US20010018967A1 - Heat pipe type cooler - Google Patents

Heat pipe type cooler Download PDF

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Publication number
US20010018967A1
US20010018967A1 US09/810,253 US81025301A US2001018967A1 US 20010018967 A1 US20010018967 A1 US 20010018967A1 US 81025301 A US81025301 A US 81025301A US 2001018967 A1 US2001018967 A1 US 2001018967A1
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United States
Prior art keywords
heat
cooler
heat pipe
radiator
cooler according
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Abandoned
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US09/810,253
Inventor
Akira Uead
Masumi Suzuki
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Fujitsu Ltd
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Fujitsu Ltd
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Priority to US09/810,253 priority Critical patent/US20010018967A1/en
Publication of US20010018967A1 publication Critical patent/US20010018967A1/en
Abandoned legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat pipe type cooler.
  • a heat pipe is a heat-transfer device comprising a sealed metal tube of a generally straight bar shape, with an inner lining of a wicklike capillary material and containing a small amount of fluid (condensed fluid) in a partial vacuum.
  • a heat is absorbed at one end by vaporization of the fluid and is released at the other end by condensation of the vapor.
  • a heat pipe is characterized by its simple structure and its a high heat transfer rate per unit area, and it can be used in a wide range of temperatures in response to requirements.
  • Japanese Unexamined Patent Publication (Kokai) No. 63-254754 discloses a cooling apparatus, having a straight bar shaped heat pipe, wherein one end of the heat pipe is embedded and fixed in a metal block, and the other end of the heat pipe has on its outer surface a plurality of disc shaped fins, spaced apart and in parallel to each other, and the heat pipe extends through the centers of the fins.
  • Japanese Unexamined Patent Publication (Kokai) No. 2-93270 discloses a cooling mechanism comprising cooling units, disposed in an air duct, wherein each of the cooling units has a straight bar shaped heat pipe of which one end is embedded and fixed in a heat generating element and the other end extends horizontally across the duct and has on its surface a plurality of square fins, spaced apart and in parallel to each other, such that the other end extends through and is perpendicular to the fins.
  • Japanese Unexamined Patent Publication (Kokai) No. 3-134453 discloses a cooling apparatus comprising a straight bar shaped heat pipe of which one end is embedded and fixed in a heater and the other end is inserted into the center of a bobbin-like radiating body.
  • Japanese Unexamined Patent Publication (Kokai) No. 3-96261 discloses a cooling apparatus comprising U shaped heat pipes wherein each of one end of each heat pipe is embedded and fixed in a corresponding side plate, and the other end of each heat pipe exists within a duct constructed by the side plates and extends through rectangular fins spaced apart and disposed in parallel to each other.
  • Japanese Unexamined Patent Publication (Kokai) No. 7-45759 discloses a cooling apparatus comprising a straight bar-shaped heat pipe, one end of which is embedded and fixed in a heat receiving plate, the other of which has on its surface a plurality of square fins spaced apart and disposed in parallel to each other such that the heat pipe extends through the fins.
  • the primary object of the present invention is, therefore, to provide a integrally constructed cooler of the heat pipe type, which is free from the aforementioned drawbacks and which ensures the achievement of sufficient cooling capacity and the realization of a simple, compact and in expensive cooler, that is especially low in height, employing and incorporating ingeniously a heat pipe.
  • a heat pipe type cooler comprising: a heat receiver; a heat radiator; and a heat pipe; and wherein the heat pipe has a generally U or V shaped profile and is secured at its middle portion to the heat receiver and wherein the heat receiver and the hear radiator are thermally connected with the heat pipe.
  • the heat radiator may have a configuration of a plurality of horizontally oriented heat radiation plates extending vertically and wherein each end of the heat pipe passes through the heat radiation plates.
  • the heat radiator may have corrugations.
  • the heat receiver may have a ridged portion for heat radiation.
  • the cooler may further comprise a fastener to secure the heat receiver to a subject to be cooled.
  • the cooler may further comprise a connector for another cooler. Further preferably, the connector may comprise a hook portion and a hook engaging portion.
  • a heat pipe type cooler comprising: a heat receiver; a heat radiator; and a plurality of heat pipes; and wherein each of the heat pipes has a generally U or V shaped profile and is secured at its middle portion to the heat receiver and wherein the heat receiver and the heat radiator are thermally connected with the heat pipes.
  • the heat radiator may have a configuration of a plurality of horizontally oriented heat radiation plates extending vertically and wherein each end of each of the heat pipe passes through the heat radiation plates.
  • the heat pipes may be parallely spaced apart and disposed in a horizontal row.
  • the cooler may further comprise a ventilation duct with an inlet and an outlet such that it surrounds the heat radiator.
  • the cooler may further comprise a fan interposed between preselected heat pipes.
  • FIG. 1 is a frontal view showing a heat pipe type cooler of a first embodiment according to the invention
  • FIG. 2 is a top view showing the cooler of FIG. 1;
  • FIG. 3 is a side view showing the cooler of FIG. 1;
  • FIG. 4 is a side view showing the cooler fixed on the LSI
  • FIG. 5 is a view showing a cooler including a heat pipe modified
  • FIG. 6 is a view showing a cooler in which the heat receiving plate is provided with a rugged portion
  • FIG. 7 is a view showing a cooler in which the heat radiation plates have corrugations
  • FIG. 8 is a view showing a cooler in which two heat radiators are spaced apart, separate from each other;
  • FIG. 9 is a view showing a cooling system comprising coolers interconnected
  • FIG. 10 is a view showing a cooler of another embodiment
  • FIG. 11 is a top view showing the cooler of FIG. 10;
  • FIG. 12 is a top view showing a modification of the cooler of FIG. 10;
  • FIG. 13 is a cross-sectional view showing a cooler according to further embodiment.
