TWM275463U - Liquid cooling heat dissipation module - Google Patents

Liquid cooling heat dissipation module Download PDF

Info

Publication number
TWM275463U
TWM275463U TW94207273U TW94207273U TWM275463U TW M275463 U TWM275463 U TW M275463U TW 94207273 U TW94207273 U TW 94207273U TW 94207273 U TW94207273 U TW 94207273U TW M275463 U TWM275463 U TW M275463U
Authority
TW
Taiwan
Prior art keywords
liquid
frame
water
box
heat
Prior art date
Application number
TW94207273U
Other languages
Chinese (zh)
Inventor
Pei-Shi Lin
Original Assignee
Thermaltake Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermaltake Technology Co Ltd filed Critical Thermaltake Technology Co Ltd
Priority to TW94207273U priority Critical patent/TWM275463U/en
Publication of TWM275463U publication Critical patent/TWM275463U/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

M275463 四、創作說明(1) 【新型所屬之技術鎖均^】 本新型係有關於—#、六、人1 一 Μ駚 说技、六Λ 檀液冷式散熱模組,尤妒從# 框體,一併將液冷散熱系 I ^曰一種精由 水箱、液壓幫浦等元件,鎖固於該;風;、散熱排、 移除上述各元件者。 體上俾一併安裝或 【先前技術】 目前所應用之電腦,由於 段時間後’會因高頻震盈而產生jh,於啟動-熱元件,提供適時的散熱,以要適當的散 •目前的散熱方式,有以散孰作。 :央處理為〕上,使晶片所產生的熱能可如 ;,直接傳遞至散熱鰭片上,進行散熱,然而孰 上。 H無法適用於新一代之晶片 緣此,目則尚有一種液冷式之散熱系統,應用於電 晶片之散熱上,該液冷式散熱系統之元件,係包含液冷 盒、散熱排、水箱、液壓幫浦及風扇,其中該液冷盒:緊 貼於晶片上,並以輸液管串聯液冷盒、散熱排、水箱及液 壓幫浦,使冷卻液可以循環流動於上述之元件間,如此使 •冷卻液在流經液冷盒時,可與晶片進行熱交換,以將埶能 帶至散?排,進行散熱,除提供較舊式散熱鰭片更佳之散 熱效果外,也可將晶片所產生之熱能帶至遠處散熱,以降 低電腦中之熱能;惟習知液冷式散熱系統,其中散熱排、 水箱、液壓幫浦及風扇,都是呈一獨立、分離的元件,於M275463 IV. Creation Instructions (1) [The new technology belongs to the technical lock ^] This new type is about— #, 六, 人 1 一 M 駚 说 术 , 六 Λ Tan liquid cooling type cooling module, especially jealous from # frame And a liquid-cooled heat-dissipating system I, which is a kind of precision-cooled water tank, hydraulic pump and other components, which are locked to the wind, heat dissipation, and the above-mentioned components. Installed together on the body or [previous technology] Currently applied computers, because after a period of time, jh will be generated due to high-frequency vibrations, providing timely heat dissipation at the start-thermal element to properly dissipate the current The heat dissipation method can be used to disperse. : The central processing is as follows], so that the thermal energy generated by the wafer can be directly transmitted to the heat dissipation fins for heat dissipation, but the heat is generated. H cannot be applied to the new generation of chips. At present, there is still a liquid-cooled heat dissipation system for heat dissipation of electric chips. The components of the liquid-cooled heat dissipation system include a liquid cooling box, a heat sink, and a water tank. , Hydraulic pump and fan, where the liquid cooling box is closely attached to the wafer, and the liquid cooling box, heat sink, water tank and hydraulic pump are connected in series by an infusion tube, so that the cooling liquid can circulate between the above components, so When the coolant flows through the liquid-cooled box, it can exchange heat with the wafer, so that the energy can be dissipated. In addition to providing better heat dissipation effect than the old-style cooling fins, it can also bring the heat generated by the chip to a distance to reduce the heat energy in the computer; however, the liquid-cooled heat dissipation system is known for heat dissipation. The drain, water tank, hydraulic pump and fan are all independent and separated components.

