TWM312770U - Package for direct driving chip - Google Patents
Package for direct driving chip Download PDFInfo
- Publication number
- TWM312770U TWM312770U TW095212297U TW95212297U TWM312770U TW M312770 U TWM312770 U TW M312770U TW 095212297 U TW095212297 U TW 095212297U TW 95212297 U TW95212297 U TW 95212297U TW M312770 U TWM312770 U TW M312770U
- Authority
- TW
- Taiwan
- Prior art keywords
- package
- wafer
- chip
- board
- circuit board
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
- H01R13/415—Securing in non-demountable manner, e.g. moulding, riveting by permanent deformation of contact member
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
- H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
- H05K5/0278—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces of USB type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Description
M312770 八、新型說明: 【新型所屬之技術領域】 本新型有關於晶片包裳體之結構設計,尤其是指具有直驅裝 置技術之晶片包裝體。 【先前技術】 現有之晶片包裝體有許多的包衫式,例如:TS0P、S08、 、DIP、⑽、卿、卿等,但是這些晶片都不能直接 使用,必_由具有特殊技術專長之電子工购設計電路,並且 經過佈局製圖,製作電路板,然後送交黯咖⑽編峡 Technology)加工廠昂貴的設備將各觀路零料接在電路板 上。其製作產品的工序十分複雜、成本高昂,但製出的電子產品 其耐溫、防水、防塵、抗衝擊等特性都不約(例如蝴高溫時塑° 膠殼會融化’溫度太低時有許多電子元件無法運作),而且需要 專業的知識及設備才絲理,這㈣題造成使时很多的不便。 【新型内容】 本新型提供一種可讓一般消費者直接使用之晶片包裝體,在 曰曰片包扁體一端具有多個金屬接端,可供直接連接電腦等電子裝 置。本新型亦可在晶片包裝體的適當位置形成豎孔,以連通到晶 片包裝體内部的保護電路板或覆晶載板,可以插入不同電阻值的 電阻裔或其他電子元件,以達成微調内部晶片特性或保護内部晶 M312770 片的作用。 於此晶片包裝體可直接插入電腦等電子設備且具有良好的 :、防水、防塵、抗衝轉触,轉日村域时直接移除 更換’使用上相當便利,非f符合—般使用者的需求。、 【實施方式】
首先說明本;包魏的製程。“的製程包姑圓切割、 ‘曰曰、銲線、封膠、接腳形成、電鑛、衝切、模壓、蓋印等步驟 其中接腳形成為本新型之著眼點。 日、第圖所7F其中不出辉晶、録線的結果,晶片以已在覆 曰曰載板12上形成’金屬線14由覆晶載板12牵出並經保護電路柄 13而往左延伸’如圖所示。然後進行封膠程序,將膠體物質洗灌 於其上,形成晶片包裝體1。 如第二圖之透視圖所示,晶片包裝體1左端上方模製形成幾 _槽15 ’最後將突出於晶片包裝體1外的金屬線14以模壓技術 附著於凹槽15處,於是形成可直接連結於電腦等電子裝置的接 :’此即本新赌「直驅裝置技術晶片包裝體」(ddtic)。本 晶片包裳體可做成多種介面,例USB、SD、sata、⑽$。 請見第三圖,為本新型另—實施例之示意圖,可在晶片包裝 體1的適當位置處形成1孔16,直接連通到内部的覆晶載板U或 保護電路板13。當需魏以_微調其電子或加強保護電 路板13之保護能力時’可將電阻器17(或電容器)插入豎孔16中, M312770 以達成微調晶片特性或保護晶片的作用。 【圖式簡單說明】 第一圖為本新型晶片經過銲晶、銲線的示意圖。 第二圖為本新型晶片包裝體結構透視圖。 第三圖為本新型另一實施例示意圖。 【主要元件符號說明】 1 晶片包裝體 11 晶片 12 覆晶載板 13 保護電路板 14 金屬線 15 凹槽 16 豎孔 17 電阻器 7
Claims (1)
- M312770 九、申請專利範圍: !.一種直驅裝置技術晶片_,由該晶片__ 2.如申請專利細第丨項之直驅裝置技_包储,在 包裝體的適當位置處形成豐孔,可直接連通到晶片包裳體: -覆晶載板或-賴電路板’當需要對晶片包裝體内部的 微調其電子特性或加強保護電路板之保護能力時曰^ 或電容器等電子元件插入該豎孔而與晶片包裝體内部的费曰、 板或保護電路板連接,以達成微調晶片特性或保護晶 曰載 的作用。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095212297U TWM312770U (en) | 2006-07-13 | 2006-07-13 | Package for direct driving chip |
US11/656,990 US20080012153A1 (en) | 2006-07-13 | 2007-01-24 | Direct drive technology chip package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095212297U TWM312770U (en) | 2006-07-13 | 2006-07-13 | Package for direct driving chip |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM312770U true TWM312770U (en) | 2007-05-21 |
Family
ID=38752243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095212297U TWM312770U (en) | 2006-07-13 | 2006-07-13 | Package for direct driving chip |
Country Status (2)
Country | Link |
---|---|
US (1) | US20080012153A1 (zh) |
TW (1) | TWM312770U (zh) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6528408B2 (en) * | 2001-05-21 | 2003-03-04 | Micron Technology, Inc. | Method for bumped die and wire bonded board-on-chip package |
KR101027574B1 (ko) * | 2002-08-26 | 2011-04-06 | 다이니폰 인사츠 가부시키가이샤 | 에스아이엠, 에스아이엠 홀더, 아이씨 모듈, 아이씨 카드및 아이씨 카드 홀더 |
TWI228811B (en) * | 2004-05-28 | 2005-03-01 | Taiwan Electronic Packaging Co | Package for integrated circuit chip |
-
2006
- 2006-07-13 TW TW095212297U patent/TWM312770U/zh not_active IP Right Cessation
-
2007
- 2007-01-24 US US11/656,990 patent/US20080012153A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20080012153A1 (en) | 2008-01-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |