M310449 八、新型說明： 【新型所屬之技術領域】 本創作係與積體電路之銲線有關，_是有關於一種 電路銲線用之銲針。 5【先前技術】 口月ΐ閱弟/、圖，傳統銲線接合(Wire B〇n(jing)之銲針 (Bonding Capillary)(8〇)主要包含有一出口㈣與一連通出口购 之通道(84) ’通道㈣具有一連接出口㈣之第一段⑽2)、—連 接第^又(842)之第一段(844)與一連接第二段(844)之第三段 ίο (846)。第/又(842)朝遠離出口(82)的方向傾斜地且收縮地往上 延=，使第-段(842)與出口(82)連接處的外徑大於第一段(842) 與第二段(844)連接處的外徑，第二段(844)則朝遠離出口 (82) 的方向傾斜地且收縮地往上延伸，使第二段(844)與第一段(祕) 連，處的外徑大於第二段_與第三段_連接處的外徑， I5而第=段(846)則朝遠離出口 (82)的方向筆直地往上延伸。 當上完晶片，進行開始銲線作業時，如第七圖所示，銲針 (80)-銲線(90)穿過銲針⑽的通道㈣，將銲線(9〇)的線尾靠 電極_峨成銲球㈣，接著銲針⑽下降，並辅以屢力及 超音波缝，將銲球(92_躲^ m(Pad)_n 20時产會形成一第一塊(922)、一第二塊陶與一第三塊(926)，其 :第塊(922)塵~於銲塾(100)上，並與鲜塾(卿)結合，位於 第塊(922)上方之第二塊(924)係自然地擠壓入通之 -&(842)與*二段(844)t ’而位於第二塊(似)上方之第三塊 ㈣則讎入第三段_巾，接著銲針(8〇)上升牵引，並將銲 4 M310449 線(90)拉銲在基板上之一銲墊， 门日守拉断基板與銲針之間的銲 線(90) I齡線動作。在傳統上晶片之銲線過程中，由於 ，_之間的距離較大，銲墊面積也較大 、 壓銲於銲墊_上的面積可較大，亦即不需顧忌第-i(922) 之間的短路财，若要使第—塊(922)與銲墊(⑽胸穩定， 只須適當_整超音波辨，即可得雜大的_面積盘較佳 的銲接效i ’當銲_)上料引時，第—塊(922)不容 易被第二塊(92=)與第三塊(926)向上拉起而產生剝離現象。 15 然而，P遺著產品功能增加與小型化的趨勢，必須增加鲜塾 (100)的數目，理想之晶片密度越高面積越小可得到較高之產 能，但是晶片的周邊空間有限，只有縮小銲墊⑽)的面積及縮 短銲墊(100)之間的距離才能增加銲墊(1〇〇)的數目，若以傳統 方式進行銲線作業，將會產生短路現象，因此只能減少第一塊 (922)壓銲於銲墊(1〇〇)上的面積。為達到好的銲接品質所設定 的I干接此里(壓力、時間、溫度、及超音波震盡)將會使得第二 塊(924)與第三塊(926)分別壓擠進入第二段⑽4)與第三段(846) 内並堵基空間，但是在向上牽引的過程中，第一塊(922)容易受 到第二塊(924)與第三塊(926)牽引而產生剝離現象。另外，銲 針(10)在製造的過程中，通道(84)内如果沒有拋光平直而造成 凹凸不平，更容易增加第二塊(924)與第三塊(926)拉動第一塊 (922)的力量，使得目前晶片常有焊接不穩固而影響電性良率的 情況發生，特別在小銲墊產品特別明顯。 【新型内容】 5 20 M310449 針，要士目的在於提供—種積體電路銲線用之銲 、’ ’：、可避免銲接畴雜銲墊之職蝴離現象。、’ =達^述目的’本創作所提供之積體電路 3有=體’該本體具有-出口與—連通該出口的通道針 =通運具有—連接該出口之第—段與—連接該第— & 中該第二段呈上窄下寬的形狀。 乐- 球二銲線係壓銲於-銲墊上而形成-銲球，該銲 【實施方式】 功^配合圖式鱗町触實_，_對摘作之結構及 力f仃雜朗；其中所關式先簡要說明如下： 15 ^一圖為本創作第—較佳實施例之示意圖； 圖為本創作第一較佳實施例之使用示意圖； ，二圖為本創作第一較佳實施例之動作流程圖； f四圖為本創作第二較佳實施例之示意圖；以及 圖為本創作第二較佳實施例之使用示意圖。 — 為本創作第-較佳實施例所提供之積_ 路杯線用之銲針⑽，銲針⑽包含有-本體(20)。 本體(20)具有一出口 (3〇)(現有之設計為圓柱孔)與一連 口⑽之通道(40)。通道(40)具有一第一段(42)盘一第-俨 (二;丄-，具有一第一分卿)與一第娜 弟刀丰又(422)的底端連接出口(3〇)，頂端則朝遠離出口⑼） 20 M310449 的方向傾斜地往上延伸而呈上窄下寬狀，第二分段(424)的底端 連接第一分段(422)的頂端，頂端則朝遠離出口(3〇)的方向傾斜 絲上延伸而呈上窄下寬狀，並鮮二段(44)底端連接；第二 ^(44)則朝遠離出口 (3〇)的方向往上延伸並傾斜一角度(0 )，使 5第二段(44)呈上窄下寬的形狀，且第二段㈣的内壁呈平坦狀。 經由上述結構，請配合參閱第二圖與第三圖，一銲線 (5〇)經由通道㈣而穿過出口⑽(如第三_ A)，將鲜線⑼) 的線尾利用電極燒成銲球(52)(如第三圖B與第三圖c)，接著 銲針(10)下降，並辅以超音波振盪，將銲球(52)壓銲於一銲墊(6〇) 1〇亡並形成一第一塊(522)、一第二塊(524)與一第三塊(526)(如第 三圖=與第三圖E)，其中第一塊(522)壓銲於晶片的銲墊(6〇) 上’第二塊(524)係自然地被向上擠壓入第一段(42)中，而第三 塊(526)則被擠壓入第二段(44)中，如第二圖所示，由於第二段 (44)呈上窄下寬狀，使得第三塊(526)被擠壓入第二段(44)時， 15所加於銲球(52)上之能量造成變形，達到能量完全被第三塊 (526)吸收並緊緊堵塞在第二段(44)内，使第三塊(526)會受到第 —丰又(44)内壁的限制而無法再被往上擠壓，並且讓大部份的體 % 4在苐一塊(522)的位置，如此一來，當銲針(1〇)往上拉引 時，第一塊(522)與銲墊(60)之間的附著力可容易克服第三塊 20 (526)因此里壓擠堵塞在第二段(44)内的附著力，使第一塊(a〕） 與隹干墊(60)之間不容易產生剝離現象。另外，由於第二段(44) 呈上窄下寬狀，即使第二段(44)的内壁具有凹凸不平，亦不會 增加第三塊(526)往上拉動第一塊(522)的力量。 藉此，本創作利用第二段(44)呈上窄下寬的形狀，以避免 7 M310449 第一塊(524)被向上拉起，使第一塊⑽)與鲜整(6〇)之間可避免 產生剝離現象而達到確實連接。 請參閱第四圖，為本創作第二較佳實施例所提供之銲針 (70)，其主要結構與第一較佳實施例大體相仿，惟其差異在於： 第二段(72)的内壁呈階梯狀，當第三塊(74)被擠壓入第 二段(72)時，如第五圖所示，同樣會受到第二段(72)内壁的限 制而無法再被往上擠壓，用以達到本創作的目的。 M310449 【圖式簡單說明】 ^圖為本創作第—較佳實施例之示意圖。 圖為本創作第—較佳實施例之使用示意圖。 ，—圖為本_第—紐實施例之動作流程圖。 ，四圖為本創作第二較佳實施例之示意圖。 第五圖為本創作第二較佳實施例之使用示意圖。 ，六圖為制銲針之示意圖。 第七圖為習用銲針之使用示意圖。 