M283496 . 八、新型說明： 【新型所屬之技術領域】 本創作係涉及一種c P U散熱器之包裝防護結構，特別是指一種塑膠薄殼 型態且設有組接腳架套組部可快速達成組合定位狀態之創新C p u散熱 器包裝護蓋型態設計者。 【先前技術】 • 按’本創作所針對之cpu散熱器，其一端面係組設有一導熱片以 供貼觸於電腦之CPU面上產生導熱作用，且相同於該導熱片之該端具 有朝相對兩側凸伸之組接腳架以供組裝固定於電腦之電路板上，而c pu散熱器之另端則組設有散熱鰭片；其中須特別說明的是，該所述導 熱片由於最終必須能與c PU表面達成全面性平貼配合狀態，以達最佳熱 傳導效益，因此該CPU散熱器在製造成型之後以至組裝於〇?1;過程中， 業者必須確保該導熱片組接面的完整光滑性，縱有些許的刮痕產生， 聲都將造成或多或少的負面影響，因此必須賦予一些防護措施；而有關 1知作法，通常是取用一些板材（如紙板）覆蓋於該CPU散熱器之導 熱片上’復藉由膠帶或膠劑黏貼方式使所述板材達成定位；惟，此種 方式在實際施作過程中發現仍存在作業緩慢而欠缺效率之問題點，如 此在大量組裝的情形下更突顯此一問題的嚴重性，而且，該所述膠帶 或膠劑黏點部位亦將對CPU散熱器表面造成瑕疵狀態，進而影響產品之品 質，實並不符合較佳之產業利用性者。 M283496 疋故，針對上述習知cpu散熱器之包裝防護結構所存在之 何開^種更具組配上更具效率、更符合較佳產業利用性之創料 構’實有待相關業者再加以努力研發突破之目標及方向。 有鑑於此，創作人本於多年從事相關產品之製造開發與設計經 驗，針對上34之目標，詳力㉝計與審慎評倾，終得—確具實用性 本創作。 'M283496. 8. Description of the new type: [Technical field to which the new type belongs] This creation relates to a packaging protective structure for c PU radiators, especially a plastic thin shell type with a set of tripods, which can be quickly reached. Innovative C pu radiator package cover designer in combination positioning state. [Previous technology] • According to the CPU of this creation, one end surface is provided with a heat conductive sheet for contacting the CPU surface of the computer to generate heat conduction. The pair of protruding pins on the opposite sides are used for assembling and fixing on the circuit board of the computer, and the other end of the CPU heat sink is provided with heat dissipation fins; among them, it should be particularly noted that the heat conducting fins are It must be able to achieve a comprehensive flat-fitting state with the c PU surface to achieve the best heat conduction benefits. Therefore, after the CPU heat sink is manufactured and assembled, it must be assembled at 0? 1; in the process, the industry must ensure that Complete smoothness, even if there are some scratches, the sound will cause more or less negative effects, so some protective measures must be given; and the related method is usually to use some plates (such as cardboard) to cover the On the heat sink of the CPU heat sink, the board is positioned by using adhesive tape or adhesive. However, in this method, it is found that there is still a problem of slow operation and lack of efficiency in the actual application process. In this way, the seriousness of this problem is more prominent in the case of a large number of assemblies. Moreover, the adhesive tape or the adhesive point portion will also cause a defect state on the surface of the CPU heat sink, and then affect the quality of the product, which does not meet the requirements. Better industrial utilization. M283496 For the above reasons, the development of the packaging protection structure of the conventional cpu radiators mentioned above is more and more efficient, and it is more in line with the better industrial availability of the construction materials' requires the relevant industry's further efforts R & D breakthrough goals and directions. In view of this, the creators have been engaged in the manufacturing development and design experience of related products for many years. According to the goal of the above 34, careful planning and careful evaluation, in the end, it is indeed practical. '
