CN102122606B - Wafer-level package micro-ball automatic collection, supply and circulation equipment - Google Patents
Wafer-level package micro-ball automatic collection, supply and circulation equipment Download PDFInfo
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- CN102122606B CN102122606B CN2010105461773A CN201010546177A CN102122606B CN 102122606 B CN102122606 B CN 102122606B CN 2010105461773 A CN2010105461773 A CN 2010105461773A CN 201010546177 A CN201010546177 A CN 201010546177A CN 102122606 B CN102122606 B CN 102122606B
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Abstract
The invention relates to wafer-level package micro-ball automatic collection, supply and circulation equipment. The mechanism comprises a micro-ball collection device and a micro-ball supply and circulation device, wherein the micro-ball supply and circulation device is arranged on the upper part of the micro-ball collection device, is fixed on a slide block of a Z-direction moving mechanism and can move up and down. Compared with the prior art, micro-balls in a micro-ball supply bottle can fall onto a ball attachment screen plate through a micro-ball supply conduit by controlling a micro-ball dropping steel band; a micro-ball suction mechanism is used for sucking redundant micro-balls which flow out of a ball attachment head during ball attachment; and the redundant micro-balls are sucked into a collection bottle through an air pipe so as to realize automatic cyclic utilization of the micro-balls.
Description
Technical field
The present invention relates to a kind of semiconductor die package equipment, especially relate to a kind of wafer-level packaging microballoon and collect and supply the ball recycle unit automatically.
Background technology
The wafer scale ball attachment machine is a kind of high-end semiconductor die package equipment, is used for microballoon (it is multiple to can be tin ball, copper ball, ping-pong ball and gold goal etc. by material) precisely is placed into the wafer of having smeared scaling powder.One of its core technology is exactly the automatic confession ball of microballoon, collects and the circulatory system of microballoon automatically.The sphere diameter that wafer current level ball attachment machine uses is generally at 70 μ m～300 μ m, and occurred the microballoon of diameter 65 μ m and the trend of further microminiaturization is arranged, and this is to the automatic collection of microballoon and supply ball circulatory system to have higher requirement.
Existing wafer scale plant ball equipment for the automatic supply that realizes microballoon with recycle, adopt vibrating disk to supply ball to add that the tool vacuum inhales the compound mode of ball, vacuum and inhale the ball dish and supply ball to add that the tool vacuum inhales the ball compound mode or directly supply ball to add that residual ball collects compound mode basically.
Supply ball to add tool vacuum suction ball compound mode about vibrating disk; This mode is utilized action of gravity; Microballoon is transported on the vibrating disk absorption that the small vibrations through vibrating disk are evenly distributed on microballoon to supply in the ball container and keep the appropriateness of microballoon to jump and be beneficial to inhale bulb the pin from storage.Make one and be covered with the tool that vacuum is inhaled the hole, it is corresponding one by one that vacuum is inhaled on hole and the wafer circuit salient point.The bulb of planting that this tool is installed passes through the vacuum suction microballoon above vibrating disk, then microballoon is placed into the wafer correspondence position.It is too high that the disadvantage of this mode is exactly the tool manufacturing cost, and particularly 12 cun wafer microballoon quantity are in 1,000,000 ranks, and manufacturing cost is high to be born to being difficult to.Secondly, plant after bulb carries out microballoon absorption, need a plurality of transducers check that to inhaling the ball effect mechanism is complicated, wayward and cost is high.Once more, from practical experience, the mode one-time success rate of this vacuum suction is poor, needs still difficult 100% the success rate that reaches of repeatedly sorption.
Supply ball to add tool vacuum suction ball compound mode about vacuum suction ball dish, supply ball to add that tool vacuum suction ball compound mode is similar with vibrating disk, the bulb of planting of this mode also is equipped with a vacuum suction hole tool corresponding with the wafer circuit salient point, is used for the absorption of microballoon.Difference is; This mode is not to supply ball with vibrating disk; But have the same vacuum hole corresponding with the wafer circuit salient point in the bottom that supplies the ball magazine, through on put the inclination of sweeping ball mechanism or supplying ball magazine itself, microballoon is mobile bottom confession ball magazine to be adsorbed by vacuum hole thereby make.After microballoon adsorbs successfully, plant bulb and come confession ball magazine top again, the position, hole is adsorbed onto microballoon accordingly plants on the bulb.The suction ball success rate of this mode is higher than vibrating disk and supplies ball to add tool vacuum suction ball compound mode, but under the situation of wafer rank microballoon One's name is legion, shortcoming with high costs does not still solve.