第5頁 M275463 四、創作說明(2) _ 安裝或拆卸上都必須逐一 十分不便,而顯有其改進之Z要因此對於組裝或拆卸作業 本案創作人有鑑於此, 一 種液冷式散熱模組。 )加以研究創新,而揭示出一 【新型内容】 本新型之目的旨扃 括··一框體,含有一容置二一種液冷式散熱模組,係包 通風口,以連通兮交^ a f,並於其一側側板上,穿設有 容置室甲,該散^排含ί者二一散熱排,裝置於該框體之 上,歲套多數^ί ΐ 一熱交換管,並於該熱交換管 ^ 11 J5I Γ7 ^ L 風扇,鎖固於該框體上,且對正 π 4通風口之外側者;一 L餸上且耵止 -水箱,鎖固於該框體上者U,鎖固於該框體上者; 口端’以輸液管銜接至液水㊁之出 道出口,LV於V» — <水道進口,而液冷盒之水 埶交換# t ^官銜接至散熱排之熱交換管的入口,並使 出水口以輪液管銜接至液壓幫、、#”水口,而水相之 徵=所揭示之液冷式散熱模組,乃…下之 浦:3 士預叹有用以鎖接風扇、散熱排、水箱及液壓幫 P遺1 i「二=,使上述元件可以一併鎖接於該框體上,而 k遠框體緊附於電腦主機箱上。 :扇、散熱排、水箱及液壓幫浦,由於一併鎖接於框體 而成一完整之個體,組裝者可以一併自電腦主機箱 M275463 沒、創作說明(3) :移除,或安裝於電腦主機箱中,以增加組裝之便利性 本新型之可取實體, 由 以明晰之。由以下5兄明及所附各圖式,而得 【實施方式】 第—至五圖所示,本新型係有關於-種液冷式 月欠…、杈、、且,係包括:一框體(2〇), 政熱排(30),裝置於該框體(20)之容置室 換典nn'散熱山排⑽含有—熱交換管(31),並於該熱 又換s(3i)上,欺套多數鰭片(32)者;一風扇(4〇),鎖固 於该框體(2〇)上,且對正於該通風口(212)之外側者一 液壓幫浦(50)鎖固於該框體(2〇)上者;一水箱⑽),’鎖固 於该框體(20)上者;以及一液冷盒(7〇),緊貼於一埶源 壓盒⑺)内、設有一水道(72)者;其中;該液 壓幫浦(50)之出口端(51),以輸液管銜接至液Page 5 M275463 IV. Creation Instructions (2) _ Installation and disassembly must be very inconvenient one by one, and the improvement Z is obvious. Therefore, for the assembly or disassembly operation, the creator of this case has a liquid cooling module. . ) Research and innovation, and revealed a [new content] The purpose of this new model includes ... a frame, containing a liquid cooling module containing two kinds of liquid-cooled modules, air vents, to connect Xijiao ^ af, and on one side of the side panel, there is a housing chamber, the diffuser contains 212 heat sinks, is installed on the frame, most of them are a heat exchange tube, and The heat exchange tube ^ 11 J5I Γ7 ^ L fan is locked on the frame and aligned with the outside of the π 4 vent; one L is fixed on the frame and the water tank is locked on the frame U, which is fixed on the frame; the mouth end is connected to the outlet of the liquid water tank with an infusion tube, LV is at V »— < the water channel inlet, and the water exchange of the liquid cooling box is connected to The entrance of the heat exchange tube of the radiator row, and the water outlet is connected to the hydraulic port, # ”water port by the liquid pipe, and the sign of the water phase = the liquid-cooled heat dissipation module disclosed, is ... The taxi sigh is useful to lock the fan, heat sink, water tank and hydraulic pressure, so that the above components can be locked to the frame together, and the frame far away from k is tight. Attached to the computer main box .: The fan, radiator, water tank and hydraulic pump are integrated into the frame to form a complete unit. The assembler can also remove the computer main box M275463, creation instructions (3) : Remove or install in the computer main box to increase the convenience of assembly. This new type of desirable entity is made clear by the following 5 brothers and the attached drawings. As shown in the five figures, the new system is related to a liquid-cooled moon owe ..., a branch, and, the system includes: a frame (20), a political heat row (30), installed in the frame (20) The accommodating room is replaced with a heat exchanger tube (31) containing heat exchanger tubes (31), and the heat exchanger s (3i) is used to fool most of the fins (32); a fan (4), Locked on the frame (20), and a hydraulic pump (50) which is aligned on the outside of the vent (212) is locked on the frame (20); a water tank ⑽), 'The one which is fixed on the frame body (20); and one liquid cooling box (70), which is close to a 埶 source pressure box ⑺) and is provided with a water channel (72); Among them, the hydraulic pump ( 50) out End (51), to the solution to the infusion tube adapter