【新型内容】 即，本創作之主要目的，係在提供—種C PU散絲之咖蓋結構其 所欲解決之_，係_知c p U散熱器設有導熱片之—端其包裳㈣ 結構仍存在組配定位上欠缺效率、不符合較佳產業利用性之問題點加 以改良突破；其_題之技術特點，係使該CPU散熱器之包裝護蓋為 塑膠製成之賴構造（-般稱之為細，該_蓋巾央具__库遮 蓋於CPU應之導D纖之嶋成财套框部或套组部 恰可套科CPU散絲之外周或組接架的螺接腳柱上，藉此而能使該 包裝護羞直接達成定位；藉此創新獨特設計，俾可使該包賴蓋達職造簡單、 組農定位更加方财效率讀佳產性及㈣進步性者。 本創作之P目的，«嫩繼之各套㈣_設成具傾斜角度 之結構設計，以使多組包裝護蓋可相互錯置堆疊，達到縮減堆放空間之優點者。 本創作之又-目的，更齡該找護蓋之套框部絲㈣形成有卡緣 之結構設計，藉以卡合於C P U散熱器所對應設置的輕部，令包裝護蓋達 成定位效果者。 6 M283496 i - * 【實施方式】 為使貴審查委員對本創作之目的、特徵及功效能夠有更進一步之瞭解與 認識，茲請配合【圖式簡單說明】詳述如后： 首先，請配合參閱第工、2、3圖所示，係本創作cpu散熱器之 包裝護蓋結構之較佳實施例，該所述c Pu散熱器（丄〇 )，其一端係設具 有一導熱面（1 〇 1 )，另端則組設有散熱鰭片（丄〇 2 );所述之包 裝護蓋（2 0 )為一塑膠薄殼構造，該包裝護蓋（2 〇 )中央具有一覆蓋面 泰（2 0 1 )可對應遮蓋於CPU散熱器（丄〇 )之導熱面（丄〇丄）上， 包裝濩蓋（2 0 )之周邊一體成型有套框部（2 〇 2)恰可套罩於cpxj 散熱器（1 〇 )之外周，使包裝護蓋達成組合狀態者。 其中，該包裝護蓋（2 0 )之覆蓋面（2 0 1 )係可設為一平整面型式（如 第1〜3圖所示）、或是如第4圖所示之覆蓋面（2 0 3 )，係設成一高凸面型 式，藉以因應C P U散熱器（1 〇 )之導熱面（1 〇 1 )上增設有導熱膏 (1 0 4)時之狀態者。 • 甘士 其中，該所述套框部（2 0 2 )内側預定部位更可一體形成有内 凸狀之卡緣（2 0 4 )，以使C P U散熱器（1 〇 )之周壁對應設有定位部 (1 0 5 )(本實施施例係為一肩部型態），俾可利用前述卡緣（2 〇 4 )卡合於該定位部（1 〇 5 )而能促使包裝護蓋（2 0 )達成定位效果， 不致輕易鬆脫者。 復如第5、6、7圖所示，係本創作CPU散熱器之包裝護蓋結構之 •M283496 "C » 另一較佳實施例，該所述CPU散熱器Cl 〇B)，其一端面係組設有一 導熱片（1 1 )以供貼觸於電腦之CPU面上產生導熱作用，相同於該導 熱片（1 1 )之該端具有朝相對兩侧凸伸之組接架（1 2 )，各組接架具 有朝同方向凸伸的螺接腳柱（1 3 )以供鎖組固定於電腦之電路板上， C PU散熱器（1 〇 B )之另端則組設有散熱鰭片（1 4 )以及導電線（工 5);另所述之包裝護蓋（2 0 B)係為一塑膠製成之薄殼構造（一般稱之為 泡殼）’該包裝護蓋（2 0 B )中央具有一覆蓋面（2 1 )可對應遮蓋於前述c 馨PU散熱器（1 〇B)之導熱片（1 1 )上，包裝護蓋（2 〇B)之各邊角 處一體成型有套組部（2 2 )恰可分別套罩於C PU散熱器（1 〇 b )之 組接架（1 2 )的各螺接腳柱（1 3 )，藉此而能使該包裝護蓋（2 〇 β ) 直接達成定位效果者。 其中，如第5、7圖所示，該包裝護蓋（2 〇 )之覆蓋面（2丄b ) 部位可為—平整面型式，此-型錢計則是當CPU散熱器d 〇)之導熱片 (1 1 )上未增設有突出物而呈平整面狀態時，得藉由該平整面型式之 覆蓋面（2 lb)直接遮蓋於該導熱片（11)表面者。 八中如第10圖所示，該包裝護蓋（2 〇 )之覆蓋面（2丄）部位 亦可為-南凸面型式，此_型式設計係#cpu散熱器（i⑴之導熱片（丄 1)上增設有導㈣（丨Q4)而產生厚度上的凸料，得藉由該高凸 面里式之覆蓋面（2 1 )而麵猶之目的者。 ，、中該包農護i ( 2 〇 B )之周邊更可設有往下曲折之圍邊（2 3 )， D亥圍邊可於包裝護蓋（2 Q B)組合於C p U散熱器（i Q B)時，包靠於c 8 M283496 P U散熱器（1 Q B )之邊域達成辅助限位穩定效果者。 其中，如第6圖所示，該包裝護蓋（2〇B)各套組部（22)之周 壁（ 2 2 0 )更可設成底端具向外傾斜角度（χ)之結構型態，以使多 組包裝護蓋（2 0 Β )堆疊時可相互錯置堆疊（如第工工圖所示），達到縮減 堆放空間之優點者。 其中，請參第5、7圖所示，該包裝護蓋（2〇Β)之套組部（2 2 )之周i (220)更可形成有向内凸出之卡緣（2 2 1 )部位，藉 瞜以當包裝護蓋（2 0 B )組合於C p u散熱器時（請對照第工2、i 3圖所示）， 得藉由所述卡緣（22 D卡合於組接架（12)端部而令該包裝護蓋（2 0 B)達成定位效果者。 藉由上述之結構、組成，本創作所揭之包裝護蓋（2 0 B )於實際應 用上更可配合一包裝盒體使用，以構組成一完整的CPU散熱器包裝結構體， 此备1參第8、9圖所示，係可將c p U散熱器（1 〇 B )置入預定包裝盒體（3 0)所設容置槽（31)中之後，再將該包裝護蓋（2 〇 B)組合於C P U散 熱$ ( 1 0 B )之各螺接腳柱（1 3 )，藉此即可達到保護其導熱片（1 1 ) 之巨的者。 【功效說明】 本創作主要藉由該C PU散熱器之包裝護蓋（2 0 )( 2 0 B )設為塑膠 薄殼構造，且其中央具有覆蓋面（2 1)、周邊處成型有套框部（2 M283496 〇 2)或套組部彳 螺接腳枝（i 3)之舍，口於C P U散熱器（丄〇)外周或各 古 創新獨特設計，進而能使該包裝護蓋（2(n 直接達成定位狀態，達到制㈣單《壯 隻现（20) 業利用性及實用進步性者 定位更加方便有效率之較佳產 2 3 =:更藉由該包裝護蓋(20B)之各套組部(22)周壁(2 又具傾斜角度之結構設計，以使多組包裝護蓋可相互錯置堆 金，達到縮減堆放空間之優點者。 又’本創作包裝護蓋（2〇)(? ' 、 〇)(2〇B)之套框部（ 2 0 2 )或套組 —、# $成有卡緣（2 Q 4 )或（2 2 1 )部位之結構設計， 稭以备包裝護蓋（2 Q)組合於c p u散熱器時得藉由所述卡緣（2 2 卡口於組接& (12)端部而令該包裝護蓋⑽）達成快速又 兼具穩固性之定位效果者。