TWM330970U - Semiconductor elements storage apparatus and reticle storage apparatus - Google Patents

Semiconductor elements storage apparatus and reticle storage apparatus Download PDF

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TWM330970U
TWM330970U TW096218380U TW96218380U TWM330970U TW M330970 U TWM330970 U TW M330970U TW 096218380 U TW096218380 U TW 096218380U TW 96218380 U TW96218380 U TW 96218380U TW M330970 U TWM330970 U TW M330970U
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storage device
hole
reticle
semiconductor component
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TW096218380U
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Po-Chien Yeh
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Gudeng Prec Industral Co Ltd
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Priority to TW096218380U priority Critical patent/TWM330970U/zh
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Priority to US12/207,905 priority patent/US20090114563A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Food Science & Technology (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

M330970 * 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種光罩存放裝置與半導體元件存放裝置，特別是有關於 • 一種具有過濾裝置之光罩存放裝置與半導體元件存放裝置。 【先前技術】 近代半導體科技發展迅速，其中光學微影技術（Optical Lithography)扮演 重要的角色，只要是關於圖形(pattern)定義，皆需仰賴光學微影技術。光學微影 • 技術在半導體的應用上，是將設計好的線路製作成具有特定形狀可透光之光罩 (photo mask) 〇利用曝光原理，則光源通過光罩投影至石夕晶圓(siUc〇n wafcr)可曝 光顯示特定圖案。由於任何附著於光罩上的塵埃顆粒(如微粒、粉塵或有機物) 都會造成投影成像的品質劣化，用於產生圖形的光罩必須保持絕對潔淨，而被 才又射的石夕晶圓或者其他半導體投射體亦必須保持絕對清靜，因此在一般的晶圓 製程中，都提供無塵室(clean room)的環境以避免空氣中的顆粒污染。然而，目 前的無塵室也無法達到絕對無塵狀態。 因此，現代的半導體製程皆利用抗污染的光罩存放裝置進行光罩的保存與 φ運輸，以使光罩保持潔淨；也利用抗污染的半導體元件存放裝置進行半導體元 件的保存與運輸，以使半導體元件保持潔淨。光罩存放裝置係在半導體製程中 ‘用於存放光罩，以利光罩在機台之間的搬運與傳送，並隔絕光罩與大氣的接觸， 、避免光罩被雜質汙染而產生變化；而半導體元件存放裝置係在半導體製程中用 於存放半導體元件，關半導體元件在機台之間的搬運與傳送，並隔絕半導體 疋件與大氣的接觸，避免半導體元件被雜質汙染喊生變化。因此，在先進的 半導體70件射，通常會要求光罩存放裝置與半導體元件存放裝置的潔淨度要 符合機械標準介面(St她rd Mechanical Interface ; SMIF)，也就是說保持潔淨度 在Class 1以下。故’在光罩存放裝置與半導體元件存放裝置中充入氣體便是目 月1J解決的手段之一。 5 M330970 然而為了進#提升產品的良率及降低製造之成本，除了達到潔淨度的 標準要求之外，還要克闕為外來氣體對於鮮的㈣。這獅絲氣體除了 大氣以外，兩個來源，其-是源自於高分子材料所製成之光罩存放裝置與 半導體兀件存放裝置本身所釋出的氣體(〇utgasing)，其二是源自於殘留在光罩或 半導體耕表面的微量化學溶賴產生轉發氣體。這些細望氣體會對光罩 或半導體元件的表面產生霧化作用，使得光罩或轉體元件無法再使用而必須 報廢的窘境，使得製造成本增加。在光罩魏裝置與轉體元件存放裝置中充 入氣體是目前解決光罩或半導體元件霧化的手段之―，其巾如何保持充入氣體 的潔淨度，是一個重要的議題。 有鑒於此，本創作所提供之具有過濾裝置的光罩存放裝置與半導體元件存 放裝置，乃針對先前技術加以改良者。 