  • FIG. 14 is a cross-sectional view showing a modification of the cooler of FIG. 13.
  • FIGS. 1 to 4 show a first embodiment of heat pipe type cooler according to the invention.
  • the cooler 1 includes a rectangular, heat receiving plate 3 adapted to be fixed to an element (including a heat generator), not shown, intended to be cooled, and also includes a generally U-shaped heat pipe H.
  • a heat pipe H (composing another cooler 1 ′) may have a profile resembling a letter V, the intermediate portion of which being not sharp but round, so as to compose another type of cooler 1 ′.
  • the intermediate, curved portion of the heat pipe H is fixed to the center on an upper surface of the heat receiving plate 3 .
  • the heat pipe H has upstanding end portions in parallel with each other. Both of the heat pipe end portions pass through a heat radiator 5 .
  • the heat radiator 5 has a configuration of a number of (in this embodiment, six) horizontally oriented heat radiation plates (or fins) extending vertically. The heat radiation plates 5 resemble the heat receiving plate 3 in shape.
  • the heat receiving plate 3 and the heat radiation plates 5 are made of a thermal conductive material, for example, aluminum and are thermally interconnected with the heat pipe H.
  • the heat receiving plate 3 can be made thin. This and other embodiments are described on the assumption that the heat receiving plate 3 may have a thickness of 0.5 mm.
  • the fixation of the heat pipe H to the heat receiving plate 3 is carried out by means of adhesion, soldering, caulking, and etc.
  • the cooler 1 is placed and secured on a LSI (an example of heat generating elements) by means of a fastener, e.g., by means of a suitable number of C-shaped clips C made of elastic material, such as stainless steel.
  • a fastener e.g., by means of a suitable number of C-shaped clips C made of elastic material, such as stainless steel.
  • the heat radiation plates 5 or the heat receiving plate 3 may be provided with integrally formed portions (not shown), each of which can perform substantially the same function as that of the C-shaped clip C.
  • the heat generated by the LSI is conducted to the heat receiving plate 3 and is then transferred, through the heat pipe H, most efficiently to the heat radiation plates 5 where the heat is most effectively radiated outside.
  • a thermally conductive member (not shown), such as a flexible sheet made of silicon rubber, a layer of a thermal grease, etc., can be interposed to promote conductivity between the top surface of the LSI and the bottom surface of the heat receiving plate 3 .
  • the thermally conductive member can relieve a stress which may be generated due to a difference of thermal expansion coefficient between the heat receiving plate 3 and the LSI, and further can absorb or counteract a shock, a jar, or a jolt.
  • the heat receiving plate 3 ′ can be provided with a ridged portion (including protrusions and recesses) on its top surface so as to widen the surface area thereof to promote heat radiation from the heat receiving plate 3 per se.
  • the heat radiation plates 5 ′ can have corrugations for heat radiation promotion.
  • FIG. 8 there is provided another type of cooler which comprises a heat pipe H having a generally U shaped profile, the middle portion of which being fixed on a heat receiving plate 3 , the end portions of which being upstanding, parallel each other, each being provided with a corresponding heat radiator 5 ( 5 a, 5 b) such that it passes therethrough.
  • Each of the heat radiators 5 has the same configuration wherein it comprises a group of horizontally oriented heat radiation plates 5 a, 5 b.
  • the two groups of the heat radiation plates are spaced apart, separate from each other, and extend vertically.
  • another provision (not shown) can be made in which radiation plates (of at least one group) have the same tilting angle with respect to the corresponding, upstanding end portion of the heat pipe H.
  • various embodied coolers can use the concept that a large scale cooling system may be built by determining one type of cooler as a standard unit and by connecting a required number of the same type of coolers one after another in a row.
  • a large scale cooling system may be built by determining one type of cooler as a standard unit and by connecting a required number of the same type of coolers one after another in a row.
  • FIG. 9 One exemplary embodied example thereof is diagrammatically illustrated in FIG. 9.
  • Cooling units 1 ′′ of FIG. 9 each are similar to the cooler 1 according to the first embodiment.
  • Each unit 1 ′′ has a heat receiving plate 31 ′′, at one end of which is provided a male type projection 7 (as an example of a hook portion according to the invention), at an opposite end of which is provided a female type depression 9 (as an example of a hook engaging portion according to the invention).
  • Unit connection is achieved by engaging a projection 7 of one unit with a depression 9 of the other unit.
  • FIGS. 10 and 11 illustrate a cooler 21 comprising a heat receiving plate 23 and a plurality of heat pipes H (three heat pipes H in this embodiment).
  • Each of the heat pipes H has a generally U-shaped profile, the middle, curved portion of which is fixed on the heat receiving plate 23 .
  • the heat pipes H are disposed substantially in parallel and extending generally in a horizontal row.
  • Each of the heat pipes H has upstanding end portions in parallel with each other which have a heat radiator 25 in a manner that they are passing therethrough.
  • the heat radiator 25 has substantially the same configuration as that of the above-described first embodiment, i.e., it comprises a number of (in this embodiment, there are six) heat radiation plates 25 disposed in a vertical row with a certain interval therebetween, the plates 25 horizontally extending in parallel with each other such that each end of each of the heat pipes H passes through the heat radiation plates 25 .
  • the air may directly collide only with the upstanding heat pipe end portions which are disposed on the upstream side, i.e., right hand side.
