TWI766276B - Combination of furnace surface block and furnace surface base of double vacuum module for crystal welding machine - Google Patents

Combination of furnace surface block and furnace surface base of double vacuum module for crystal welding machine Download PDF

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TWI766276B
TWI766276B TW109115759A TW109115759A TWI766276B TW I766276 B TWI766276 B TW I766276B TW 109115759 A TW109115759 A TW 109115759A TW 109115759 A TW109115759 A TW 109115759A TW I766276 B TWI766276 B TW I766276B
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block
furnace
longitudinal
perforation
cooktop
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TW109115759A
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TW202135260A (en
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黃家豪
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金欣實業有限公司
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This creation is a combination of a furnace block and a furnace base of a dual vacuum module for a crystal welding machine, including: a furnace block with a receiving surface for receiving a substrate on the crystal welding machine, and The hearth block includes: a plurality of first perforation groups whose openings are located in a middle area of the receiving surface of the hearth block; and two second perforation groups whose openings are located in two peripheral areas of the receiving surface of the hearth block. The first perforated groups and the two second perforated groups are not connected and connected; and a plurality of first longitudinal channels are used to communicate with the first perforated groups respectively; and the two second longitudinal channels are used to communicate with each other. The two second perforation groups of the two, the first longitudinal channels and the two second longitudinal channels are not connected and conducted; the two lateral channels are connected and conducted with the two second longitudinal channels, and the There is a height difference between the two lateral passages and the two second longitudinal passages; wherein both ends of the first longitudinal passage, the second longitudinal passage, and the transverse passage are closed ends; and a furnace surface base for receiving and fix the hearth block.

Description

用於銲晶機的雙真空模組的爐面塊及爐面底座之組合 Combination of cooktop block and cooktop base for dual vacuum modules of crystal welding machine

本創作係關於一種利用真空吸附之固定基板裝置;更詳而言之,特別係指一種用於銲晶機的雙真空模組的爐面塊及爐面底座之組合。 This creation is about a fixed substrate device using vacuum adsorption; more specifically, it refers to a combination of a furnace block and a furnace surface base for a double vacuum module of a soldering machine.

在半導體封裝結構中,其最下方通常係一基板單元(Substrate)。在製程中,通常是在一基板(Substrate Panel)上進行疊設晶片、打線及灌膠等作業後,再切割該基板以形成複數個半導體封裝結構。因此,該製程之第一要務係將該基板平整穩定地固定於一機台上。此外,在製程中常需要利用一傳送裝置搬動該基板,因而也需要將該基板平整穩定地固定於該傳送裝置上。傳統上,利用真空吸附之方法及裝置係為最常見之固定基板之方式。 In the semiconductor package structure, a substrate unit (Substrate) is usually at the bottom. In the manufacturing process, after stacking chips, wire bonding and gluing, etc. on a substrate panel, the substrate is cut to form a plurality of semiconductor package structures. Therefore, the first priority of the process is to fix the substrate flatly and stably on a machine. In addition, it is often necessary to use a conveying device to move the substrate during the manufacturing process, so the substrate also needs to be flatly and stably fixed on the conveying device. Traditionally, methods and devices utilizing vacuum adsorption are the most common ways to fix substrates.

通常對半導體製造用基板或印刷電路板(PCB)進行附持、固定的擋板類之固定方法,包括螺絲、磁鐵、真空吸附和磁鐵並用之固定方法。 Fixing methods such as baffles, which are usually used to attach and fix semiconductor substrates or printed circuit boards (PCBs), include screws, magnets, vacuum adsorption and magnets.

使用螺絲進行固定的方法,是對用以附持半導體製造用基板或印刷電路板(PCB)的塊狀體進行固定時最常使用的方法,通過利用螺絲在所述塊狀體前後、左右的2個或2個以上位置連接固定,防止真空塊本體 發生移動。 The method of fixing with screws is the most commonly used method for fixing a block to which a substrate for semiconductor manufacturing or a printed circuit board (PCB) is attached. 2 or more positions are connected and fixed to prevent the vacuum block body Movement occurs.

使用磁鐵的方法,是指通過在塊狀體的下側面裝配磁鐵,使其半導體基板或印刷電路板(PCB)附著在固定支撐台中的方法。此時,可以通過調整磁鐵磁性強度的方式對其附著力進行調節。 The method of using a magnet refers to a method of attaching a semiconductor substrate or a printed circuit board (PCB) to a fixed support by attaching a magnet to the lower side of the block. At this time, the adhesion force of the magnet can be adjusted by adjusting the magnetic strength of the magnet.

在使用真空吸附方式時,在真空塊的支撐體上側面配備真空板,並使真空板板面和真空塊下側面之間形成真空,從而達到附持效果。且近年來動態隨機存取記憶體設計朝向薄型化,容易產生翹曲情況,因此在真空吸附方式時,需要較大的吸附能力,才容易吸附。 When using the vacuum adsorption method, a vacuum plate is equipped on the upper side of the support body of the vacuum block, and a vacuum is formed between the plate surface of the vacuum plate and the lower side of the vacuum block, so as to achieve the adhesion effect. Moreover, in recent years, the design of dynamic random access memory tends to be thinner, which is prone to warping. Therefore, in the vacuum adsorption method, a large adsorption capacity is required to facilitate adsorption.

