US20100294462A1 - Heat sink and heat-dissipating fins of the same - Google Patents

Heat sink and heat-dissipating fins of the same Download PDF

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Publication number
US20100294462A1
US20100294462A1 US12468182 US46818209A US2010294462A1 US 20100294462 A1 US20100294462 A1 US 20100294462A1 US 12468182 US12468182 US 12468182 US 46818209 A US46818209 A US 46818209A US 2010294462 A1 US2010294462 A1 US 2010294462A1
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US
Grant status
Application
Patent type
Prior art keywords
heat
dissipating
form
fold
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12468182
Inventor
Kuo-Len Lin
Chen-Hsiang Lin
Jui-Ho Liu
Chih-Hung Cheng
Ken Hsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CpuMate Inc
Golden Sun News Techniques Co Ltd
Original Assignee
CpuMate Inc
Golden Sun News Techniques Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat sink and heat-dissipating fins have wave-shaped folds. The heat sink includes a plurality of heat-dissipating fins that are radially connected together to form a ring. The inside of the heat-dissipating fins is formed with an accommodating space for allowing a heat-generating element to be disposed therein. The heat-dissipating fin is a metallic piece with its one side bent vertically to form a fold. The fold is bent continuously to form a wave shape. Via the wave-shaped folds, the user can grip the heat-dissipating fins easily. Further, the rigidness and strength of the fold can be increased.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a heat sink, and in particular to a heat sink having folds and heat-dissipating fins of the same.
  • 2. Description of Prior Art
  • Electronic elements generate heat when they are in operation. With the advancement of technology, the heat generated by the electronic products is increased greatly because their functions and performance are improved. Therefore, most of the electronic elements are provided with a heat-dissipating device so as to control the working temperature and maintain the normal operation of the electronic elements.
  • In order to dissipate the heat, various kinds of heat sinks are proposed in the market, such as a heat-dissipating fin assembly constituted of a plurality of heat-dissipating fins. When the heat-dissipating fin assembly is used in a light-emitting diode lamp, it is adhered to the light-emitting diodes that are generating heat, thereby providing a large area for heat dissipation. In use, a plurality of heat-dissipating fins is connected and radially arranged in the outer periphery of the light-emitting diodes. Since the heat-dissipating fin is a thin metallic piece with sharp edges, when a user or operator intends to replace or repair the lamp, he/she may be hurt by the sharp edges. Thus, the outer edge of the heat-dissipating fin is bent inwards to form a fold. However, such an edge with an inward fold may obstruct the dissipation of heat and make the heat to be accumulated therein. As a result, the temperature of the heat-dissipating fin becomes so high that the user or operator cannot grip the heat-dissipating fin easily.
  • Another kind of heat sink is made by stacking up a plurality of heat-dissipating fins. Such a heat sink is widely used in the heat dissipation of an electronic element such as a computer CPU. Two opposite sides of each heat-dissipating fin are upright and bent inwards to form a fold. After being stacked up, the fold becomes a gap between neighboring two heat-dissipating fins. If the user touches the fold, the user may be hurt by the high heat. Since the rigidness of the fold is poor, the fold may suffer damage or deformation so as to deteriorate its performance and external appearance.
  • Therefore, in order to overcome the above problems, the present Inventor proposes a reasonable and novel structure based on his delicate researches and expert experiments.
  • SUMMARY OF THE INVENTION
  • The present invention is to provide a heat sink, which can be gripped by a user easily.
  • The present invention is to provide a heat sink. The rigidness and strength of the folds of the heat sink are enhanced, so that the folds can be prevented from suffering damage or deformation when being touched by the user, thereby maintaining its external appearance.
  • The present invention is to provide a heat sink adhered to the outside of a heat-generating element. The heat sink comprises a plurality of heat-dissipating fins that are arranged radially and connected together to form a ring. The inside of the heat-dissipating fins is formed with an accommodating space for allowing the heat-generating element to be disposed therein. The heat-dissipating fin is a metallic piece with its one side bent vertically to form a fold. The fold is bent continuously to form a wave shape
  • The present invention is to provide a heat sink adhered to a heat-generating element. The heat sink comprises a plurality of heat-dissipating fins. The plurality of heat-dissipating fins is stacked up in parallel to one another. The heat-dissipating fin is a metallic piece with its one side bent vertically to form a fold. The fold is bent continuously to form a wave shape.
