TW202135260A - Combination of furnace surface block and furnace surface base of double vacuum module for crystal welding machine - Google Patents

Abstract

This creation is a combination of a furnace block and a furnace base of a dual vacuum module for a crystal welding machine, including: a furnace block with a receiving surface for receiving a substrate on the crystal welding machine, and The hearth block includes: a plurality of first perforation groups whose openings are located in a middle area of the receiving surface of the hearth block; and two second perforation groups whose openings are located in two peripheral areas of the receiving surface of the hearth block. The first perforated groups and the two second perforated groups are not connected and connected; and a plurality of first longitudinal channels are used to communicate with the first perforated groups respectively; and the two second longitudinal channels are used to communicate with each other. The two second perforation groups of the two, the first longitudinal channels and the two second longitudinal channels are not connected and conducted; the two lateral channels are connected and conducted with the two second longitudinal channels, and the There is a height difference between the two lateral passages and the two second longitudinal passages; wherein both ends of the first longitudinal passage, the second longitudinal passage, and the transverse passage are closed ends; and a furnace surface base for receiving and fix the hearth block.

Description

Combination of furnace surface block and furnace surface base of dual vacuum module used for soldering crystal machine

This creation is about a fixed substrate device using vacuum adsorption; more specifically, it specifically refers to a combination of a furnace top block and a furnace top base of a dual vacuum module used in a crystal soldering machine.

In the semiconductor package structure, the bottom is usually a substrate unit (Substrate). In the manufacturing process, usually, after stacking wafers, wire bonding, and potting on a substrate (Substrate Panel), the substrate is cut to form a plurality of semiconductor packaging structures. Therefore, the first priority of the manufacturing process is to smoothly and stably fix the substrate on a machine table. In addition, it is often necessary to use a conveying device to move the substrate during the manufacturing process, and therefore, it is also necessary to smoothly and stably fix the substrate on the conveying device. Traditionally, the method and device using vacuum adsorption is the most common way to fix the substrate.

Fixing methods such as baffles that usually attach and fix substrates or printed circuit boards (PCBs) used in semiconductor manufacturing include screws, magnets, vacuum suction and magnets.

The method of fixing with screws is the most commonly used method for fixing blocks used to attach semiconductor manufacturing substrates or printed circuit boards (PCBs). 2 or more positions are connected and fixed to prevent the vacuum block body Move occurs.

The method of using a magnet refers to a method in which a semiconductor substrate or a printed circuit board (PCB) is attached to a fixed support table by assembling a magnet on the lower side of a block. At this time, the adhesion of the magnet can be adjusted by adjusting the magnetic strength of the magnet.

When using the vacuum adsorption method, the upper side of the support of the vacuum block is equipped with a vacuum plate, and a vacuum is formed between the surface of the vacuum plate and the lower side of the vacuum block, so as to achieve the attachment effect. In addition, in recent years, the design of dynamic random access memory is becoming thinner, which is prone to warping. Therefore, in the vacuum suction method, a large suction capacity is required to be easy to suction.

Therefore, in summary, according to different printed circuit boards (PCB), that is, different printed circuit board (PCB) sizes and internal chip layouts, it is necessary to replace and use different vacuum blocks for smooth production. With the design of dynamic random access memory towards thinner, it is prone to warping. Therefore, in the vacuum adsorption method, it is necessary to design a larger adsorption capacity on the furnace block.

The main purpose of this creation is to provide a combination of the furnace surface block and furnace surface base of the dual vacuum module for the crystal soldering machine. When the dynamic random access memory is designed to become thinner, it is prone to warping. In the vacuum adsorption mode, a larger adsorption capacity can be designed on the furnace block, and when it is applied to the crystal soldering machine, it can reduce the number of adsorption times required for each workpiece, thereby increasing the production capacity and saving working time, thereby increasing the crystal soldering machine Work efficiency.

