M332941 八、新型說明： 【新型所屬之技術領域】 本新型係一種發光二極體（LED)，尤指一種白光發光 二極體的結構改良。 【先前技術】 , 發光二極體（LED)是一種半導體固體發光器件，它是 利用固體半導體晶片做為發光材料，當兩端加上正向電 壓’半導體中的載流子發生復合引起光子發射而產生 • 光，是當今最熱門的光源技術。M332941 VIII. New Description: [New Technology Field] This new type is a kind of light-emitting diode (LED), especially a white light-emitting diode. [Prior Art] A light-emitting diode (LED) is a semiconductor solid-state light-emitting device that uses a solid semiconductor wafer as a light-emitting material, and when a positive voltage is applied to both ends, a carrier in the semiconductor recombines to cause photon emission. Producing • Light is the most popular light source technology today.
LED光源的特點是節能，其消耗能量較同光效的白熾 燈減少80% ;使用低壓電源（在6 —24V之間），安全性高； 體積小，可以製備成各種形狀的器件；壽命長，反應時 間快，白熾燈的反應時間為毫秒級，而LED燈的反應時間 為奈秒級；無有害金屬汞對環境的污染等。隨著大功率 LED燈的開發應用，LED燈已從點光源朝功能性照明的方 向發展，其前景無比廣闊。 然而，從應用中發現，目前國内外生產的LED燈，特 別疋白光LED燈有其明顯的缺失： 現有技術1 :如圖1所示，該LED燈是由兩條腿式的引 線支架01及設於一支架碗杯中的晶片〇2、覆蓋晶片上 的螢光粉03和封裝晶片02的環氧樹脂〇4組成，其缺點 壞氧樹脂封裝時將晶片及螢光粉無縫隙地包覆， ^的光和熱使得螢光粉加速老化，環㈣ 料 使得LED的散熱效果變差，加之兩條腿式的引線支架= M332941 熱能力不足，均導致LED的光效和壽命的降低。 現有技術2 :針對上述產品的不足，申請人的中華民LED light source is characterized by energy saving, which consumes 80% less energy than incandescent lamps with light efficiency; low voltage power supply (between 6 and 24V), high safety; small size, can be prepared into various shapes of devices; long life The reaction time is fast, the reaction time of the incandescent lamp is millisecond, and the reaction time of the LED lamp is nanosecond; there is no environmental pollution caused by harmful metal mercury. With the development and application of high-power LED lamps, LED lamps have evolved from point sources to functional lighting, and their prospects are vast. However, it has been found from the application that LED lamps currently produced at home and abroad, especially white LED lamps, have their obvious drawbacks: Prior Art 1: As shown in Figure 1, the LED lamp is a two-leg lead frame 01 and The wafer 〇 2 disposed in a bracket cup, the phosphor powder 03 covering the wafer, and the epoxy resin 〇 4 of the package wafer 02 have the disadvantages that the wafer and the phosphor powder are seamlessly covered during the bad oxygen resin package. The light and heat of ^ make the phosphor powder accelerate aging, and the ring (four) material makes the heat dissipation effect of the LED worse. In addition, the two-legged lead frame = M332941 has insufficient heat capacity, which leads to the reduction of LED light efficiency and life. Prior Art 2: In response to the deficiencies of the above products, the applicant's Chinese people
國專利M312775號（參見圖2)對LED燈進行了改良，該LED 產品是柱狀基板2上設置有碗杯3，在碗杯3内設置有晶片 4，在晶片4的外表而塗有一層螢光粉5，基板2用抗紫外 線的中空的透鏡罩7封罩，在透鏡罩7的空腔内填充有惰 性氣體8 ’晶片4的正負極分別用引線6引出並與延伸至透 鏡罩7之外的導腳1連線，該結構由於柱狀基板、導腳及 ⑩惰性氣體的導熱性，使晶片周圍的溫度有所降低，但是， 經研究發現，該結構由於晶片與螢光粉直接接觸，螢光 粉直接受熱，導致螢光粉容易迅速老化及碳化發黑，使 藍光晶片發出的藍光與螢光粉結合生成的白色光在短時 間内產生光通量降低、大幅度的光衰減、色溫改變，直 至死燈，即LED燈報廢的現象時有發生，因此，只有降低 螢光粉的環境溫度，才能防止螢光粉的老化及碳化發 黑，保持色溫不發生變化，進一步延長LED燈的工作壽 ⑩命’提高LED燈的光效。 【新型内容】 • 本新型之目的在提供一種螢光粉與晶片不直接接 觸，以便可進一步降低螢光粉的環境溫度，維持LED燈的 色溫不變變，延長LED燈的工作壽命，提高LED燈光效的 白光發光二極體的結構改良。 為達上述目的，本新型白光發光二極體的結構改 良，是將發光二極體藍光晶片上的正、負電級分別用引 6 M332941 線引出並與延伸至透鏡罩之外的導腳或支架連接透鏡 罩可罩住藍光晶片’在基板或支架上的至少一個杯型凹 槽或平台上固定有至少一個藍光晶片，在藍光晶片的外 表面設置有賴熱、冑光、抗紫外線的光學玻璃或光學 塑膠料或矽膠或環氣樹脂或陶瓷材料製作的介質，在介 質的外表面或透鏡罩上設置有一層螢光粉。 上述的螢光粉設置在透鏡罩的夾層内或透鏡罩的内 表面或透鏡罩的外表面或混合在製作透鏡罩的材料内。 