TWM343245U - Substrate carrier structure - Google Patents

Substrate carrier structure Download PDF

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Publication number
TWM343245U
TWM343245U TW97210841U TW97210841U TWM343245U TW M343245 U TWM343245 U TW M343245U TW 97210841 U TW97210841 U TW 97210841U TW 97210841 U TW97210841 U TW 97210841U TW M343245 U TWM343245 U TW M343245U
Authority
TW
Taiwan
Prior art keywords
substrate
bump
bearing
bottom plate
bumps
Prior art date
Application number
TW97210841U
Other languages
Chinese (zh)
Inventor
Kuo-Ching Chiang
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW97210841U priority Critical patent/TWM343245U/en
Publication of TWM343245U publication Critical patent/TWM343245U/en

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Abstract

Disclosed is a carrier structure for holding substrates with its clamping arms, the carrier comprising a plurality of symmetrically-aligned bumps disposed on the bottom board thereof, thereby allowing each of the bumps to carry substrates of different sizes and further preventing metals from entering into these bumps that would otherwise affect the evenness of holding the substrates on the carrier.

Description

M343245 八、新型說明: 【新型所屬之技術領域】 本創作係有關於-種承載治具,尤指-種基板之承載 治具能供承载不同大小尺寸之基板。 【先前技術】 隨著電子產業的蓬勃發展,電子產品亦朝向高性能和 .:功能的應用領域快速進展,為滿足不同應用領域電子產 印的而求’封裝基板的尺寸大小亦勢必將隨著電子產品應 籲用領域的不同,而有不同相對應的變化。 。 半v體製転中之封裝基板,於製程中必須先將該封裝 基板夹置於治具上,方能進行置晶或整平錫球等動作。 、么請參閱f 1A及1B圖,係為習知用以夾持基板之承載 /α具1 ’如第1A圖所示,係於底板丨i上設置有複數直角 狀之角凸塊12,且該些角凸塊12係圍構成柱狀,以於該 中心部位形成空心部12〇,又該角凸塊12之頂部係為平 春面12a ’於該承載治具1外並排列有生產機台(圖未示)所 •屬之複數夾臂13;如第1B圖所示,於該些角凸塊12之 -平面12a上放置基板14,使該角凸塊丨2支承該基板14, 並使該些複數夾臂13同時内進以夾靠在基板14之邊緣, 使該基板14精確夾置於承載治具1上。 惟’習知之該些角凸塊12係圍構成柱狀,且於該中 心部位形成空心部120,當待處理之基板14的尺寸較小 時’由於該些角凸塊12所圍構成之中心係為空心部12〇, 而缺少能夠提供支撐該基板的結構;因此,進行較小尺寸 M343245 處理時,必須因應不同大小之基板Η更換 對應尺寸之承載治具b因而造成製程的不便利性;此 同的各種不同尺寸的基板14預先製備對應不 勺承載/U 1,無形中增加製造成本。 柄制再者’為符合不同大小之承載治具1之便利性,並降 :克力的材質製成= 人 口應丨牛低成本的需未。然而,於該其 之製料職生係如觸#之金屬物f,容易嵌: 19知該以壓克力材質所製成之角凸塊12頂部之平面 導凸塊12構成之平面12&缺乏平整性,進而 基板14無法平整置放在該角凸塊12之平而19a 上’如此即影響該基板14之平整度;且嵌入該角凸㈣ 之平面12a中的金屬物質’或該平面m被金 =成毛邊,致使放置於該角凸塊12上的基㈣表面^ 劳因而造成基板14被報廢,同時降低產品的良率。 ,因此’如何在基板的製程中提供可因應不同尺寸基板 :承載化具’以減少更換承載治具的不便利性,同時避免 自头[克力材質之角凸塊因嵌入金屬物質,或壓克力材質 之角凸塊表面因金屬物質摩擦而刮傷,導致基板產品良率 降低的問題’實已成爲目前業界所亟待克服的難題。 【新型内容】 址鑒於上述習知技術的缺點,本創作之主要目的在於提 種基板之承載治具,能承载不同尺寸之基板,以免除 更換不同尺寸承載治具的不便利性。 6 M343245 避免在,提供一種基板之承载治具,能 捭 A承载冶具或用凸塊表面因金屬物質摩 .以影響基板產品良率的問題。 .係用的及其他目的,本創作基板之承載治具, Λσ/Λ臂以承载該基板,係包括H以及;^數 .凸塊,係對稱排列設置於該底板上。 及&數 上之基板之承載治具,該凸塊係設置於該底板之 •板=1角:位置,且該凸塊係以45度角設置於該底 · :〜凸塊係呈長條型且斷面係為圓弧形;又 Μ 免i為鎢鋼之金屬材質。 制成本Γέ作基板之承載治具’該凸塊係由質地堅硬之鎮鋼 :,使,光處理’又該凸塊為斷面為圓弧之形長條 狀使该金屬物質不易嵌入該凸塊中,且該凸塊 質刮傷’俾以避免該凸塊與基板接觸時所造成 劳土板表面的問題,並且提升基板產品之 凸塊之長短設計,而能承載不同尺寸大小之基::: .不地支撐該基板之功效,並可減少更換承載治具的 【實施方式】 >以下藉由特定的具體實施例說明本創作之實施方 式’熟悉此技藝之人士可由本說明書所揭示之内容輕易地 瞭解本創作之其他優點及功效。 請參閱第2Α及2Β圖’係為本創作基板之承載治具之 立體示意圖及搭載基板之示意圖;係於承载治具2 :放 7 M343245 置基板23,且於該承載治具2外排列有生產機台(圖未示) 所屬之複數夾臂24,使該夾臂24用以夾持該基板23,該 承載治具2係於底板21上對稱排列設置有複數凸塊22, 且該凸塊22係為斷面為圓弧形之長條型,該凸塊22係為 鎢鋼之金屬材質。 請參閱第2C圖,該複數凸塊22係以45度角相互對 %地设置於該底板21之對角線位置上,且為斷面為圓弧 之形長條狀,使該凸塊22表面不會殘留金屬物質,且該 、’屬物貝亦不會刮傷凸塊22之表面,此外依據凸塊22 長紐之不同設計,而能夠同時對應置放不同尺寸之基板 23,以達到平穩地支撐該基板23之功效。 該凸塊22係為鶴鋼之金屬材質,而可避免係如銅絲 二之金屬物質嵌入該凸塊22中’能避免該凸塊22與基板 接觸時造成刮傷基板表面的問題,進而能提高製程良 >本創作基板之承載治具,該凸塊係由質地堅硬 :成蚀且經過抱先處理’又該凸塊為斷面為圓弧之形長: 使該金屬物質不易嵌入該凸塊中,以及金屬物質不Ϊ =表面_,並且提;基:產 並可’以達到平穩地支撐該基板之功效, 』减夕更換承載治具的不便利性。 上述實施例僅例示性說明本 非用於_本㈣。料糊作㈣ M343245 知識者均可在不違背本創作之精神及範疇下,對上述實施 例進行修飾與改變。因此,本創作之權利保護範圍,應如 後述之申請專利範圍所列。 