[New content] That is, the main purpose of this creation is to provide a kind of C PU loose silk coffee cover structure which it wants to solve. The structure still has problems of lack of efficiency in assembly and positioning, and does not meet the requirements of better industrial availability. The technical characteristics of the problem are that the packaging cover of the CPU radiator is made of plastic (- Generally called thin, the _ cover towel and central gear __ library is covered by the CPU, the D fiber, and the jacket. The sleeve or the sleeve of the sleeve can be set on the outer periphery of the CPU loose wire or the screw connection of the assembly frame. This will allow the packaging to achieve a direct positioning of the shampoo; this innovative and unique design will make the job of Gaida simple, and the positioning of the farmer will be more cost-effective. The purpose of the P of this creation, «Nen Jizhi's each set of __ is structured with an inclined angle, so that multiple sets of packaging covers can be stacked with each other to achieve the advantages of reducing the storage space. -Purpose, the frame design of the cover frame of the cover should be formed with a card edge structure for the card The light part corresponding to the CPU radiator is used to make the packaging cover achieve the positioning effect. 6 M283496 i-* [Embodiment] In order for your review committee to have a better understanding and understanding of the purpose, characteristics and effects of this creation Please refer to the detailed description of the drawings as follows: First, please refer to the first, second and third figures, which are the preferred embodiments of the packaging cover structure of the cpu radiator of this creation, which c Pu radiator (丄 〇), one end of which is provided with a heat conducting surface (101), and the other end is provided with a heat dissipation fin (丄 〇2); the packaging cover (20) is a With a thin plastic shell structure, the packaging cover (20) has a covering surface (2 0 1) in the center, which can be correspondingly covered on the heat-conducting surface (20) of the CPU heat sink (20), and the packaging cover (20) ) Is integrally formed with a casing frame portion (202), which can cover the outer periphery of the cpxj radiator (10), so that the packaging cover can achieve a combined state. Among them, the covering surface of the packaging cover (20) (2 0 1) can be set to a flat surface type (as shown in Figures 1 to 3), or as shown in Figure 4 The covering surface (203) shown is a high-convex type, so as to correspond to the state when a thermal conductive paste (104) is added to the thermal conductive surface (100) of the CPU heat sink (104). • Ganz, among which, a predetermined position inside the frame portion (202) can be integrally formed with a convex edge (204), so that the peripheral wall of the CPU heat