In order to achieve the purpose of the above, this creation is to provide a combination of the furnace top block and the furnace top base for the dual vacuum module of the crystal soldering machine, including: a furnace surface block with a receiving surface for receiving the solder crystal A base plate on the machine, and the furnace block includes: a plurality of first perforation groups, the openings of which are located in a middle area of the receiving surface of the furnace block; and two second perforation groups, the openings of which are located on the furnace surface block The two peripheral areas of the bearing surface, the first perforation groups and the two second perforation groups are not connected And a plurality of first longitudinal channels to respectively communicate with the first perforation groups; two second longitudinal channels to respectively communicate with the two second perforation groups, the first longitudinal channels and The two second longitudinal channels are not connected and conductive; two lateral channels are connected and conductive with the two second longitudinal channels, and there is a height difference between the two lateral channels and the two second longitudinal channels ; Wherein both ends of the first longitudinal channel, the second longitudinal channel and the transverse channel are closed ends; and a furnace surface base for receiving and fixing the furnace surface block, and respectively has a first pipe and a second The pipes are used to respectively conduct the first longitudinal channels and the two second longitudinal channels, and respectively connect the first vacuum module and the second vacuum module of the soldering machine, so as to independently generate vacuum to adsorb the first vacuum of the substrate. One area and two second areas.

The combination of the furnace top block and the furnace top base of the dual vacuum module used in the crystal soldering machine of this invention, wherein the first perforation group and the second perforation group are arranged in an array in a matrix.

The combination of the furnace top block and the furnace top base of the dual vacuum module used in the crystal soldering machine in this creation, wherein the first area of the substrate is relative to the middle area of the furnace top block, so that the first area of the substrate is The area is adsorbed to the middle area of the furnace block, and the two second areas of the substrate are opposite to the two peripheral areas of the furnace block to adsorb the two second areas of the substrate to the two furnace blocks. A peripheral area.

The combination of the furnace surface block and furnace surface base of the dual vacuum module used in the crystal soldering machine of the present invention, wherein the second perforation group has at least one row of perforations connected to the second longitudinal channel, and the perforations are round holes. Or square hole shape.

The combination of the furnace top block and the furnace top base of the dual vacuum module used in the crystal soldering machine of the present invention, wherein the second perforation group has two rows of perforations connected to the second longitudinal channel, and the two rows of perforations are aligned or mutually aligned. staggered.

This creation is to provide a combination of a furnace top block and a furnace top base of a dual vacuum module for a crystal soldering machine, including: a furnace top block with a receiving surface for receiving a substrate on the crystal soldering machine, And the furnace surface block includes: a plurality of first perforation groups, the openings of which are located in the support of the furnace surface block A middle area of the junction; two second perforation groups, the openings of which are located in the two first peripheral areas of the receiving surface of the furnace block, the first perforation groups and the two second perforation groups are not connected and conductive; Two third perforation groups, the openings of which are located in two second peripheral areas of the middle area of the receiving surface of the furnace block, wherein the two first peripheral areas and the two second peripheral areas surround the middle area; and First longitudinal passages are used to connect the first perforation groups respectively; two second longitudinal passages are used to connect the two second perforation groups, the first longitudinal passages and the two second perforation groups respectively The two longitudinal channels are not connected and connected; two lateral channels are used to connect the two third perforation groups respectively, wherein the two lateral channels and the two second longitudinal channels are connected and connected, and the two The horizontal passage and the two second longitudinal passages are at the same level; the two ends of the first longitudinal passage, the second longitudinal passage and the transverse passage are all closed ends; and a furnace surface base for receiving and fixing the furnace The noodle block has a first pipe and a second pipe respectively for conducting the first longitudinal passages and the two second longitudinal passages respectively, and respectively connecting the first vacuum module and the second vacuum module of the soldering machine The vacuum module separately generates vacuum to adsorb the first area and two second areas of the substrate.