10【主要元件符號說明】 銲針(10) 本體(20) 出口 (30) 通道(40) 第一段(42) 第一分段(422) 第二分段(424) 第二段(44) 15 銲線(50) 銲球(52) 第一塊(522) 第二塊(524) 第三塊(526) 銲墊(60) 銲針(70) 第二段(72) 第三塊(74) 9M310449 VIII. New description: [New technical field] This creation is related to the welding wire of integrated circuit, _ is a kind of welding pin for circuit welding wire. 5 [Prior Art] The mouth of the moon, the drawing, the traditional wire bonding (Wire B 〇 (Jing) Bonding Capillary (8 〇) mainly contains an outlet (four) and a connected export purchase channel ( 84) 'Channel (4) has a first segment (10) 2) connecting the outlet (4), a first segment (844) connecting the second segment (842) and a third segment ίο (846) connecting the second segment (844). The second/again (842) is inclined obliquely and retracted in a direction away from the outlet (82), such that the outer diameter at the junction of the first segment (842) and the outlet (82) is greater than the first segment (842) and the second The outer diameter of the junction of the segment (844), the second segment (844) extends obliquely and retracted upwardly away from the outlet (82), so that the second segment (844) is connected to the first segment (secret) The outer diameter is greater than the outer diameter of the junction of the second segment _ and the third segment _, and the fifth segment (846) extends straight upwardly away from the outlet (82). When the wafer is finished and the wire bonding operation is started, as shown in the seventh figure, the welding pin (80)-welding wire (90) passes through the passage (4) of the welding pin (10), and the wire tail of the bonding wire (9〇) is The electrode _ is soldered into the ball (4), and then the soldering pin (10) is lowered, and supplemented by repeated force and ultrasonic stitching, the solder ball (92_ ^ ^ m (Pad)_n 20 will form a first piece (922), a second pottery and a third block (926), the first block (922) dust on the weld bead (100) and combined with the fresh clam (clear), located second above the first block (922) The block (924) is naturally squeezed into the third section (4) above the second block (84) and the second section (4) is inserted into the third section. Then the welding pin (8〇) is pulled up and the welding wire 4 M310449 wire (90) is welded to one of the pads on the substrate, and the wire is cut between the substrate and the welding pin (90). In the conventional soldering process of the wafer, since the distance between _ is large, the area of the pad is also large, and the area of the pad on the pad can be large, that is, there is no need to worry about the -i ( 922) Short-circuit between the two, if you want to make the first block (922) and the pad ((10) chest stable, only need to properly _ whole ultrasonic It is possible to obtain a better welding effect of the large-sized _ area disk. When the welding is performed, the first block (922) is not easily pulled up by the second block (92=) and the third block (926). However, the peeling phenomenon occurs. 15 However, the trend of increasing the functionality and miniaturization of P products must increase the number of fresh enamel (100). The higher the wafer density, the smaller the area, the higher the capacity, but the wafer The surrounding space is limited. Only by reducing the area of the pad (10) and shortening the distance between the pads (100) can increase the number of pads (1〇〇). If the wire bonding operation is performed in a conventional manner, a short circuit will occur. Therefore, only the area of the first piece (922) welded to the pad (1 〇〇) can be reduced. The I dry