M3 05961 八 、新型說明： 【新型所屬之技術領域】 =創作係有關於一種半自動植球機，九丹疋箱以 人工輸运基板$人貞#騎2㈣ 二可經由檢測，再配合人工收料 作業的半自動植球機者。 貝的 【先前技術】 IC運算功能的增加，其所構裝之電路亦相 較較夕，而母- IC所需的接腳數亦 式構裝（BGA)具有可應祕高密度、高集基㈣d =的散熱途徑、電性更為優良、錫球高度低可達薄型化^ 裝之目的、_不㈣料伽，因此，球 成為目前多腳化1C構裝的主流。 ㈣（BGA) 而就一般植球機的結構，如一種植球機改良，該球 機之入料端具有待料盒以供應待處理的基板，使之利用推 杯之推送及輸送帶送入沾劑段的沾劑輸送帶上，由樺桿架 上之沾台配合滑執使沾台可以至助焊劑槽上沾附助焊劑 後再沾附於基板上並送入植球段的植球輸送帶上；利用橫 桿架上之植球台配合滑軌使植球台至錫球槽上吸附錫球 至基板上置放以完成植球，再送入檢測裝置作檢測及配合 分配裝置予以分配至下一加工的各生產線上； 然而，根據上述之植球機，其係因整體機構運作的行 程設計，而利用輸送帶來輸送基板進行沾點助焊劑、植入 錫球及檢測基板等程序，所以上述程序結構均與輸送帶呈 垂直方向設置，且依序延伸而設，所以整體機台的體積無 M305961 論於直向或橫向都具有龐大的面積，在機房操作均極佔空 間不致理想。 今，創作人即是鑒於上述植球機於實際實施使用上的 缺失之處，而加以修正、改良，同時本著求好之精神及理 念，並藉由專業之知識、經驗的輔助，以及在多方巧思、 試驗後，方創設出本創作，以提供一種半自動植球機來因 應人工市場之需求，俾可減少機台體積及增加工作的時效 性0M3 05961 VIII, new description: [New technology field] = Creative Department has a semi-automatic ball planting machine, Jiudan box to manually transport the substrate $人贞# Ride 2 (four) 2 can be tested, and then with manual receipt Semi-automatic ball planter for homework. [Previous technology] The increase of IC computing function, the circuit of its construction is also relatively eve, and the number of pins required by the mother-IC is also high-density and high-set. The base (4) d = the heat dissipation path, the electricity is better, the height of the solder ball is low, the purpose of the thinning is reduced, and the _ is not (four) material gamma. Therefore, the ball becomes the mainstream of the current multi-footed 1C assembly. (4) (BGA) As for the structure of the general ball plant, such as a planting ball machine improvement, the feeding end of the ball machine has a waiting box to supply the substrate to be processed, so that it can be pushed by the push cup and the conveyor belt. On the adhesive conveyor belt of the agent section, the dipstick table on the birch frame can be used to make the dipstick table to the ball conveyor belt which is adhered to the flux tank and then adhered to the substrate and sent to the ball-planting section. The ball is placed on the crossbar to match the slide rail, so that the ball is placed on the solder ball to the solder ball to the substrate to complete the ball placement, and then sent to the detecting device for detection and distribution device to be distributed to the next processing. According to the above-mentioned ball-splitting machine, the above-mentioned procedure is carried out by using a conveyor belt to transport a substrate to perform fluxing, soldering, soldering, and detecting substrates, because of the stroke design of the overall mechanism operation. The structure is arranged in the vertical direction with the conveyor belt, and is extended in sequence. Therefore, the volume of the whole machine is not M305961. It has a huge area in both straight and horizontal directions, and the space occupied by the machine room is not ideal. Today, the creator is correcting and improving in view of the lack of actual implementation of the above-mentioned ball-planting machine, and at the same time, in the spirit and philosophy of seeking for good, with the help of professional knowledge and experience, and After a lot of ingenuity and experimentation, Fang created this creation to provide a semi-automatic ball planting machine to meet the needs of the artificial market, which can reduce the size of the machine and increase the timeliness of work.