The combination of the furnace top block and the furnace top base of the dual vacuum module used in the crystal soldering machine in this invention, wherein the first perforation group, the second perforation group and the third perforation group are arranged in an array in a matrix.

The combination of the furnace top block and the furnace top base of the dual vacuum module used in the crystal soldering machine in this creation, wherein the first area of the substrate is relative to the middle area of the furnace top block, so that the first area of the substrate is The area is adsorbed to the middle area of the furnace block, and the two second areas of the substrate are opposite to the two first and second peripheral areas of the furnace block to adsorb the two second areas of the substrate to the furnace block. Two first and second peripheral areas of the furnace block.

The combination of the furnace surface block and the furnace surface base of the dual vacuum module used in the crystal soldering machine of the present invention, wherein the second perforation group has at least one row of perforations connected to the second longitudinal channel.

The furnace surface block and furnace surface base of the dual vacuum module used in the crystal soldering machine in this creation Combination, wherein the second perforation group has two rows of perforations connected to the second longitudinal channel.

The dual vacuum module used in the crystal soldering machine in this creation to absorb the furnace surface block and furnace surface base, when the dynamic random access memory design is towards thinner, it is prone to warping, so in the vacuum adsorption mode, it can be The furnace surface block is designed with a larger adsorption capacity, and when it is applied to the crystal welding machine, it can reduce the number of adsorption times required for each workpiece, thereby increasing the production capacity and saving working time, thus improving the working efficiency of the crystal welding machine.

In order to have a more detailed understanding of the purpose, effects, features, and structure of this creation, a preferred embodiment and accompanying drawings are described as follows.

10: Stove noodle block

20: Stove noodle block

30: Stove base

32: The first pipeline

34: The second pipeline

100: The first perforation group

200: The second perforation group

300: The third perforation group

110: The first longitudinal channel

210: second longitudinal channel

310: Lateral channel

410: Lateral Channel

120: substrate

150: The first area

180: middle area

182: Groove

250: second area

260: Peripheral area

262: groove

270: The first peripheral area

280: The second peripheral area

Figure 1: A schematic diagram of a furnace surface block of a dual vacuum module used in a crystal soldering machine in one of the creative embodiments;

Figure 1a: Another schematic diagram of the furnace surface block of the dual vacuum module used in the crystal soldering machine according to the creative embodiment;

Figure 1b: Another schematic diagram of the furnace surface block of the dual vacuum module used in the crystal soldering machine according to the creative embodiment;

Figure 2: A schematic diagram of the furnace surface block of the dual vacuum module used in the crystal soldering machine in the second embodiment of this creation;

Figure 3: A schematic diagram of the furnace surface base of the dual vacuum module used in the crystal soldering machine in one of the creative embodiments;

Figure 4: A schematic diagram of the combination of the furnace surface block and the furnace surface base of the dual vacuum module used in the crystal soldering machine in one of the creative embodiments.

Figure 1 is a schematic diagram of a furnace surface block of a dual vacuum module used for a crystal soldering machine in one of the creative embodiments, and Figure 2 is a schematic diagram of a furnace surface block of a dual vacuum module used for a crystal soldering machine in the second creative embodiment. Figure 3 is a schematic diagram of the furnace surface base of the dual vacuum module used in the crystal soldering machine in one of the creative embodiments and Figure 4 is the furnace surface block and the furnace of the dual vacuum module used in the crystal soldering machine in one of the creative embodiments Schematic diagram of the combination of the surface base. Please refer to Figure 1, Figure 3 and Figure 4, a combination of a furnace top block 10 and a furnace top base 30 of a dual vacuum module used in a crystal soldering machine, including: a furnace top block 10 having a The receiving surface is used to receive a substrate 120 on the crystal soldering machine (not shown), and the furnace top block 10 includes: a plurality of first perforation groups 100 whose openings are located on one of the receiving surfaces of the furnace top block 10 The middle area 180; and two second perforation groups 200, the openings of which are located in the two peripheral areas 260 of the receiving surface of the furnace block 10, the first perforation groups 100 and the two second perforation groups 200 are not connected and connected And a plurality of first longitudinal passages 110 to respectively communicate with the first perforation groups 100; two second longitudinal passages 210 to respectively communicate with the two second perforation groups 200, the first The longitudinal channel 110 and the two second longitudinal channels 210 are not connected and conducted; the two lateral channels 310 are connected and conducted with the two second longitudinal channels 210, and the two lateral channels 310 are connected to the two second longitudinal channels. There is a height difference between the longitudinal channels 210; wherein the two ends of the first longitudinal channel 110, the second longitudinal channel 210, and the transverse channel 310 are closed ends; and a furnace surface base 30 for receiving and fixing (for example: (It can be fixed with screws) The furnace top block 10 has a first pipe 32 and a second pipe 34 for respectively conducting the first longitudinal channels 110 and the two second longitudinal channels 210, and respectively connecting the welding The first vacuum module and the second vacuum module of the crystal machine can separately generate the first area 150 and two second areas 250 of the substrate 120 by vacuum adsorption.