  • The present invention is to provide a heat-dissipating fin. The heat-dissipating fin is a metallic piece with its one side bent vertically to form a fold. The fold is bent continuously to form a wave shape
  • In comparison with prior art, according to the present invention, the side of each heat-dissipating fin is bent vertically to form a fold. The fold is bent continuously to form a wave shape and the smooth folds are arranged in the periphery of the heat sink. When the user touches the peaks of the wave-shaped folds, the user may not feel so hot because the contact area is small. Furthermore, the smooth surface of the fold may not hurt the user. Further, the rigidness and strength of the wave-shaped fold is enhanced, so that the fold can be prevented from suffering damage or deformation. Thus, the external appearance of the heat-dissipating fins can be maintained.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view showing the external appearance of the heat-dissipating fin of the present invention;
  • FIG. 2 is an assembled perspective view showing the heat-dissipating fins of the present invention;
  • FIG. 3 is a perspective view showing the external appearance of the heat sink of the present invention;
  • FIG. 4 is a perspective view showing the external appearance of the heat sink according to one embodiment of the present invention; and
  • FIG. 5 is a perspective view showing the external appearance of the heat sink according to another embodiment of the present invention.
  • DETAILED DESCRIPTION OF THE INVENTION
  • The characteristics and technical contents of the present invention will be explained with reference to the accompanying drawings. However, the drawings are illustrative only but not used to limit the present invention.
  • Please refer to FIG. 1, which is a perspective view showing the external appearance of the heat-dissipating fin of the present invention. The present invention provides a heat-dissipating fin. The heat-dissipating fin 10 is a metallic piece 11. One side of the metallic piece 11 is bent vertically to form a fold 12. The fold 12 is bent continuously to form a wave shape. The other side of the metallic piece 11 is provided with a locking portion 13. The locking portion 13 is a protruding plate 131 that is formed with a ridge. The interior of the protruding plate 131 is provided with an insertion hole 132. The other side of the metallic piece 10 extends vertically to form a retaining piece 14. The retaining piece 14 is to be adhered to a heat-generating source.
  • Please refer to FIGS. 2 to 4. FIG. 2 is an assembled perspective view showing the heat-dissipating fins of the present invention, FIG. 3 is a perspective view showing the external appearance of the heat sink of the present invention, and FIG. 4 is a perspective view showing the external appearance of the heat sink according to one embodiment of the present invention. The present invention further provides a heat sink 1 that is adhered to the outside of a heat-generating element. The heat sink 1 comprises a plurality of heat-dissipating fins 10. The heat-dissipating fins 10 are engaged with each other via the locking portions 13 of the two neighboring heat-dissipating fins 10, so that these heat-dissipating fins are radially connected to form a ring. A heat-dissipating path 100 is formed between two heat-dissipating fins 10. The inside of the heat-dissipating fin 10 is formed with an accommodating space 101 for allowing a lamp seat 50 to be disposed therein. The retaining piece 14 is adhered to a portion of surface of the lamp seat 50.
  • The wave-shaped folds 12 are arranged in the outer periphery of the heat sink 20, thereby increasing the heat-dissipating area of each heat-dissipating fin 10. When the user grips the heat-dissipating fin 10, the user only touches the peak of the wave-shaped fold 12, so that the user may not feel too hot because of the small contact area. Further, the smooth surface of the heat-dissipating fin may not hurt the user.
  • Please refer to FIG. 5, which is a perspective view showing the external appearance of the heat sink according to another embodiment of the present invention. The present invention further provides a heat sink 2 comprising a plurality of heat-dissipating fins 20. The heat-dissipating fin 20 is a rectangular metallic piece 21. Two opposite sides of the metallic piece 21 are bent vertically to form a fold 22 respectively. The two folds 22 are bent continuously to form a wave shape. The heat-dissipating fins 20 are stacked up in parallel to one another, so that a heat-dissipating path 200 is formed between any two heat-dissipating fins 20. The heat sink 2 is adhered to the surface of a heat-generating surface 60. Further, the heat-generating element 60 is connected with a plurality of heat pipes 70 passing through the heat-dissipating fins 20. Via this arrangement, the heat of the heat-generating element 60 can be dissipated.
  • The rigidness and strength of the wave-shaped fold 22 is enhanced. Thus, the heat-dissipating fin can be prevented from suffering damage or deformation when being touched by the user. Thus, the external appearance of the heat-dissipating fin can be maintained.
  • Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