【新型内容】 爰是，本創作係有關於一種半自動植球機，其主要於 中央設有以人工輸送基板的基板送收裝置，且於左、右兩 侧分別設有助焊裝置及植球裝置，以助焊裝置配合植球裝 置來分別依序進行沾取助焊劑及植入錫球於基板之左、右 來回作動的程序設置；另，於基板送收裝置與植球裝置之 間設有可偵測錫球吸引、植入狀態之偵測裝置，同時基板 送收裝置後端配合偵測裝置而設有承接疏失程序所^落 錫球之拋球組，以上述諸等裝置而形成一以人工輸送、收 料之半自動植球機者。 ' 【實施方式】 為令本創作所運用之技術内容、創作目的及1達成之 功^有更完整且清楚的揭露，兹於下詳細朗之，、 併參閱所揭之圖式及圖號： 31 ^ 首先，請參閱第一〜二圖所示，係本創作一種丰自動 植球機立體外觀及俯視示意圖，兮 +自 邊植球機（1)機会卜φ耍 包含有基板送收裝置（2)、助焊穿署上主要 ㈣裝置⑸及拋球組⑻，其中、置（3)、植球裝置⑷、 M305961 於機台中央設有以人工輸送基板⑺的基板送收裝置 ⑵，該基㈣收錢⑵具有—輪肋⑵），可將基板⑺ 導送至工作區（22); 於基板送收裝置⑵左、右兩侧分別設有助嬋裝置（3) 及植球裝置⑷，且_裝置⑶係與植球裝置⑷連動， 而分別依前後順序進行沾取助焊舰吸附錫球植入於基 板（7)之左、右來回作動的作業程序； 於基板达收裝置⑵與植球裝置⑷之間設有谓測裝 置（5) ’俾可針對植球裝置⑷所⑽卿及獻釋放鍚球 之狀態作偵測者； 另於基板送收裝置（2)後端配合偵測裝置（5)設有偵 測吸附、植人騎財失魏息，❿來承接失雜序所遺 落錫球之拋球組⑻，該拋球組⑻具有—動力組⑽連設 -拋球盒⑽，以動力組⑽帶動抛球盒（62)至植球震置 (4)下承接錫球者。 請在參閱第-〜六圖所示，當使㈣作時，其係將基 板^、7)置人於植球機⑴機台上的基板送收裝置⑵，以基 板，收裝置⑺之輸送組（21)將基板⑺輸送至工作區 (22)，當基板⑺到達功區⑽時，該助焊裝置⑶即沾 ^滑純移至工作區⑽上方，再將助焊劑沾點 ^ ⑺上’而當助焊裝置⑶在往下沾點助焊劑的同 ，显=植球裝置⑷也往下真空吸引錫球，當助焊劑沾點 =畢=助焊裝置（3)回復至原位，而吸附錫球之植球裝置 i 岐移至功區（22)上方，且在位移的同時， I -置（5)檢測錫球之吸附狀態，若錫球之吸附有空 、專失誤時，其_裝置⑸料知拋雜⑹之動力組 M305961[New content] 爰Yes, this creation department is about a semi-automatic ball-planting machine, which is mainly provided with a substrate feeding device for manually transporting a substrate in the center, and a welding device and a ball-planting device respectively on the left and right sides. The device uses the fluxing device and the ball-planting device to sequentially perform the program of taking the flux and implanting the solder ball on the left and right sides of the substrate; and, between the substrate feeding device and the ball-planting device There is a detecting device capable of detecting the attraction and implantation state of the solder ball, and at the same time, the back end of the substrate feeding device is matched with the detecting device, and a tossing group for receiving the tin ball is provided by the above-mentioned devices. A semi-automatic ball planter that manually transports and receives materials. 'Embodiment】 In order to make the technical content, creative purpose and 1 achievement of this creation more complete and clear, please refer to the details below, and refer to the drawings and drawings: 31 ^ First of all, please refer to the first to second pictures, which is a schematic diagram of the three-dimensional appearance and top view of the automatic ball planter. The 兮+self-edge ball-planting machine (1) has the opportunity to include the substrate receiving device ( 2) The main (4) device (5) and the tossing group (8) in the fluxing and welding department, wherein the device (3), the ball implanting device (4), and the M305961 are provided with a substrate feeding device (2) for manually transporting the substrate (7) in the center of the machine table. The base (4) collects money (2) has a wheel rib (2), which can guide the substrate (7) to the working area (22); and the auxiliary device (3) and the ball placing device (4) are respectively arranged on the left and right sides of the substrate feeding device (2) And the device (3) is interlocked with the ball-planting device (4), and the operation procedure of the welding ball adsorbing the solder ball implanted on the left and right sides of the substrate (7) is performed in the order of the front and the rear; the substrate receiving device (2) Between the ball-planting device (4) and the pre-measuring device (5) '俾 can be used for the ball-planting device (4) (10) Qing and the state of releasing the ball to be the detector; and the back-end detection device (5) of the substrate receiving device (2) is equipped with detection and adsorption, planting people to lose money, and then accepting the loss. The tossing group (8) of the tin ball left by the miscellaneous sequence, the tossing group (8) has