  • the air can hardly directly collide with the heat pipe end portions which are disposed on the downstream side, i.e., left hand side.
  • the heat pipes H can also be arranged such that the heat pipes each are located at a slant with respect to the bottom side of the heat receiving plate 23 (or of the heat radiation plates 25 ), when viewed from the upper side, as shown in FIG. 12.
  • the air can directly collide not only the upstream heat pipe end portions but also the downstream heat pipe end portions, thereby improving the heat radiation from the heat pipes.
  • FIG. 13 shows a cooler according to a further embodiment of the invention.
  • the cooler 51 comprises a heat receiving plate 53 and two generally U-shaped heat pipes H fixed on the heat receiving plate 53 .
  • the heat receiving plates provided with a heat radiator 55 at their upstanding end portions.
  • the heat radiator 55 comprises a plurality of heat radiation plates 55 (in this embodiment, there are nine), extending horizontally in parallel with each other.
  • the cooler 51 further comprises a ventilation duct, for example, a square pipe, which surrounds at least the heat radiation plates and has an inlet opening (on the right side) and an outlet opening (on the left side). At the inlet is provided a fan F which may produce a current of air flowing through the duct. Further, as can be seen in FIG. 14, to make a small-sized cooler, another provision can be employed in which a fan F′ is interposed between two neighboring heat pipes H.
  • a ventilation duct for example, a square pipe, which surrounds at least the heat radiation plates and has an inlet opening (on the right side) and an outlet opening (on the left side).
  • a fan F which may produce a current of air flowing through the duct.
  • FIG. 14 to make a small-sized cooler, another provision can be employed in which a fan F′ is interposed between two neighboring heat pipes H.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
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  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

To realize a integrally constructed cooler of the heat pipe type which ensures the achievement of sufficient cooling capacity and the realization of a simple, compact and inexpensive cooler, that is especially low in height, employing and incorporating ingeniously a heat pipe, there is provided a heat pipe type cooler comprising: a heat receiving plate 3; a heat radiator having a configuration of a plurality of horizontally oriented heat radiation plates 5 extending vertically; and a heat pipe H having a generally U or V shaped profile, the middle portion of which is secured to the heat receiving plate 3: and wherein each end of the heat pipe H passes through the heat radiation plates 5.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The present invention relates to a heat pipe type cooler. [0002]
  • 2. Description of the Related Art [0003]
  • At present, technologically advanced and miniaturized electronic equipments are appearing. This involves a serious problem of internally generated heat at a high temperature. Use of a heat pipe has been considered and examined for the purpose of efficiently transferring such heat. [0004]
  • A heat pipe is a heat-transfer device comprising a sealed metal tube of a generally straight bar shape, with an inner lining of a wicklike capillary material and containing a small amount of fluid (condensed fluid) in a partial vacuum. A heat is absorbed at one end by vaporization of the fluid and is released at the other end by condensation of the vapor. A heat pipe is characterized by its simple structure and its a high heat transfer rate per unit area, and it can be used in a wide range of temperatures in response to requirements. [0005]
  • Several examples of a cooling apparatus using heat pipes will be briefly described hereinbelow. [0006]
  • Japanese Unexamined Patent Publication (Kokai) No. 63-254754 discloses a cooling apparatus, having a straight bar shaped heat pipe, wherein one end of the heat pipe is embedded and fixed in a metal block, and the other end of the heat pipe has on its outer surface a plurality of disc shaped fins, spaced apart and in parallel to each other, and the heat pipe extends through the centers of the fins. [0007]
  • Japanese Unexamined Patent Publication (Kokai) No. 2-93270 discloses a cooling mechanism comprising cooling units, disposed in an air duct, wherein each of the cooling units has a straight bar shaped heat pipe of which one end is embedded and fixed in a heat generating element and the other end extends horizontally across the duct and has on its surface a plurality of square fins, spaced apart and in parallel to each other, such that the other end extends through and is perpendicular to the fins. [0008]
  • Japanese Unexamined Patent Publication (Kokai) No. 3-134453 discloses a cooling apparatus comprising a straight bar shaped heat pipe of which one end is embedded and fixed in a heater and the other end is inserted into the center of a bobbin-like radiating body. [0009]
  • Japanese Unexamined Patent Publication (Kokai) No. 3-96261 discloses a cooling apparatus comprising U shaped heat pipes wherein each of one end of each heat pipe is embedded and fixed in a corresponding side plate, and the other end of each heat pipe exists within a duct constructed by the side plates and extends through rectangular fins spaced apart and disposed in parallel to each other. [0010]
  • Japanese Unexamined Patent Publication (Kokai) No. 7-45759 discloses a cooling apparatus comprising a straight bar-shaped heat pipe, one end of which is embedded and fixed in a heat receiving plate, the other of which has on its surface a plurality of square fins spaced apart and disposed in parallel to each other such that the heat pipe extends through the fins. [0011]
  • However, according to the above prior art structures, there is a problem in that, since each of the heat receiving parts inevitably requires a considerable height due to the straight bar portion of the heat pipe perpendicularly embedded therein, there cannot be provided a cooler designed to the small in size and economical in operation. [0012]
  • SUMMARY OF THE INVENTION
  • The primary object of the present invention is, therefore, to provide a integrally constructed cooler of the heat pipe type, which is free from the aforementioned drawbacks and which ensures the achievement of sufficient cooling capacity and the realization of a simple, compact and in expensive cooler, that is especially low in height, employing and incorporating ingeniously a heat pipe. [0013]