因此,綜上所述,根據不同的印刷電路板(PCB),即不同的印刷電路板(PCB)大小和內部晶片佈局,還必須更換使用不同的所述真空塊,才能夠順利進行生產,並且配合動態隨機存取記憶體設計朝向薄型化,容易產生翹曲情況,因此在真空吸附方式時,需要在爐面塊上設計較大的吸附能力。 Therefore, to sum up, according to different printed circuit boards (PCBs), ie different printed circuit board (PCB) sizes and internal wafer layouts, it is also necessary to replace and use different said vacuum blocks in order to be able to produce smoothly, and With the dynamic random access memory design, it tends to be thinner, which is prone to warpage. Therefore, in the vacuum adsorption method, it is necessary to design a larger adsorption capacity on the cooktop block.

本創作之主要目的在於,提供一種用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,在當動態隨機存取記憶體設計朝向薄型化,容易產生翹曲情況,因此在真空吸附方式時,可以在爐面塊上設計較大的吸附能力,且應用於在銲晶機時,可以減少每次工件需要的吸附次數因而提升產能,節省工作時間,因而提高銲晶機的工作效率。 The main purpose of this creation is to provide a combination of a furnace top block and a furnace top base for a dual vacuum module of a soldering machine. When the dynamic random access memory is designed to be thin, it is easy to produce warpage. Therefore, In the vacuum adsorption method, a larger adsorption capacity can be designed on the furnace block, and when applied to the soldering machine, it can reduce the number of adsorption times required for each workpiece, thereby increasing the production capacity and saving working time, thus improving the soldering machine. work efficiency.

為達上揭目的,本創作係提供一種用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,包括:一爐面塊,具有一承接面,用以承接該銲晶機上的一基板,且該爐面塊包括:複數個第一穿孔組,其開口位於該爐面塊之承接面的一中間區域;及兩個第二穿孔組,其開口位於爐面塊之承接面的兩個外圍區域,該些第一穿孔組及該兩個第二穿孔組係不連接 導通;以及複數個第一縱向通道,用以分別連通該些第一穿孔組;兩個第二縱向通道,用以分別連通該兩個的該些第二穿孔組,該些第一縱向通道及該兩個第二縱向通道係不連接導通;兩個橫向通道,其與該兩個第二縱向通道係連接導通,且該兩個橫向通道與該兩個第二縱向通道之間具有一高低差;其中上述第一縱向通道、第二縱向通道及橫向通道之兩端皆為封閉端;以及一爐面底座,用以承接並固定該爐面塊,並分別具有一第一管道及一第二管道用以分別導通該些第一縱向通道及該兩個第二縱向通道,並分別連接該銲晶機之第一真空模組及第二真空模組,以分別獨立產生真空吸附該基板之第一區域及兩個第二區域。 In order to achieve the purpose of the above disclosure, this creation system provides a combination of a stove top block and a stove top base for a dual vacuum module of a crystal welding machine, including: a stove top block with a receiving surface for receiving the welding crystal. A base plate on the machine, and the cooktop block includes: a plurality of first perforated groups, the openings of which are located in a middle area of the receiving surface of the cooktop block; and two second perforated groups, the openings of which are located between the cooktop blocks. The two peripheral areas of the receiving surface, the first perforation groups and the two second perforation groups are not connected Conduction; and a plurality of first longitudinal channels for communicating with the first perforation groups respectively; two second longitudinal channels for respectively communicating with the two second perforation groups, the first longitudinal channels and The two second longitudinal channels are not connected and conducted; the two lateral channels are connected and conducted with the two second longitudinal channels, and there is a height difference between the two lateral channels and the two second longitudinal channels ; wherein both ends of the first longitudinal channel, the second longitudinal channel and the transverse channel are closed ends; The pipes are used to conduct the first longitudinal passages and the two second longitudinal passages respectively, and are respectively connected to the first vacuum module and the second vacuum module of the soldering machine, so as to independently generate a vacuum to adsorb the substrate. One area and two second areas.

本創作之用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,其中,該第一穿孔組及該第二穿孔組係陣列排列成一矩陣。 The combination of the furnace surface block and the furnace surface base for the dual vacuum module of the crystal welding machine of the present invention, wherein the first perforation group and the second perforation group are arrayed in a matrix.

本創作之用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,其中,該基板之第一區域係相對於該爐面塊之中間區域,以將該基板之第一區域吸附於該爐面塊之中間區域,該基板之兩個第二區域係相對於該爐面塊之兩個外圍區域,以將該基板之兩個第二區域吸附於該爐面塊之兩個外圍區域。 The combination of the furnace surface block and the furnace surface base for the dual vacuum module of the soldering machine of this invention, wherein the first area of the substrate is opposite to the middle area of the furnace surface block, so that the first area of the substrate is opposite to the middle area of the furnace surface block. The area is adsorbed on the middle area of the cooktop block, and the two second areas of the base plate are opposite to the two peripheral areas of the cooktop block, so that the two second areas of the substrate are adsorbed on the two second areas of the cooktop block. a peripheral area.

本創作之用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,其中,該第二穿孔組具有至少一排穿孔連接該第二縱向通道,該些穿孔為圓孔狀或方孔狀。 The combination of the furnace top block and the furnace top base for the dual vacuum module of the soldering machine of the present invention, wherein the second perforation group has at least one row of perforations connected to the second longitudinal channel, and the perforations are in the shape of round holes or square hole.

本創作之用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,其中,該第二穿孔組具有兩排穿孔連接該第二縱向通道,該兩排穿孔彼此對齊或彼此交錯。 The combination of the furnace top block and the furnace top base for the dual vacuum module of the crystal welding machine of the present invention, wherein the second perforation group has two rows of perforations to connect the second longitudinal channel, and the two rows of perforations are aligned with each other or with each other staggered.

