200845836 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種包含兩個 法，其具申請專利範圍第11項所述之概本， 子電路。 ~ ^^㈢予刃鞄閨所述乏概念，及關於一種方 用以製造上述微電 鮮:ΪΓΓ係指表面裝有電子元件之各式電路載板， 來可見之需求，躺尺寸越來越小、電子手统 Κ题势發展續達成例如可攜式或行動式之應 【先前技術】 在已知技術中，舉例來說，已知以彼此平行之插卡 裝多片已裝有電子元件之電路板ϋ已知方式係以各式由 電路板構成讀組為基礎’鱗接或插接核堆疊*成。該等 截至目前為止之所有技術均伴隨各式缺點。以插卡方式為^， 該種多片之電路板設計只有侧邊具接觸點，所能實現之電路複 雜度極為有限。利用-與該電路板呈垂直方向插接連接:互1 置之電路板時，一方面結構高度較高外，另一方面對許多應用 而言，其接點也無法達到足夠之安全性及足夠之低電阻。^使 以焊接方式連接相互疊置之電路板也具有缺點，因烊接過程或 電路組裝過程中所造成之碰觸係無法容忍的。 / 由可彎折之電路載板彎折而成之密實微電子電路，亦為已 知技術。以已知技術構成之該類微電子電路，缺點也是電路拓 撲之複雜性受限。此外，由於所採用之電路載板可彎曲，因此 該種電路之機械穩定度不足，容易受到損傷。 【發明内容】 200845836 ^發明之基本目_創造同—類型之 免雨述缺點，以及麵要求之料尺寸中^、= ’同時避 撲，且該微電予f路之機械特性也必須強電路拓 一目的係提出—_以製造上述微電子電路:本發明之另 所述===係採用:種具申請專利範_項 路，以及採用中請專利範園第η項所述特徵主Γ 範圍附屬項所述之特徵則為本發明優良架構之延伸。3專利 本發明之微電子電路係利用至少一能著震於 以機械核結合其魏餘，該元件 ^ ’ 載板疋連、纟口，因為電路載板不僅能配合所採用之 /、又重功叱，成為孩電路之組成元件之一。另一種僅具電 板機械連接功能之元件，此時即可大量捨棄，甚至完全:棄。 而製造至少兩片電路載板所構成之微電子電路，其相優 艮万法，—片至少局料可彎折之基板所構成之電路載板 上’於不同段落著裝表面著裝元件，再崎疊基板方式使其平 行相，疊ί使電路載板經表面練元件以機械方式彼ς相 連，忒表面元件同時為其中一面電路載板之電路組成元件。 本發明之典型實施方式係利用多個表面著裝元件，以機械 方式將兩個疊至一起之相鄰電路載板加以結合，而該表面元件 至少為其中一面電路載板之電路組成元件，此外該表面著裝元 件於電路載板上之分布方式，能以極大自由度將彼此固定住。 上文所述之基板」，係指包含所有電路層在内之電路載 板整，邊基板除了載體外，至少還包含一層導電層，通常於 7 200845836 兩個表面各有一層導電層，例如鋼導 部為可彎折。 &此處之基板至少局 ^發明之構造係由單--片基板構成所有或部分之 板，其折疊方式係讓基板上相連之二段荩晶八/ 、迅各载 上文所述之「電路载板一 板，也可指一片可彎折或軟硬相間之 上 電路載板。上文所述之「雷跋哉扣—九並开y成一 不僅指完整之單一基 基板可為完全可彎折，或基板僅段落中間 ，許多未彎折或已彎折，成品相互A(局：4可彎折）基板 ............. 宜置<段落中的一段落。 可彎折，但段落本身 則為堅硬之區域，而段落於折疊後即形成電路載板 當基板為完全可彎折時，本發明以表士人。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 ~ ^^(3) The concept of the lack of the blade, and a kind of circuit board used to manufacture the above-mentioned micro-electric fresh: ΪΓΓ refers to the surface of the circuit board equipped with electronic components, to see the needs, the size of the lie more and more Small, electronic hand-to-hand development continues to achieve, for example, portable or mobile applications. [Prior Art] In the known art, for example, it is known to install a plurality of electronic components in parallel with each other. The known method of the circuit board is based on various types of readouts formed by the circuit board. All of these technologies so far have been accompanied by various shortcomings. In the card mode, the multi-chip circuit board design has only the contact points on the side, and the circuit complexity that can be achieved is extremely limited. Utilize - plug-in connection with the board in a vertical direction: when the circuit board is placed on one side, on the one hand, the structure height is high, on the other hand, for many applications, the contact point cannot achieve sufficient safety and sufficient Low resistance. ^ There is also a disadvantage in soldering a circuit board that is stacked on top of each other, because the touch system caused by the splicing process or the circuit assembly process cannot be tolerated. / Compact microelectronic circuits that are bent from bendable circuit carriers are also known in the art. A disadvantage of such microelectronic circuits constructed by known techniques is that the complexity of the circuit topology is limited. In addition, since the circuit carrier used is bendable, such a circuit is insufficient in mechanical stability and is susceptible to damage. SUMMARY OF THE INVENTION 200845836 ^The basic purpose of the invention _ create the same type of rain-free shortcomings, and the size of the material required ^, = ' at the same time avoiding, and the mechanical characteristics of the micro-electric to f-circuit must also be strong circuit The purpose of Tuoyi is to make the above-mentioned microelectronic circuit: the other part of the present invention === is adopted: the patent application patent model _ project road, and the characteristics of the characteristics mentioned in the patent application garden The features described in the scope of the sub-items are an extension of the superior architecture of the present invention. 3 Patent The microelectronic circuit of the present invention utilizes at least one capable of combining the Wei core with a mechanical core, and the component is connected and connected, because the circuit carrier can not only be used in conjunction with, but also heavy. It is one of the components of the circuit. Another component that only has the mechanical connection function of the board can be discarded in large quantities at this time, or even completely: discarded. And manufacturing a microelectronic circuit composed of at least two circuit carriers, which is superior to the method, the chip carrier on which the at least the substrate can be bent is mounted on the surface of the different paragraphs. The stacked substrate mode is such that the parallel phases thereof are stacked, and the circuit carrier boards are mechanically connected to each other via the surface-strengthening components, and the surface components of the circuit are simultaneously composed of circuit components of one of the circuit carriers. An exemplary embodiment of the present invention mechanically joins two adjacent circuit carriers stacked together using a plurality of surface-mounting components, the surface