上述的基板是用PCB基或銅基或鋁基或鐵基材料製 作的。 上述的透鏡罩與介質之間可設置有空腔，在空腔内 填充有氮氣、乱氣、氖氣、氬氣、氣氣之一的惰性氣體。 上述的透鏡罩是用抗紫外線的光學玻璃或光學塑料 或樹脂或矽膠或環氣樹脂或陶瓷材料製作的，透鏡罩的 外开>為圓形或橢圓形或半圓形或平面形或方形或蜂窩六 角形。 白光發光二極體的結構改良的用途，可用於製做led 照明燈、LED信號燈、LED指示指、LED裝飾燈、LED燈帶、 LED燈杯、LED節能燈、LED地埋燈、LED輪廓燈、LED投光 燈等發光燈具。 本新型與現有技術卜2相較，所具有突出的優點是： 1、LED燈的光強度及色溫穩定：由於本新型將螢光 粉的位置從晶片的周圍外移，並用介質將螢光粉與晶片 隔離，由於介質的隔熱性，使晶片由於發光所激發出的 7 M332941 熱量大部分被金屬基板帶走，少部分被光帶走，形成了 螢光粉周圍良好的環境溫度，螢光粉就不易老化及碳化 發黑’保持色溫不發生變化，使led燈的光強度及色溫穩 定。 2、本新型的使用壽命延長：由於本新型中的螢光粉 的環境溫度變好，不易使螢光粉受熱導致迅速老化及碳 化發黑，從而延長了 led燈的工作壽命，經試驗驗證，LED 燈在5000小時老化後，現有技術1的光通量僅有初始光通 畺的10%’現有技術2的光通量為初始光通量的85%，而本 新型的光通量為初始光通量的9〇%以上，使led燈的工作 哥命大大延長。 【實施方式】 本新型係以如下具體實施例作進一步描述·· 實施例1 請參見圖3。白光發光二極體的結構改良，是將發光 二極體藍光晶片20上的正、負電極分別用引線21引出並 與延伸至透鏡罩40外的導腳22連接，透鏡罩4〇可罩住藍 光晶片20，在基板1〇上的至少一個杯型凹槽或平台“上 固疋有至少一個藍光晶片2〇，在藍光晶片2〇的外表面設 置有用隔熱、透光、抗紫外線的光學玻璃或光學塑膠料 或矽膠或環氣樹脂或陶瓷材料製作的介質3〇，在介質3〇 的外表面上設置有一層螢光粉31。 上述的基板10是用PCB基或銅基或鋁基或鐵基材料 製成的。 M332941 • 上述的透鏡罩40與介質30之間可形成有空腔32，也 可以不形成空腔32，在形成空腔32時，在空腔32内填充 有氮氣、氦氣、氖氣、氬氣、氙氣之一的惰性氣體。 上述的透鏡罩40是用抗紫外線的光學玻璃或光學塑 料或樹脂或石夕膠或環氣樹脂或陶瓷材料製作的，透鏡罩 40的外形為圓形或橢圓形或半圓形或平面形或方形或蜂 ^窩六角形。 實施例2 ⑩ 請參見圖4。本實施例的結構與實施例1的差異在 於，其一層螢光粉31係設置在透鏡罩4〇上，即設置在透 鏡罩40的夾層内，當然，上述的一層螢光粉31也可設置 在透鏡罩40的内表面或透鏡罩4〇的外表面或混合在製作 透鏡罩40的材料内。 實施例3 請參見圖5-6:本實施例的結構中所採用的基板1〇、 晶片20、杯型凹槽或平台、介質、惰性氣體、引線以及 •導腳22與實施例1或實施例2基本相同，差異在於將多個 • LED燈組件安裝在一個金屬盒體5〇内，盒體的上部用平面 ，的透鏡罩41封蓋，在透鏡罩的夾層内分別設置有一層螢 光粉31 ;當然，也可以像實施例丨及實施例2那樣，將螢 光粉31設置在介質的外表面或透鏡罩的内表面或透鏡罩 的外表面或混合在製作透鏡罩的材料内，再將正、負電 極分別用引線21引出並分別與導腳22串聯連接；當然， LED的數量多少可視光照強度的需求而設計。本實施例除 M332941 螢光粉被介質隔熱外，加上金屬盒體散熱性佳及散熱空 間加大’因此’使得L E D的穩定性變好、光效增大、壽命 增長，試驗證明，螢光粉的環境溫度越低，其工作環境 就越好，光效就越大，壽命就越長。 實施例4 請參見圖7-8。將晶片20固定在支架23上的杯型凹槽 或平口 上’將發光^一極體晶片20上的正、負電極分別 用引線21引出並與延伸至透鏡罩4〇之外的支架23連接， 參在晶片20的外表面設置有透光、隔熱的介質30，在介質 30的外表面設置有一層螢光粉31，支架23的上部、晶片 2〇、介質30、螢光粉31均用透鏡罩40封蓋住，當然，螢 光粉31與透鏡罩40之間也可以形成有空腔，當有空腔 時，可在空腔内填充有氮氣、氦氣、氖氣、氬氣、氙氣 之一的惰性氣體。本實施例的晶片2〇、介質3〇、螢光粉 31、透鏡罩40與實施例1基本相同。 本新型之白光發光二極體的結構改良的用途，可用 •於製作各種LED照明燈、LED信號燈、LED指示指、LED裝 -飾燈、LED燈帶、LED燈杯、LED節能燈、LED地埋燈、LED ‘輪靡燈、LED投光燈等各種發光類燈具。 上列詳細說明係針對本新型之一可行實施例之具體 說明，惟該實施例並非用以限制本新型之專利範圍，凡 未脫離本新型技藝精神所為之等效實施或變更，均應包 含於本案之專利範圍中。 10 M332941 【圖式簡單說明】 圖1是現有技術1的結構示意圖； 圖2是現有技術2的結構示意圖； 圖3是本新型實施例1的結構示意圖； 圖4是本新型實施例2的結構示意圖； 圖5是本新型實施例3的俯視示意圖； 圖6是圖5的A - A向剖視圖； \ 圖7是本新型實施例4的結構前視示意圖； φ 圖8是本新型實施例4的結構俯視示意圖。 【主要元件符號說明】 既知技術 01引線支架 02晶片 03螢光粉 04環氧樹脂 1導腳 # 2柱狀基板 - 3碗杯 4 晶片 5螢光粉 6引線 7透鏡罩 8惰性氣體 11 M332941 本新型 10基板 11杯型凹槽或平台 20晶片 21引線 22導腳 23支架 - 30介質 φ 31螢光粉 32空腔 40、41透鏡罩 50盒體 12The LED lamp is improved by the national patent M312775 (see FIG. 2). The LED product is provided with a bowl 3 on the column substrate 2, a wafer 4 in the bowl 3, and a layer on the outer surface of the wafer 4. Fluorescent powder 5, the substrate 2 is covered with a UV-resistant hollow lens cover 7, and the cavity of the lens cover 7 is filled with an inert gas 8'. The positive and negative electrodes of the wafer 4 are respectively led out by the lead wires 6 and extended to the lens cover 7 The lead pin 1 is connected. This structure reduces the temperature around the wafer due to the thermal conductivity of the column substrate, the lead pin and the 10 inert gas. However, it has been found that the structure is directly related to the wafer and the phosphor powder. In contact, the phosphor powder is directly heated, which causes the phosphor powder to be easily aged and carbonized black, so that the white light generated by the combination of the blue light