本創作係提供一種用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,包括:一爐面塊,具有一承接面,用以承接該銲晶機上的一基板,且該爐面塊包括:複數個第一穿孔組,其開口位於該爐面塊之承 接面的一中間區域;兩個第二穿孔組,其開口位於爐面塊之承接面的兩個第一外圍區域,該些第一穿孔組及該兩個第二穿孔組係不連接導通;兩個第三穿孔組,其開口位於爐面塊之承接面的中間區域的兩個第二外圍區域,其中該兩個第一外圍區域及該兩個第二外圍區域環繞該中間區域;以及複數個第一縱向通道,用以分別連通該些第一穿孔組;兩個第二縱向通道,用以分別連通該兩個的該些第二穿孔組,該些第一縱向通道及該兩個第二縱向通道係不連接導通;兩個橫向通道,用以分別連通該兩個的該些第三穿孔組,其中該兩個橫向通道與該兩個第二縱向通道係連接導通,且該兩個橫向通道與該兩個第二縱向通道位於同一水平高度;其中上述第一縱向通道、第二縱向通道及橫向通道之兩端皆為封閉端;以及一爐面底座,用以承接並固定該爐面塊,並分別具有一第一管道及一第二管道用以分別導通該些第一縱向通道、該兩個第二縱向通道,並分別連接該銲晶機之第一真空模組及第二真空模組,以分別獨立產生真空吸附該基板之第一區域及兩個第二區域。 This creation provides a combination of a furnace surface block and a furnace surface base for a dual vacuum module of a crystal welding machine, including: a furnace surface block, which has a receiving surface for receiving a substrate on the crystal welding machine, And the cooktop block includes: a plurality of first perforation groups, the openings of which are located at the support of the cooktop block. a middle area of the junction surface; two second perforation groups, the openings of which are located in the two first peripheral areas of the receiving surface of the furnace block, and the first perforation groups and the two second perforation groups are not connected and conducted; Two third perforation groups, the openings of which are located in the two second peripheral regions of the middle region of the receiving surface of the furnace block, wherein the two first peripheral regions and the two second peripheral regions surround the middle region; and a plurality of A first longitudinal channel is used to connect the first perforation groups respectively; two second longitudinal channels are used to respectively communicate with the two second perforation groups, the first longitudinal channels and the two second perforation groups. The two longitudinal channels are not connected and conducted; the two lateral channels are used to communicate with the two third perforation groups respectively, wherein the two lateral channels and the two second longitudinal channels are connected and conducted, and the two The transverse channel and the two second longitudinal channels are located at the same level; both ends of the first longitudinal channel, the second longitudinal channel and the transverse channel are closed ends; and a furnace surface base is used to receive and fix the furnace The noodle block has a first pipeline and a second pipeline respectively for conducting the first longitudinal passages and the two second longitudinal passages respectively, and respectively connecting the first vacuum module and the second vacuum unit of the soldering machine. The vacuum module is used to independently generate vacuum to adsorb the first area and the two second areas of the substrate.

本創作之用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,其中,該第一穿孔組、該第二穿孔組及該第三穿孔組係陣列排列成一矩陣。 The combination of the furnace top block and the furnace top base for the dual vacuum module of the crystal welding machine of the present invention, wherein the first perforation group, the second perforation group and the third perforation group are arrayed in a matrix.

本創作之用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,其中,該基板之第一區域係相對於該爐面塊之中間區域,以將該基板之第一區域吸附於該爐面塊之中間區域,該基板之兩個第二區域係相對於該爐面塊之兩個第一及第二外圍區域,以將該基板之兩個第二區域吸附於該爐面塊之兩個第一及第二外圍區域。 The combination of the furnace surface block and the furnace surface base for the dual vacuum module of the soldering machine of this invention, wherein the first area of the substrate is opposite to the middle area of the furnace surface block, so that the first area of the substrate is opposite to the middle area of the furnace surface block. The area is adsorbed on the middle area of the furnace block, and the two second areas of the substrate are opposite to the two first and second peripheral areas of the furnace block, so that the two second areas of the substrate are attracted to the The two first and second peripheral regions of the cooktop block.

本創作之用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,其中,該第二穿孔組具有至少一排穿孔連接該第二縱向通道。 The combination of the furnace top block and the furnace top base for the dual vacuum module of the crystal welding machine of the present invention, wherein the second perforation group has at least one row of perforations connected to the second longitudinal channel.

本創作之用於銲晶機的雙真空模組的爐面塊及爐面底座之 組合,其中,該第二穿孔組具有兩排穿孔連接該第二縱向通道。 The creation of the furnace surface block and the furnace surface base for the dual vacuum module of the soldering machine combination, wherein the second perforation group has two rows of perforations connecting the second longitudinal channel.

本創作之用於銲晶機的雙真空模組吸附爐面塊及爐面底座,在當動態隨機存取記憶體設計朝向薄型化,容易產生翹曲情況,因此在真空吸附方式時,可以在爐面塊上設計較大的吸附能力,且應用於在銲晶機時,可以減少每次工件需要的吸附次數因而提升產能,節省工作時間,因而提高銲晶機的工作效率。 The dual-vacuum modules used in this creation for the soldering machine to adsorb the furnace block and the furnace surface base, when the DRAM design is thin, it is easy to produce warpage, so in the vacuum adsorption method, it can be The furnace block is designed with a large adsorption capacity, and when it is used in a crystal welding machine, it can reduce the number of adsorption times required for each workpiece, thereby increasing the production capacity, saving working time, and thus improving the working efficiency of the crystal welding machine.