component being at least a circuit component of one of the circuit carriers, and further The manner in which the surface-mounted components are distributed on the circuit carrier can be fixed to each other with a great degree of freedom. The above-mentioned substrate refers to a circuit carrier including all circuit layers. The edge substrate includes at least one conductive layer in addition to the carrier. Usually, there is a conductive layer on both surfaces of 7 200845836, such as steel. The guide is bendable. & The substrate herein is at least invented by a single-piece substrate to form all or part of the board, which is folded in such a manner that the two sections of the substrate are connected to each other. A board can also refer to a circuit board that can be bent or hard and hard. The above-mentioned "Thunderbolt-Nine-in-one" means that not only a complete single base substrate can be completely bendable. Fold, or the substrate is only in the middle of the paragraph, many are not bent or bent, the finished product is A (bureau: 4 bendable) substrate............. It is appropriate to set a paragraph in the paragraph It can be bent, but the paragraph itself is a hard area, and the paragraph forms a circuit carrier after folding. When the substrate is completely bendable, the present invention is a watch person.
1式= ㈣具有顯著增加穩定度之優點。相較已知技術G ϋ板十分柔軟而需加上額外支撐，本發明即使基板十分 柔叙且特別㈣’健透過表面錄元讀财堅魏定之電 路，使其不易受到損傷。 本發明另-種實施方式也值得考慮，即電路載板上及/或電 路載板全部或部分電子元件上，再歧—觀緣材料。Equation 1 = (4) has the advantage of significantly increasing the stability. Compared with the prior art, the G-plate is very soft and requires additional support. The present invention is not susceptible to damage even if the substrate is very soft and special (4)'s through the surface recording element. Another embodiment of the present invention is also worth considering, that is, all or part of the electronic components on the circuit carrier board and/or the circuit carrier board.
、在本發明之優良應用形式中，著裝於電路載板表面用以連 接相鄰兩片電路載板之元件中，至少有—元件為該兩片以表面 著，元件連接之電路載板所構成之魏喊元件之―，其中表 面著裝元件亦形成該兩片電路載板之電路連接路徑。則能以一 特別簡單方式及較小之空間複雜之料，因為該表面 著裝元2不僅作為電子電路之組成元件及電路載板之機械連接 元件’還可作為兩片電路載板間所留下之随之橋接聽，以 實現三度空間之電路拓撲。 由於該表面著裝元件既能作為電路之組成元件，也可作為 電路載板之機械連接元件，因此該元件至少有局雜與電路載 8 200845836 板通電結合，且機械連結之著裝方式必須能承受拉力及前 因此，至少有-表面著裝元件，其至少具一個以上之接$，用 =:導::上端點)或導電線通電相連，而使兩片經由該 表面者裝兀件結合一起之電路載板被固定住。此外， 點只需要機械連接，不需通電相連時，該表面著裝元件:接 點，也可被固足於電路載板上一四周均為絕緣之導電面上。雙 在表面著裝元件上用於固定電路載板之接點，其形式 ^ 表面著裝元件常見之連接帽，該形式之優點係能於垂直於^ 面著裝元件之縱軸方向上連結。至少其中一表面著裝元件^亦 稱為SMD或Surfaee M〇unted以⑹），也可是一種被動元件， 因為被動元件之結構形式相同，且適用於前文所述較不 2路載板之連接。當然也可採用其他表面著裝元件，尤其採用 則又所述能與㈣兩㈣面相連結之電子元件來 例如簡單之主動元件，或複雜之電子科，如積體電= 件0 當電^載板與其中一表面著裝元件如所希望的完成通電連 =，及穩疋《機猶接後，便能制雌合雜電路 ί 載板上之焊接’或利用能導電的接著劑加以黏 '。知用此導⑧的接著劑’具有簡單製造電路之決纽優點， 因為可免除在接點上的加熱。該方式也不會對電路載板^電子 以牛產生因溫度而造成之傷害。令人驚訏的是於前賴型之電 路中，採用能導電之接著劑，也能在接難生足夠良好 ^。表面著裝it件及對應之電路載板之連結點，料需要通= 3、’當然也可·其他接合劑，例如絕緣之接著劑。最後，2 =表面著裝元件也可被橡焊於電路載板上，尤指表面著裝元 件《接點與電路載板上導細或導電線之轉連接。 9 200845836 製造該類微電子電路時 ^ 載板之導電面及/料〜^，域面著裝元件與兩片相鄰電路 及/或導電面或導電=上H電相連時’可於該表面著裝元件 導電線壓合树應之表面著把電路載板上之導電面或 劑或烊劑，例如===樣也可為一種能咏 k之接著 路載板與表面著裝元件二只是在制焊劑時，當電 :。此處電路載板與表;;裝元:之、:=^^ 知之裝二:之結合方式’係利用其他本身即為已 末接。這種狀況下即可捨棄接合劑之塗抹。 空隙内路Γ之表面著裝元件，係於電路載板當中之 且有許t件’R時用雜持間距。祕表面著裝元件 /、u夕、同么疋尺寸，所以能隨著電路載板所設計之著 ί 1毫無_的選_應之表面著裝元件，該元件能讓彼此平 灯併排《相鄰電路載板，保持一個如預期儘可能小之距離。電 路載板及表面著裝元件結合前，通常電路載板已著裝有其他電 子兀件=該電路載板可同時與其他電路載板減合，或事後再 把位於最外面之表面與其他電路載板相結合。 、本發明i良應用形式當中，至少一作為二相鄰電路載板 之機械連接7L件用之表面著裝元件，其縱減與電路載板表面 平打。孩万式能讓表面著裝元件特別容易安裝，尤其是四周均 能導電連接之滾筒狀表面著裝元件之連接帽，更能視需求讓相 鄰的兩片電路載板之任何位置通電相連。也可讓兩片電路載板 200845836 在特 至少由—表面著裝元件連接 間，也可設置其鱗電連接，其可 ^ %路載板< 於兩片電路載板導電面上之兩顆金屬球:現=由分別被焊接 接時’可於電路載板結合前，至少於其5 =現_垂直連 面上，先行塗上導電材料，例如焊劑或】導電In an excellent application form of the present invention, an element mounted on a surface of a circuit carrier for connecting two adjacent circuit carriers, at least one of the components is a surface of the circuit board. The component of the Wei shouting component, wherein the surface-mounting component also forms the circuit connection path of the two circuit carriers. It can be complicated in a particularly simple way and in a small space, because the surface wearing element 2 can be used not only as a component of the electronic circuit but also as a mechanical connecting component of the circuit carrier. It is then bridged to achieve a three-dimensional circuit topology. Since the surface-mounting component can be used as a component of the circuit or as a mechanical connecting component of the circuit carrier, the component is at least complicated to be electrically coupled with the circuit board 8 200845836, and the mechanical connection must be able to withstand the tension. And therefore, at least the surface-mounting component, which has at least one or more of the connection, is connected to the conductive wire, and the two pieces of the circuit are joined together via the surface. The carrier board is fixed. In addition, the point only needs to be mechanically connected, and when the power is not connected, the surface of the component: the contact, can also be fixed on the conductive surface of the circuit carrier on one side of the insulation. The contact on the surface-mounting component for securing the circuit carrier, in the