Please refer to FIG. 1, the first perforation group 100 and the second perforation group 200 are arranged in an array in a matrix.

Please refer to Figures 1 and 4, the first area 150 of the substrate 120 is opposite to the middle area 180 of the furnace top block 10 to adsorb the first area 150 of the substrate 120 to the middle area of the furnace top block 180. The two second regions 250 of the substrate 120 are opposite to the two peripheral regions 260 of the furnace top block 10 so as to adsorb the two second regions 250 of the substrate 120 to the two peripheral regions of the furnace top block 10 Area 260.

Please refer to FIG. 1, the second perforation group 200 has at least one row of perforations connected to the second longitudinal channel 210. For example, the second perforation group 200 has two rows of perforations connected to the second longitudinal channel 210, and the two rows of perforations are aligned with each other to increase the adsorption area of the furnace top block to the two second regions of the substrate. The perforations may be round holes or square holes.

Please refer to Figure 1a, the second perforation group 200 has two rows of perforations connected to the second longitudinal channel 210, and the two rows of perforations are staggered to increase the uniform adsorption force of the furnace block to the two second regions of the substrate. sex. The perforations may be round holes or square holes.

Furthermore, referring to Figure 1b, the middle area 180 and the two peripheral areas 260 of the furnace top block 10 can be provided with a plurality of annular grooves 182, 262, and the positions of the plurality of annular grooves 182, 262 are respectively The positions of the first perforation group 100 and the second perforation group 200 overlap to increase the area and uniformity of the adsorption force of the furnace block to the substrate. The depth of the plurality of annular grooves 182 and 262 may be between 0.1 and 2 mm.

Please refer to Figures 2, 3 and 4, a combination of a furnace top block 20 and a furnace top base 30 of a dual vacuum module used in a crystal soldering machine, including: a furnace top block 20 with a receiving surface , For receiving a substrate 120 on the crystal soldering machine (not shown), and the furnace block 20 includes: a plurality of first perforation groups 100, the opening of which is located in a middle area of the receiving surface of the furnace block 20 180; Two second perforation groups 200, the openings of which are located in the two first peripheral regions 270 of the receiving surface of the furnace block 20, the first perforation groups 100 and the two second perforation groups 200 are not connected and conductive; Two third perforation groups 300, the openings of which are located in two second peripheral areas 280 of the middle area 180 of the receiving surface of the furnace block 20, wherein the two first peripheral areas 270 and the two second peripheral areas 280 surround The intermediate area 180; and a plurality of first longitudinal channels 110 to respectively communicate with the first perforation groups 100; two second longitudinal channels 210 to respectively communicate with the two second perforation groups 200, The first longitudinal passages 110 and the two second longitudinal passages 210 are not connected and connected; two transverse passages 410 are used to respectively communicate with the two third perforation groups 300, wherein the two transverse passages 410 The two second longitudinal channels 210 are connected and conducted, and the two transverse channels 410 and the two second longitudinal channels 210 are located at the same level; wherein the above-mentioned first longitudinal channel 110, second longitudinal channel 210 and transverse channel Both ends of the 410 are closed ends; and a furnace top base 30 for receiving and fixing (for example: can be fixed with screws) the furnace top block 20, and has a first pipe 32 and a second pipe 34 respectively for Respectively conduct the first longitudinal channels 110, the two A second longitudinal channel 210 is respectively connected to the first vacuum module and the second vacuum module of the soldering machine to independently generate a vacuum to adsorb the first area 150 and two second areas 250 of the substrate 120 respectively.