and the phosphor powder emitted by the blue light wafer causes a decrease in luminous flux, a large light attenuation, and a color temperature in a short time. Change, until the dead light, that is, the phenomenon of LED lamp scrapping occurs, therefore, only reduce the ambient temperature of the fluorescent powder, can prevent the aging of the fluorescent powder and carbonization black, keep the color temperature does not change, further extend the LED light The working life of 10 lives' improves the light efficiency of LED lights. [New content] • The purpose of this new type is to provide a kind of phosphor powder that is not in direct contact with the wafer, so as to further reduce the ambient temperature of the phosphor powder, maintain the color temperature of the LED lamp unchanged, prolong the working life of the LED lamp, and improve the LED. The structural improvement of the white light-emitting diode of the light effect. In order to achieve the above object, the structure improvement of the novel white light-emitting diode is to lead the positive and negative electric currents on the LED of the light-emitting diode to the lead wire or bracket extending from the 6 M332941 line and extending outside the lens cover. Connecting the lens cover to cover the blue light wafer 'At least one blue crystal wafer is fixed on at least one cup groove or platform on the substrate or the support, and the outer surface of the blue light crystal is provided with the optical glass of heat, light, ultraviolet light or A medium made of optical plastic or silicone or epoxy resin or ceramic material is provided with a layer of phosphor on the outer surface of the medium or the lens cover. The phosphor powder described above is disposed in the interlayer of the lens cover or on the inner surface of the lens cover or the outer surface of the lens cover or in the material from which the lens cover is formed. The above substrate is made of a PCB-based or copper-based or aluminum-based or iron-based material. A cavity may be disposed between the lens cover and the medium, and the cavity is filled with an inert gas of nitrogen, gas, helium, argon or gas. The lens cover described above is made of ultraviolet-resistant optical glass or optical plastic or resin or silicone or epoxy resin or ceramic material, and the outer opening of the lens cover is circular or elliptical or semi-circular or planar or square. Or honeycomb hexagon. The improved structure of the white light emitting diode can be used for manufacturing led lighting, LED signal light, LED indicating finger, LED decorative light, LED light strip, LED light cup, LED energy saving lamp, LED underground light, LED contour light , LED floodlights and other lighting fixtures. Compared with the prior art, the present invention has the outstanding advantages of: 1. The light intensity and color temperature of the LED lamp are stable: since the new type moves the position of the phosphor powder from the periphery of the wafer, and uses the medium to fluorinate the powder. Isolated from the wafer, due to the thermal insulation of the medium, most of the heat of the 7 M332941 excited by the light is taken away by the metal substrate, and a small part is taken away by light, forming a good ambient temperature around the fluorescent powder, fluorescent The powder is not easy to age and carbonized and blackened to keep the color temperature from changing, so that the light intensity and color temperature of the led lamp are stable. 