【圖式簡單說明】 第1A圖係為習知^载治具結構之立體示意圖; 圖 弟1B圖係為習知承载治具結構搭載基板之側視示意M343245 VIII. New description: [New technical field] The author has a kind of bearing fixture, especially the carrier of the substrate can be used to carry substrates of different sizes. [Prior Art] With the rapid development of the electronics industry, electronic products are also rapidly advancing toward high-performance and functional applications. In order to meet the electronic printing of different application fields, the size of the package substrate is bound to increase. Electronic products should appeal to different fields and have different corresponding changes. . In the half-v system, the package substrate must be placed on the fixture before the process can be used to crystallize or level the solder ball. Please refer to the figures f 1A and 1B, which are conventionally used for holding the substrate/α1 1'. As shown in FIG. 1A, a plurality of right-angled corner bumps 12 are disposed on the bottom plate 丨i. And the corner bumps 12 are formed into a column shape to form a hollow portion 12 该 at the center portion, and the top portion of the corner bump 12 is a flat spring surface 12a ′ outside the load-bearing jig 1 and arranged for production. a plurality of clamping arms 13 of the machine (not shown); as shown in FIG. 1B, the substrate 14 is placed on the plane 12a of the corner bumps 12, so that the corner bumps 2 support the substrate 14 And the plurality of clamping arms 13 are simultaneously inserted to be clamped against the edge of the substrate 14, so that the substrate 14 is accurately sandwiched on the bearing fixture 1. However, the conventional angular projections 12 are formed into a columnar shape, and the hollow portion 120 is formed at the central portion. When the size of the substrate 14 to be processed is small, the center of the corner projections 12 is formed. It is a hollow portion 12〇, and lacks a structure capable of providing support for the substrate; therefore, when the M343245 is processed in a small size, it is necessary to replace the bearing j of the corresponding size for the substrate 不同 of different sizes, thereby causing process inconvenience; The same various sizes of the substrate 14 are prepared in advance to correspond to the unspoken load/U1, which invisibly increases the manufacturing cost. The shank system is more convenient for the bearing fixtures of different sizes, and it is reduced: the material of the crepe is made = the demand for the yak is low. However, in the material production system of the material, such as the metal material f of the touch #, it is easy to embed: 19, the flat guide 12 formed on the top of the corner bump 12 made of acrylic material is formed into a plane 12& Lack of flatness, and thus the substrate 14 cannot be placed flat on the flat 19a of the corner bumps 12, thus affecting the flatness of the substrate 14; and the metal substance 'or the plane embedded in the plane 12a of the corner (4) m is gold = burrs, causing the surface of the base (4) placed on the corner bumps 12 to cause the substrate 14 to be scrapped while reducing the yield of the product. Therefore, 'how to provide different sizes of substrates in the process of the substrate: carrying the tooling' to reduce the inconvenience of replacing the bearing fixture, while avoiding self-heading [the angle of the bump of the material is due to the embedded metal substance, or pressure The problem that the surface of the bump of the gram material is scratched by the friction of the metal material, resulting in a decrease in the yield of the substrate product has become a difficult problem to be overcome in the industry. [New Content] Address In view of the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a substrate carrying fixture capable of carrying substrates of different sizes, so as to avoid the inconvenience of replacing different size bearing fixtures. 