Please refer to FIG. 2, the first perforation group 100, the second perforation group 200, and the third perforation group 300 are arranged in an array in a matrix.

Please refer to Figure 2, the first area 150 of the substrate 120 is opposite to the middle area 180 of the furnace block 20, so that the first area 150 of the substrate 120 is adsorbed to the middle area 180 of the furnace block. The two second areas 250 of 120 are opposite to the two first and second peripheral areas 270, 280 of the furnace block 20, so that the two second areas 250 of the substrate 120 are adsorbed on the furnace block 20. Two first and second peripheral areas 270, 280.

Please refer to FIG. 2, the second perforation group 200 has a row of perforations connected to the second longitudinal channel 210.

Please refer to FIG. 2, the second perforation group 200 has two rows of perforations connected to the second longitudinal channel 210.

To sum up, the dual vacuum module used in the crystal soldering machine to absorb the furnace surface block and furnace surface base in this creation, when the dynamic random access memory is designed to become thinner, it is prone to warping, so in the vacuum adsorption method At the same time, a larger adsorption capacity can be designed on the furnace surface block, and when it is applied to the crystal welding machine, it can reduce the number of adsorption times required for each workpiece, thereby increasing the production capacity and saving working time, thus improving the working efficiency of the crystal welding machine.

Therefore, this creation has excellent advancement and practicality among similar products. At the same time, after checking domestic and foreign technical materials and documents about this kind, it is true that no identical or similar structure or technology exists before the application of this case. Therefore, This case should have met the patent requirements of "patentability", "applicability for industrial use" and "progressiveness", and an application was filed in accordance with the law.

However, the above are only the preferred embodiments of this creation. Any other equivalent structural changes made in this creation specification and the scope of the patent application should be included in this creation. The creation is within the scope of patent application.

10: Stove noodle block

100: The first perforation group

200: The second perforation group

110: The first longitudinal channel

210: second longitudinal channel

310: Lateral channel

180: middle area

260: Peripheral area

Claims (10)

