M305543 八、新型說明： 【新型所屬之技術領域】 本新型係有關於-種物件與電路板之焊接部結構，尤指一種 於物件之焊接部周圍，環繞地凹設有凹溝，使電路板上的焊料， 、、”皿雜後’除正常介置於物件焊接部與電路板間外，多餘的 融化焊料，則可藉由利轉料的社表面張力現象而逸入並集留 於該凹溝中，凡全防止多餘的焊料漫溢至電路板的其它印刷電路 | 上，以避免不良品的產生。 【先前技術】 目刖電路板上所焊接的物件，其焊接方式係如第七圖所示， 係於電路板⑽之預設焊接點⑵）上，預先突上一層錫膏等焊料 (曰30) ’再將所要焊接的物件⑽令其焊接部⑻清正的跨置於該 知料(30)上’而後再將物件⑽)連同電路板(2〇)一併送入高溫 中加熱’使焊料⑽融化，而緊固焊接該物件⑽)與電路板⑽/ ►而呈第八圖所示狀態；然而上述習知的物件⑽與電路板⑽）的 焊接結射，由於該物件⑽是以平整的焊接部⑽跨置於焊料 (30)上’當焊料⑽高溫融解後，因重力作用，將使物件⑽)盘 電路板⑽相對漏融化之焊料(3〇)，此時融化呈液態狀之谭料 (30)便經常由物件⑽與電路板⑽間之空隙向外竄流，而此多 餘的融化焊料⑽a)，如第八圖所示，便經常沾附於電路板⑽的 其它印刷電路上，而造成短路，導致電路板⑽的不良率提升， 而增加製造成本。 M305543 卜：件⑽與電路板⑽谭接時，大相對擠麗之禪料 里不被限制的向四周擴散，使物件⑽預 =電路_彻輸⑻附侧__ Γ穩固地焊接該物件(6G)及電路板⑽，而顯有改_必 乃加予研究創新，終於揭示出一種物 本案創作人有鑑於此， 件與電路板之焊接部結構。 【新型内容】 本新里之創作目的旨在提供一種物件與電路板之焊接部姓 構’係在物件的焊接部周圍，環設有—凹溝，如是當物件的料 部跨置於電路板之預設對應焊接點之焊料上，並—併通過高溫的 知爐時’㉔化的焊料除了正常介置於該物件之焊接部與電路板之 對應焊接關之外，多餘的融化焊料，則可因焊料的強大表面張 力現象而逸人物件位於焊接部棚之凹溝巾並完全予以集留，從 而兀全防止液綠之焊料向外漫溢至電路板其它之印刷電路處， 元全避免造成電路板短路的問題者。 本新型之可取實體’可以由以下之說明及_各圖式得以明 晰之。 【實施方式】 請參閱第一至三圖所示，本新型係有關於一種物件與電路板 之焊接部結構，係在物件（10)的焊接部G1)周圍，環設有凹溝 (12)，如是當物件（1〇)的焊接部（11)跨置於電路板(2〇)之預設對 M305543 應焊接點（21)之焊料（30)〔如錫膏〕上，並一併通過一高溫區 時’此時，融化的焊料（3〇)除了正常地介於該物件（丨〇)之焊接部 (11)與電路板(20)之對應焊接點（21)間，使物件（1〇)緊固地焊接 於該電路板(20)之外，多餘的融化焊料(30a)便可藉由焊料(3〇)的 強大表面張力現象而自動向上逸入物件（1〇)位於焊接部（11)周圍 之凹溝（12)中，並且完全予以集留，從而完全防止液態狀之焊料 (30)向外漫溢至電路板(2〇)其它之印刷電路之各處，而沾附於電 路板(20)之其它印刷電路處，避免造成電路板(2〇)短路的惱人問 題者。 如第六圖所示，本新型所揭示之物件（1〇)，係指如以扣接電 子卡之固定接地構件或其它物件，本新型並不自限該物件（1〇)之 種類者。 如第四圖所示，本新型所揭示物件與電路板之焊接部結構， 其中於該物件（10)之焊接部（11)上，進一步穿設有穿孔（111)，如 是於焊接的過程中，多餘的融化焊料(30a)，便可以藉由焊料的強 大表面張力作用而集留於該穿孔（111)之周緣及位於焊接部（11) 外圍之凹溝（12)周緣，除可以有效抑制高溫融化之焊料流向，並 避免附著於電路板(20)之其它印刷電路外。當焊料(3〇)冷卻硬化 後’也可以更加緊緊地包纽所焊接的物件⑽），進而增加焊接 的接著力，而顯本新型之新穎性及實用性。 如第五圖所示，本新型所揭示物件與電路板之焊接部結構， 其中於該物件⑽之焊接部⑻周圍所職的凹溝⑽，於該凹 M305543 »(12)之姆崎個’進—步連伸有錄肋桿(12ι)，以增進物 件⑽於該處之機械強度’避免於焊接過財造成物件⑽的彎 曲變型者。 本新型所揭示物件與電路板之焊接部結構，其中該環繞於焊 接部（11)周圍之凹溝⑽，係可呈矩形或_，本新型並不自限 其形狀者。 本新型所揭示物件與電路板之焊接部結構，其結構特徵乃在 ❿於該物件⑽之焊接部⑻顯，環設有凹溝⑽，使在與電路 板(20)焊接過程中’除了正常介置於該物件⑽之焊接部⑴）與 電路板⑽之對應焊接點⑻間，以便用來焊接物件⑽與電路 板(20)的正相量之外’多餘的融化焊料⑽⑴可以藉由焊料⑽ 的強大表面張力作用，完全集留於該凹溝⑽所框圍之區域中， 以有效阻止高溫呈液態狀之焊料⑽由物件⑽與電路板⑽間 的空隙，向外漫溢或流竄而意外地附著於電路板⑽之其它印刷 鲁電路上’避免造成電路板⑽短料問題，以有效防止不良品的 產生’以降低本新型之製造成本並提升其品質。另外，本新型由 於可使焊料⑽在高溫融化過財，被關於凹溝⑽之區域範 圍内’元全不向四周擴散，因此可以有效確保物件⑽與電路板 ⑽間之烊料⑽厚度，峰_將物件⑽焊胁電路板⑽ 之目的，而顯本新型之新穎性與實用性。 至於凹溝（12)與穿孔（111)之容納體積的大小，係根據焊料 (30)的注料量事先設計好凹溝⑽射孔⑴1)的體積均足 8 M305543 夠全谷納多餘的融化焊料(30)的溢料量，所以焊料（30)的溢料 問題能夠獲得完全的解決。 本新型所揭示之結構、形狀，可於不違本新型之精神及範疇 下，予以修飾應用，本新型並不予自限。 【圖式簡單說明】 第一圖：係本新型所示物件與電路板之立體示意圖。 第二圖：係顯示本新型所示物件跨置於電路板預設焊料上之示意 圖。 第三圖：麵示本新型所示物件與電路板通過高溫區，並完成焊 接後之示意圖。 第四圖·係顯示本新型第二實施例示意圖。 第五圖：係顯示本新型第三實施例示意圖。 第六圖：係顯示本新型應用於電子卡固定接地構件上之示意圖。 第七圖：係顯示習知物件與電路板焊接前之示意圖。 第八圖·係顯示第七圖所示習知物件與電路板於完成焊接後之示 意圖。 【主要元件符號說明】 (111)穿孔 (20)電路板 (30a)多餘的融化焊料 (10)物件 （11)焊接部 (12)凹溝 （121)肋桿 (21)焊接點 （30)焊料 (60)物件 （61)焊接部M305543 VIII. New description: [New technical field] The new type relates to the structure of the welded part of the object and the circuit board, especially to the surrounding of the welded part of the object, and the groove is provided around the recess to make the circuit board After the solder, the "after the dish" is normally placed between the soldered portion of the object and the circuit board, the excess molten solder can escape and collect in the concave by the surface tension phenomenon of the material. In the trench, all the excess solder is prevented from overflowing onto other printed circuits on the board to avoid the generation of defective products. [Prior Art] The objects welded on the board are soldered in the same way as in the seventh figure. It is shown on the pre-set soldering point (2) of the circuit board (10), and a solder (such as 30) is soldered in advance. Then the object to be soldered (10) is placed on the soldering part (8). 