Add that about direct confession ball residual ball collects compound mode, this mode is called web plate again and sweeps the ball formula and plant the ball mode.The general cylinder that uses makes the upset of storage pin to realize supplying automatically ball, and microballoon directly drops on the web plate, plants position, the hole correspondence position that bulb is pressed into microballoon wafer through special elastomer.This plantation ball mode need be cleared up or collect the residue ball of planting on the ball after otter board.Collection mode generally has two kinds: one is to use sweeping device will remain ball transfers to the web plate edge, when planting ball next time, reuses; Another kind of mode is to use independent residual ball to remove device, plants after ball finishes residual ball to be collected in the container at wafer to abandon.This mode whole structure is better, but that the residual ball of making is separately removed apparatus structure is complicated and to collect the mode that the residue ball abandons also be a kind of waste and environmental pollution.
Summary of the invention
The object of the invention is exactly to provide a kind of wafer-level packaging microballoon simple in structure, that utilance is high to collect and supply the ball recycle unit automatically for the defective that overcomes above-mentioned prior art existence.
The object of the invention can be realized through following technical scheme:
A kind of wafer-level packaging microballoon is collected automatically and is supplied the ball recycle unit, it is characterized in that, this mechanism comprises the microballoon gathering-device and supply the ball EGR that described confession ball EGR is located at the top of microballoon gathering-device.
Described microballoon gathering-device comprise X to motion, Y to motion, Z to motion, plant net plate and line slideway; Described Y is located at a side of planting the net plate to motion; Described X is erected at Y on motion to motion one end, and the other end is nested on the line slideway, and described line slideway is located at the opposite side of planting the net plate; With Y to the motion level, described Z is located at X to motion top to motion.
Described confession ball EGR is fixed in Z on the slide block of motion, can move up and down.
Described confession ball EGR comprises to be lost with steel band, supply pin, microballoon receiving flask, loses with cylinder, plants ball rotating mechanism, plants bulb, inhales ball mechanism and supplies the ball conduit; Described confession pin is located at the top of device; Described microballoon receiving flask is located at a side that supplies pin, and described losing has two with cylinder, is connected lower left and the lower right that supplies pin through losing with steel band; The described ball rotating mechanism of planting is located at the middle sidepiece of device; Described confession ball catheter tip is connected with supplying pin, the bottom with plant bulb and be connected, described suction ball mechanism is located at the bottom of device.
Described losing with the hole of losing is set on the steel band.
Described microballoon receiving flask is connected through tracheae with suction ball mechanism.
Compared with prior art; The present invention's control is lost and with steel band the microballoon that supplies in the pin planted on the net plate through supplying the ball conduit to fall; Inhaling ball mechanism is used for drawing and plants the ball process and flow out the unnecessary microballoon of planting bulb; Be drawn in the receiving flask through the tracheae microballoon that these are unnecessary, realized the Automatic Cycle utilization of microballoon, specifically comprise following advantage:
(1) this microballoon is collected automatically and is supplied the used mechanism of ball cycling mechanism simple relatively, and cost significantly reduces;
(2) originally planting the ball mode does not need the high-performance detection system in supplying the ball process, compare cost with tool vacuum suction ball mode and significantly reduce;
(3) this mode supplies the ball success rate high, and nothing waste, microballoon recycle, and utilance is high;
(4) the unnecessary ball of this mode is removed and is planted the ball process and carry out, make equipment integral UPH to improve simultaneously.
Description of drawings
Fig. 1 is a plan structure sketch map of the present invention;
Fig. 2 is for supplying the structural representation of ball EGR.
Among the figure 1 for microballoon gathering-device, 11 for planting the net plate, 12 for X to motion, 13 for Y to motion, 14 for Z to motion, 15 for line slideway, 2 be that confession ball conduit, 27 for plant bulb, 28 be suction ball mechanism for microballoon receiving flask, 23 uses steel band, 24 to use cylinder, 25 for losing for losing for planting ball rotating mechanism, 26 for supplying pin, 22 for supplying ball EGR, 21.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the present invention is elaborated.
Embodiment
The ball recycle unit is collected and supplied to a kind of wafer-level packaging microballoon automatically; Its structure is as shown in Figure 1; This mechanism comprises microballoon gathering-device 1 and supplies ball EGR 2, supplies ball EGR 2 to be located at the top of microballoon gathering-device 1, is fixed in Z to the motion machine; On 14 the slide block, can move up and down along Z-direction.
