M346011 八、新型說明： 【新型所屬之技術領域】 本創作是有關於一種測試治具，且特別是有關於一種 記憶體測試治具。 【先前技術】 在現今資訊化爆炸的時代，個人電腦的使用已經與日 '俱增。此外，為了滿足社會大眾對影音以及各種高階軟體 # 的需求，不但各項硬體需要加大容量與提升速度，作業系 統也必須不斷的升級。隨著作業系統的升級，除了硬碟要 加大容量與中央處理器須提升運算速度之外，作為兩者之 媒介的記憶體模組同樣也需要加大容量並提升處理速度。 記憶體模組在加大容量且提升速度的同時，如何量測 記憶體模組之測試端的訊號以判斷記憶體模組是否有缺陷 已成為一個重要課題。因為，測試廠商可透過量測到的訊 唬來判斷記憶體模組的缺陷是來自於製程的問題、記憶體 鲁 β部電路的問題、模組後而發生的問題或是主板上各插样 的問題。 曰 、一般而S，記憶體模組在測試的過程中，測試廠商通 ¥會先根據記憶體模組的電路圖與萬用表，找出與記憒體 模組之測試端等位或相隔一個排阻的點來作為焊接測試 點。之後，再焊出記憶體模組的焊接測試點，以進行記情 體模組之測試訊號的量測。此種作法不僅容易焊壞或損二 記憶體模，，此外焊接測試點的尋找以及焊線的^續都ς 5 M346011 【新型内容】 本創作提供一種記憶體測試治具，可致使測試人員輕 易量測到待測記憶體模組之測試端的訊號。 本創作提出一種記憶體測試治具，適於與配置在主板 上的第一記憶體插槽電性連接。此記憶體測試治具包括载 板、第二記憶體插槽以及多個連接器。其中，載板具有金 手指，以插入第一記憶體插槽。第二記憶體插槽配置在载 板上，並電性連接至金手指。 此外，在實際應用上，第二記憶體插槽用以插設待測 記憶體模組，並具有與待測記憶體模組之測試端電性相連 的多個測試點。另一方面，所述多個連接器分別配置在載 板上，並與這些測試點一對/電性連接。藉此，與這些連 接器電性相連的多個傳輸線，將可傳送來自待測記憶體模 組之測試端的訊號。 在本創作之一實施例中，上述之载板為印刷電路板。 射卜’所述之第一記憶體插槽與第二記憶體插槽具有相同 的結構。 一兄憶體插槽與第M346011 VIII. New description: [New technical field] This creation is about a test fixture, and especially about a memory test fixture. [Prior Art] In the era of information explosion, the use of personal computers has increased. In addition, in order to meet the needs of the public for audio and video and various high-end software #, not only do the hardware need to increase capacity and speed, but the operating system must also be continuously upgraded. With the upgrade of the work system, in addition to the hard disk to increase the capacity and the CPU must increase the computing speed, the memory module as the medium of the two also needs to increase the capacity and increase the processing speed. While increasing the capacity and speed of the memory module, how to measure the signal of the test end of the memory module to determine whether the memory module is defective has become an important issue. Because the tester can use the measured signal to determine whether the memory module defect is caused by the process problem, the memory of the β-circuit, the problem after the module or the insert on the motherboard. The problem.曰, general S, memory module in the process of testing, the test manufacturer will first use the memory module's circuit diagram and multimeter to find the test end of the 愦 body module is equivalent or separated by an exclusion The point comes as a soldering test point. After that, the soldering test points of the memory module are soldered to measure the test signals of the sensible body module. This method is not only easy to weld or damage the memory model, but also the search for soldering test points and the continuity of the bonding wire. 5 M346011 [New content] This creation provides a memory test fixture that can make testers easy The signal of the test end of the memory module to be tested is measured. The present invention proposes a memory test fixture suitable for electrically connecting to a first memory slot disposed on a motherboard. The memory test fixture includes a carrier, a second memory slot, and a plurality of connectors. The carrier board has a gold finger for insertion into the first memory slot. The second memory slot is disposed on the carrier board and electrically connected to the gold finger. In addition, in practical applications, the second memory slot is configured to insert a memory module to be tested, and has a plurality of test points electrically connected to the test end of the memory module to be tested. In another aspect, the plurality of connectors are respectively disposed on the carrier board and are electrically/coupled to the test points. Thereby, a plurality of transmission lines electrically connected to the connectors can transmit signals from the test terminals of the memory module to be tested. In one embodiment of the present invention, the carrier is a printed circuit board. The first memory slot described in the 'buoy' has the same structure as the second memory slot. a brother recalls the body slot and the first