水道進口(721),而液冷盒(70)之水道出口(722):US 管銜接至散熱排(30)之熱交換管的入口(311),並 換官(31)之出口(312)以輸液管銜接至水箱(6〇)之進水= 障61),而水箱⑽)之出水口(62),以輸液f銜接至 浦(50)之吸水口(52),以構成一散熱循環者。 如第-、二圖所示,本新型所揭示之液冷式散熱模 組,其中該框體(2 〇 ),係含有··一本體(2 J ),於1 、Water inlet (721), and water outlet (722) of liquid cooling box (70): US pipe is connected to the inlet (311) of the heat exchange tube of the heat sink (30), and the outlet (312) of the official (31) is replaced Connect the infusion tube to the water inlet of the water tank (60) = barrier 61), and the water outlet (62) of the water tank ⑽) is connected to the water inlet (52) of Pu (50) with the infusion solution f to form a heat dissipation cycle By. As shown in Figures 2 and 2, the liquid-cooled heat dissipation module disclosed in the present invention, wherein the frame body (20) contains a body (2 J),

面,凹設一凹部,以形成該容置室(210),於該'容置室' |JSurface, a recess is recessed to form the accommodating chamber (210), and the 'accommodating chamber' | J

M275463 四、創作說明(4) ~ 一 "一— (2 1 0 )之相對兩側,分別相對地穿設有多數固定孔(2 11 ), 以鎖接散熱排(3 0 )於内,並於該本體(2丨)之第二側面,即 ,一側面之相對面,穿設有通風口(212),以連通該容置 至(210),且於邊本體(21)位於該通風口(212)之外圍,穿 設有多數風扇固定孔(213),以對應地鎖接一風扇(4〇), =於該本體(21)上穿設有水箱固定孔(214)及液壓幫浦固 定孔(2 1 5 ),以分別對應地鎖接一水箱(6 〇 )及液壓幫浦 (50)者;以及一蓋板(22)鎖接於該本體(21)之第一側面, 於忒蓋板(22)上,係設有通口(221),以連通該容置室 •(210),並於該蓋板(22)上,設有多數固定孔(222 ),以藉 螺絲鎖接於電腦主機箱(8 〇 )中,其中各該固定孔(2 2 2 )之 間距,係吻合、對應電腦主機箱(8〇)所預設用以鎖接一般 散熱風扇之孔距,使本新型所揭示之框體(2 〇 ),可以直接 鎖固於電腦主機箱(8 〇 )上,而可以將散熱排(3 〇 )、風扇 (4 0 )、液壓幫浦(5 0 )及水箱(6 0 ) —併緊附於電腦主機箱 (80)中。 本新型所揭示之液壓幫浦(5 0 ),於其外殼體,係鎖接 或突設有固定舌板(53),並穿設有穿孔(531),以對應該 框體(2 0 )之液壓幫浦固定孔(2 1 5 ),以藉螺絲將該液壓幫 _浦(50)緊鎖於該框體(20)之本體(21)上者。 本新型所揭示之水箱(6 0 ),於其外殼體,係鎖接或突 設有舌板部(63) ’並於該舌板部(63)上穿設有多數穿孔 (6 3 1)’以對應框體(2 0 )之水箱固定孔(21 4 ),以藉螺絲將 該水箱(60)鎖固於框體(20)上者。M275463 Fourth, the creation instructions (4) ~ one "(2 1 0) on the opposite sides of the two, respectively through a plurality of fixing holes (2 11), to lock the heat sink (3 0) inside, A ventilation opening (212) is penetrated on the second side of the body (2 丨), that is, the opposite side of one side, to communicate the accommodation to (210), and the side body (21) is located in the ventilation. The periphery of the port (212) is provided with a plurality of fan fixing holes (213) to correspondingly lock a fan (40). = The body (21) is provided with a water tank fixing hole (214) and a hydraulic helper. A fixing hole (2 1 5) to lock a water tank (60) and a hydraulic pump (50) respectively; and a cover plate (22) locked to the first side of the body (21), An opening (221) is provided on the cover plate (22) to communicate with the accommodation chamber (210), and a plurality of fixing holes (222) are provided on the cover plate (22) to borrow The screw is locked in the computer main box (80), and the distance between each of the fixing holes (22) is consistent with the hole distance preset to lock the general cooling fan corresponding to the computer main box (80). Make this new The disclosed frame (20) can be directly locked to the main computer case (80), and the heat sink (30), fan (40), hydraulic pump (50) and water tank can be locked. (60)-and tightly attached to the main computer case (80). The hydraulic pump (50) disclosed in the present invention is