Microballoon gathering-device 1 comprise plant net plate 11, X to motion 12, Y to motion 13, Z to motion 14 and line slideway 15; Y is located at a side of planting net plate 11 to motion 13; X is erected at Y on motion 13 to motion 12 1 ends, and the other end is nested on the line slideway 15, and line slideway 15 is located at the opposite side of planting net plate 11; With Y to motion 13 levels, Z is located at X to motion 12 tops to motion 14.
Supply the structure of ball EGR 2 as shown in Figure 2; Comprise confession pin 21, microballoon receiving flask 22, lose with steel band 23, lose with cylinder 24, plant ball rotating mechanism 25, supply ball conduit 26, plant bulb 27 and inhale ball mechanism 28, supply pin 21 to be located at the top of device, microballoon receiving flask 22 is located at a side that supplies pin 21; Losing has two with cylinder 24; Be connected lower left and the lower right that supplies pin 21 through losing with steel band 23, plant ball rotating mechanism 25 and be located at the middle sidepiece of device, supply ball conduit 26 tops to be connected with supplying pin 21; The bottom with plant bulb 27 and be connected, inhale the bottom that ball mechanism 28 is located at device.
During use, the wafer of in preceding working procedure, having smeared scaling powder via the wafer transport mechanism deliver to plant net plate 11 below, after the vision processing system contraposition, wafer with plant net plate 11 and align and press close to.Planting bulb 27 moves under the drive of motion 14 to motion 13 and Z to motion 12, Y at X and plants ball and carry initial position.To supply pin 21 to install, bottleneck is downward.When needs supply ball, to lose through losing with the action of cylinder 24, making and to align with the spherical cavity of confession pin 21 with the hole of losing of steel band 23, microballoon leaks down smoothly, passes through to fall behind the confession ball conduit 26 and plants on the net plate 11.After supplying ball to accomplish, plant bulb 27 and drop to loading position, and turn at the drive underspin of planting ball rotating mechanism 25.Plant bulb 27 X to motion 12 and Y under the drive of motion 13, according to the path of prior setting microballoon is pressed on the wafer of planting in net plate 11 holes.
Planting when ball carries out, inhale the vacuum of ball mechanism 28 and open simultaneously, absorb and plant the unnecessary ball that from plant bulb 27, flows out in the ball process.Since inhale ball mechanism 28 have tracheae to link to each other with 22 of microballoon receiving flasks and microballoon receiving flask 22 in vacuum action, all be drawn in the microballoon receiving flask 22 so inhale the microballoon of ball mechanism 28 absorptions.The microballoon that is drawn in the microballoon receiving flask 22 has two kinds of processing modes: the one, and microballoon receiving flask 22 is just the same with confession pin 21, can be behind the microballoon receiving flask 22 full balls directly as supplying pin 21; The 2nd, microballoon receiving flask 22 is transformed, therefrom pick out tracheae and link to each other with supplying pin 21, utilize the self gravitation effect of microballoon to add the air valve adjusting, make the microballoon in the receiving flask 22 flow into confession pin 21 automatically, realize supplying the fully automatic operation of ball.
Claims (5)
1. a wafer-level packaging microballoon is collected and confession ball recycle unit automatically, it is characterized in that this equipment comprises the microballoon gathering-device and supply the ball EGR that described confession ball EGR is located at the top of microballoon gathering-device;
Described confession ball EGR comprises to be lost with steel band, supply pin, microballoon receiving flask, loses with cylinder, plants ball rotating mechanism, plants bulb, inhales ball mechanism and supplies the ball conduit; Described confession pin is located at the top of device; Described microballoon receiving flask is located at a side that supplies pin, and described losing has two with cylinder, is connected lower left and the lower right that supplies pin through losing with steel band; The described ball rotating mechanism of planting is located at the middle sidepiece of device; Described confession ball catheter tip is connected with supplying pin, the bottom with plant bulb and be connected, described suction ball mechanism is located at the bottom of device.
2. the ball recycle unit is collected and supplied to a kind of wafer-level packaging microballoon according to claim 1 automatically; It is characterized in that; Described microballoon gathering-device comprise X to motion, Y to motion, Z to motion, plant net plate and line slideway, described Y is located at a side of planting the net plate to motion, described X is erected at Y on motion to motion one end; The other end is nested on the line slideway; Described line slideway is located at the opposite side of planting the net plate, with Y to the motion level, described Z is located at X to motion top to motion.