在本創作之一實施例中，上述之第一 二記憶體插槽分別為雙線上記憶模組插槽 連接器分別為SMA連接器，且所述之傳輕 此*外’所诚之佐;目丨丨#掩艘裙知炎m 6 M346011 訊號。藉此，與習知技術相較之下，測試人員無需尋找焊 接測試點，就可透過與連接器電性相連的傳輸線量測到測 武訊號。相對地，本創作也可避免習知技術在焊接記憔體 模組時所造成的損壞。 〜 為讓本創作之上述特徵和優點能更明顯易懂，下文特 舉較佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 圖1繪示為依照本創作一實施例之記憶體測試治具與 主板的結構示意圖。請參閱圖1，記憶體測試治具包 括一載板110、一記憶體插槽120以及多個連接器，例如· 連接器131〜133。在說明本實施例之前，必須先了解，圮 十思體測試治具100適用於一記憶體插槽21〇。其中，吃卜 體插槽210配置在一主板220上。此外，主板220例如是 電腦系統或伺服系統的主機板。 尺 請繼續參照圖1，載板110具有金手指1H。在實於 應用上，e己彳思體測试治具1〇〇會透過金手指111插設於^ 憶體插槽210，以電性連接至記憶體插槽21〇。其中，載板 130例如是印刷電路板。 另一方面，記憶體插槽120配置在載板110上，並與 - 金手指ill電性連接。在實際應用上，記憶體插槽12〇用 以插設一待測記憶體模組(未繪示出）。此外，記憶體插槽 12 0具有與待測記憶體模組之測試端電性相連的多個測言^ 點(未繪示出）。 、# 再者，連接器131〜133也配置在載板110上，並與前 7 M346011 述的多個測試點1_電性連接。在實際應用上，連接器 :31 :33刀 '用以书性連接一條傳輸線(未繪示出)。藉此， ，測ΖΙ：緣模組之Κ端將可透過記憶體插槽⑽與連接 益131 133 ffij刀別電性連接至多條傳輸線。相對地，所 述多條傳輸㈣可傳送來自待測記舰齡之職端的訊 號0In an embodiment of the present invention, the first two memory slots are respectively two-line memory module slot connectors are respectively SMA connectors, and the said pass is lighter;目丨丨# Covering the skirt and knowing the inflammation m 6 M346011 signal. In this way, compared with the prior art, the tester can measure the measurement signal through the transmission line electrically connected to the connector without looking for the soldering test point. In contrast, this creation also avoids the damage caused by conventional techniques when soldering cartridges. In order to make the above features and advantages of the present invention more comprehensible, the preferred embodiments are described below in conjunction with the accompanying drawings. [Embodiment] FIG. 1 is a schematic structural view of a memory test fixture and a main board according to an embodiment of the present invention. Referring to Figure 1, the memory test fixture includes a carrier 110, a memory slot 120, and a plurality of connectors, such as connectors 131-133. Before describing this embodiment, it must be understood that the 测试 思 体 test fixture 100 is suitable for a memory slot 21 〇. The eating slot 210 is disposed on a motherboard 220. Further, the main board 220 is, for example, a motherboard of a computer system or a servo system. Referring to Figure 1, the carrier 110 has a gold finger 1H. In practical applications, the e-sense test fixture 1 is inserted into the memory slot 210 through the gold finger 111 to be electrically connected to the memory slot 21〇. Among them, the carrier 130 is, for example, a printed circuit board. On the other hand, the memory slot 120 is disposed on the carrier 110 and electrically connected to the - gold finger ill. In practical applications, the memory slot 12 is used to insert a memory module to be tested (not shown). In addition, the memory slot 120 has a plurality of test points (not shown) electrically connected to the test end of the memory module to be tested. Further, the connectors 131 to 133 are also disposed on the carrier 110 and electrically connected to the plurality of test points 1_ described in the above 7 M346011. In practical applications, the connector: 31:33 knife 'uses a book to connect a transmission line (not shown). Therefore, the terminal of the edge module can be electrically connected to the plurality of transmission lines through the memory slot (10) and the connection 133 ff ffij knife. In contrast, the plurality of transmissions (4) can transmit signals from the terminal of the ship to be tested.
為了致使本領域具有通常知識者能更加了解本實 施’接下來料ι4酬記紐敎之測試賴訊號是如何 透過記憶體測試治具100而被讀出。 在貫際應用上，當待測記憶體模組插設於記憶體插槽 120 ’且§己憶體測試治具1〇〇透過金手指ηι插入在主板 220的圯憶體插槽210時，主板220可以透過記憶體測試 治具100對待測記憶體模組進行讀寫。在讀寫待測記憶體 模組的過程中，待測記憶體模組之測試端會產生測試訊 號。此時，使用者只需將連接器131〜133接上傳輸線，就 可透過與傳輸線相連的量測設備(例如是示波器），讀取到 來自待測憶體模組之測試端的訊號。 值得一提的是，在本實施例中，記憶體插槽21〇與記 憶體插槽120具有相同的結構。此外，記憶體插槽21〇與 記憶體插槽120例如是雙線上記憶模組(Duai In_line Memory Module，DIMM)插槽。此外，待測記憶體模組例如 是同步動態記憶體（Synchronous Dynamic Random Access Memory，SDRAM)、雙倍資料速率(Double Data Rate，DDR) 記憶體或是第二代雙倍資料速率（Double Data Rate 2, DDR2)記憶體等。 8 M346011 另一方面，在本實施例中，連接器131〜133例如是 SMA(Sub-MinaturetypeA)連接器。此外，與連接器 131 〜；[33 相連的傳輸線例如是同轴繞線。然而，本領域具有通常知 識者應知，記憶體模組、記憶體插槽、連接器以及傳輸線 的種類衫，目此可依輯所需來更換記紐模組、記憶 體插槽、連接器以及傳輸線的應用型態。 〜 _綜上所述，本創作是利用第二記憶體插槽所具有的測In order to enable those skilled in the art to have a better understanding of the present implementation, the test of the next test is read through the memory test fixture 100. In a continuous application, when the memory module to be tested is inserted into the memory slot 120' and the hex test fixture 1 is inserted into the memory slot 210 of the motherboard 220 through the golden finger ηι, The main board 220 can read and write the memory module to be tested through the memory test fixture 100. During the process of reading and writing the memory module to be tested, the test end of the memory module to be tested generates a test signal. At this time, the user only needs to connect the connectors 131 to 133 to the transmission line, and the signal from the test end of the module to be tested can be read through a measuring device (for example, an oscilloscope) connected to the transmission line. It is worth mentioning that in the present embodiment, the memory slot 21A has the same structure as the memory card slot 120. Further, the memory slot 21A and the memory slot 120 are, for example, Duai In_line Memory Module (DIMM) slots. In addition, the memory module to be tested is, for example, a Synchronous Dynamic Random Access Memory (SDRAM), Double Data Rate (DDR) memory, or a second generation double data rate (Double Data Rate). 2, DDR2) memory, etc. 8 M346011 On the other hand, in the present embodiment, the connectors 131 to 133 are, for example, SMA (Sub-Minature type A) connectors. Further, the transmission line connected to the connectors 131 to [33 is, for example, a coaxial winding. However, those skilled in the art should know that memory modules, memory slots, connectors, and transmission line types can be used to replace the button module, memory slot, and connector. And the application type of the transmission line. ~ _ In summary, this creation is based on the measurement of the second memory slot
忒二占以及載板上的連接器，導引出來自待測記憶體模組之 測試端的瓣u。藉此，賴人貞無需雜焊躺試點，就 可透過與連接器電性相連的傳輸線量測到測試訊號。 〜雖然本創作已以較佳實施例揭露如上，然其並非用以 限定本創作，任何所屬技術領域中具有通常知識者，在不 脫離本創作之精神和範圍内，當可作些許之更動與潤飾， ，此本創作之賴範圍當視後附之申請專職_ 為準。 【圖式簡單說明】 圖1繪示為依照本創作一實施例之記憶體測試治且鱼 主板的結構示意圖。Ί、 【主要元件符號說明】 1〇〇 :記憶體測試治且 110 :載板 111 :金手指 120、210 :記憶體插槽 131〜133 :連接器 220 :主板 9The second and the connectors on the carrier board guide the petals u from the test end of the memory module to be tested. In this way, Lai Renqi can measure the test signal through the transmission line electrically connected to the connector without the need for a miscellaneous welding pilot. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and any person having ordinary skill in the art can make some changes without departing from the spirit and scope of the present invention. Retouching, the scope of this creation depends on the application full-time _ attached. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing the structure of a memory board according to an embodiment of the present invention. Ί, [Main component symbol description] 1〇〇: Memory test and 110: Carrier board 111: Gold finger 120, 210: Memory slot 131~133: Connector 220: Main board 9