JP2024024647A5 - - Google Patents
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- Publication number
- JP2024024647A5 JP2024024647A5 JP2023202508A JP2023202508A JP2024024647A5 JP 2024024647 A5 JP2024024647 A5 JP 2024024647A5 JP 2023202508 A JP2023202508 A JP 2023202508A JP 2023202508 A JP2023202508 A JP 2023202508A JP 2024024647 A5 JP2024024647 A5 JP 2024024647A5
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- metal plating
- protrusions
- aspect ratio
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 239000010970 precious metal Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229910000510 noble metal Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Description
実施形態の一態様に係る金属部品は、半導体装置の製造に用いられる金属部品において、導電性を有する基材と、前記基材の表面の全面または一部に形成される貴金属めっき層と、を備える。また、前記貴金属めっき層は、表面に粒状の凹凸形状を有し、前記凹凸形状における凸部のアスペクト比が０．３以上である。 A metal part according to one aspect of the embodiment is a metal part for use in the manufacture of a semiconductor device, comprising a conductive base material and a precious metal plating layer formed on the entire surface or a part of the surface of the base material, the precious metal plating layer having a granular uneven shape on the surface, the protrusions of the uneven shape having an aspect ratio of 0.3 or more.
Claims (3)
導電性を有する基材と、
前記基材の表面の全面または一部に形成される貴金属めっき層と、
を備え、
前記貴金属めっき層は、表面に粒状の凹凸形状を有し、前記凹凸形状における凸部のアスペクト比が０．３以上である
金属部品。 In metal parts used in the manufacture of semiconductor devices,
A conductive substrate;
a precious metal plating layer formed on the entire surface or a part of the surface of the base material;
Equipped with
The noble metal plating layer has a granular uneven surface, and the aspect ratio of the protrusions in the uneven surface is 0.3 or more.
請求項１に記載の金属部品。 The metal part according to claim 1 , wherein the precious metal plating layer contains Ag as a main component.
請求項１または２に記載の金属部品。 The metal part according to claim 1 or 2, wherein the protrusions have an aspect ratio of 0.5 or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023202508A JP2024024647A (en) | 2021-07-28 | 2023-11-30 | Metal component |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021123496A JP7454530B2 (en) | 2021-07-28 | 2021-07-28 | metal parts |
| JP2023202508A JP2024024647A (en) | 2021-07-28 | 2023-11-30 | Metal component |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021123496A Division JP7454530B2 (en) | 2021-07-28 | 2021-07-28 | metal parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024024647A JP2024024647A (en) | 2024-02-22 |
| JP2024024647A5 true JP2024024647A5 (en) | 2024-04-24 |
Family
ID=82656483
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021123496A Active JP7454530B2 (en) | 2021-07-28 | 2021-07-28 | metal parts |
| JP2023202508A Pending JP2024024647A (en) | 2021-07-28 | 2023-11-30 | Metal component |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021123496A Active JP7454530B2 (en) | 2021-07-28 | 2021-07-28 | metal parts |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230047332A1 (en) |
| EP (1) | EP4124678A1 (en) |
| JP (2) | JP7454530B2 (en) |
| CN (1) | CN115692353A (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH053277A (en) | 1991-06-25 | 1993-01-08 | Hitachi Ltd | Semiconductor device |
| JPH0786484A (en) * | 1993-09-14 | 1995-03-31 | Matsushita Electron Corp | Resin-sealed semiconductor device |
| JP6744020B1 (en) * | 2019-03-22 | 2020-08-19 | 大口マテリアル株式会社 | Lead frame |
| JP6733941B1 (en) * | 2019-03-22 | 2020-08-05 | 大口マテリアル株式会社 | Substrate for mounting semiconductor elements |
-
2021
- 2021-07-28 JP JP2021123496A patent/JP7454530B2/en active Active
-
2022
- 2022-07-14 CN CN202210824388.1A patent/CN115692353A/en active Pending
- 2022-07-19 EP EP22185760.0A patent/EP4124678A1/en active Pending
- 2022-07-22 US US17/871,281 patent/US20230047332A1/en active Pending
-
2023
- 2023-11-30 JP JP2023202508A patent/JP2024024647A/en active Pending
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