3. a kind of wafer-level packaging microballoon according to claim 1 is collected automatically and is supplied the ball recycle unit, it is characterized in that described confession ball EGR is fixed in Z on the slide block of motion, can move up and down.
4. a kind of wafer-level packaging microballoon according to claim 1 is collected automatically and is supplied the ball recycle unit, it is characterized in that, described losing with the hole of losing is set on the steel band.
5. a kind of wafer-level packaging microballoon according to claim 1 is collected automatically and is supplied the ball recycle unit, it is characterized in that, described microballoon receiving flask is connected through tracheae with suction ball mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105461773A CN102122606B (en) | 2010-11-16 | 2010-11-16 | Wafer-level package micro-ball automatic collection, supply and circulation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105461773A CN102122606B (en) | 2010-11-16 | 2010-11-16 | Wafer-level package micro-ball automatic collection, supply and circulation equipment |
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| CN102122606A CN102122606A (en) | 2011-07-13 |
| CN102122606B true CN102122606B (en) | 2012-07-18 |
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| CN2010105461773A Active CN102122606B (en) | 2010-11-16 | 2010-11-16 | Wafer-level package micro-ball automatic collection, supply and circulation equipment |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311137B (en) * | 2012-03-06 | 2015-10-28 | 上海微松工业自动化有限公司 | A kind of superchip packaging solder ball location auto supply equipment |
| CN104576415A (en) * | 2013-10-09 | 2015-04-29 | 上海微松工业自动化有限公司 | Bumping device with ball grid array structure |
| CN103871915B (en) * | 2014-03-24 | 2016-08-17 | 上海微松工业自动化有限公司 | Manually BGA ball attachment machine |
| CN105609435A (en) * | 2015-12-25 | 2016-05-25 | 南通富士通微电子股份有限公司 | Ball supply mechanism for bumping equipment |
| CN106112182B (en) * | 2016-07-12 | 2018-09-04 | 上海微松工业自动化有限公司 | A kind of full-automatic ball attachment device and its application |
| CN117423649B (en) * | 2023-12-19 | 2024-02-23 | 江苏中科智芯集成科技有限公司 | Chip packaging full-automatic ball planting machine and ball planting method thereof |
Citations (5)
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|---|---|---|---|---|
| JP2000040709A (en) * | 1998-07-23 | 2000-02-08 | Matsushita Electric Ind Co Ltd | Shifting device and method of conductive ball |
| CN1615542A (en) * | 2002-01-10 | 2005-05-11 | 日本电气株式会社 | Method of arranging micro spheres with liquid, micro sphere arranging device, and semiconductor device |
| CN1703295A (en) * | 2002-10-14 | 2005-11-30 | 奥利进科技有限公司 | An apparatus and method for filling a ball grid array template |
| CN201229934Y (en) * | 2008-06-13 | 2009-04-29 | 重庆群崴电子材料有限公司 | Metal microsphere material dropping apparatus |
| JP2010192796A (en) * | 2009-02-20 | 2010-09-02 | Ngk Spark Plug Co Ltd | Solder ball removing device, and method of manufacturing wiring board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3724003B2 (en) * | 1995-03-06 | 2005-12-07 | セイコーエプソン株式会社 | Solder ball mounting device and solder ball supply device |
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2010
- 2010-11-16 CN CN2010105461773A patent/CN102122606B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000040709A (en) * | 1998-07-23 | 2000-02-08 | Matsushita Electric Ind Co Ltd | Shifting device and method of conductive ball |
| CN1615542A (en) * | 2002-01-10 | 2005-05-11 | 日本电气株式会社 | Method of arranging micro spheres with liquid, micro sphere arranging device, and semiconductor device |
| CN1703295A (en) * | 2002-10-14 | 2005-11-30 | 奥利进科技有限公司 | An apparatus and method for filling a ball grid array template |
| CN201229934Y (en) * | 2008-06-13 | 2009-04-29 | 重庆群崴电子材料有限公司 | Metal microsphere material dropping apparatus |
| JP2010192796A (en) * | 2009-02-20 | 2010-09-02 | Ngk Spark Plug Co Ltd | Solder ball removing device, and method of manufacturing wiring board |
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| CN102122606A (en) | 2011-07-13 |
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