6 M343245 avoids the problem of providing a substrate carrying fixture that can carry the tool or the surface of the bump due to the metal material to affect the yield of the substrate. For the purpose of use and other purposes, the carrier fixture of the present substrate, the Λσ/Λ arm to carry the substrate, includes H and the number of bumps, which are symmetrically arranged on the bottom plate. And the bearing fixture of the substrate on the & number, the bump is disposed on the bottom plate of the bottom plate: position, and the bump is disposed at the bottom at a 45 degree angle: ~ the bump is long The strip type and the section are arc-shaped; and the i is a metal material of tungsten steel. The bearing fixture of the manufacturing cost substrate is 'the bump is made of a hardened steel: the light treatment' and the bump is a long strip having a circular arc shape so that the metal substance is not easily embedded in the In the bump, the bump is scratched to avoid the problem of the surface of the soil plate caused by the bump contacting the substrate, and the length of the bump of the substrate product is improved, and the base of different sizes can be carried. ::: The effect of the substrate is not supported, and the method of replacing the carrying jig is reduced. [Embodiment] The following describes an embodiment of the present invention by a specific embodiment. Reveal the content to easily understand the other advantages and effects of this creation. Please refer to the 2nd and 2nd drawings for a schematic view of the bearing fixture of the original substrate and a schematic diagram of the mounting substrate; the bearing fixture 2 is placed on the substrate 23 of the M343245, and is arranged outside the bearing fixture 2 The plurality of clamping arms 24 of the production machine (not shown) are used to clamp the substrate 23, and the bearing fixtures 2 are symmetrically arranged on the bottom plate 21 with a plurality of bumps 22, and the convex The block 22 is a long strip having a circular arc shape, and the bump 22 is made of a metal material of tungsten steel. Referring to FIG. 2C, the plurality of bumps 22 are disposed at a diagonal position of the bottom plate 21 at an angle of 45 degrees, and are elongated in the shape of a circular arc, so that the bumps 22 are formed. The metal material does not remain on the surface, and the 'beauty shell does not scratch the surface of the bump 22, and according to the different design of the bump 22, the substrate 23 of different sizes can be placed correspondingly to achieve The effect of the substrate 23 is smoothly supported. The bump 22 is made of a metal material of Hegang, and can prevent the metal material such as the copper wire from being embedded in the bump 22 to avoid the problem of scratching the surface of the substrate when the bump 22 is in contact with the substrate. Improve the process of the process> The carrier fixture of the creation substrate, the bump is made of hard texture: etched and pre-treated by the 'the bump is the shape of the arc of the cross section: making the metal material difficult to embed In the bump, and the metal material is not Ϊ = surface _, and mention; base: production and can 'to achieve the effect of smoothly supporting the substrate, 』 eve of the inconvenience of replacing the carrying fixture. The above embodiments are merely illustrative of the use of this (not for the fourth). Miscellaneous (4) M343245 Knowledge can modify and change the above embodiments without departing from the spirit and scope of this creation. Therefore, the scope of protection of this creation should be as listed in the scope of the patent application described later. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a schematic perspective view of a conventional fixture structure; FIG. 1B is a side view of a conventional carrier-mounted structure.