2. The service life of the new type is prolonged: Since the ambient temperature of the phosphor powder in the novel is improved, it is difficult to cause the fluorescent powder to be heated to cause rapid aging and carbonization, thereby prolonging the working life of the LED lamp, and verified by experiments. After the aging of the LED lamp for 5,000 hours, the luminous flux of the prior art 1 is only 10% of the initial luminous flux. The luminous flux of the prior art 2 is 85% of the initial luminous flux, and the luminous flux of the present invention is more than 9% of the initial luminous flux. The work of the led lamp is greatly extended. [Embodiment] The present invention is further described by the following specific embodiments. Embodiment 1 Please refer to FIG. The improvement of the structure of the white light emitting diode is that the positive and negative electrodes on the light emitting diode blue chip 20 are respectively led out by the lead wires 21 and connected to the lead legs 22 extending outside the lens cover 40, and the lens cover 4 can be covered. The blue light wafer 20, at least one cup-shaped groove or platform on the substrate 1" is fixed with at least one blue light wafer 2, and the outer surface of the blue light wafer 2 is provided with heat-insulating, light-transmitting, ultraviolet-resistant optical A medium made of glass or optical plastic or silicone or epoxy resin or ceramic material is provided with a layer of phosphor powder 31 on the outer surface of the medium. The substrate 10 is made of PCB-based or copper-based or aluminum-based. Or made of iron-based material. M332941 • The above-mentioned lens cover 40 and the medium 30 may be formed with a cavity 32 or may not form a cavity 32. When the cavity 32 is formed, the cavity 32 is filled with nitrogen gas. An inert gas of one of xenon, xenon, argon or xenon. The lens cover 40 is made of ultraviolet-resistant optical glass or optical plastic or resin or stone or epoxy resin or ceramic material. 40 is round or oval Or semicircular or planar or square or bee hexagonal. Embodiment 2 10 See Fig. 4. The structure of this embodiment differs from that of Embodiment 1 in that a layer of phosphor powder 31 is disposed in the lens cover 4. The upper layer is disposed in the interlayer of the lens cover 40. Of course, the above-mentioned layer of phosphor powder 31 may be disposed on the inner surface of the lens cover 40 or the outer surface of the lens cover 4 or mixed in the material for manufacturing the lens cover 40. Embodiment 3 Referring to FIG. 5-6: a substrate 1 〇, a wafer 20, a cup groove or a land, a medium, an inert gas, a lead, and a lead 22 used in the structure of this embodiment are the same as Embodiment 1 or Embodiment 2 is basically the same, the difference is that a plurality of LED lamp assemblies are mounted in a metal case 5〇, the upper part of the case is covered with a flat lens cover 41, and a layer of firefly is respectively disposed in the interlayer of the lens cover. Light powder 31; of course, the phosphor powder 31 may be disposed on the outer surface of the