a power group (10) and a tossing box (10), and the power box (10) drives the toss box (62) to the ball placement (4) Undertake the solder ball. Please refer to the figure -~6, when the (4) is made, the substrate ^, 7) is placed on the substrate feeding device (2) on the ball machine (1) machine, and the substrate and the receiving device (7) are transported. The group (21) transports the substrate (7) to the working area (22). When the substrate (7) reaches the work area (10), the soldering device (3) is simply moved to the upper side of the working area (10), and the flux is spotted on the (7) 'When the soldering device (3) is dipped in the flux, the ball-balling device (4) also draws the solder ball under the vacuum, and when the flux touches the point = the welding device (3) returns to the original position, The ball-carrying device i of the adsorption solder ball is moved to the top of the work area (22), and at the same time of displacement, I-position (5) detects the adsorption state of the solder ball, and if the adsorption of the solder ball is empty, the special error occurs. Its_device (5) knows that the power of the hybrid (6) is M305961
受動力組（61)的帶動而伸展於植球裝 失誤㈣所祕之錫球，另，若無失誤則 ;:置（4)順而往下進行植入錫球於基板（7)上的程 序，，，之i該植球裝置（4)將錫球釋放植入於基板（？）上之 後/頁回復至原位，而當於回復的過程中該偵測裝置（ 同樣進行仙植球裝置⑷上的鍚球釋放狀態，若植球農 置⑷上的錫球在釋放的過程，沒有被植人基板⑺而黏^ 於植球裝置（4)上時，即偵測裝置（5)會檢測到異狀失誤， 所以，偵測裝置（5)再度通知拋球組之動力組（61)，使 拋球盒（62)受動力組（61)的帶動而伸展，同時令植球裝置 (4)回復至工作區（22)上方，配合拋球盒（62)的伸展及承 接，使殘留之錫球掉落於拋球盒（62)内，爾後，植球裝置 (4)與拋球盒（62)再回復至原位，進行下一個程序的動 作，此時基板（7)以完成植入錫球的程序，而基板（7)則再 藉由基板送收裝置（2)中的輸送組（21)，將基板（7)由工作 區輸送出來，再以人工收料完成基板（7)的製作。 前述之實施例或圖示並非限定本創作之結構樣態或 尺寸，任何所屬技術領域中具有通常知識者之適當變化或 修飾’皆應視為不脫離本創作之專利範_。 經由以上的實施說明，可知本創作之半自動植球機 與現有技術相較之下’於使用上確實具有諸項優點，其詳 述如下： 1·本創作半自動植球機’利用人力配合機械來完成基板植 球的程序，令人力資源可被充分的利用，達到善用資源 不會有人力資源浪費的現象。 M305961 2·本創作半自動植球機，利用助焊裝置及植球裝置分別設 置在基板送收裝置（工作區）之左、右兩侧，使其活動範 圍僅限於於工作區之左右兩側依序來回作動的區域，如 此，使機台之體積相對縮小，也較不佔空間。 3·本創作半自動植球機，利用可移動式之拋球組，前進至 植球裝置下承接殘留之錫球，使其整體機台不會有現有 固定式拋球組所佔空間過大之缺失，且拋球組配合植球 裝置來移動，可縮短運作時間、減短工時。 、 4·本創作半自動植球機，利用以基板送收裝置為中心， 將助焊裝置、植球裝置、偵測裝置及拋球組，分別产2 於周邊，使其整體機台的體積縮小而不佔空間，展、、心 作空間上的靈活運用。 到工 絲上所述，本創作實施例確能達到所預期之 效，又其所揭露之具體構造，不僅未曾見諸於^用功 中’亦，冒公開於巾請前，誠已完全符合專利法，品 要求，羑依法提出新型專利之申請，懇請惠予審見定與 准專利，則實感德便。 〜，並賜 9 M305961 【圖式簡單說明】 第一圖：本創作半自動植球機之立體外觀示意圖 第二圖：本創作之俯視示意圖 第三圖：本創作正視動作示意圖（一） 第四圖：本創作正視動作示意圖（二） 第五圖：本創作正視動作示意圖（三） 第六圖：本創作俯視動作示意圖 【主要元件符號說明】 <本創作> (1) 植球機 (2) 基板送收裝置 (21) 輸送組 (22) 工作區 (3) 助焊裝置 (4) 植球裝置 (5) 偵測裝置 (6) 抛球組 (61) 動力組 (62) 抛球盒 (7) 基板 10Driven by the power group (61) and extended to the ball of the ball (4) secret, if there is no mistake;: (4) smoothly implant the solder ball on the substrate (7) The program, i, the ball placement device (4) releases the solder ball onto the substrate (?) after the / ball is returned to the original position, and during the recovery process the detection device (also performs the fairy ball The spheroid release state on the device (4), if the solder ball on the implant ball (4) is not released by the implanted substrate (7) during the release process, the detecting device (5) The abnormality is detected, so the detecting device (5) again informs the power group (61) of the tossing group, so that the toss box (62) is stretched by the power group (61), and the ball placing device is at the same time (4) Revert to the top of the work area (22), cooperate with the expansion and acceptance of the toss box (62), so that the residual solder ball falls into the toss box (62), and then, the ball placement device (4) and the toss The ball box (62) is returned to the original position, and the next