Claims (15)

  1. 1. A heat-dissipating fin, the heat-dissipating fin being a metallic piece with one side thereof bent vertically to form a fold, and the fold being bent continuously to form a wave shape.
  2. 2. The heat-dissipating fin according to claim 1, wherein the other side of the metallic piece is provided with a locking portion, the locking portion is connected with another heat-dissipating fin.
  3. 3. The heat-dissipating fin according to claim 2, wherein the locking portion is a protruding plate, an interior of the protruding plate is provided with an insertion hole.
  4. 4. The heat-dissipating fin according to claim 3, wherein the protruding plate is formed with a ridge.
  5. 5. The heat-dissipating fin according to claim 1, wherein the other side of the metallic piece extends vertically to form a retaining piece.
  6. 6. A heat sink adhered to outside of a heat-generating element, the heat sink comprising a plurality of heat-dissipating fins, the heat-dissipating fins being connected radially to form a ring, an interior of the heat-dissipating fins being formed with an accommodating space for the heat-generating element to be disposed therein, the heat-dissipating fin being a metallic piece with one side thereof bent vertically to form a fold, and the fold being bent continuously to form a wave shape.
  7. 7. The heat sink according to claim 6, wherein the other side of the metallic piece is provided with a locking portion, the locking portion is connected with another heat-dissipating fin.
  8. 8. The heat sink according to claim 7, wherein the locking portion is a protruding plate, the interior of the protruding plate is provided with an insertion hole.
  9. 9. The heat sink according to claim 8, wherein the protruding plate is formed with a ridge.
  10. 10. The heat sink according to claim 6, wherein the other side of the metallic piece extends vertically to form a retaining piece, the retaining piece is adhered to the heat-generating element.
  11. 11. The heat sink according to claim 6, wherein a heat-dissipating path is formed between any two heat-dissipating fins.
  12. 12. A heat sink adhered to a heat-generating element, the heat sink comprising a plurality of heat-dissipating fins, the heat-dissipating fins being stacked up in parallel to one another, the heat-dissipating fin being a metallic piece with one side bent thereof vertically to form a fold, and the fold being bent continuously to form a wave shape.
  13. 13. The heat sink according to claim 12, wherein the metallic piece is formed into a rectangular shape.
  14. 14. The heat sink according to claim 13, wherein two opposite sides of the metallic piece are bent vertically to form a fold respectively, the two folds are bent continuously to form a wave shape.
  15. 15. The heat sink according to claim 12, wherein a heat-dissipating path is formed between any two heat-dissipating fins.
US12468182 2009-05-19 2009-05-19 Heat sink and heat-dissipating fins of the same Abandoned US20100294462A1 (en)

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US12468182 US20100294462A1 (en) 2009-05-19 2009-05-19 Heat sink and heat-dissipating fins of the same

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US12468182 US20100294462A1 (en) 2009-05-19 2009-05-19 Heat sink and heat-dissipating fins of the same

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100276118A1 (en) * 2009-04-29 2010-11-04 Hon Hai Precision Industry Co., Ltd. Cooling device for illumination source
US20110214842A1 (en) * 2010-03-05 2011-09-08 Lea-Min Technologies Co., Ltd. Heat sink
US20110310315A1 (en) * 2010-06-18 2011-12-22 Akifumi Yamaguchi Television apparatus and electronic device
US20170097122A1 (en) * 2015-10-06 2017-04-06 Hsu Li Yen Led lamp holder