sink (10) is correspondingly provided. The positioning portion (105) (this embodiment is a shoulder type). The aforementioned card edge (204) can be used to engage the positioning portion (105) to promote the packaging cover ( 20) Those who achieve positioning effect and do not easily loosen. As shown in Figures 5, 6, and 7, it is the M283496 " C »of the packaging cover structure of the CPU cooler of this original creation. Another preferred embodiment, the CPU cooler Cl 〇B), one The end surface group is provided with a thermally conductive sheet (1 1) for contacting the CPU surface of the computer to generate heat conduction. The end is the same as the thermally conductive sheet (1 1) and has an assembly frame (1 2) protruding toward opposite sides. ), Each group of brackets has screw pins (1 3) protruding in the same direction for the lock group to be fixed on the circuit board of the computer, and the other end of the C PU radiator (10 〇B) is provided with heat dissipation. Fins (1 4) and conductive wires (work 5); the other packaging cover (2 0 B) is a thin shell structure made of plastic (commonly referred to as blister) 'the packaging cover ( 2 0 B) has a covering surface (2 1) in the center which can be correspondingly covered on the heat-conducting sheet (1 1) of the aforementioned c Xin PU radiator (1 0B), and the corners of the packaging cover (2 0B) are integrated The set part (2 2) is formed and can be sheathed respectively on each screw pin (1 3) of the set stand (1 2) of the CPU radiator (10b), so that the packaging can be made. Cover (2 〇β) directly reached Effector. Among them, as shown in Figures 5 and 7, the covering surface (2 丄 b) of the packaging cover (20) may be a flat surface type, and this type of money meter is when the CPU heat sink d) is thermally conductive. When the sheet (1 1) has a flat surface without adding protrusions, it is necessary to cover the surface of the heat conductive sheet (11) directly with the flat surface type covering surface (2 lb). As shown in Figure 10 of the Eighth Middle School, the covering surface (2 丄) of the packaging cover (20) can also be a -south convex type. This _type design is #cpu radiator (i⑴ 的 热热 片 (丄 1) A guide 丨 (丨 Q4) is added on the top to produce a convex material in thickness, which can be used for the purpose of facing the surface through the high convex surface (2 1). ， 中 中 包 农 护 i (2 〇B The periphery of) can be provided with a zigzag perimeter (2 3). The Dhai perimeter can be combined with the C p U radiator (i QB) in the packaging cover (2 QB), and it can rest on c 8 M283496. Those whose PU radiator (1 QB) achieves the effect of auxiliary limit stabilization. Among them, as shown in FIG. 6, the peripheral wall (2 2 0) of each set (22) of the packaging cover (20B). It can also be set to a structure with an outwardly inclined angle (χ) at the bottom end, so that when multiple sets of packaging covers (2 0 Β) are stacked, they