【新型内容】 為解決先前技術之問題，本創作提供一種具有過渡裝置之光罩存放裝置與 半導體元件存放裝Ϊ。鮮存放裝轉航件存放裝置係由第—蓋體與第 二蓋體組合而成，形成-内部空間可容_罩或轉體元件，此光罩存放裝置 與半導體元件存放裝置之第二蓋體設有至少—孔，用以連贱罩存放裝置盘半 籲導體元件存放裝置的内部空間以及外部空間，以及一過滤裝置置於該孔。該過 滤裝置係由過滤件以及第-部份所構成，其中該第一部份具有通孔與卡纖 -構，與第二蓋體之齧合機構卡固，過滤件置於第一部份上，用以過遽空氣中之 w微塵與雜質，而過濾裝置可再增設固定件用以固定過濾件。 因此，本創作之主要目的在於提供一種具有過濾、裝置之光罩存放裝置與半 導體兀件存放裝置’可用來過遽空氣中之微塵，以避免光罩或半導體元件受到 汙染。 本創作之再-目的在於提供-種具有過據裝置之光罩存放裝置與半導體元 件存放裝置，可用來猶空氣中之微塵，以保持光罩存放裝置或半導體元件存 6 M330970 放裝置内之潔淨度。 【實施方式】 由於本創作係揭露—種具有磁裝置的光罩姐裝置與轉體元件存放裝 置之結構’其巾所_到的—些光罩辭導體元件或光罩存放裝置與半導體元 件存放裝置之詳細製造域理過程，係细現有技術來達成，故在下舰明中， 並不作完整描述。軌下述蚊巾之圖式，亦縣絲實際之侧尺寸完整繪 製’其作用僅在表達與本創作特徵有關之示意圖。 請先參閱第-圖’此係補作之光罩存放裝置或半導體元件存放裝置之示 意圖，光罩存放裝置或半導體元件存放裝置係由第__蓋體⑹與第二蓋體⑺組合 而成械可谷納光罩或半導體元件的内部空間；而在第二蓋體⑺有一本體 C71)，本體㈤上包含有至少一個孔(A)，用以連通光罩存放裝置或半導體元件存 放裝置的内部空間以及外部空間’孔(A)設置·合機構(79)，用以與以下所陳 述之過濾裝置(1)卡固。 接著’ 2參閱第二圖，過渡裝置⑴設置於光罩存放裝置或半導體元件存放 =第二蓋體⑺，與第二蓋體⑺之本體㈤之孔(A)結合;_裝置⑴係由第 、箱(2)與過滤件⑷組合而成，第一部份(2)具有一個對應於本體㈤之孔⑷的 通孔(H)，以及一個與本體⑺齧合機構(79)卡固之卡制機構(21);過渡件⑷覆蓋 ，4伤(2)之通孔⑻上，當空氣流通過該通孔⑻時，可由過渡件⑷過滤空 氣中之微塵與雜質。 〜 …其中1一部份(2)之卡制機構(21)，與本體㈤之齧合機構(79)相卡固，其 t如第二A圖至第三F圖所示；卡制機構⑼可以是至少_對卡勾，如第三a 圖所不’或者如第三B圖所示，是環狀卡勾；齧合機構⑽可以如第三C圖所 不一為至對槽體，或如第三D圖所示，為環狀之槽體；不論卡制機構㈤ $對卡勾或環狀卡勾，齧合機構(π)為至少一對槽體或環狀槽體，卡制機構⑼ ”。機構(79)均得互相卡固；又其卡固之方式亦有不同實施方式，當第一部份 7 M330970 (2)係自本體⑼面對内部空間之内部(川)向相對於内部之外部⑽)穿設，與本 體㈤之孔(A)結合時，卡制機構(21)與齧合機構(79)卡固之方式如第三e圖所 示；或者第-部份(2)係自本體之外部(712)向内部(711)穿設，與本體(71)之孔⑷ •結合時，卡制機構㈤與餐合機構(79)之卡固即如第j圖所示。卡制機構(21) •與齧合機構(79)卡固之方向不同，端視使用者之需求。 —接著，過遽裝置⑴可再增設固定件(5)以固定過滤件⑷，如第四圖所示，固 疋件⑶具有至少-個孔隙⑻可供空氣流通。而固定件(5)設置之方式，可包覆 於第-部份(2)上，如第五A圖與第五c圖所示；或卡設於第一部份⑺上，如第 五B圖所示；而固定件⑶可大致覆蓋該過滤件⑷,如第五B圖與第五〔圖所示； >或者亦可僅框住該過滤件⑷，如第五八圖所示，端視使用之需要。 再者’如第六A圖與第六b圖所示，光罩存放裝置或半導體元件存放裝置 之第-蓋體⑺可再設置板件(72)於本體⑺)之上，而為使本體⑼之孔⑷保持連 通光罩存放裝置或半導體元件存放裝置_部空間以及外部空間之功能，在板 件(72)相對應於本體㈤之孔⑷處設置一個具有至少一個縫隙⑽的對應部分 (73)板件(72)具有大致平坦的第—表面(721)，對應部分⑽可凸設於第一表面 (721)，如第七a圖所示；或凹設於第一表面(721)，如第七b圖所示；亦可與 一表面(721)共平面，如第七〇圖所示。 > 社所趙為本齡之較佳實施_已，並非μ限定本辦之中請專利 權利，同時以上的描述’對於熟知本技術領域之專門人士應可明瞭及實施 -此其他未脫離本發明所揭示之精神下所完成的等效改變或修飾，均應 述之申請專利範圍中。 你广 【圖式簡單說明】 第一圖：本創作光罩魏裝置辭導體元件存放裝置之示音圖。 第二圖：本解光罩存放裝置或半導體元件械裝置結合過置之示意 8 M330970 第 ®至第—F圖·本創作光單存放裝置或半導體元件存放裝置中第一 部份與本體之孔卡固之示意圖。 第四圖·本創作光罩存放輕或轉體元件存放裝置結合過舰置之示意 第五A ®至第五:本創作光罩存放裝置辭導體元件存放裝置第一部 份、過濾件與固定件之示意圖。 =六A _第六B圖：本桃_存放裝置或半導體元件存結合 過濾裝置之示意圖。
㈣圖至Γc圖：本卿__辭導體元件械裝置中板件 及對應部分之不意圖。 【主要元件符號說明】 1過濾裝置 2第一部份 21卡制機構 4過濾件 5固定件 51孔隙 6第一蓋體 7第二蓋體 71本體 711内部 712外部 72板件 721第一平面 73對應部分 9 M330970 74縫隙 79齧合機構 A 孔 Η 通孔

