wire, a resistor, a capacitor, an inductor, an integrated circuit, Components or other active or passive components, etc. Also refer to ® 5, which is a TV diagram provided for the implementation of the _ another - implementation. The difference from the embodiment shown in Figure 4 is that the actual ς = The group 3 is only provided with the aforementioned concave wall surface 13Q on the side surface thereof, and === 130 to set the pins; in contrast, the other sides of the circuit board module 3〇〇 can be taken from the conventional technology. And the way, that is, the pin Set the form of the opposite pins to set the opposite pins. The bottom surface of the S board is next to Figure 6 and the following figure. Figure 6 is a bottom view of the circuit board module according to an example of the present creation, and Figure 6B is the edge. A side cross-sectional view taken from the second DD' in Fig. 6A. The circuit board module (9) has a bottom _ and a top 670. The side 62 of the bottom 6GG is provided with a plurality of input/output pins 612 or 614. The output pin 612 includes a concave pin formed by the bottom conductive portion 612& and the conductive layer 612b coated on the concave wall surface; similarly, the input/output pin 614 includes the bottom conductive portion 61 and the concave wall surface. a concave pin formed by the coated conductive layer μ. A plurality of circuits 672 and 674 may be disposed on the top portion 67. The bottom portion 6GG includes a groove 61Q. The groove 61Q may be disposed in the groove 61Q. Circuit 620 and control terminal 63. In general, circuits 62A, 672, and 674 can be any one or combination of integrated circuits, electronic components, or wires. Although shown in Figure 6B, the sides of groove 610 65〇 is flat, but in another embodiment, the groove A concave pin can also be used as the input/output pin on the four sides. Please refer to FIG. 7A and FIG. 7B, wherein FIG. 7A is a bottom view of the circuit substrate according to an embodiment of the present invention, and FIG. 7B is along A side cross-sectional view taken along the line EE in Fig. 7A. The structure of the present embodiment is substantially the same as that of the embodiment shown in Figs. 8 and b, and will not be described here. The difference lies in the side of the groove 61〇. 650, comprising at least one or more concave pins, the concave lead package 9 M350209 includes a bottom conductive portion 720a and a conductive layer coated on the concave wall surface 72%. In other words, the peripheral side 65 of the groove 610 It is also possible to use a design structure similar to a stamp hole to form an input/rounding position. 'In this creation of the peach plate model, by forming a concave pin only at the bottom or sides of the circuit board, the circuit board module 2, the circuit board can be assembled to provide a good bond between the pin and the solder. The grid board core group can be made smaller. Although the invention is disclosed in the preferred embodiment as described above, it is not intended to limit the scope of the patent, and the scope of the patent is delimited::: Therefore, the scope of protection of this creation is as follows: [Simple description of the drawing] ^ ^ This is only a schematic view of the side of the circuit board provided by the example. The figure is a top view of the circuit board of Fig. 1. FIG. 3 is an exploded perspective view of the circuit board of the ®1. 4 is a top plan view of a circuit board module according to an embodiment of the present invention. A top view of the map board handle set. Figure New is the bottom view of the group: Γηη " Figure 7 is a side cross-sectional view taken from ϋ # ^. The graph is the lower view of the group of green slabs along the surface of the map. [Explanation of main component symbols] , , 'The resulting side cross-sectional view. 100: circuit substrate 10, 670 · top 12, 600: bottom M350209 62, 120: bottom side 111: top top surface 112: top bottom surface 110: top side 121: bottom top surface 122: bottom bottom surface 130: concave wall surface 132: pins 200, 300: circuit board modules 201, 620, 672, 674: circuits 612, 614: input/output pins 612a, 614a, 720a: bottom conductive portions 612b, 614b, 720b: concave Conductive layer on the wall