can be stacked with each other (as shown in the drawing) to achieve reduction. The advantages of stacking space. Among them, please refer to Figs. 5 and 7. The circumference i (220) of the package part (2 2) of the packaging cover (20B) can be formed with an inward protrusion. Card edge (2 2 1) When the packaging cover (2 0 B) is combined with the CPU pu radiator (please refer to Figures 2 and 3), the card edge (22 D can be engaged with the end of the assembly frame (12)) Those who make the packaging cover (20B) achieve the positioning effect. With the above-mentioned structure and composition, the packaging cover (20B) disclosed in this creation can be used with a packaging box in practical applications. A complete CPU heat sink packaging structure is constituted by the structure, as shown in Figs. 8 and 9 of this equipment. The cp U heat sink (100B) can be placed in a predetermined packaging box (30). After being placed in the slot (31), the packaging cover (20B) is combined with each screw pin (1 3) of the CPU to dissipate $ (10 B), thereby protecting the thermal conductive sheet ( 1 1). [Effect description] This creation is mainly based on the packaging cover (20) (20B) of the CPU radiator set as a plastic thin shell structure, and its center has a covering surface (2 1 ), The periphery is formed with a frame frame (2 M283496 〇2) or a set of the 彳 screw feet (i 3), the mouth of the CPU radiator (丄 〇) or the ancient unique innovative design, which can Make the package The cover (2 (n directly achieves the positioning status, and reaches the production list "Zhuang only now (20) industry utilization and practical progress is more convenient and efficient positioning better production 2 3 =: more with the packaging cover (20B) The peripheral wall (2) of each set (2) has a structural design with an inclined angle, so that multiple sets of packaging covers can be stacked with each other to achieve the advantage of reducing the storage space. Cover (20) (? ', 〇) (2〇B) of the frame part (2 0 2) or the set-, # $ 成 有 卡 缘 (2 Q 4) or (2 2 1) part of the structure Design, when the packaging cover (2 Q) is combined with the CPU radiator, the card edge (2 2 bayonet at the end of the assembly & (12) makes the packaging cover ⑽) to achieve fast Those who also have a stable positioning effect.
• I 修改，而晴更與修改，顯精神細下進行變更與 •貝…、白應涵盍於如后之申請專利範圍所界定範疇中。 '本創作確已達到其所有目的，另其組合結構之空間鶴未見於嶋產品， 亦未曾公開於帽前，已符合專概之規定，爰依法提出申請。 M283496 、 · 【圖式簡單說明】 第1圖：係本創作之包裝護蓋與CPU散熱器較佳實施例之分解立體圖。 第2圖··係本創作之包裝護蓋與CPU散熱器較佳實施例之平面分解圖。 第3圖：係本創作之包裝護蓋與CPU散熱器較佳實施例之平面組合圖。 第4圖··係承第1〜3圖所揭包裝護蓋型態之變化實施例圖。 第5圖··係本創作之包裝護蓋與c P U散熱器另一較佳實施例之立體分解 不意圖° 齡第6圖：係本創作之包裝護蓋與CPU散熱器另一較佳實施例組合狀態 之第一側向剖視圖。 第7圖：係本創作之包裝護蓋與CPU散熱器另一較佳實施例組合狀態 之第二側向剖視圖。 第8圖··係本創作之包裝護蓋搭配包裝盒體使用實施例之立體分解示意 圖。 第9圖係承第7圖所揭實施例之組合狀態剖視圖。 .第10圖··係系每·= ,、 5〜7圖所揭包裝遵蓋之覆蓋面型態另一實施例圖。 ^ 圖係本創作包裝護蓋可相互錯置堆疊之剖面示意圖。 第 θ係本創作包裝護蓋之卡緣尚未卡合狀態之剖面示意。 圖係本創作包裝護蓋之卡緣達成卡合狀態 之剖面示意。 