及 第2A圖係本創作基板 第2B圖係本創作基板 之承载治具立體示意圖; 之承载治具之側視示意圖 以 【主 1、2 11、 12 120 12a 13、 14、 22 弟2C圖係本創作基板 要元件符號說明1 7冑治具之上視示意圖 承載治具 底板 角凸塊 空心部 平面 U 夾臂 ^ 基板 凸塊2A is a perspective view of the bearing fixture of the present creation substrate; the side view of the bearing fixture is [2, 2, 11, 12, 12, 12, 13, 22, 22, 2C, This creative substrate requires component symbol description 1 7 胄 fixture top view schematic bearing fixture bottom plate corner bump hollow plane plane U clip arm ^ substrate bump

Claims (1)

M343245 九、申請專利範圍: 1 · 一種基板之承載治罝,# m 係包括: 一係用於配合夾臂以承載基板, « 底板;以及 減凸塊’係對稱排列設置於該底板上。 ••如申請專利範圍第1項之基板之承載治具,並中,兮 凸塊係設置於該底板之上表面的對角線位置:、- •如申請專利範圍第2項之美柘夕i/ 貝之丞板之承載治具,1 凸塊係以45度角設置於該底板之上表面。八 其中,該 4. 如申請專利範圍第lJM之基板之承载^具 凸塊係壬長條型。 其中,該 5. 如申請專利範圍#1項之基板之承載治具 凸塊之Wf面係為圓弧形。 6. 如申請專利範圍第Μ之基板之承裁 凸塊係為金屬材質。 八Υ 51 7. 如申請專利範圍第1項之基板之 〜取载治具,豆中,兮 凸塊係為鎢鋼。 ' ^ ^ ^M343245 IX. Patent application scope: 1 · A substrate bearing treatment, #m system includes: a series is used to match the clamp arm to carry the substrate, and the «backplane; and the reduced bumps are symmetrically arranged on the bottom plate. • The bearing fixture of the substrate of claim 1 of the patent application, and the ridge bump is disposed at a diagonal position on the upper surface of the bottom plate: - - as in the second paragraph of the patent application scope / The bearing fixture of the shell of the shell, 1 bump is placed at the upper surface of the bottom plate at a 45 degree angle. 8. Among them, the carrier of the substrate of the lJM of the patent application scope is a strip type. Wherein, the bearing surface of the substrate of the substrate of claim #1 is a circular arc shape. 6. If the base plate of the application for the patent scope is the base, the bump is made of metal. Gossip 51 7. If you apply for the substrate of the first paragraph of the patent scope ~ take the jig, the bean, the 凸 bump is tungsten steel. ' ^ ^ ^
TW97210841U 2008-06-19 2008-06-19 Substrate carrier structure TWM343245U (en)

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TW97210841U TWM343245U (en) 2008-06-19 2008-06-19 Substrate carrier structure

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TW97210841U TWM343245U (en) 2008-06-19 2008-06-19 Substrate carrier structure

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110167270A (en) * 2019-05-29 2019-08-23 业成科技(成都)有限公司 Jig and mounting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110167270A (en) * 2019-05-29 2019-08-23 业成科技(成都)有限公司 Jig and mounting device

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