  • To achieve the above object, according to a first feature of the present invention, there is provided a heat pipe type cooler comprising: a heat receiver; a heat radiator; and a heat pipe; and wherein the heat pipe has a generally U or V shaped profile and is secured at its middle portion to the heat receiver and wherein the heat receiver and the hear radiator are thermally connected with the heat pipe. [0014]
  • Preferably, the heat radiator may have a configuration of a plurality of horizontally oriented heat radiation plates extending vertically and wherein each end of the heat pipe passes through the heat radiation plates. Preferably, the heat radiator may have corrugations. Preferably, the heat receiver may have a ridged portion for heat radiation. Preferably, the cooler may further comprise a fastener to secure the heat receiver to a subject to be cooled. Preferably, the cooler may further comprise a connector for another cooler. Further preferably, the connector may comprise a hook portion and a hook engaging portion. [0015]
  • According to another feature of the present invention, there is provided a heat pipe type cooler, comprising: a heat receiver; a heat radiator; and a plurality of heat pipes; and wherein each of the heat pipes has a generally U or V shaped profile and is secured at its middle portion to the heat receiver and wherein the heat receiver and the heat radiator are thermally connected with the heat pipes. [0016]
  • Preferably, the heat radiator may have a configuration of a plurality of horizontally oriented heat radiation plates extending vertically and wherein each end of each of the heat pipe passes through the heat radiation plates. Preferably, the heat pipes may be parallely spaced apart and disposed in a horizontal row. Preferably, the cooler may further comprise a ventilation duct with an inlet and an outlet such that it surrounds the heat radiator. Preferably, the cooler may further comprise a fan interposed between preselected heat pipes. [0017]
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • These and other objects of the present invention will become apparent from the following detailed description of the preferred embodiments of the invention in connection with the accompanying drawings. [0018]
  • In the drawings: [0019]
  • FIG. 1 is a frontal view showing a heat pipe type cooler of a first embodiment according to the invention; [0020]
  • FIG. 2 is a top view showing the cooler of FIG. 1; [0021]
  • FIG. 3 is a side view showing the cooler of FIG. 1; [0022]
  • FIG. 4 is a side view showing the cooler fixed on the LSI; [0023]
  • FIG. 5 is a view showing a cooler including a heat pipe modified; [0024]
  • FIG. 6 is a view showing a cooler in which the heat receiving plate is provided with a rugged portion; [0025]
  • FIG. 7 is a view showing a cooler in which the heat radiation plates have corrugations; [0026]
  • FIG. 8 is a view showing a cooler in which two heat radiators are spaced apart, separate from each other; [0027]
  • FIG. 9 is a view showing a cooling system comprising coolers interconnected; [0028]
  • FIG. 10 is a view showing a cooler of another embodiment; [0029]
  • FIG. 11 is a top view showing the cooler of FIG. 10; [0030]
  • FIG. 12 is a top view showing a modification of the cooler of FIG. 10; [0031]
  • FIG. 13 is a cross-sectional view showing a cooler according to further embodiment; and [0032]
  • FIG. 14 is a cross-sectional view showing a modification of the cooler of FIG. 13. [0033]
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Preferred embodiments of the present invention are described hereunder, in detail, with reference to the drawings attached hereto. Common parts in each of the following embodiments are given the same reference characters/numbers, and thus a description thereof is properly omitted, and only parts characteristic of the present invention is mainly described hereunder. [0034]
  • FIGS. [0035] 1 to 4 show a first embodiment of heat pipe type cooler according to the invention.
  • With reference to these drawings, the [0036] cooler 1 includes a rectangular, heat receiving plate 3 adapted to be fixed to an element (including a heat generator), not shown, intended to be cooled, and also includes a generally U-shaped heat pipe H. Instead, as shown in FIG. 5, a heat pipe H (composing another cooler 1′) may have a profile resembling a letter V, the intermediate portion of which being not sharp but round, so as to compose another type of cooler 1′.
  • As seen in FIG. 1, the intermediate, curved portion of the heat pipe H is fixed to the center on an upper surface of the [0037] heat receiving plate 3.
  • The heat pipe H has upstanding end portions in parallel with each other. Both of the heat pipe end portions pass through a [0038] heat radiator 5. The heat radiator 5 has a configuration of a number of (in this embodiment, six) horizontally oriented heat radiation plates (or fins) extending vertically. The heat radiation plates 5 resemble the heat receiving plate 3 in shape.
  • The [0039] heat receiving plate 3 and the heat radiation plates 5 are made of a thermal conductive material, for example, aluminum and are thermally interconnected with the heat pipe H.
  • The [0040] heat receiving plate 3 can be made thin. This and other embodiments are described on the assumption that the heat receiving plate 3 may have a thickness of 0.5 mm.
  • The fixation of the heat pipe H to the [0041] heat receiving plate 3 is carried out by means of adhesion, soldering, caulking, and etc.
  • In the first embodiment having the above-described structure, as can be seen in FIG. 4, the [0042] cooler 1 is placed and secured on a LSI (an example of heat generating elements) by means of a fastener, e.g., by means of a suitable number of C-shaped clips C made of elastic material, such as stainless steel. Instead of such clips as those separate from coolers, the heat radiation plates 5 or the heat receiving plate 3 may be provided with integrally formed portions (not shown), each of which can perform substantially the same function as that of the C-shaped clip C.
  • The heat generated by the LSI is conducted to the [0043] heat receiving plate 3 and is then transferred, through the heat pipe H, most efficiently to the heat radiation plates 5 where the heat is most effectively radiated outside.