form of a common connecting cap for the surface-mounting component, which has the advantage of being able to be joined perpendicular to the longitudinal axis of the component. At least one of the surface-mounting components ^ is also referred to as SMD or Surfaeee M〇unted (6)), and may be a passive component because the passive components are of the same structural form and are suitable for the connection of the lesser two-way carrier as described above. Of course, other surface-mounting components can also be used, especially the electronic components that can be connected to the (four) two (four) planes, such as simple active components, or complex electronic components, such as integrated electrical = 0. With one of the surface-mounting components as desired, the power-on connection is completed, and after the machine is connected, it can be soldered on the carrier board or adhered with an electrically conductive adhesive. It is known that the adhesive agent of this guide 8 has the advantage of a simple manufacturing circuit because the heating at the joint can be dispensed with. This method does not cause damage to the circuit board. What is striking is that in the circuit of the former type, the use of an electrically conductive adhesive can also be good enough in the connection. The surface of the surface of the device and the corresponding circuit carrier board connection point, the material needs to pass = 3, 'of course, other bonding agents, such as insulating adhesive. Finally, 2 = the surface-mounting component can also be rubber-bonded to the circuit carrier, especially the surface-mounting component "contacts are connected to the conductive or conductive wires on the circuit carrier. 9 200845836 When manufacturing such microelectronic circuits ^ the conductive surface of the carrier and / / material, when the surface-mounting component is connected to two adjacent circuits and / or conductive surface or conductive = upper H - can be mounted on the surface The conductive line of the component wire should be on the surface of the conductive surface or the agent or the tincture on the circuit board. For example, the === sample can also be a type of the carrier board and the surface of the component. When, when electricity:. Here, the circuit board and the table;; loading yuan: it, :=^^ know the two: the combination of the way to use the other itself is already connected. In this case, the application of the bonding agent can be discarded. The surface of the gap in the gap is a component that is attached to the circuit carrier and has a pitch of ''R'. The surface of the secret surface is /, 夕 夕, the same size, so it can be designed with the circuit carrier ί 1 no choice _ should be the surface of the component, the component can make each other flat side by side "adjacent The circuit carrier is kept as small as possible as expected. Before the circuit carrier board and the surface mounting components are combined, usually the circuit carrier board is equipped with other electronic components. The circuit carrier board can be simultaneously reduced with other circuit carrier boards, or the outermost surface and other circuit carrier boards can be later added. Combine. In the preferred application form of the present invention, at least one of the surface-mounting components for the mechanical connection of the 7L members of the two adjacent circuit carriers is vertically offset from the surface of the circuit carrier. The versatile surface allows the surface-mounting components to be particularly easy to install, especially the connecting caps of the component-like components that are electrically conductively connected around the circumference, and the two adjacent circuit carriers can be electrically connected at any position as required. It is also possible to allow two circuit carriers 200845836 to be connected at least by the surface-mounting component, or to be provided with a scale connection, which can be used to carry two metal plates on the conductive surfaces of the two circuit carriers. Ball: Now = when soldered separately, can be coated with a conductive material, such as flux or conductive, before the circuit carrier is bonded, at least on its 5 = current _ vertical joint.
該材料會在電路載板結合時，於魏餘間產生^=屬棒’ 除I作為電路餘之機械連翻之表面著裝元件外，。要 2上，、他電子70件，即㈣最佳空_用之下，讓微電子兩 =達到更减械敎度，簡加之電子元件縣裝於^ :=ί’Γ=⑽載板那-面’倚靠於附近其: 複雜的元件’例如加封蓋或未加封蓋之積體電路如多晶片模: 或以覆晶法或（_導線橋接）晶片直烊練法組裝或接著而 成之^片。_電子元龍止於倚#，便能構成間距保持器， 並提咼微電子電路之穩定度。視應用之情形，只屬於其中—片 ^各載板配件之電子元件也可被黏貼或以其他方式蚊於所倚 靠之附近電路載板上，顺元件以機齡讀該電路載板相結 合，使微電子電路更加穩定。 ^ 如果電路不須要额外之支點，且電路載板中有足夠間距， 當然也可於其中一片電路載板上安裝前文所述之元件，使該元 件與相鄰之電路載板間留下空隙。 本發明之典型應用形式中，彼此相鄰之電路載板具—與電 路載板垂直之間距，介於〇·〇5 111111至5 mm之間，尤其介於〇.2 mm至1.5 mm之間，該間距使表面著裝元件容易被取用。例如採 200845836 用0402型之表面著裝元件，並讓該元件縱軸與電路載板平行 時，電路載板間之間距通常約為0.6 mm。 本發明之優良應用形式係包含多片相互平行電路載板之微 電子電路，例如至少三片電路載板，其中彼此相鄰之電路板係 以前文所述方式，由表面著裝元件以機械方式加以結合。