為期許本創作之目的、功效、特徵及結構能夠有更為詳盡之了解,茲舉較佳實施例並配合圖式說明如後。 In order to have a more detailed understanding of the purpose, function, features and structure of this creation, preferred embodiments are given and described in conjunction with the drawings as follows.

10:爐面塊 10: Stovetop Blocks

20:爐面塊 20: Cooktop Blocks

30:爐面底座 30: Cooktop base

32:第一管道 32: First Pipeline

34:第二管道 34: Second Pipe

100:第一穿孔組 100: The first piercing group

200:第二穿孔組 200: Second Piercing Group

300:第三穿孔組 300: Third Piercing Group

110:第一縱向通道 110: The first longitudinal passage

210:第二縱向通道 210: Second longitudinal passage

310:橫向通道 310: Lateral channel

410:橫向通道 410: Lateral channel

120:基板 120: Substrate

150:第一區域 150: The first area

180:中間區域 180: Middle area

182:溝槽 182: Groove

250:第二區域 250: Second area

260:外圍區域 260: Peripheral area

262:溝槽 262: Groove

270:第一外圍區域 270: First Peripheral Area

280:第二外圍區域 280: Second Peripheral Area

第1圖:本創作實施例之一用於銲晶機的雙真空模組的爐面塊示意圖; Figure 1: A schematic diagram of a furnace block for a dual vacuum module of a crystal welding machine in one of the creative embodiments;

第1a圖:本創作實施例之另一用於銲晶機的雙真空模組的爐面塊示意圖; Figure 1a: a schematic diagram of a furnace block of another dual vacuum module used for a crystal welding machine in this creative embodiment;

第1b圖:本創作實施例之又一用於銲晶機的雙真空模組的爐面塊示意圖; Fig. 1b: a schematic diagram of a furnace block of another dual vacuum module used in a crystal welding machine in this creative embodiment;

第2圖:本創作實施例之二用於銲晶機的雙真空模組的爐面塊示意圖; Figure 2: Schematic diagram of the furnace block for the dual vacuum module of the crystal welding machine in the second embodiment of this creation;

第3圖:本創作實施例之一用於銲晶機的雙真空模組的爐面底座示意圖; Figure 3: A schematic diagram of a furnace surface base for a dual vacuum module of a crystal welding machine in one of the creative embodiments;

第4圖:本創作實施例之一用於銲晶機的雙真空模組的爐面塊及爐面底座的組合示意圖。 Figure 4: A schematic diagram of the combination of the furnace block and the furnace surface base for the dual vacuum module of the crystal welding machine in one of the creative embodiments.

圖1為本創作實施例之一用於銲晶機的雙真空模組的爐面塊示意圖、圖2為本創作實施例之二用於銲晶機的雙真空模組的爐面塊示意圖、圖3為本創作實施例之一用於銲晶機的雙真空模組的爐面底座示意圖及圖4為本創作實施例之一用於銲晶機的雙真空模組的爐面塊及爐面底座的組合示意圖。請參閱第1圖、第3圖及第4圖,一種用於銲晶機的雙真空模組的爐面塊10及爐面底座30之組合,包括:一爐面塊10,具有一 承接面,用以承接該銲晶機(圖未示)上的一基板120,且該爐面塊10包括:複數個第一穿孔組100,其開口位於該爐面塊10之承接面的一中間區域180;及兩個第二穿孔組200,其開口位於爐面塊10之承接面的兩個外圍區域260,該些第一穿孔組100及該兩個第二穿孔組200係不連接導通;以及複數個第一縱向通道110,用以分別連通該些第一穿孔組100;兩個第二縱向通道210,用以分別連通該兩個的該些第二穿孔組200,該些第一縱向通道110及該兩個第二縱向通道210係不連接導通;兩個橫向通道310,其與該兩個第二縱向通道210係連接導通,且該兩個橫向通道310與該兩個第二縱向通道210之間具有一高低差;其中上述第一縱向通道110、第二縱向通道210及橫向通道310之兩端皆為封閉端;以及一爐面底座30,用以承接並固定(舉例:可用螺絲固定)該爐面塊10,並分別具有一第一管道32及一第二管道34用以分別導通該些第一縱向通道110及該兩個第二縱向通道210,並分別連接該銲晶機之第一真空模組及第二真空模組,以分別獨立產生真空吸附該基板120之第一區域150及兩個第二區域250。 Fig. 1 is a schematic diagram of a furnace surface block of a dual vacuum module used for a crystal welding machine according to one creative embodiment, Fig. 2 is a schematic diagram of a furnace surface block of a dual vacuum module used for a crystal welding machine according to the second creative embodiment, FIG. 3 is a schematic diagram of a furnace surface base of a dual vacuum module for a crystal welding machine according to one creative embodiment, and FIG. 4 is a furnace surface block and a furnace for a dual vacuum module for a crystal welding machine according to one creative embodiment. Schematic diagram of the combination of the surface base. Please refer to FIG. 1 , FIG. 3 and FIG. 4 , a combination of a furnace surface block 10 and a furnace surface base 30 for a dual vacuum module of a crystal welding machine, comprising: a furnace surface block 10 having a furnace surface block 10 . The receiving surface is used to receive a substrate 120 on the soldering machine (not shown in the figure), and the furnace block 10 includes: a plurality of first perforation groups 100 whose openings are located at one of the receiving surfaces of the furnace block 10 The middle area 180; and the two second perforation groups 200, the openings of which are located in the two peripheral areas 260 of the receiving surface of the furnace block 10, the first perforation groups 100 and the two second perforation groups 200 are not connected and conducted and a plurality of first longitudinal passages 110 for communicating with the first perforation groups 100 respectively; two second longitudinal passages 210 for communicating with the two second perforation groups 200, the first The longitudinal channel 110 and the two second longitudinal channels 210 are not connected and conducted; the two lateral channels 310 are connected and conducted with the two second longitudinal channels 210, and the two lateral channels 310 are connected with the two second longitudinal channels 310. There is a height difference between the longitudinal channels 210; wherein both ends of the first longitudinal channel 110, the second longitudinal channel 210 and the transverse channel 310 are closed ends; and a furnace surface base 30 is used for receiving and fixing (for example: The cooktop block 10 can be fixed by screws, and has a first pipe 32 and a second pipe 34 respectively for conducting the first longitudinal passages 110 and the two second longitudinal passages 210 respectively, and connecting the welding The first vacuum module and the second vacuum module of the crystal machine independently generate vacuum to adsorb the first region 150 and the two second regions 250 of the substrate 120 .