  • A thermally conductive member (not shown), such as a flexible sheet made of silicon rubber, a layer of a thermal grease, etc., can be interposed to promote conductivity between the top surface of the LSI and the bottom surface of the [0044] heat receiving plate 3. In connection therewith, the thermally conductive member can relieve a stress which may be generated due to a difference of thermal expansion coefficient between the heat receiving plate 3 and the LSI, and further can absorb or counteract a shock, a jar, or a jolt.
  • Incidentally, as can be seen in FIG. 6, the [0045] heat receiving plate 3′ can be provided with a ridged portion (including protrusions and recesses) on its top surface so as to widen the surface area thereof to promote heat radiation from the heat receiving plate 3 per se.
  • As can be seen in FIG. 7, the [0046] heat radiation plates 5′ can have corrugations for heat radiation promotion.
  • As can be seen in FIG. 8, there is provided another type of cooler which comprises a heat pipe H having a generally U shaped profile, the middle portion of which being fixed on a [0047] heat receiving plate 3, the end portions of which being upstanding, parallel each other, each being provided with a corresponding heat radiator 5 (5a, 5b) such that it passes therethrough.
  • Each of the [0048] heat radiators 5 has the same configuration wherein it comprises a group of horizontally oriented heat radiation plates 5a, 5b. The two groups of the heat radiation plates are spaced apart, separate from each other, and extend vertically. Further, another provision (not shown) can be made in which radiation plates (of at least one group) have the same tilting angle with respect to the corresponding, upstanding end portion of the heat pipe H.
  • To any of the above-described cases, various embodied coolers can use the concept that a large scale cooling system may be built by determining one type of cooler as a standard unit and by connecting a required number of the same type of coolers one after another in a row. One exemplary embodied example thereof is diagrammatically illustrated in FIG. 9. [0049]
  • Cooling [0050] units 1″ of FIG. 9 each are similar to the cooler 1 according to the first embodiment. Each unit 1″ has a heat receiving plate 31″, at one end of which is provided a male type projection 7 (as an example of a hook portion according to the invention), at an opposite end of which is provided a female type depression 9 (as an example of a hook engaging portion according to the invention).
  • Unit connection is achieved by engaging a [0051] projection 7 of one unit with a depression 9 of the other unit. By connecting in a series a required number of units in the same way, a desired large scale cooling system for practical use can be easily and simply constructed.
  • Referring now to FIGS. 10 and 11, another embodiment of the invention will be explained hereinafter. These drawings illustrate a cooler [0052] 21 comprising a heat receiving plate 23 and a plurality of heat pipes H (three heat pipes H in this embodiment). Each of the heat pipes H has a generally U-shaped profile, the middle, curved portion of which is fixed on the heat receiving plate 23.
  • As can be seen in the drawings, the heat pipes H are disposed substantially in parallel and extending generally in a horizontal row. [0053]
  • Each of the heat pipes H has upstanding end portions in parallel with each other which have a [0054] heat radiator 25 in a manner that they are passing therethrough.
  • The [0055] heat radiator 25 has substantially the same configuration as that of the above-described first embodiment, i.e., it comprises a number of (in this embodiment, there are six) heat radiation plates 25 disposed in a vertical row with a certain interval therebetween, the plates 25 horizontally extending in parallel with each other such that each end of each of the heat pipes H passes through the heat radiation plates 25.
  • Supposing that there is an air flow flowing from right hand side to left hand side in FIG. 11, the air may directly collide only with the upstanding heat pipe end portions which are disposed on the upstream side, i.e., right hand side. The air can hardly directly collide with the heat pipe end portions which are disposed on the downstream side, i.e., left hand side. [0056]
  • The heat pipes H can also be arranged such that the heat pipes each are located at a slant with respect to the bottom side of the heat receiving plate [0057] 23 (or of the heat radiation plates 25), when viewed from the upper side, as shown in FIG. 12. In this arrangement, the air can directly collide not only the upstream heat pipe end portions but also the downstream heat pipe end portions, thereby improving the heat radiation from the heat pipes.
  • Next, FIG. 13 shows a cooler according to a further embodiment of the invention. The cooler [0058] 51 comprises a heat receiving plate 53 and two generally U-shaped heat pipes H fixed on the heat receiving plate 53. The heat receiving plates provided with a heat radiator 55 at their upstanding end portions. The heat radiator 55 comprises a plurality of heat radiation plates 55 (in this embodiment, there are nine), extending horizontally in parallel with each other.
  • The cooler [0059] 51 further comprises a ventilation duct, for example, a square pipe, which surrounds at least the heat radiation plates and has an inlet opening (on the right side) and an outlet opening (on the left side). At the inlet is provided a fan F which may produce a current of air flowing through the duct. Further, as can be seen in FIG. 14, to make a small-sized cooler, another provision can be employed in which a fan F′ is interposed between two neighboring heat pipes H.
  • It is to be understood that the present invention is by no means limited to the specific embodiments as illustrated and described herein, and that various modifications thereof may be made which come within the scope of the present invention as defined in the appended claims. [0060]

Claims (12)

1. A heat pipe type cooler, comprising:
a heat receiver;
a heat radiator; and
a heat pipe; and
wherein the heat pipe has a generally U or V shaped profile and is secured at its middle portion to the heat receiver and wherein the heat receiver and the heat radiator are thermally connected with the heat pipe.
2. The cooler according to
claim 1
, wherein the heat radiator has a configuration of a plurality of horizontally oriented heat radiation plates extending vertically and wherein each end of the heat pipe passes through the heat radiation plates.
3. The cooler according to
claim 1
, wherein the heat radiator has corrugations.