如此 一來，便能實現一密實而堅固，且聚積密度很高之微電子電 路0 【圖式簡單說明】This material will generate a ^= a rod when the circuit carrier is combined, except for I as the surface of the circuit. To be 2, and his electronic 70, that is, (4) the best empty _ use, let the microelectronics two = achieve more destructive strength, simply add the electronic component county installed in ^ := ί' Γ = (10) carrier board - face 'relieving nearby: complex components' such as capped or uncapped integrated circuits such as multi-wafer die: or by flip chip or (_ wire bridging) wafer straight-through assembly or subsequent formation ^ piece. _Electronic Yuanlong stops at ##, which can form a spacer and improve the stability of the microelectronic circuit. Depending on the application, only the electronic components of the board and the carrier components can be glued or otherwise mosquitoed to the nearby circuit carrier, and the component is read by the circuit board. Make the microelectronic circuit more stable. ^ If the circuit does not require additional fulcrums and there is sufficient spacing in the circuit board, it is of course possible to install the components described above on one of the circuit carriers to leave a gap between the component and the adjacent circuit carrier. In a typical application form of the invention, the circuit carriers adjacent to each other - perpendicular to the circuit carrier, are between 111·〇5 111111 to 5 mm, especially between 〇.2 mm and 1.5 mm. This spacing allows the surface mount components to be easily accessed. For example, when using the 0402 type surface mount component and the vertical axis of the component is parallel to the circuit carrier board, the distance between the circuit boards is usually about 0.6 mm. A preferred application form of the invention is a microelectronic circuit comprising a plurality of mutually parallel circuit carriers, such as at least three circuit carriers, wherein the circuit boards adjacent to each other are mechanically applied by surface-mounting elements in the manner previously described. Combine. In this way, a dense and strong microelectronic circuit with high density can be realized. [Simplified illustration]
本發明之應用實施例，將以下文根據圖一至圖四加以說 明。各圖所示為： 圖一本發明微電予電路之剖面圖， 圖二圖一之微電子電路之局部詳細剖面圖， 圖三同一微電予電路中，兩片相鄰電路載板間垂直接點 之剖面示意圖， 圖四該微電子電路另一部位之局部透明透视圖。 【實施方式】 圖-可見-微電予電路，其係以—可料之電路板為基 ΐ 基板可折疊成第—層電路載板1，以及平行叠置其上方之 電路載板2，及以同—方向叠置第二層電路載板2上之第 錄板3。構成三層電路餘1、加之基板可由例如-為基礎之載板構成，而其上表面及下表 ==树結構，並著裝各式電子元件。該等電子元件中，一 路组成者及4,，並不僅止於為電路載板1、2或3上之電 械处人’電路載板卜2及3也透過該等電子元件完成機 ^二=面著裝元件4及4’中，至少有—些元件亦屬本應 ，、中《被動轉，例如電阻、電感、或電容，而形成電路 12 200845836 載板1及2之間’或電路載板2及3之間之連接路徑，並構成一包 含二片電路載板1、2及3在内之完整電子電路。 圖二顯示其中-表面著裝元件4之細部結構範例，該表面著 s元件樓減電路載板2及蝴連核，亦翻於電路載板如 &其他位置。此處所示之表面著裝元件4，其縱軸指向係位於一 與電路載板2及3平行之平面，且兩個末端分別設有滾筒狀、形 式為導電連接帽之接點5。每-接點5均以通電相連方式固定於 -亦稱為連接面之導電面6上，該導電面分別屬於該表面著裝元 (% 件4下方所設之電路載板2 ’及該表面著裝it件4上方所設之電路 载板3。至少-圖二所示之電路載板3之導電面6，及至少一圖二 所示之電路載板2之導電面6 ’係以如下方式分別與電路載板2或 3《導f構相連’即表面著裝元件4係構成電路載板如之 間，如前文所述之電路之連接路徑。视實際情形而定，位於電 路載板1、2或3之其餘導電面6，也可四周均為絕緣，僅作為該 表面著裝元件4之機械連接。其他表面著裝元件4之電路連接方 式，也可只安裝於電路載板丨、2或3一處四周均為絕緣之導電面 〔 6上’使該表面著裝元件4所形成之路徑只構成電路載板卜2或3 . 之電路，而相鄰之兩面電路載板1及2或2及3之間，沒有任何電 路連結。 • 圖一所不之表面著裝元件4，於本圖示之應用實例中，係採 用種接&别7作為連接辅助劑，該劑為可導電之接著劑或焊 ，，使經由表面著裝元件4所連接之電路載板2及3能承受拉力及 男力。孩表面著裝元件當然也可焊接於導電面6上，其結果亦相 同。在製造電子電路時，除了黏著法及坪接法之外，也可採用 點焊法或擴散連接法固定表面著裝元件4及4,。 13 200845836 圖二所示麵著裝元件錄_2型之被動元件，因此在電路 載板2之導電面6及電路載板3之導電面6之間，留下-由表面著 裝元件4所橋接而成之間隙，其垂直寬度約為〇 6腿。由於電路 載板及2之間及⑧路載板2及3之間散佈著許多著裝於電路載板 1 2及3之表面著裝元件4，且以前述方式加以固定，所以電路 載板1、2及3之連結十分穩定，不須於電路載板1、2及3之間再 採取其他連接措施。因此，圖一所示類型之微電子電路中，也 可考慮以全面性或局部性於電路載板丨、2及3上方，及/或全部 ( 絲別安裝其上之電子元件上方，紅絕緣材料。此處三片電 路載板1、2及3係由單—一片基板之三個段落折疊而成，該基板 通常全部可彎折。在軟硬相間之電路板技術中，每一段落也可 為堅硬的，並由基板上可彎折區域加以連結。 位於私路載板2及3之間之表面著裝元件4’，與表面著裝元 件4之差異處’係該元件縱軸與電路載板丨、如之方向垂直。 此表面著裝元件4,也以同樣方式固定於電路載板2及3之導電面 6 ’同樣形成電路載板2及3之間之機械連接，並形成電路載板2 及3之間所相應之微電子電路之路徑。 圖一也可見兩片積體電路8，其以覆晶法安裝於第三片電路 , 載板3上方’及錢於第二片f路餘2下表面。安裝在於第二 ‘ Λ電路餘2上之_電路8，其尺寸大小及設置方式，係以背 - ㈣路載板2 —測，倚靠下方第-片電路載板ljL，使該微電子 電路構成電路餘叱之間之間贿持器，以提供额外之穩定 度。若採用其他尺寸微電子電路時，第二片電路載板2上所安裝 之電路8及第-片電路載板！之間，自然會留下間隙。其他電子 ^牛’例如主動或被動SMD元件、多晶片，或其他有加封 盍或未加封蓋之晶片’也可採用相同方式安裝於電路載板i、2 14 200845836 或3其中、一片載板上，並同時作為間距保持器，以提高其連結之 ，械％、疋度。最後’也可考慮把例如電路載板m之間所設之 知體電路8，黏貼於第一片電路載板丨上。 ^電路載板1及2之間，及電路載板2及3之間，也可透過焊 球9貫現導電連接，餅球能把電路載板如之間或2及3之間所 相對，兩個導電面6加以連接。電路載板2及3之間，由兩個坪球 9 (英文亦稱為Bump)所形成之連結，於圖三中詳細圖示。若 相鄰兒路載板1及2或2及3之間距較大時，也可於相應導線結構 中二相料電面6之崎上金屬球或金屬棒或以能導電之接著劑 黏上至屬球或金屬棒方式橋接。最後，若相鄰之電路載板1及2 或2及3之間距較大時’也可考慮採用軟性導電板之插線連接， 及/或接線方式橋接。 則述《實例中，電路載板丨、2及3之間作為機械連結用之表 面著裝元件4及4,，除了可作為被動元件外，當然也可作為其他 功能之表面著裝元件’亦即作為主動元件，而該元件係以前述 方式連接相鄰二電路接點。 、圖-所示之微電子電路之製造，係首先於一片用以形成電 路載板1、2及3之基板上，以已知方式先安裝積體電路8及其他 電子元件，再加以折疊，並利用表面著裝元件4及4，以機械結合 万式，把基板上形成電路載板丨、2及3各段落結合，該等表面著 裝7G件4及4’則與相鄰兩片電路載板丨及2或2及3上之導電面6或 導電線通電相連。此時導電面6或導電線上已塗有接合劑，以便 思路載板1、2及3上之導電面6或導電線能與表面著裝元件4及4, 壓合一起。此處接合劑可採用焊劑，以便電路載板丨、2及3在壓 合後能採用加減流片轉接程序，讓表面練元件4及¥固定 於電路載板1、2及3上。除了焊劑外，也可採用一種可導電之接 200845836 f •即可省去電路載板1、2及3以及表面著裝元件4及4,間之 過程。焊劑或可導電之接著劑，可採用面罩或網版印 =万式^上去。表面著裝元件4及t與電路載板丨、2及3之導 =6,合W ’該接合劑當然可改成塗於該元件接點5上，或額 卜再1 於㈣件接點5上。前述步驟執行完畢後，表面著裝元件 4及4 a成為-由電路載板丨、加共同組成之電路組件，而至 /有—表面著衣元件4及4’能構成相鄰電路載板认2或2及頂 2連接通路。要在電路編、加之間，姻烊細彡成垂直 I接時/員在私路載板卜2及3連接前，於電路載板阳之導電 面6上先加上焊球，該焊球會於電路载板丨、2及3結合後於電路 載板1及2或2及3間構成接_，而該焊雜加齡化後，相鄰 電路載板⑻或2及3之導電面6間會形成一導電性良好且強化該 微電子電路之機械穩定度的連結。 在-已％工之微電子電路中，表面著裝元件4及^不僅用來 作為電路載板卜2及3間之間距保持器（Spacer)，也用來作為 個此承又拉力及@力之固定元件。利用前述發明，即可達成 -具有三維電路架構之垂直系統整合，其不僅能以堆疊方式， 讓各式不同電路以極簡單方式形成密實之結構，還能把可彎折 ^電路板之應用，與前述垂直接觸連接之方式相結合，以實現 高度複雜之電路。本發明當射和—些此處未深人說明之特徵 相結合，例如於電路載板卜2及3所著裝之元件上，再额外使用 其他導引元件、螺絲及其他連接元件，及制封裝技術。 