30) above and then the object (10) together with the circuit board (2〇) is sent to the high temperature to heat 'make the solder (10) melt, and the object (10) is fastened and welded) and the circuit board (10) / ► and the eighth figure State; however, the above-mentioned conventional object (10) and electricity The soldering of the board (10) is due to the fact that the object (10) is placed on the solder (30) with a flat soldering portion (10). When the solder (10) is melted at a high temperature, the object (10) is shielded by the gravity of the object (10). The molten solder (3〇), at which point the melted liquid material (30) is often turbulent outwardly from the gap between the object (10) and the circuit board (10), and the excess molten solder (10) a), such as the eighth As shown in the figure, it is often attached to other printed circuits of the circuit board (10), causing a short circuit, which leads to an increase in the defective rate of the circuit board (10) and an increase in manufacturing cost. M305543: When the component (10) is connected to the circuit board (10), it is large. The squeezing of the zen material is unrestricted and spreads around, so that the object (10) pre-circuit _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Adding research and innovation, I finally revealed that the creator of this article has the structure of the welded part of the board and the board. [New content] The purpose of this new creation is to provide a welding name of the object and the circuit board. Attached around the welded part of the object, the ring is provided with a groove For example, when the material portion of the object is placed on the solder of the preset corresponding solder joint of the circuit board, and the high-temperature furnace is used, the solder of the '24' is not only normally corresponding to the soldering portion of the object and the circuit board. In addition to the soldering off, the excess molten solder can be placed in the groove of the soldering chamber due to the strong surface tension of the solder and is completely collected, thereby preventing the liquid green solder from overflowing to the circuit. At the other printed circuit boards of the board, the problem of short circuit of the circuit board is avoided. The preferred entity of the present invention can be clarified by the following descriptions and the following figures. [Embodiment] Please refer to the first to third figures. The present invention relates to a welded portion structure of an object and a circuit board, which is disposed around the welded portion G1) of the object (10), and is provided with a groove (12), such as a welded portion of the object (1). 11) Between the presets on the board (2〇), the solder (30) solder (30) (such as solder paste) should be soldered to the M305543, and when passing through a high temperature zone, 'melting solder at this time' 3〇) except that it is normally between the object (丨Between the soldering portion (11) and the corresponding soldering point (21) of the circuit board (20), the object (1) is securely soldered to the outside of the circuit board (20), and the excess molten solder (30a) is The object (1〇) can be automatically slid upward by the strong surface tension phenomenon of the solder (3〇) in the groove (12) around the welded portion (11), and is completely collected, thereby completely preventing the liquid state. The solder (30) overflows to the periphery of the printed circuit board (2〇) and other printed circuits, and is attached to other printed circuits of the circuit board (20) to avoid annoying problems caused by short circuit of the circuit board (2〇). . As shown in the sixth figure, the object (1〇) disclosed in the present invention refers to a fixed grounding member or other object for fastening an electronic card, and the present invention does not limit the type of the object (1〇). As shown in the fourth figure, the welded portion structure of the object and the circuit board disclosed in the present invention, wherein the welding portion (11) of the object (10) is further provided with a through hole (111), as in the process of welding. The excess molten solder (30a) can be accumulated on the periphery of the perforation (111) and the periphery of the groove (12) on the periphery of the welded portion (11) by the strong surface tension of the solder, which can effectively suppress The high temperature melted solder flows and avoids adhesion to other printed circuits on the board (20). When the solder (3〇) is cooled and hardened, the object (10) to be welded can be tightly packed, thereby increasing the bonding force of the solder, and the novelty and practicability of the novel. As shown in the fifth figure, the welded portion structure of the object and the circuit board disclosed in the present invention, wherein a groove (10) is disposed around the welded portion (8) of the object (10), and the M305543 of the concave M305543 (12) The step-and-step extension has a rib (12 ι) to enhance the mechanical strength of the object (10) to avoid bending deformation of the object (10) caused by welding. The welded structure of the object and the circuit board disclosed in the present invention, wherein the groove (10) surrounding the welded portion (11) can be rectangular or _, and the present invention does not limit its shape. The structure of the welded portion of the object and the circuit board disclosed in the present invention is characterized in that the welded portion (8) of the object (10) is displayed, and the ring is provided with a groove (10) so that during the welding process with the circuit board (20), except for normal Between the soldering portion (1) of the object (10) and the corresponding soldering point (8) of the circuit board (10), in order to solder the object (10) and the positive phasor of the circuit board (20), the excess molten solder (10) (1) can be soldered The strong surface tension of (10) is completely trapped in the area enclosed by the groove (10) to effectively prevent the high temperature liquid-like solder (10) from being overflowed or flowing out of the gap between the object (10) and the circuit board (10). It is attached to other printed circuit boards of the circuit board (10) to avoid causing short circuit problems of the circuit board (10) to effectively prevent the occurrence of defective products to reduce the manufacturing cost and improve the quality of the present invention. In addition, since the present invention can melt the solder (10) at a high temperature, it is not diffused to the periphery in the region of the groove (10), so that the thickness (10) of the material (10) between the object (10) and the circuit board (10) can be effectively ensured. _ The purpose of the object (10) soldering the circuit board (10), and the novelty and practicality of the novel. As for the size of the receiving volume of the groove (12) and the perforation (111), the groove (10) perforation (1) 1) is designed in advance according to the amount of the solder (30). The volume of the perforation is sufficient. 8 M305543 The amount of flash (30) is exceeded, so the problem of solder (30) flash can be completely solved. The structure and shape disclosed in the present invention can be modified and applied without departing from the spirit and scope of the novel, and the present invention is not limited. [Simple description of the diagram] The first picture: is a three-dimensional diagram of the object and circuit board shown in the present invention. The second figure shows a schematic view of the object shown in the present invention placed on a predetermined solder of a circuit board. The third figure shows the schematic diagram of the object and the circuit board of the present invention passing through the high temperature zone and after welding. The fourth figure shows a schematic view of the second embodiment of the present invention. Fig. 5 is a view showing a third embodiment of the present invention. Figure 6 is a schematic view showing the application of the present invention to an electronic card fixed grounding member. Figure 7: shows a schematic diagram of a conventional object and a circuit board before soldering. The eighth figure shows the intention of the conventional object and the circuit board shown in the seventh figure after the welding is completed. [Main component symbol description] (111) Perforation (20) Circuit board (30a) Excess melted solder (10) Object (11) Weld portion (12) Groove (121) Rib (21) Solder joint (30) Solder (60) Object (61) Welded part