請參閱第1圖,該第一穿孔組100及該第二穿孔組200係陣列排列成一矩陣。 Please refer to FIG. 1 , the first through hole group 100 and the second through hole group 200 are arrayed in a matrix.

請參閱第1圖及第4圖,該基板120之第一區域150係相對於該爐面塊10之中間區域180,以將該基板120之第一區域150吸附於該爐面塊之中間區域180,該基板120之兩個第二區域250係相對於該爐面塊10之兩個外圍區域260,以將該基板120之兩個第二區域250吸附於該爐面塊10之兩個外圍區域260。 Please refer to FIG. 1 and FIG. 4 , the first region 150 of the substrate 120 is opposite to the middle region 180 of the furnace block 10 , so that the first region 150 of the substrate 120 is adsorbed to the middle region of the furnace block 10 180, the two second regions 250 of the substrate 120 are relative to the two peripheral regions 260 of the furnace block 10, so that the two second regions 250 of the substrate 120 are adsorbed to the two outer regions of the furnace block 10 Area 260.

請參閱第1圖,該第二穿孔組200具有至少一排穿孔連接該第二縱向通道210。例如,該第二穿孔組200具有兩排穿孔連接該第二縱向通道210,該兩排穿孔彼此對齊,以增加該爐面塊對該基板之兩個第二區域的吸附力面積。該些穿孔可為圓孔狀或方孔狀。 Please refer to FIG. 1 , the second perforation group 200 has at least one row of perforations connected to the second longitudinal channel 210 . For example, the second perforation group 200 has two rows of perforations connected to the second longitudinal channel 210 , and the two rows of perforations are aligned with each other, so as to increase the suction force area of the cooktop block to the two second regions of the substrate. The perforations can be round holes or square holes.

請參閱第1a圖,該第二穿孔組200具有兩排穿孔連接該第二縱向通道210,該兩排穿孔彼此交錯,以增加該爐面塊對該基板之兩個第二區域的吸附力均勻性。該些穿孔可為圓孔狀或方孔狀。 Please refer to FIG. 1a, the second perforation group 200 has two rows of perforations connected to the second longitudinal channel 210, and the two rows of perforations are staggered to increase the uniform adsorption force of the cooktop block to the two second regions of the substrate sex. The perforations can be round holes or square holes.

再者,請參閱第1b圖,該爐面塊10之中間區域180及兩個外圍區域260可設有多條環形溝槽182、262,該多條環形溝槽182、262之位置分別與該第一穿孔組100及該第二穿孔組200之位置重疊,以增加該爐面塊對該基板的吸附力面積及均勻性。該多條環形溝槽182、262之深度可介於0.1~2mm。 Furthermore, please refer to FIG. 1b, the middle region 180 and the two peripheral regions 260 of the cooktop block 10 may be provided with a plurality of annular grooves 182, 262, and the positions of the plurality of annular grooves 182, 262 are respectively The positions of the first perforation group 100 and the second perforation group 200 overlap, so as to increase the area and uniformity of the adsorption force of the furnace block to the substrate. The depths of the plurality of annular grooves 182 and 262 may be between 0.1 and 2 mm.