此處所述技術，可採用已知之技術堆叠電路載板，並形成 一三維系統，該系統尤具下列特徵·· •採用組成電路之表面著裝元件及SMD組件或SMD元件，作 為間距保持器。 16 200845836 •除了作為電路元件之直接功能’及作為間距保持器之機械功 能外’還可透過SMD元件及其無之麵，實贴平面之間 之導電連接。平面至平關之其他垂直連接方式，也可經由 焊接或導電黏貼方式（洋球9、Bumps、Balls)實現。其他 垂直連接核及所採用之接合技術係為次要。電路載板】、2 及3之間不需插座、導線或電纜，即可完成連接。 •高密度整合之多平面系統之經濟型產品，可以經由下列 實現： 同時疊合許多元件或模組（即所謂共用板）， 採用電子加工業所能升級之製程或機械（焊接、能導兩 之接著劑）。 ％ 實現方式係於電路設計佈局階段中，於其中一平面（電路 載板）之上表面及相對應另一平面之下表面，確認其導=面 (Pad)位置。導電面之大小及間距係取決於平面間之間距。 在接合劑（例如焊劑）印刷、以及擺放元件的標準smd組 裳程序之後，該等平面會疊在—起，再經由―敎裝步驟（例 如流片式焊接），使其永遠被固定住。此處也可設置例如導孔 或螺釘作為定位之用。在一般的電路形式中，通常會出現大量 的標準被動SMD元件。同一系列之元件（例如〇4〇2)，由於定 義之高度完全相同，所以可用來作為_保持器，而其擺放方 式則是使其有安全之支撐點。採用該類標準§]^11)元件並利用其 焊接面，便能以垂直通電之連接方式，及機械穩定之方式組ς 大量模組。 θ 此應用實例中，由一平面至另一平面之垂直導電連接，其 路徑為 〃 17 200845836 •元件之連接帽，該連接帽可於所有空間 結及焊接接點， 0上，產生導電連 力口裳於該模組 •由可導電之接合劑（焊劑、可導電之接著劑） (電路載板1、2及3 )上之焊點。 此外，還可考慮採用垂直設計之元件。 垂直連接之焊財以在SMD壓合元件之同—步 例如面罩、網版印刷或植球機植上，糾距較大，必: 再植上銅球、-般金屬球或可導電之塑膠球。而本 =Application examples of the present invention will be described below with reference to Figs. 1 to 4. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a micro-electric circuit of the present invention, FIG. 2 is a partial detailed sectional view of the microelectronic circuit, and FIG. 3 is in the same micro-electric circuit, two adjacent circuit carriers are suspended. A schematic view of a direct point, Figure 4 is a partially transparent perspective view of another portion of the microelectronic circuit. [Embodiment] A picture-visible-micro-electric circuit is based on a circuit board that can be folded into a first-layer circuit carrier 1, and a circuit carrier 2 above which is stacked in parallel, and The recording board 3 on the second layer circuit board 2 is stacked in the same direction. The three-layer circuit is formed. The substrate can be composed of, for example, a carrier board, and the upper surface and the lower surface == tree structure, and various electronic components are mounted. Among the electronic components, the one-way component and the 4, and not only the electrical armor on the circuit carrier 1, 2 or 3, the circuit carrier board 2 and 3 also complete the machine through the electronic components. = Among the face-mounted components 4 and 4', at least some of the components are also the same, and "passively turn, such as resistors, inductors, or capacitors, to form the circuit 12 200845836 between the carriers 1 and 2' or the circuit load The connection path between the boards 2 and 3 and constitutes a complete electronic circuit including two circuit boards 1, 2 and 3. Figure 2 shows an example of a detailed structure of the surface-mounting component 4, which is turned off from the circuit carrier board 2 and the butterfly core, and also turned over to the circuit carrier board, such as & The surface mount component 4 shown here has a longitudinal axis oriented in a plane parallel to the circuit carriers 2 and 3, and the ends are respectively provided with contacts 5 which are in the form of rollers and in the form of electrically conductive connecting caps. Each of the contacts 5 is fixed to the conductive surface 6 of the connection surface by an energized connection, and the conductive surfaces belong to the surface mounting component (the circuit carrier 2 ' disposed under the component 4 and the surface is mounted) The circuit carrier 3 disposed above the element 4 is at least - the conductive surface 6 of the circuit carrier 3 shown in FIG. 2, and at least one of the conductive surfaces 6' of the circuit carrier 2 shown in FIG. Connected to the circuit carrier 2 or 3, that is, the surface-mounting component 4 constitutes a circuit carrier, such as the connection path of the circuit as described above. Depending on the actual situation, it is located on the circuit carrier 1, 2 Or the remaining conductive surface 6 of 3 or may be insulated around the surface, only as a mechanical connection of the surface-mounting component 4. The circuit connection manner of other surface-mounting components 4 may also be mounted only on the circuit carrier board, 2 or 3 The surrounding area is insulated conductive surface [6] 'the path formed by the surface wearing component 4 only constitutes the circuit board 2 or 3. The adjacent two-sided circuit carrier 1 and 2 or 2 and 3 There is no circuit connection between them. • Figure 1 shows the surface of component 4, in this picture. In the application example shown, the seeding & 7 is used as a connection auxiliary agent, which is an electrically conductive adhesive or solder, so that the circuit carriers 2 and 3 connected via the surface mounting component 4 can withstand the tension and The male surface. The child's surface-mounted components can of course be soldered to the conductive surface 6. The result is the same. In the manufacture of electronic circuits, in addition to the adhesion method and the splicing method, the surface can be fixed by spot welding or diffusion bonding. Dressing components 4 and 4, 13 200845836 Figure 2 shows the passive component of the component type 2, so that between the conductive surface 6 of the circuit carrier 2 and the conductive surface 6 of the circuit carrier 3, The gap between the surface-mounting