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2365162A (en) * 1943-02-23 1944-12-19 Victor R Abrams Laminated finned cylinder
US5709263A (en) * 1995-10-19 1998-01-20 Silicon Graphics, Inc. High performance sinusoidal heat sink for heat removal from electronic equipment
US20010018967A1 (en) * 1997-10-20 2001-09-06 Fujitsu, Ltd. Heat pipe type cooler
US6390188B1 (en) * 2000-12-22 2002-05-21 Chung-Ping Chen CPU heat exchanger
US6450250B2 (en) * 1999-06-11 2002-09-17 Psc Computer Products, Inc. Stackable heat sink for electronic components
US6657865B1 (en) * 2002-12-12 2003-12-02 Wuh Chuong Indutrial Co., Ltd. Heat dissipating structure
US20040244947A1 (en) * 2003-05-14 2004-12-09 Inventor Precision Co., Ltd. Heat sinks for a cooler
US20060144580A1 (en) * 2004-12-30 2006-07-06 Dong-Mau Wang Radiator sheet
US20060144560A1 (en) * 2005-01-04 2006-07-06 Ruei-An Lo Clip assembly structure for heat dissipating fins
US7163050B2 (en) * 2004-09-17 2007-01-16 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device
US20070131390A1 (en) * 2005-12-09 2007-06-14 Kuo-Hsin Chen Heat dissipating module and method of fabricating the same
US20080105408A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat-pipe type heat sink
US20080257527A1 (en) * 2007-04-18 2008-10-23 Foxconn Technology Co., Ltd. Heat sink assembly having a fin also functioning as a supporting bracket
US20090260779A1 (en) * 2008-04-21 2009-10-22 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having an improved fin structure
US20110048675A1 (en) * 2009-08-28 2011-03-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2365162A (en) * 1943-02-23 1944-12-19 Victor R Abrams Laminated finned cylinder
US5709263A (en) * 1995-10-19 1998-01-20 Silicon Graphics, Inc. High performance sinusoidal heat sink for heat removal from electronic equipment
US20010018967A1 (en) * 1997-10-20 2001-09-06 Fujitsu, Ltd. Heat pipe type cooler
US6450250B2 (en) * 1999-06-11 2002-09-17 Psc Computer Products, Inc. Stackable heat sink for electronic components
US6390188B1 (en) * 2000-12-22 2002-05-21 Chung-Ping Chen CPU heat exchanger
US6657865B1 (en) * 2002-12-12 2003-12-02 Wuh Chuong Indutrial Co., Ltd. Heat dissipating structure
US20040244947A1 (en) * 2003-05-14 2004-12-09 Inventor Precision Co., Ltd. Heat sinks for a cooler
US7117928B2 (en) * 2003-05-14 2006-10-10 Inventor Precision Co., Ltd. Heat sinks for a cooler
US7163050B2 (en) * 2004-09-17 2007-01-16 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device
US20060144580A1 (en) * 2004-12-30 2006-07-06 Dong-Mau Wang Radiator sheet
US20060144560A1 (en) * 2005-01-04 2006-07-06 Ruei-An Lo Clip assembly structure for heat dissipating fins
US20070131390A1 (en) * 2005-12-09 2007-06-14 Kuo-Hsin Chen Heat dissipating module and method of fabricating the same
US20080105408A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat-pipe type heat sink
US20080257527A1 (en) * 2007-04-18 2008-10-23 Foxconn Technology Co., Ltd. Heat sink assembly having a fin also functioning as a supporting bracket
US20090260779A1 (en) * 2008-04-21 2009-10-22 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having an improved fin structure
US20110048675A1 (en) * 2009-08-28 2011-03-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100276118A1 (en) * 2009-04-29 2010-11-04 Hon Hai Precision Industry Co., Ltd. Cooling device for illumination source
US20110214842A1 (en) * 2010-03-05 2011-09-08 Lea-Min Technologies Co., Ltd. Heat sink
US20110310315A1 (en) * 2010-06-18 2011-12-22 Akifumi Yamaguchi Television apparatus and electronic device
US8531838B2 (en) * 2010-06-18 2013-09-10 Kabushiki Kaisha Toshiba Television apparatus and electronic device
US20170097122A1 (en) * 2015-10-06 2017-04-06 Hsu Li Yen Led lamp holder

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AS Assignment

Owner name: CPUMATE INC, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, KUO-LEN;LIN, CHEN-HSIANG;LIU, JUI-HO;AND OTHERS;REEL/FRAME:022701/0047

Effective date: 20090505

Owner name: GOLDEN SUN NEWS TECHNIQUES CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, KUO-LEN;LIN, CHEN-HSIANG;LIU, JUI-HO;AND OTHERS;REEL/FRAME:022701/0047

Effective date: 20090505