fixed or protrudingly provided with a fixed tongue plate (53) on the outer shell thereof, and is provided with a perforation (531) to correspond to the frame body (20) The hydraulic pump fixing hole (2 1 5) is used to fasten the hydraulic pump (50) to the main body (21) of the frame (20) by screws. The water tank (60) disclosed in the new model is locked or protruded with a tongue plate portion (63) 'in its outer shell, and a plurality of perforations (6 3 1) are passed through the tongue plate portion (63). 'The water tank fixing hole (21 4) corresponding to the frame body (20) is used to fix the water tank (60) to the frame body (20) by screws.

M275463 习、創作說明(5) 本新型所揭示之散熱排(30)、風扇(4〇)、 (5〇)、水箱(60)及液冷盒(70)等元件,其内部 習知技術,且已被普遍應用於一般之液中屬 ==之内部結構特徵,並非本新型專利;=, 故不予贅述。 本新型所揭示之液冷式散熱模組,其中該框體(2〇), 係可由金屬板材以扳金方式成型,或以塑 型,本新型並不予自限。 〇 了叶町成 如第三、四、五圖所* ’本新型所揭示之液冷式散埶 •权組,於應用上,係可將框體(2〇)固裝於如電腦主機箱 (,8〇)之箱體上,使固裝於框體(2〇)上之風扇(4〇),於啟動 後所產生之冷空氣流’可以吹向位於框體(2 〇 )容置室 (210)中之散熱排(30),而將散熱排(3〇)上之熱能,循框 體(20)第二側之通口(221),經電腦主機箱(8〇)的通氣孔 〔圖未不出〕,向外吹出電腦主機箱體(8 〇 )外,即將電腦 主機鈿體(8 0 )中的熱能,強制地排出電腦主機箱(8 〇 ) 以增進其散熱效率。 ^如第三、四、五圖所示,本新型所揭示之液冷式散熱 板組’於組裝上係可令該風扇(4 〇 )鎖接於該框體(2 〇 )之本 體(21 )之外側,使該風扇(4〇)於啟動後,其出風方向係吹 向置於框體(20)中之散熱排(30);或者如第六圖所示令 該風扇(40),係鎖接於該框體(2〇)之蓋板(22) 一側,以i 於該框體(20)與電腦主機箱(80)之間,於啟動該風扇(4〇) 後,以抽風的方式,如箭頭引線所示,將電腦主機箱(8㈧M275463 Study and Creation Instructions (5) The elements disclosed in this new model include radiators (30), fans (40), (50), water tanks (60), and liquid cooling boxes (70). And it has been widely used in the general internal structure characteristics of liquid ==, not the new patent; =, so it will not be repeated. The liquid-cooled heat-dissipation module disclosed in the present invention, wherein the frame body (20) is formed from a metal sheet by a gold pull method, or is molded, and the present invention is not self-limiting. 〇He Yecheng Cheng as shown in Figures 3, 4, and 5 * 'The liquid-cooled loose-body • power unit disclosed in this new model can be used to fix the frame (20) to a computer main box. (, 80) box, so that the fan (40) fixed on the frame (20), the cold air flow generated after the startup can be blown to the housing (20). The heat radiation bar (30) in the room (210), and the heat energy on the heat radiation bar (30) is passed through the port (221) on the second side of the frame (20), and passed through the computer main box (80). The air hole (not shown in the figure) blows out the main computer case (80) outside the computer main body (80) to forcibly exhaust the main computer case (80) to improve its heat dissipation efficiency. ^ As shown in the third, fourth, and fifth figures, the liquid-cooled heat-dissipating plate group disclosed in the new model 'is assembled so that the fan (40) can be locked to the body (21) of the frame (20). ) Outside, after the fan (40) is started, the direction of the wind blows toward the heat sink (30) placed in the frame (20); or as shown in the sixth figure, the fan (40) Is locked to the cover (22) side of the frame (20), i is between the frame (20) and the computer main box (80), and after the fan (4) is turned on, Using a ventilation method, as shown by the arrow lead, place the computer case (8㈧