4. The cooler according to
claim 1
, wherein the heat receiver has a ridged portion for heat radiation.
5. The cooler according to
claim 1
, further comprising a fastener to secure the heat receiver to a subject to be cooled.
6. The cooler according to
claim 1
, further comprising a connector for another cooler.
7. The cooler according to
claim 6
, wherein the connector comprises a hook portion and a hook engaging portion.
8. A heat pipe type cooler, comprising:
a heat receiver;
a heat radiator; and
a plurality of heat pipes; and
wherein each of the heat pipes has a generally U or V shaped profile and is secured at its middle portion to the heat receiver and wherein the heat receiver and the heat radiator are thermally connected with the heat pipes.
9. The cooler according to
claim 8
, wherein the heat radiator has a configuration of a plurality of horizontally oriented heat radiation plates extending vertically and wherein each end of the heat pipe passes through the heat radiation plates.
10. The cooler according to
claim 8
, wherein the heat pipes are parallely spaced apart and disposed in a horizontal row.
11. The cooler according to
claim 8
, further comprising a ventilation duct with an inlet and an outlet such that it surrounds the heat radiator.
12. The cooler according to
claim 11
, further comprising a fan interposed between preselected heat pipes.
US09/810,253 1997-10-20 2001-03-19 Heat pipe type cooler Abandoned US20010018967A1 (en)

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JP9287358A JPH11121667A (en) 1997-10-20 1997-10-20 Heat pipe type cooling device
JP9-287358 1997-10-20
US09/044,030 US7156158B2 (en) 1997-10-20 1998-03-19 Heat pipe type cooler
US09/810,253 US20010018967A1 (en) 1997-10-20 2001-03-19 Heat pipe type cooler

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US09/810,253 Abandoned US20010018967A1 (en) 1997-10-20 2001-03-19 Heat pipe type cooler
US11/604,750 Expired - Fee Related US7721789B2 (en) 1997-10-20 2006-11-28 Heat pipe type cooler

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050077028A1 (en) * 2003-10-08 2005-04-14 Hironori Oikawa Liquid cooling jacket
EP1595099A1 (en) * 2003-01-24 2005-11-16 iCurie Lab Holdings Limited Cooling device of hybrid-type
US20070169919A1 (en) * 2006-01-21 2007-07-26 Foxconn Technology Co., Ltd. Heat pipe type heat dissipation device
EP1870946A2 (en) * 2006-06-21 2007-12-26 Otkrytoe Aktsionernoe Obschestvo "RIF" Autonomous thermo-electric source of electricity with small dimensions
US20090166679A1 (en) * 2007-12-31 2009-07-02 Paul Paternoster Integrated circuit and manufacturing process facilitating selective configuration for electromagnetic compatibility
US20090321058A1 (en) * 2006-03-02 2009-12-31 Sony Computer Enterainment Inc. Heat sink provided with centrifugal fan
US20100294462A1 (en) * 2009-05-19 2010-11-25 Kuo-Len Lin Heat sink and heat-dissipating fins of the same
US20110000641A1 (en) * 2009-07-06 2011-01-06 Xiaozhen Zeng Radiating fin structure and heat sink thereof
US20110093462A1 (en) * 2007-04-30 2011-04-21 Sap Ag Hierarchical metadata generator for retrieval systems
CN102056459A (en) * 2009-10-30 2011-05-11 鸿富锦精密工业(深圳)有限公司 Liquid-cooling heat radiating device
CN102122648A (en) * 2010-10-18 2011-07-13 安徽瑞煌光电科技有限公司 Heat pipe radiator
US20130112373A1 (en) * 2010-05-18 2013-05-09 Hiroyuki Fukai Cooling device with a plurality of fin pitches
TWI554193B (en) * 2013-05-13 2016-10-11 緯創資通股份有限公司 Heat dissipating system with insulating device, insulating device and manufacturing method thereof

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11121667A (en) * 1997-10-20 1999-04-30 Fujitsu Ltd Heat pipe type cooling device
JP4461584B2 (en) * 1999-11-16 2010-05-12 パナソニック株式会社 Heat sink device
US7061102B2 (en) * 2001-06-11 2006-06-13 Xilinx, Inc. High performance flipchip package that incorporates heat removal with minimal thermal mismatch
US20040011509A1 (en) * 2002-05-15 2004-01-22 Wing Ming Siu Vapor augmented heatsink with multi-wick structure
US7143819B2 (en) * 2002-09-17 2006-12-05 Hewlett-Packard Development Company, L.P. Heat sink with angled heat pipe
US7140422B2 (en) * 2002-09-17 2006-11-28 Hewlett-Packard Development Company, L.P. Heat sink with heat pipe in direct contact with component
US6894900B2 (en) * 2002-09-17 2005-05-17 Hewlett-Packard Development Company, L.P. Heat sink with heat pipe and base fins
TW557114U (en) * 2003-01-15 2003-10-01 Hon Hai Prec Ind Co Ltd Heat dissipation device