elements 4 is bridged, and the vertical width is about 〇6 legs. Since the circuit carrier board and the two-way board and the two-way board 2 and 3 are interspersed with many mountings on the circuit board 12 and 3 The surface of the component 4 is mounted and fixed in the manner described above, so that the connection of the circuit carriers 1, 2 and 3 is very stable, and no other connection measures are required between the circuit carriers 1, 2 and 3. Therefore, FIG. Microelectronic circuits of the type shown may also be considered comprehensive Localized above the circuit carriers 丨, 2 and 3, and/or all (the upper part of the electronic components on which the wires are mounted, red insulating material. Here three circuit boards 1, 2 and 3 are single-to-one substrate The three sections are folded and the substrate is usually fully bendable. In the hard and soft board technology, each paragraph can also be rigid and connected by a bendable area on the substrate. The difference between the surface-mounting component 4' between 2 and 3 and the surface-mounting component 4 is that the longitudinal axis of the component is perpendicular to the circuit carrier 丨, such as the direction. The surface-mounting component 4 is also fixed to the circuit in the same manner. The conductive faces 6' of the carriers 2 and 3 also form a mechanical connection between the circuit carriers 2 and 3 and form the path of the corresponding microelectronic circuits between the circuit carriers 2 and 3. Also shown in Fig. 1, two integrated circuits 8 are mounted on the third circuit, over the carrier 3, and on the lower surface of the second film. The circuit 8 is mounted on the second circuit of the second circuit, and its size and setting mode are measured by the back- (four) way carrier board 2, leaning against the lower-side circuit carrier ljL, so that the microelectronic circuit is constructed. The circuit between the embers is bribed to provide additional stability. If other size microelectronic circuits are used, the circuit 8 and the first-chip circuit carrier mounted on the second circuit carrier 2! Naturally, there will be a gap. Other electronic devices such as active or passive SMD components, multi-chips, or other wafers with or without capping can also be mounted in the same manner on circuit carrier board i, 2 14 200845836 or 3, on a carrier board. And at the same time as a spacer to increase its connection, mechanical %, twist. Finally, it is also conceivable to adhere, for example, the body circuit 8 provided between the circuit boards m to the first circuit board. ^Between the circuit carriers 1 and 2, and between the circuit carriers 2 and 3, the conductive connection can also be realized through the solder balls 9, and the cake balls can be opposite to each other between the circuit carriers, such as between 2 and 3. The two conductive faces 6 are connected. Between the circuit carriers 2 and 3, a connection formed by two ping balls 9 (also known as Bump) is illustrated in detail in FIG. If the distance between the adjacent carrier plates 1 and 2 or 2 and 3 is large, the metal ball or metal bar of the two-phase material surface 6 of the corresponding wire structure may be adhered or adhered with an electrically conductive adhesive. Bridge to the ball or metal bar. Finally, if the distance between adjacent circuit carriers 1 and 2 or 2 and 3 is large, it is also conceivable to use a flexible conductive board to make a patch connection and/or a wiring method to bridge. In the example, in the example, the surface mounting members 4 and 4 for mechanical connection between the circuit carriers 丨, 2 and 3, in addition to being used as passive components, can of course be used as surface-loading components for other functions. An active component that connects adjacent two circuit contacts in the manner previously described. The microelectronic circuit shown in FIG. 1 is first mounted on a substrate for forming circuit carriers 1, 2 and 3, and the integrated circuit 8 and other electronic components are first mounted in a known manner and then folded. And using the surface-mounting components 4 and 4, mechanically combining the universal type, forming the circuit carrier boards 丨, 2 and 3 on the substrate, the surface wearing 7G parts 4 and 4' and the adjacent two circuit board The conductive surface 6 or the conductive line on the 2 or 2 and 3 is electrically connected. At this time, the conductive surface 6 or the conductive line has been coated with a bonding agent so that the conductive surface 6 or the conductive line on the carrier boards 1, 2 and 3 can be pressed together with the surface mounting members 4 and 4. Here, the bonding agent may be soldered so that the circuit carriers 丨, 2, and 3 can be attached to the circuit carriers 1, 2, and 3 by the addition and subtraction transfer procedure after pressing. In addition to solder, an electrically conductive connection can be used. 200845836 f • The process of board carriers 1, 2 and 3 and surface mounting components 4 and 4 can be eliminated. Flux or conductive adhesive, can be used mask or