A combination of the furnace top block and the furnace top base of the dual vacuum module used for the crystal soldering machine, including: A furnace noodle block has a receiving surface for receiving a substrate on the crystal soldering machine, and the furnace noodle block includes: A plurality of first perforation groups, the openings of which are located in a middle area of the receiving surface of the furnace block; and Two second perforation groups, the openings of which are located in two peripheral areas of the receiving surface of the furnace block, the first perforation groups and the two second perforation groups are not connected and conductive; and A plurality of first longitudinal passages for respectively communicating with the first perforation groups; Two second longitudinal passages for connecting the two second perforation groups respectively, the first longitudinal passages and the two second longitudinal passages are not connected and conducted; Two transverse channels, which are connected to the two second longitudinal channels, and there is a height difference between the two transverse channels and the two second longitudinal channels; Wherein both ends of the first longitudinal channel, the second longitudinal channel and the transverse channel are closed ends; and A furnace surface base for receiving and fixing the furnace surface block, and respectively has a first pipe and A second pipe is used to respectively conduct the first longitudinal passages and the two second longitudinal passages, and respectively connect the first vacuum module and the second vacuum module of the soldering machine, so as to independently generate vacuum to absorb the The first area and two second areas of the substrate. The combination of the furnace top block and the furnace top base of the dual vacuum module used for the crystal soldering machine as described in the first item of the patent application, wherein the first perforation group and the second perforation group are arranged in an array in a matrix; And, the middle area and the two peripheral areas of the furnace block are provided with a plurality of annular grooves, and the positions of the plurality of annular grooves respectively overlap with the positions of the first perforation group and the second perforation group. The furnace surface block and furnace surface of the dual vacuum module used for the crystal soldering machine as described in item 1 of the scope of patent application The combination of the base, wherein the first area of the substrate is relative to the middle area of the furnace top block to adsorb the first area of the substrate to the middle area of the furnace top block, and the two second areas of the substrate are Relative to the two peripheral areas of the furnace block, the two second areas of the substrate are adsorbed on the two peripheral areas of the furnace block. The combination of the furnace surface block and the furnace surface base of the dual vacuum module for the crystal soldering machine as described in the first item of the patent application, wherein the second perforation group has at least one row of perforations connected to the second longitudinal channel, These perforations are round holes or square holes. The combination of the furnace surface block and the furnace surface base of the dual vacuum module used for the crystal soldering machine as described in the first item of the patent application, wherein the second perforation group has two rows of perforations connected to the second longitudinal channel, the The two rows of perforations are aligned with each other or staggered with each other. A combination of the furnace top block and the furnace top base of the dual vacuum module used for the crystal soldering machine, including: A furnace noodle block has a receiving surface for receiving a substrate on the crystal soldering machine, and the furnace noodle block includes: A plurality of first perforation groups, the openings of which are located in a middle area of the receiving surface of the furnace block; Two second perforation groups, the openings of which are located in the two first peripheral areas of the receiving surface of the furnace block, the first perforation groups and the two second perforation groups are not connected and conductive; Two third perforation groups, the openings of which are located in two second peripheral regions of the middle region of the receiving surface of the furnace block, wherein the two first peripheral regions and the two second peripheral regions surround the middle region; and A plurality of first longitudinal channels for respectively communicating with the first perforation groups; Two second longitudinal channels for connecting the two second perforation groups respectively, the first longitudinal channels and the two second longitudinal channels are not connected and conducted; Two transverse passages are used to connect the two third perforation groups respectively, wherein the two transverse passages are connected and communicated with the two second longitudinal passages, and the two transverse passages are connected to the two second longitudinal passages. The longitudinal channels are located at the same level; Wherein both ends of the first longitudinal channel, the second longitudinal channel and the transverse channel are closed ends; and A stove top base for receiving and fixing the stove top block, and each having a first pipe and a second pipe for respectively conducting the first longitudinal channels and the two second longitudinal channels, and respectively connecting the The first vacuum module and the second vacuum module of the wafer soldering machine independently generate vacuum to adsorb the first area and two second areas of the substrate. The combination of the furnace top block and the furnace top base for the dual vacuum module of the crystal soldering machine as described in item 6 of the scope of patent application, wherein the first perforation group, the second perforation group and the third perforation group The arrays are arranged in a matrix. The combination of the furnace top block and the furnace top base for the dual vacuum module of the crystal soldering machine as described in item 6 of the scope of patent application, wherein the first area of the substrate is relative to the middle area of the furnace top block, In order to adsorb the first area of the substrate to the middle area of the furnace block, the two second areas of the substrate are opposite to the two first and second peripheral areas of the furnace block, so that the two of the substrate A second area is adsorbed on the two first and second peripheral areas of the furnace block. The combination of the furnace top block and the furnace top base for the dual vacuum module of the crystal soldering machine as described in item 6 of the scope of patent application, wherein the second perforation group has at least one row of perforations connected to the second longitudinal channel. For the combination of the furnace top block and the furnace top base of the dual vacuum module used in the crystal soldering machine described in item 6 of the scope of patent application, the second perforation group has two rows of perforations connected to the second longitudinal channel.

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