connection (pressure, time, temperature, and ultrasonic shock) set to achieve good soldering quality will cause the second (924) and third (926) to be squeezed into the second segment. (10) 4) and the third section (846) and the base space is blocked, but during the upward traction, the first block (922) is easily pulled by the second block (924) and the third block (926) to cause peeling. In addition, during the manufacturing process, if there is no polishing and straightness in the channel (84), it is more likely to increase the second block (924) and the third block (926) to pull the first block (922). The power of the current wafers often causes soldering to be unstable and affects the electrical yield, especially in small pad products. [New content] 5 20 M310449 needle, the purpose of the aim is to provide a kind of welding of the integrated circuit soldering wire, ' ’: to avoid the phenomenon of soldering the domain bond pad. '=达说说的目的' The integrated circuit provided by this creation has a body = the body has an - outlet and - the channel needle that connects the outlet = the transport has - the first segment connected to the exit - and the connection — The second segment of the & is a narrow, wide shape. Le-ball welding wire is welded on the welding pad to form a solder ball. The welding method [embodiment] is compatible with the pattern of the scales of the town, _, _ the structure and force of the extraction; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 15 is a schematic view of a first preferred embodiment of the present invention; FIG. 2 is a schematic view of the first preferred embodiment of the present invention; FIG. 4 is a schematic view showing a second preferred embodiment of the present invention; and a schematic view showing the use of the second preferred embodiment of the present invention. - a soldering pin (10) for a product of the first embodiment of the present invention, the soldering pin (10) comprising a body (20). The body (20) has an outlet (3〇) (the existing design is a cylindrical hole) and a port (10) of the port (10). The channel (40) has a first segment (42) disk-first-俨 (two; 丄-, with a first division) and a Dina knives (422) bottom end connection outlet (3 〇) The top end extends obliquely upward in a direction away from the outlet (9)) 20 M310449 to be narrow and wide, the bottom end of the second section (424) is connected to the top end of the first section (422), and the top end is facing away from the exit. The direction of (3〇) extends obliquely on the wire to be narrow and wide, and the bottom end of the fresh two segments (44) are connected; the second ^(44) extends upward and tilts away from the outlet (3〇). At an angle (0), the second segment (44) of the fifth portion has a shape that is narrow and wide, and the inner wall of the second segment (four) is flat. Through the above structure, please refer to the second and third figures, a wire (5〇) passes through the outlet (10) through the passage (4) (such as the third_A), and the tail of the fresh wire (9) is burned by the electrode. The solder ball (52) (such as the third figure B and the third figure c), then the soldering pin (10) is lowered, and supplemented by ultrasonic oscillation, the solder ball (52) is