CN100402963C (en) * 2003-02-17 2008-07-16 深圳市益酷科技有限公司 Heat dissipation fins, heat pipe, master board metal integral radiator
US7698815B2 (en) * 2003-04-14 2010-04-20 Thermal Corp. Method for forming a heat dissipation device
CN2681342Y (en) * 2003-12-19 2005-02-23 鸿富锦精密工业(深圳)有限公司 Heat sink using heat pipe
CN2763973Y (en) * 2004-12-10 2006-03-08 鸿富锦精密工业(深圳)有限公司 Radiator
JP4550664B2 (en) * 2005-03-02 2010-09-22 古河電気工業株式会社 Heat sink with heat pipe
KR100759554B1 (en) * 2005-04-12 2007-09-18 삼성에스디아이 주식회사 Plasma display module
CN100573416C (en) * 2005-07-15 2009-12-23 富准精密工业(深圳)有限公司 Computer system and heat radiation module thereof
US7606029B2 (en) * 2005-11-14 2009-10-20 Nuventix, Inc. Thermal management system for distributed heat sources
JP2007149855A (en) * 2005-11-25 2007-06-14 Toshiba Corp Electronic device
US7298620B2 (en) * 2005-12-08 2007-11-20 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
CN101155501B (en) * 2006-09-27 2011-11-09 鸿富锦精密工业(深圳)有限公司 Heat radiator
WO2008109804A1 (en) * 2007-03-08 2008-09-12 Convergence Technologies Limited Vapor-augmented heat spreader device
TWM323645U (en) * 2007-06-04 2007-12-11 Comptake Technology Inc Improved CPU heat dissipating structure
US7580263B2 (en) * 2007-12-29 2009-08-25 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device with a fan holder
TW200942145A (en) * 2008-03-20 2009-10-01 Jun-Guang Luo Heat-dissipating device with multiple heat sources
US7929306B2 (en) * 2009-03-31 2011-04-19 Alcatel-Lucent Usa Inc. Circuit pack cooling solution
CN101908513B (en) * 2009-06-05 2012-05-30 鸿富锦精密工业(深圳)有限公司 Radiator
US20110214842A1 (en) * 2010-03-05 2011-09-08 Lea-Min Technologies Co., Ltd. Heat sink
US8550650B1 (en) 2010-08-10 2013-10-08 Patrick McGinty Lighted helmet with heat pipe assembly
CN103036394A (en) * 2011-09-29 2013-04-10 台达电子企业管理(上海)有限公司 Heat dissipation device applied to middle and high voltage inverter
EP2943726B1 (en) 2013-01-11 2023-03-01 Carrier Corporation Air handling unit
TW201509286A (en) * 2013-08-29 2015-03-01 Delta Electronics Inc Modular aluminum extruded heat sink
JP6283794B2 (en) * 2014-03-31 2018-02-28 千代田空調機器株式会社 Heat pipe fixing structure
EP3273323A1 (en) * 2016-07-22 2018-01-24 EKWB d.o.o. Computer liquid cooling system and method of use
CN109659288A (en) * 2018-12-28 2019-04-19 福建龙净环保股份有限公司 A kind of combination radiator
US20230100966A1 (en) * 2019-12-03 2023-03-30 Hewlett-Packard Development Company, L.P. Processor cooling with phase change material filled shell
US20240237277A9 (en) * 2022-10-24 2024-07-11 Strategic Thermal Labs, Llc Stacked-fin cold plate with a 3d vapor chamber

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB128898A (en) * 1918-06-22 Brown Eric Improved Method and Apparatus for Heating Inhabited Rooms.
FR1190936A (en) * 1958-01-31 1959-10-15 advanced multi-tube heating element for steam ovens
US3143592A (en) * 1961-11-14 1964-08-04 Inland Electronics Products Co Heat dissipating mounting structure for semiconductor devices
CH498488A (en) * 1969-04-30 1970-10-31 Bbc Brown Boveri & Cie Cooling device, in particular for semiconductor elements and electron tubes
SE354943B (en) * 1970-02-24 1973-03-26 Asea Ab
US4226282A (en) * 1978-08-30 1980-10-07 Foster Wheeler Energy Corporation Heat exchange apparatus utilizing thermal siphon pipes
JPS55160286A (en) * 1979-05-17 1980-12-13 Furukawa Electric Co Ltd:The Heat-conducting pipe equipped with gaseous phase connecting pipe
JPS568860A (en) * 1979-07-02 1981-01-29 Nec Corp Semiconductor device
US4588023A (en) * 1980-06-16 1986-05-13 Showa Aluminum Corporation Device for releasing heat
JPS5765523A (en) * 1980-10-06 1982-04-21 Sony Corp Heat pipe
JPS57101293A (en) * 1980-12-16 1982-06-23 Furukawa Electric Co Ltd:The Heat pipe type radiator
JPS599550A (en) 1982-07-09 1984-01-18 Toshiba Corp Ion-selective electrode
JPS5995385A (en) * 1982-11-22 1984-06-01 Akutoronikusu Kk Heat pipe type radiator
DE3415554A1 (en) * 1983-04-30 1984-10-31 Barmag Barmer Maschinenfabrik Ag, 5630 Remscheid Heat sink for power electronic components
US4501122A (en) * 1983-08-25 1985-02-26 Chicago Bridge & Iron Company Liquid piston heat pump
JPS6122193A (en) * 1984-07-05 1986-01-30 Showa Alum Corp Long heat pipe
JPS6161895A (en) 1984-09-04 1986-03-29 Daicel Chem Ind Ltd Laser recording film
US4688399A (en) * 1984-11-05 1987-08-25 Carrier Corporation Heat pipe array heat exchanger
JPS61130789A (en) * 1984-11-06 1986-06-18 Mitsubishi Electric Corp Heat exchanger
JPS63245329A (en) 1987-03-30 1988-10-12 Inoue Japax Res Inc Wire-cut electric discharge machining device