【主要元件符號說明】 c P U散熱器 (1 〇)(10Β) 導熱面 ， 散熱鰭片• I am revised, and Qing is modified and modified, and changes are made in the spirit of detail. • Bei ..., Bai Ying are included in the scope defined by the scope of patent application as described later. 'This creation has indeed fulfilled all its purposes. In addition, the space crane of its combined structure has not been seen in the products of the company, nor has it been disclosed in front of the hat. It has complied with the general requirements, and has submitted an application according to law. M283496, · [Schematic description] Figure 1: This is an exploded perspective view of the preferred embodiment of the packaging cover and CPU cooler of this creation. Figure 2 is an exploded plan view of the preferred embodiment of the packaging cover and CPU heat sink of this creation. Figure 3: This is a plan combination view of the preferred embodiment of the packaging cover and the CPU heat sink of this creation. Fig. 4 is a diagram showing a modified embodiment of the packaging cover type disclosed in Figs. 1 to 3. Figure 5: The three-dimensional decomposition of another preferred embodiment of the packaging cover and c PU radiator of this creation is not intended ° Age Figure 6: The packaging cover of this creation and another preferred implementation of the CPU radiator A first side cross-sectional view of an example combined state. Fig. 7: A second lateral cross-sectional view of the combined state of the packaging cover and another preferred embodiment of the CPU heat sink of this creation. Fig. 8 is a three-dimensional exploded view of the embodiment of the use of the packaging cover and packaging box body. FIG. 9 is a sectional view of the assembled state following the embodiment disclosed in FIG. 7. . Fig. 10 is a diagram of another embodiment of the cover conforming form of the packaging disclosed in Figs. ^ The figure is a schematic cross-sectional view of the creative packaging covers that can be stacked on top of each other. Section θ is a cross-sectional view showing that the card edge of the creative packaging cover is not yet engaged. The picture shows the cross-section of the snap edge of the packaging cover of this creative. [Description of main component symbols] c P U heat sink (1 〇) (10B) heat conduction surface, heat radiation fin
(10 1) 11 M283496 導熱膏 (104) ^ 定位部 (10 5) 導熱片 (11) 組接架 (12) 螺接腳柱 (13) 散熱鰭片 (14) 導電線 (15) 包裝護蓋 (2 0 ) ( 2 0 Β ) 覆蓋面 (201)(203) 套框部 ( 2 0 2 ) 卡緣 ( 2 0 4 ) 覆蓋面 (21)(21b) 套組部 (22) 周壁 ( 2 2 0 ) 卡緣 (2 2 1 ) 圍邊 (23) 包裝盒體 (30) 容置槽 (3 1) 12(10 1) 11 M283496 Thermal paste (104) ^ Positioning part (10 5) Thermally conductive sheet (11) Assembly bracket (12) Screw pin (13) Radiating fin (14) Conductive wire (15) Packaging cover (2 0) (2 0 Β) Covering surface (201) (203) Frame frame portion (2 0 2) Card edge (2 0 4) Covering surface (21) (21b) Covering portion (22) Peripheral wall (2 2 0) Card edge (2 2 1) Surrounding edge (23) Packaging box body (30) Receiving slot (3 1) 12