screen printing = 10,000 type. The surface-mounting elements 4 and t are connected to the circuit carriers 丨, 2 and 3=6, and the combination of the components can be changed to be applied to the component contacts 5, or the amount of the bonding agent can be changed to (4) contacts 5 on. After the execution of the foregoing steps, the surface-mounting components 4 and 4 a become a circuit component which is composed of a circuit carrier and a common component, and the surface coating components 4 and 4' can constitute an adjacent circuit carrier. Or 2 and top 2 connection paths. In the circuit coding and addition, the marriage is finely divided into vertical I. When the member is connected to the private circuit board 2 and 3, the solder ball is first added to the conductive surface 6 of the circuit carrier board. After the circuit carrier boards 2, 2 and 3 are combined, the circuit board 1 and 2 or 2 and 3 are connected to each other, and after the welding is aging, the conductive surfaces of the adjacent circuit carrier boards (8) or 2 and 3 are formed. Six of them form a bond that is electrically conductive and enhances the mechanical stability of the microelectronic circuit. In the microelectronic circuit that has been used, the surface-mounting components 4 and ^ are not only used as circuit carriers, but also as a spacer between the 2 and 3, and also used as a bearing and a force. Fixed component. By using the foregoing invention, it is possible to achieve a vertical system integration with a three-dimensional circuit architecture, which can not only form a dense structure in a very simple manner in a stacking manner, but also can apply a bendable circuit board. Combined with the aforementioned vertical contact connection to achieve a highly complex circuit. The present invention combines the features of the present invention with those not described herein, such as the components of the circuit board 2 and 3, and additionally uses other guiding elements, screws and other connecting components, and packaging. technology. The techniques described herein can be used to stack circuit carriers and form a three-dimensional system using known techniques. The system has the following features: • Surface mount components and SMD components or SMD components that make up the circuit are used as spacers. 16 200845836 • In addition to being a direct function of the circuit components and as a mechanical function of the spacers, the SMD components and their absence can be used to electrically connect the planes. Other vertical connections from flat to level can also be achieved by soldering or conductive bonding (Popular Ball 9, Bumps, Balls). Other vertical connection cores and bonding techniques used are secondary. The circuit board, 2, and 3 can be connected without sockets, wires or cables. • High-density integrated multi-plane system economical products can be realized by: stacking many components or modules at the same time (so-called shared boards), using processes or machinery that can be upgraded by the electronic processing industry (welding, energy guiding The adhesive)). The % implementation is in the circuit design layout phase, on the surface of one of the planes (circuit carrier) and the surface below the other plane, confirming its position = Pad position. The size and spacing of the conductive surfaces depend on the distance between the planes. After the bonding agent (such as flux) is printed, and the standard smd assembly process of the component is placed, the planes are stacked and then permanently fixed by the armoring step (such as flow-chip soldering). . It is also possible here to provide, for example, a guide hole or a screw for positioning. In the general circuit form, a large number of standard passive SMD components are usually present. Components of the same series (eg 〇4〇2) can be used as _holders because they are exactly the same height, and they are placed in a safe way. Using this standard §]^11) component and using its soldered surface, a large number of modules can be assembled in a vertically energized connection and mechanically stable. θ In this application example, a vertical conductive connection from one plane to another, the path is 〃 17 200845836 • The connecting cap of the component, which can make conductive joints on all space junctions and solder joints, 0 The mouthpiece is in the module • the solder joint on the conductive bonding agent (flux, conductive adhesive) (circuit carrier boards 1, 2 and 3). In addition, vertical design components can also be considered. Vertically connected welding is used in the same step of SMD pressing components such as mask, screen printing or ball planting. The correction distance is large. It must be: replanted with copper balls, metal balls or conductive plastics. ball. And this =