procedure is performed. At this time, the substrate (7) is completed by the process of implanting the solder ball, and the substrate (7) is further loaded and transported by the substrate. The transport group (21) in (2) transports the substrate (7) from the work area, and then completes the fabrication of the substrate (7) by manual receiving. The foregoing embodiment or illustration does not limit the structural form of the creation. Or the size, any appropriate change or modification of the person having ordinary knowledge in the art should be regarded as not departing from the patent model of the present invention. Through the above implementation description, it can be seen that the semi-automatic ball plant of the present invention is compared with the prior art. Underneath, there are indeed advantages in use. The details are as follows: 1. The semi-automatic ball-planting machine of this creation uses the manpower and the machine to complete the procedure of the substrate ball-planting. The powerful resources can be fully utilized to achieve the best use. There is no waste of human resources in resources. M305961 2. The semi-automatic ball-planting machine of this creation is set on the left and right sides of the substrate feeding device (work area) by using the welding device and the ball-planting device respectively to make the range of motion It is limited to the area where the left and right sides of the work area are operated back and forth in order, so that the volume of the machine is relatively smaller and less space is occupied. 3. The semi-automatic ball planting machine of the creation can be utilized. The mobile tossing group advances to the residual ball of the ball under the ball-planting device, so that the overall machine does not have the space occupied by the existing fixed-type tossing group, and the tossing group cooperates with the ball-planting device to move It can shorten the operation time and shorten the working hours. 4. The semi-automatic ball-planting machine of this creation uses the substrate feeding device as the center, and the welding device, the ball-planting device, the detecting device and the tossing group are respectively produced. In the surrounding area, the volume of the whole machine is reduced without occupying space, and the exhibition and the heart are used flexibly in space. As described on the wire, the creation embodiment can achieve the expected effect, and the disclosed The specific structure, not only has not been seen in the use of the work 'also, before the public to the towel, Cheng has fully complied with the patent law, product requirements, 提出 filed a new type of patent application, pleading for the review and quasi-patent, then the real sense Debian. ~, and give 9 M305961 [Simple description of the picture] The first picture: The three-dimensional appearance of the semi-automatic ball-planting machine of the creation of the second picture: the top view of the creation of the third picture: the schematic picture of the creation of the front (1) : This creation is a schematic diagram of the action (2). The fifth picture: the schematic diagram of the action of the creation (3). The sixth picture: the schematic view of the creation of the creation [the main component symbol description] <This creation> (1) Ball planting machine (2 Substrate feeding device (21) Conveying group (22) Working area (3) Welding device (4) Ball ball device (5) Detection device (6) Tossing group (61) Power group (62) Toss box (7) Substrate 10