JPS63254754A (en) 1987-04-10 1988-10-21 Mitsubishi Electric Corp Cooling device for electronic element body
JPH0293270A (en) 1988-09-29 1990-04-04 Nec Corp Cooling mechanism by using heat pipe
JPH02126098A (en) * 1988-11-04 1990-05-15 Nippon Telegr & Teleph Corp <Ntt> Heat pipe
US4931905A (en) * 1989-01-17 1990-06-05 Grumman Aerospace Corporation Heat pipe cooled electronic circuit card
JP2685918B2 (en) 1989-09-08 1997-12-08 古河電気工業株式会社 Heat pipe cooler
JP2534363B2 (en) * 1989-09-08 1996-09-11 古河電気工業株式会社 Heat pipe cooler
JPH03134453A (en) 1989-10-16 1991-06-07 Fujitsu Ltd Heat dissipation device
JPH03232262A (en) * 1990-02-08 1991-10-16 Fujitsu Ltd Thermosiphon device of functional element of electronic equipment
JPH04225790A (en) * 1990-12-27 1992-08-14 Furukawa Electric Co Ltd:The Heat pipe type radiator and manufacture thereof
US5768492A (en) * 1991-06-17 1998-06-16 Schumer; Alfred L. Digitizer interface
US5168921A (en) * 1991-12-23 1992-12-08 Thermacore, Inc. Cooling plate with internal expandable heat pipe
JP3408586B2 (en) 1993-08-02 2003-05-19 三菱電線工業株式会社 Heat pipe cooler
JP3434552B2 (en) 1993-12-14 2003-08-11 ダイヤモンド電機株式会社 heatsink
JPH0878587A (en) 1994-08-31 1996-03-22 Toshiba Transport Eng Kk Power semiconductor device cooling device
US5582240A (en) * 1994-09-19 1996-12-10 Motorola, Inc. Pneumatically coupled heat sink assembly
JP3255818B2 (en) * 1995-03-20 2002-02-12 カルソニックカンセイ株式会社 Cooling device for electronic components
JP2917105B2 (en) 1995-04-19 1999-07-12 厚 寺田 Method and structure for joining extruded materials
US5819407A (en) 1995-04-19 1998-10-13 Tousui, Ltd. Method of joining together a pair of members each having a high thermal conductivity
JPH09210581A (en) 1996-01-31 1997-08-12 Showa Aircraft Ind Co Ltd Radiator
US5764482A (en) * 1996-07-24 1998-06-09 Thermacore, Inc. Integrated circuit heat seat
US5699853A (en) * 1996-08-30 1997-12-23 International Business Machines Corporation Combined heat sink and sink plate
CA2199239A1 (en) * 1997-03-05 1998-09-05 Trevor Zapach Electronic unit
JPH11121667A (en) * 1997-10-20 1999-04-30 Fujitsu Ltd Heat pipe type cooling device

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1595099A1 (en) * 2003-01-24 2005-11-16 iCurie Lab Holdings Limited Cooling device of hybrid-type
EP1595099A4 (en) * 2003-01-24 2010-03-10 Icurie Lab Holdings Ltd Cooling device of hybrid-type
US7021367B2 (en) * 2003-10-08 2006-04-04 Hitachi, Ltd. Liquid cooling jacket
US20050077028A1 (en) * 2003-10-08 2005-04-14 Hironori Oikawa Liquid cooling jacket
CN100385653C (en) * 2003-10-08 2008-04-30 株式会社日立制作所 Liquid cooling jacket
US20070169919A1 (en) * 2006-01-21 2007-07-26 Foxconn Technology Co., Ltd. Heat pipe type heat dissipation device
US20090321058A1 (en) * 2006-03-02 2009-12-31 Sony Computer Enterainment Inc. Heat sink provided with centrifugal fan
EP1870946A2 (en) * 2006-06-21 2007-12-26 Otkrytoe Aktsionernoe Obschestvo "RIF" Autonomous thermo-electric source of electricity with small dimensions
EP1870946A3 (en) * 2006-06-21 2009-07-15 Otkrytoe Aktsionernoe Obschestvo "RIF" Autonomous thermo-electric source of electricity with small dimensions
US20110093462A1 (en) * 2007-04-30 2011-04-21 Sap Ag Hierarchical metadata generator for retrieval systems
US20090166679A1 (en) * 2007-12-31 2009-07-02 Paul Paternoster Integrated circuit and manufacturing process facilitating selective configuration for electromagnetic compatibility
US8347251B2 (en) 2007-12-31 2013-01-01 Sandisk Corporation Integrated circuit and manufacturing process facilitating selective configuration for electromagnetic compatibility
US20100294462A1 (en) * 2009-05-19 2010-11-25 Kuo-Len Lin Heat sink and heat-dissipating fins of the same
US20110000641A1 (en) * 2009-07-06 2011-01-06 Xiaozhen Zeng Radiating fin structure and heat sink thereof
CN102056459A (en) * 2009-10-30 2011-05-11 鸿富锦精密工业(深圳)有限公司 Liquid-cooling heat radiating device
US20130112373A1 (en) * 2010-05-18 2013-05-09 Hiroyuki Fukai Cooling device with a plurality of fin pitches
CN102122648A (en) * 2010-10-18 2011-07-13 安徽瑞煌光电科技有限公司 Heat pipe radiator
TWI554193B (en) * 2013-05-13 2016-10-11 緯創資通股份有限公司 Heat dissipating system with insulating device, insulating device and manufacturing method thereof

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US20070068658A1 (en) 2007-03-29
US20010001981A1 (en) 2001-05-31
JPH11121667A (en) 1999-04-30
US7156158B2 (en) 2007-01-02
US7721789B2 (en) 2010-05-25

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