則採用被動元件來製造垂直之電路訊號導線（路徑^，而=為 截至目前為止未曾出現過的應用。 二 /、'、、 此處所述之技術較已知技術進步，因本發明只採用現有泰 子元件，不增加元件即可改善其機械穩定性，且同 並^ 直連接密度。 〃 本應用實例中，所有由一平面至另一平面之導線，均在同 一組裝步驟中完成。除了較高組裝密度及組裝容易之優點外， 另一優點係導線長度較短，其能為系統帶來較高之速度，並減 少寄生效應。此處所述之技術，特別適合用來為一般均為特別 扁平之彳政電子元件及精金元件之垂直整合，以應用於未封裝之 半導體元件，尤指多晶片模組（MCM，Multi-Chip_Module)或 包裝式系統（SiP ’ System-in-Package) 〇 此處所述之元件應用方式，即可避免一些已知之垂直組合 問題（例如幾乎完全沒有周邊作為系統插接用之接點，以及類 似BGA構造之垂直焊接，使其載重力較小），並且在元件設計 上增加新的自由度：由設計者角度來看，即可採用一種四極元 件，元件上二雙極係分置於物理上為不同之兩個層面上，或不 同之模組上。該種型式之幾何配置如圖四所示。 18 200845836 圖四可見第二片電路載板2及第三片電路载板3，後者係以 示：連接該二片電路载板2及3之表面著裝元件’係 之導電面6上 目定於圖上所示分屬電路載板加 此處表面著裝請4係-電容，安裝於兩 防干擾電容之用，而該電源線為—安裝於第二片電/載板^為 圖上未π出《晶片電源線。電源線係為兩條導線，由兩個均被 设於上万電路餘3上之導電面“起料向勤，並以Passive components are used to fabricate vertical circuit signal conductors (paths ^, = is an application that has not appeared so far. Second, ',, the techniques described herein are more advanced than known techniques, as the invention only employs Existing Thai components can improve their mechanical stability without adding components, and the density of the connection is straight. 〃 In this application example, all the wires from one plane to the other are completed in the same assembly step. In addition to the advantages of high assembly density and ease of assembly, another advantage is the short length of the wire, which can bring higher speed to the system and reduce parasitic effects. The technique described here is particularly suitable for general use. Vertical integration of particularly flat sinister electronic components and fine gold components for unpackaged semiconductor components, especially multi-chip modules (MCM, Multi-Chip_Module) or packaged systems (SiP 'System-in-Package)元件The application of the components described here avoids some known vertical combination problems (for example, there is almost no perimeter as a joint for system plug-in, and similar BG The vertical welding of the A structure makes it less portable, and adds a new degree of freedom in component design: from the designer's point of view, a four-pole component can be used, and the two bipolar components on the component are physically placed. For the two different levels, or different modules, the geometric configuration of this type is shown in Figure 4. 18 200845836 Figure 4 shows the second circuit carrier 2 and the third circuit carrier 3, the latter It is shown that the conductive surface 6 of the surface mounting component of the two circuit carrier boards 2 and 3 is attached to the circuit board shown in the figure, and the surface is mounted on the surface. The anti-interference capacitor is used, and the power cord is mounted on the second electric/carrier board. The chip power cord is not π. The power cord is two wires, and both are set at tens of thousands. The conductive surface on the remaining 3 of the circuit
連接該電容。該二條導線下方也有兩條導線以同—方向被投置 ^二片電路載板上，其以電容下方兩個導電面聽點，圖四 中可看到其中-導電面，而另—導電面被電容遮住。這兩條導 線，連接顺述晶片之電祕點，_晶相位於電源導線之 導線下方。如此-來，不僅可完成—最密實之結構，也可以極 短連接導線形成防干擾能力極為良好之結構。尤其電 簡單方式置於另-平面，以供給該晶片所需之。除此處匕作 為實例所提之晶片外，也可連接其他任何電子树，該元件必 須並聯-電容或另-種元件，例如電感。最後可考慮以圖 示方式，將許多電容並聯-起，例如1〇〇奸，以形成所期望之 較小電容量，例如以四顆電容形成25//17，如此—來，不僅$採 用較小SMD元件軸較低結構高度，且所連接之大量支點: 可讓電路載板形成較穩定之結合。 利用此處所提之技術，就可利用簡單物件（利用傳統可彎 折電路板、SMD元件、—般組裝程絲實現—種具著裝元件之 多層系統，及實現-贿度特編（近乎）垂直整合電 子系統’該系統整體於空間及重量受限環境下（例如可 19 200845836 行動式、迷你化產品、用於航空及太空之電子產品、汽車電 子、行動式感應及測量系統），特別具有優點。 20 200845836 【主要元件符號說明】 1、2、3 1電路載板 4, 4， 表面著裝元件 5 接點 6 導電面 7 接合劑 8 積體電路 9 焊球 21Connect the capacitor. There are also two wires under the two wires which are placed in the same direction and are placed on two circuit boards. The two conductive surfaces under the capacitor are used to listen to the points. In Figure 4, the conductive surface can be seen, and the other conductive surface. Covered by a capacitor. These two wires are connected to the electrical point of the wafer, and the crystal phase is located below the wire of the power conductor. In this way, not only can the completion of the most compact structure, but also the extremely short connecting wires form a structure with excellent anti-interference ability. In particular, the electrical simple mode is placed on the other plane to supply the wafer. In addition to the wafers mentioned herein as examples, any other electronic tree may be connected, which must be connected in parallel with a capacitor or another component such as an inductor. Finally, it can be considered to graphically connect a number of capacitors in parallel, for example, to create a desired smaller capacitance, for example, to form 25//17 with four capacitors, so that not only The small SMD component shaft has a lower structural height and a large number of fulcrums connected: it allows the circuit carrier to form a more stable bond. Using the techniques presented here, you can use simple objects (using traditional bendable boards, SMD components, and general assembly process) - a multi-layer system with a set of components, and an implementation-bribe special (nearly) Vertically integrated electronic system's system as a whole in space and weight-constrained environments (eg, 19 200845836 mobile, mini-products, electronics for aerospace and space, automotive electronics, mobile sensing and measurement systems), especially Advantages 20 200845836 [Description of main component symbols] 1, 2, 3 1 circuit carrier board 4, 4, surface mounting component 5 contact 6 conductive surface 7 bonding agent 8 integrated circuit 9 solder ball 21