請參閱第2圖、第3圖及第4圖,一種用於銲晶機的雙真空模組的爐面塊20及爐面底座30之組合,包括:一爐面塊20,具有一承接面,用以承接該銲晶機(圖未示)上的一基板120,且該爐面塊20包括:複數個第一穿孔組100,其開口位於該爐面塊20之承接面的一中間區域180;兩個第二穿孔組200,其開口位於爐面塊20之承接面的兩個第一外圍區域270,該些第一穿孔組100及該兩個第二穿孔組200係不連接導通;兩個第三穿孔組300,其開口位於爐面塊20之承接面的中間區域180的兩個第二外圍區域280,其中該兩個第一外圍區域270及該兩個第二外圍區域280環繞該中間區域180;以及複數個第一縱向通道110,用以分別連通該些第一穿孔組100;兩個第二縱向通道210,用以分別連通該兩個的該些第二穿孔組200,該些第一縱向通道110及該兩個第二縱向通道210係不連接導通;兩個橫向通道410,用以分別連通該兩個的該些第三穿孔組300,其中該兩個橫向通道410與該兩個第二縱向通道210係連接導通,且該兩個橫向通道410與該兩個第二縱向通道210位於同一水平高度;其中上述第一縱向通道110、第二縱向通道210及橫向通道410之兩端皆為封閉端;以及一爐面底座30,用以承接並固定(舉例:可用螺絲固定)該爐面塊20,並分別具有一第一管道32及一第二管道34用以分別導通該些第一縱向通道110、該兩 個第二縱向通道210,並分別連接該銲晶機之第一真空模組及第二真空模組,以分別獨立產生真空吸附該基板120之第一區域150及兩個第二區域250。 Please refer to Figure 2, Figure 3 and Figure 4, a combination of a furnace surface block 20 and a furnace surface base 30 for a dual vacuum module of a crystal welding machine, comprising: a furnace surface block 20 with a receiving surface , which is used to receive a substrate 120 on the soldering machine (not shown), and the furnace block 20 includes: a plurality of first perforation groups 100 whose openings are located in a middle area of the receiving surface of the furnace block 20 180; two second perforation groups 200, the openings of which are located in the two first peripheral regions 270 of the bearing surface of the furnace block 20, the first perforation groups 100 and the two second perforation groups 200 are not connected and conducted; Two third perforation groups 300, the openings of which are located in the two second peripheral regions 280 of the middle region 180 of the receiving surface of the cooktop block 20, wherein the two first peripheral regions 270 and the two second peripheral regions 280 surround the middle area 180; and a plurality of first longitudinal passages 110 for communicating with the first perforation groups 100 respectively; two second longitudinal passages 210 for communicating with the two second perforation groups 200, respectively, The first longitudinal channels 110 and the two second longitudinal channels 210 are not connected and conducted; the two transverse channels 410 are used to communicate with the two third perforation groups 300 respectively, wherein the two transverse channels 410 The two second longitudinal channels 210 are connected and conducted, and the two transverse channels 410 and the two second longitudinal channels 210 are located at the same level; wherein the first longitudinal channel 110, the second longitudinal channel 210 and the transverse channel Both ends of 410 are closed ends; and a cooktop base 30 is used to receive and fix (for example: can be fixed with screws) the cooktop block 20, and has a first pipe 32 and a second pipe 34 respectively for use Conduct the first longitudinal channels 110, the two A second longitudinal channel 210 is connected to the first vacuum module and the second vacuum module of the soldering machine respectively, so as to independently generate vacuum to adsorb the first region 150 and the two second regions 250 of the substrate 120 .

請參閱第2圖,該第一穿孔組100、該第二穿孔組200及該第三穿孔組300係陣列排列成一矩陣。 Please refer to FIG. 2 , the first through hole group 100 , the second through hole group 200 and the third through hole group 300 are arrayed in a matrix.

請參閱第2圖,該基板120之第一區域150係相對於該爐面塊20之中間區域180,以將該基板120之第一區域150吸附於該爐面塊之中間區域180,該基板120之兩個第二區域250係相對於該爐面塊20之兩個第一及第二外圍區域270、280,以將該基板120之兩個第二區域250吸附於該爐面塊20之兩個第一及第二外圍區域270、280。 Please refer to FIG. 2, the first area 150 of the substrate 120 is opposite to the middle area 180 of the furnace block 20, so that the first area 150 of the substrate 120 is adsorbed to the middle area 180 of the furnace block. The two second regions 250 of the base plate 120 are opposite to the two first and second peripheral regions 270 , 280 of the cooktop block 20 , so that the two second regions 250 of the base plate 120 are adsorbed on the cooktop block 20 . Two first and second peripheral regions 270, 280.

請參閱第2圖,該第二穿孔組200具有一排穿孔連接該第二縱向通道210。 Please refer to FIG. 2 , the second perforation group 200 has a row of perforations connected to the second longitudinal channel 210 .

請參閱第2圖,該第二穿孔組200具有兩排穿孔連接該第二縱向通道210。 Please refer to FIG. 2 , the second perforation group 200 has two rows of perforations connected to the second longitudinal channel 210 .

綜上所述,本創作用於銲晶機的雙真空模組吸附爐面塊及爐面底座,在當動態隨機存取記憶體設計朝向薄型化,容易產生翹曲情況,因此在真空吸附方式時,可以在爐面塊上設計較大的吸附能力,且應用於在銲晶機時,可以減少每次工件需要的吸附次數因而提升產能,節省工作時間,因而提高銲晶機的工作效率。 To sum up, the dual vacuum modules used in this creation for the soldering machine to adsorb the furnace block and the furnace surface base, when the dynamic random access memory is designed to be thin, it is easy to produce warpage, so the vacuum adsorption method is used. When it is used, a larger adsorption capacity can be designed on the furnace block, and when applied to a crystal welding machine, it can reduce the number of adsorption times required for each workpiece, thereby increasing the production capacity, saving working time, and thus improving the working efficiency of the crystal welding machine.

故,本創作在同類產品中具有極佳之進步性以及實用性,同時查遍國內外關於此類之技術資料文獻後,確實未發現有相同或近似之構造或技術存在於本案申請之前,因此本案應已符合『可專利性』、『合於產業利用性』以及『進步性』的專利要件,爰依法提出申請之。 Therefore, this creation has excellent progress and practicability among similar products. At the same time, after checking the domestic and foreign technical documents and documents, it is true that no identical or similar structure or technology exists before the application in this case. Therefore, This case should have met the patent requirements of "patentability", "suitability for industrial utilization" and "progressiveness", and the application should be filed in accordance with the law.

唯,以上所述者,僅係本創作之較佳實施例而已,舉凡應用本創作說明書及申請專利範圍所為之其它等效結構變化者,理應包含在本 創作之申請專利範圍內。 However, the above are only the preferred embodiments of this creation, and any equivalent structural changes made by applying the description of this creation and the scope of the patent application should be included in this document. Creation within the scope of the patent application.