Claims (1)

  1. M330970 九、申請專利範圍： 1. 一種光罩存放裝置，包含有： 一第一蓋體； 1二蓋體，用以與該第-蓋體組合，形成—内部空間可容納光罩， 一蓋體包含有一本體，該本體具有至少一孔及一齧合機構；以及 X -過濾裝置’設置於該本體，與該本體之孔結合，該過據装置包含有： 一第一部份，包含有： 一通孔對應該本體之孔，以及 一·^制機構與該本體之齧合機構相結合；以及 一過濾件，覆蓋於該第一部份之通孔。 ^申請專概圍第丨項之光罩存放裝置’另包含有―固定件，用賴定該過渡 3.，申請專利範圍第2項之光罩存放裝置，其中制定件具有至少—孔隙可供 空氣流通。 ” ^ 請專概Μ 2項之光罩存錄置，其巾職騎域覆蓋該過渡件。 .申凊專利範圍第2項之光罩存放裝置，其中該固定件框住财渡件。 6.如申請專利第2項之光罩存放裝置，其中細定件包覆該第二部份。 ^請補細第2項之光罩姐《’其中該固定件卡設於該第一部份。 卡勾申輸咖第1項之光罩存放裝置，其巾該第—部份之卡繼構為至少一 ^申請專鄕Μ 8項之光罩存放《，其巾該本體4合部分為至少一對槽 遐興該卡勾結合，使該本體與該第一部分卡固。 10·如申請專利範圍第8項之光罩存放裝置，其中 T逆本體之齧合部分為一環狀槽 遐興該卡勾結合，使該本體與該第一部分卡固。 U.如申請專利第8項之光罩存放裝置，其中該卡勾為至少一對。 12.如申請專利細第8項之技存放裝置，其中該卡勾為環狀。 M330970 ‘ π.如申請專纖圍第丨項之光罩存放裝置，其中該第二蓋體另包含有一板件， 設於該本體上面對勒部空間，該板件具有—對應部分對應於該本體之孔。 14. 如申請專利範圍第13項之光罩存放裝置，其中該板件之對應部分具有至少一 縫隙。 15. 如申請專利細第13項之光罩存放裝置，其中該板件具有—大致平坦之第一 表面，該板件之對應部分係凸設或凹設於該第—表面或與該第—表面共平面。 16·—種半導體元件存放裝置，包含有·· 一第一蓋體； 一第二蓋體，用以與該第一蓋體組合，形成一内部空間可容納半導體元件，其 中該第二蓋體包含有-本體，該本體具有至少—孔及—齧合機構；以及 一過濾裝置，設置於該本體，與該本體之孔結合，該過濾裝置包含有： 一第一部份，包含有： 一通孔對應該本體之孔，以及 一卡制機構與該本體之齧合機構相結合；以及 一過濾件，覆蓋於該第一部份之通孔。 Π·如申請專利範圍第10項之半導體元件存放裝置，另包含有—固定件，用以固 定該過濾件。 队如申請專利範圍第17項之半導體元件存放裝置，其中該固定件具有至少一 孔隙可供空氣流通。 八 I9·如申請專利麵帛π項之半導體元件存放裝置，其中該固定件大致覆蓋該過 濾件。 μ 20.如申請專利範圍第17項之半導體元件存放裝置，其中該固定件框住該過渡 件0 21·如申請專利範圍第17項之半導體元件存放裝置，其中該固定件包覆該第一部 份0 22·如申請專利範圍第Π項之半導體元件存放裝置，其中該固定件卡設於該第— 12 M330970 部份 範圍第16項之半導體元件存放裝置，其中該第—部份之卡刪 24·如申凊專利範圍第23項之半導體藉存置 槽體與該卡勾結合，使該本體與該第一部分卡固。^本體⑽合部分為一 25·如申明專利範圍帛23 J員之半導體元件存放裝置，1中 物咖第23項之半導體元件存放裝置，其中該卡鹎至 28:如申;:==項之半導體元件存放裝置’其中該卡勾‘ 板件，設於^體上面^之半導體兀件存放裝置，其中該第二蓋體另包含有一 孔。…本體上面對該_謂，錄件具有-對_分對應於該本體之 2至職第28項之半導歸存放裝置，其中該板件之對應部分具有 圍第28項之半導體元件存放裝置，其中該板件具有—大致平坦 平面。’該板件之對應部分係凸設或凹設於該第―表面錢該第—表面共 13
TW096218380U 2007-11-01 2007-11-01 Semiconductor elements storage apparatus and reticle storage apparatus TWM330970U (en)

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