pressure-welded to a solder pad (6〇) 1 Falling down and forming a first block (522), a second block (524) and a third block (526) (such as the third figure = and the third figure E), wherein the first piece (522) is pressure welded On the wafer pad (6〇), the 'second block (524) is naturally squeezed up into the first segment (42) and the third block (526) is squeezed into the second segment (44) As shown in the second figure, since the second segment (44) is narrow and wide, so that the third block (526) is squeezed into the second segment (44), 15 is applied to the solder ball (52). The energy on the deformation causes the energy to be completely absorbed by the third block (526) and tightly blocked in the second segment (44), so that the third block (526) is restricted by the inner wall of the first and fourth (44) And can no longer be squeezed up, and let most of the body 4 in the position of a piece (522), so that when the welding pin (1〇) goes up In the lead time, the adhesion between the first block (522) and the pad (60) can easily overcome the adhesion of the third block 20 (526) and thus the plugging in the second segment (44), so that the first Peeling is not likely to occur between the block (a)) and the dry pad (60). In addition, since the second segment (44) is narrow and wide, even if the inner wall of the second segment (44) has irregularities, the third block (526) does not increase the force of pulling the first block (522) upward. . Thereby, the creation uses the second segment (44) to have a narrow and wide shape to avoid the first piece (524) of the 7 M310449 being pulled up, so that the first piece (10)) and the fresh piece (6 〇) are between It can avoid peeling and achieve a true connection. Please refer to the fourth figure, which is a welding pin (70) provided for the second preferred embodiment of the present invention, the main structure of which is substantially similar to that of the first preferred embodiment, except that the difference is that: the inner wall of the second segment (72) is Stepped, when the third block (74) is squeezed into the second segment (72), as shown in the fifth figure, it is also restricted by the inner wall of the second segment (72) and can no longer be squeezed upward. Used to achieve the purpose of this creation. M310449 [Simple Description of the Drawings] ^ Figure is a schematic diagram of a preferred embodiment of the creation. The figure is a schematic view of the use of the preferred embodiment of the present invention. , - Figure is a flow chart of the action of the _ first-new embodiment. The four figures are schematic views of the second preferred embodiment of the creation. The fifth figure is a schematic view of the use of the second preferred embodiment of the present invention. The six figures are schematic diagrams of the welding pins. The seventh picture is a schematic diagram of the use of conventional solder pins. 10 [Description of main component symbols] Solder pin (10) Body (20) Outlet (30) Channel (40) First segment (42) First segment (422) Second segment (424) Second segment (44) 15 Bonding wire (50) Solder ball (52) First block (522) Second block (524) Third block (526) Solder pad (60) Solder pin (70) Second section (72) Third block (74 ) 9