10:爐面塊 10: Stovetop Blocks

100:第一穿孔組 100: The first piercing group

200:第二穿孔組 200: Second Piercing Group

110:第一縱向通道 110: The first longitudinal passage

210:第二縱向通道 210: Second longitudinal passage

310:橫向通道 310: Lateral channel

180:中間區域 180: Middle area

260:外圍區域 260: Peripheral area

Claims (10)

一種用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,包括: A combination of a furnace surface block and a furnace surface base for a double vacuum module of a crystal welding machine, comprising: 一爐面塊,具有一承接面,用以承接該銲晶機上的一基板,且該爐面塊包括: A cooktop block has a receiving surface for receiving a substrate on the soldering machine, and the cooktop block includes: 複數個第一穿孔組,其開口位於該爐面塊之承接面的一中間區域;及 a plurality of first perforation groups, the openings of which are located in a middle area of the receiving surface of the cooktop block; and 兩個第二穿孔組,其開口位於爐面塊之承接面的兩個外圍區域,該些第一穿孔組及該兩個第二穿孔組係不連接導通;以及 two second perforation groups, the openings of which are located in two peripheral regions of the receiving surface of the cooktop block, the first perforation groups and the two second perforation groups are not connected and conducted; and 複數個第一縱向通道,用以分別連通該些第一穿孔組; a plurality of first longitudinal passages for communicating with the first perforation groups respectively; 兩個第二縱向通道,用以分別連通該兩個的該些第二穿孔組,該些第一縱向通道及該兩個第二縱向通道係不連接導通; two second longitudinal passages for communicating with the two second perforation groups respectively, the first longitudinal passages and the two second longitudinal passages are not connected and conducted; 兩個橫向通道,其與該兩個第二縱向通道係連接導通,且該兩個橫向通道與該兩個第二縱向通道之間具有一高低差; two transverse channels, which are connected and conducted with the two second longitudinal channels, and there is a height difference between the two transverse channels and the two second longitudinal channels; 其中上述第一縱向通道、第二縱向通道及橫向通道之兩端皆為封閉端;以及 Wherein both ends of the first longitudinal channel, the second longitudinal channel and the transverse channel are closed ends; and 一爐面底座,用以承接並固定該爐面塊,並分別具有一第一管道及 A cooktop base is used to receive and fix the cooktop block, and has a first pipe and 一第二管道用以分別導通該些第一縱向通道及該兩個第二縱向通道,並分別連接該銲晶機之第一真空模組及第二真空模組,以分別獨立產生真空吸附該基板之第一區域及兩個第二區域。 A second pipe is used to conduct the first longitudinal passages and the two second longitudinal passages respectively, and is respectively connected to the first vacuum module and the second vacuum module of the soldering machine, so as to independently generate vacuum and adsorb the A first area and two second areas of the substrate. 如申請專利範圍第1項所述之用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,其中,該第一穿孔組及該第二穿孔組係陣列排列成一矩陣;以及,該爐面塊之中間區域及兩個外圍區域設有多條環形溝槽,該多條環形溝槽之位置分別與該第一穿孔組及該第二穿孔組之位置重疊。 The combination of the furnace top block and the furnace top base for the dual vacuum module of the crystal welding machine according to the first item of the patent application scope, wherein the first perforation group and the second perforation group are arrayed in a matrix; And, a plurality of annular grooves are arranged in the middle region and two peripheral regions of the furnace block, and the positions of the plurality of annular grooves overlap with the positions of the first perforation group and the second perforation group respectively. 如申請專利範圍第1項所述之用於銲晶機的雙真空模組的爐面塊及爐面 底座之組合,其中,該基板之第一區域係相對於該爐面塊之中間區域,以將該基板之第一區域吸附於該爐面塊之中間區域,該基板之兩個第二區域係相對於該爐面塊之兩個外圍區域,以將該基板之兩個第二區域吸附於該爐面塊之兩個外圍區域。 The furnace block and the furnace surface for the dual vacuum module of the soldering machine as described in the first item of the patent application scope The combination of the base, wherein the first area of the base plate is relative to the middle area of the furnace block, so that the first area of the base plate is adsorbed to the middle area of the furnace block, and the two second areas of the base plate are The two second regions of the base plate are adsorbed on the two peripheral regions of the furnace top block relative to the two peripheral regions of the furnace top block. 如申請專利範圍第1項所述之用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,其中,該第二穿孔組具有至少一排穿孔連接該第二縱向通道,該些穿孔為圓孔狀或方孔狀。 The combination of the furnace top block and the furnace top base for the dual vacuum module of the crystal welding machine as described in the first item of the patent application scope, wherein the second perforated group has at least one row of perforated holes connected to the second longitudinal channel, The perforations are round holes or square holes. 如申請專利範圍第1項所述之用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,其中,該第二穿孔組具有兩排穿孔連接該第二縱向通道,該兩排穿孔彼此對齊或彼此交錯。 The combination of the furnace top block and the furnace top base for the dual vacuum module of the crystal welding machine as described in the first item of the patent application scope, wherein the second perforation group has two rows of perforations connected to the second longitudinal channel, the The two rows of perforations are aligned with each other or staggered with each other. 一種用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,包括: A combination of a furnace surface block and a furnace surface base for a double vacuum module of a crystal welding machine, comprising: 一爐面塊,具有一承接面,用以承接該銲晶機上的一基板,且該爐面塊包括: A cooktop block has a receiving surface for receiving a substrate on the soldering machine, and the cooktop block includes: 複數個第一穿孔組,其開口位於該爐面塊之承接面的一中間區域; A plurality of first perforation groups, the openings of which are located in a middle area of the receiving surface of the cooktop block; 兩個第二穿孔組,其開口位於爐面塊之承接面的兩個第一外圍區域,該些第一穿孔組及該兩個第二穿孔組係不連接導通; two second perforation groups, the openings of which are located in the two first peripheral regions of the receiving surface of the cooktop block, the first perforation groups and the two second perforation groups are not connected and conducted; 兩個第三穿孔組,其開口位於爐面塊之承接面的中間區域的兩個第二外圍區域,其中該兩個第一外圍區域及該兩個第二外圍區域環繞該中間區域;以及 two third perforation groups, the openings of which are located in two second peripheral regions of the middle region of the receiving surface of the furnace block, wherein the two first peripheral regions and the two second peripheral regions surround the middle region; and 複數個第一縱向通道,用以分別連通該些第一穿孔組; a plurality of first longitudinal passages for communicating with the first perforation groups respectively; 兩個第二縱向通道,用以分別連通該兩個的該些第二穿孔組,該些第一縱向通道及該兩個第二縱向通道係不連接導通; two second longitudinal channels for communicating with the two second perforation groups respectively, the first longitudinal channels and the two second longitudinal channels are not connected and conducted; 兩個橫向通道,用以分別連通該兩個的該些第三穿孔組,其中該兩個橫向通道與該兩個第二縱向通道係連接導通,且該兩個橫向通道與該兩個第二縱向通道位於同一水平高度; Two transverse channels are used to communicate with the two third perforation groups respectively, wherein the two transverse channels and the two second longitudinal channels are connected and conducted, and the two transverse channels and the two second Longitudinal passages are at the same level; 其中上述第一縱向通道、第二縱向通道及橫向通道之兩端皆為封閉端;以及 Wherein, both ends of the first longitudinal channel, the second longitudinal channel and the transverse channel are closed ends; and 一爐面底座,用以承接並固定該爐面塊,並分別具有一第一管道及一第二管道用以分別導通該些第一縱向通道、該兩個第二縱向通道,並分別連接該銲晶機之第一真空模組及第二真空模組,以分別獨立產生真空吸附該基板之第一區域及兩個第二區域。 A cooktop base is used to receive and fix the cooktop block, and has a first pipe and a second pipe respectively for conducting the first longitudinal passages, the two second longitudinal passages, and connecting the The first vacuum module and the second vacuum module of the soldering machine independently generate vacuum to adsorb the first area and the two second areas of the substrate. 如申請專利範圍第6項所述之用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,其中,該第一穿孔組、該第二穿孔組及該第三穿孔組係陣列排列成一矩陣。 The combination of the furnace top block and the furnace top base for the dual vacuum module of the crystal welding machine as described in item 6 of the patent application scope, wherein the first perforation group, the second perforation group and the third perforation group The arrays of systems are arranged in a matrix. 如申請專利範圍第6項所述之用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,其中,該基板之第一區域係相對於該爐面塊之中間區域,以將該基板之第一區域吸附於該爐面塊之中間區域,該基板之兩個第二區域係相對於該爐面塊之兩個第一及第二外圍區域,以將該基板之兩個第二區域吸附於該爐面塊之兩個第一及第二外圍區域。 The combination of the furnace top block and the furnace top base for the dual vacuum module of the crystal soldering machine as described in item 6 of the patent application scope, wherein the first area of the base plate is opposite to the middle area of the furnace top block, So that the first area of the substrate is adsorbed to the middle area of the furnace block, the two second areas of the substrate are opposite to the two first and second peripheral areas of the furnace block, so that the two A second area is adsorbed on the two first and second peripheral areas of the cooktop block. 如申請專利範圍第6項所述之用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,其中,該第二穿孔組具有至少一排穿孔連接該第二縱向通道。 The combination of the furnace top block and the furnace top base for the dual vacuum module of the crystal welding machine as described in claim 6, wherein the second perforated group has at least one row of perforated holes connected to the second longitudinal channel. 如申請專利範圍第6項所述之用於銲晶機的雙真空模組的爐面塊及爐面底座之組合,該第二穿孔組具有兩排穿孔連接該第二縱向通道。 According to the combination of the furnace top block and the furnace top base for the dual vacuum module of the crystal welding machine as described in claim 6, the second perforation group has two rows of perforations to connect the second longitudinal channel.
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Publication number Priority date Publication date Assignee Title
TW367576B (en) * 1997-03-06 1999-08-21 Ngk Insulators Ltd Wafer attachment apparatus and base material and manufacturing method therefor
CN102459676A (en) * 2009-06-15 2012-05-16 日新制钢株式会社 Ferritic stainless steel material for brazing, and heat exchanger member
EP2778649A1 (en) * 2011-11-11 2014-09-17 Kwansei Gakuin Educational Foundation Nanometer standard prototype and method for manufacturing nanometer standard prototype
CN110164784A (en) * 2018-02-15 2019-08-23 美光科技公司 The method and apparatus of conducting element for reflow semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW367576B (en) * 1997-03-06 1999-08-21 Ngk Insulators Ltd Wafer attachment apparatus and base material and manufacturing method therefor
CN102459676A (en) * 2009-06-15 2012-05-16 日新制钢株式会社 Ferritic stainless steel material for brazing, and heat exchanger member
EP2778649A1 (en) * 2011-11-11 2014-09-17 Kwansei Gakuin Educational Foundation Nanometer standard prototype and method for manufacturing nanometer standard prototype
CN110164784A (en) * 2018-02-15 2019-08-23 美光科技公司 The method and apparatus of conducting element for reflow semiconductor device

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