medium or the inner surface of the lens cover or the outer surface of the lens cover or mixed in the material for fabricating the lens cover, as in the embodiment and the second embodiment. Then, the positive and negative electrodes are respectively led out by the lead wires 21 And the lead pins 22 are respectively connected in series; of course, the number of LEDs is designed according to the requirements of the light intensity. In addition to the heat insulation of the M332941 phosphor powder, the heat dissipation of the metal case and the heat dissipation space are increased. 'Therefore', the stability of the LED is improved, the light efficiency is increased, and the life is increased. The test proves that the lower the ambient temperature of the phosphor powder, the better the working environment, the greater the light efficiency and the longer the life. Example 4 Referring to Figures 7-8, the wafer 20 is fixed to the cup-shaped recess or flat opening on the bracket 23. The positive and negative electrodes on the light-emitting diode wafer 20 are respectively led out by the lead wires 21 and extended to the lens. A bracket 23 other than the cover 4 is connected, and a light-transmissive and heat-insulating medium 30 is disposed on the outer surface of the wafer 20. A phosphor powder 31 is disposed on the outer surface of the medium 30, and the upper portion of the holder 23 and the wafer 2 The medium 30 and the phosphor powder 31 are all covered by the lens cover 40. Of course, a cavity may be formed between the phosphor powder 31 and the lens cover 40. When there is a cavity, the cavity may be filled with nitrogen. An inert gas of one of helium, neon, argon or helium. The wafer 2, the dielectric 3, the phosphor 31, and the lens cover 40 of this embodiment are basically the same as those of the first embodiment. The utility model has the advantages of improving the structure of the white light emitting diode, and can be used for making various LED lightings, LED signal lights, LED indicating fingers, LED mounting lights, LED light strips, LED light cups, LED energy saving lamps, LED grounds. Buried lamps, LED 'rims, LED floodlights and other lighting lamps. The detailed description above is a detailed description of one of the possible embodiments of the present invention, and is not intended to limit the scope of the present invention. The patent scope of this case. 10 is a schematic structural view of the prior art 1; FIG. 2 is a schematic structural view of the prior art 2; FIG. 3 is a schematic structural view of the first embodiment of the present invention; Figure 5 is a plan view of a third embodiment of the present invention; Figure 6 is a cross-sectional view taken along line A - A of Figure 5; Figure 7 is a front view of the structure of the fourth embodiment of the present invention; φ Figure 8 is a fourth embodiment of the present invention The structure is a schematic view. [Main component symbol description] Known technology 01 lead bracket 02 wafer 03 fluorescent powder 04 epoxy resin 1 lead pin # 2 column substrate - 3 bowl cup 4 wafer 5 phosphor powder 6 lead 7 lens cover 8 inert gas 11 M332941 New 10 substrate 11 cup type groove or platform 20 wafer 21 lead 22 lead 23 bracket - 30 medium φ 31 fluorescent powder 32 cavity 40, 41 lens cover 50 box 12