M275463M275463

四、創作說明(6) 内之空氣,吸進框體(20)内,並竄入散熱排(3〇),而 風扇(40)吹向電腦主機箱⑻)外;本新型並: (40)裝置於框體(20)的位置者。 风屬 本新型所揭示之液冷式散熱模組,由於該散熱排 (30)、風扇(40)、液壓幫浦(5〇)及水箱(6〇)等元件, 併鎖固於框體(20)上,因此,使用者在安裝上,可以— 除上述各元件,因此可以使組裝或拆卸操作更力: |特徵所揭示之液冷式散熱模組’乃具有以下之結構 1 ·於框體上預設有用以鎖接風巵、 浦之固定孔,使上述水箱及液壓幫 隨該框體緊附於電腦主機箱上。 、。亥框體上,而 2 ·風扇、散熱排、水箱及液壓蜇者 匕,& & 一办敕+ : 幫浦由於一併鎖接於框體 成701之個體,組裝者可以一併自雷腦主機箱 中移除,或安裝於電腦主機箱中,以拼:自電細主械相 。 固风相干,以增加組裝之便利性 本新型所揭示之結構、元株彡 捽抽及筘於ΠΓ不攸从& 件I狀,可於不違本新塑之 精神及粑笮下予以修飾應用,本新型並不自限。Fourth, the creative instructions (6), the air is sucked into the frame (20) and channeled into the heat sink (30), while the fan (40) is blown out of the main computer box; the new model does not: (40 ) Installed at the position of the frame (20). The wind belongs to the liquid-cooled heat-dissipating module disclosed by the new model. Due to the heat-dissipating elements (30), fans (40), hydraulic pumps (50), and water tanks (60), they are locked to the frame ( 20), therefore, the user can-in addition to the above-mentioned components, make the assembly or disassembly operation more powerful: | The liquid-cooled heat dissipation module disclosed in the features has the following structure 1 The body is preset with fixing holes for locking the wind turbine and the pump, so that the water tank and the hydraulic helper are closely attached to the main computer box with the frame. . On the frame, 2 fans, radiators, water tanks, and hydraulic daggers, & & one office +: As the pump is locked to the frame 701, the assembler can also The Thunderhead mainframe is removed, or installed in the mainframe of the computer to fight: the main phase of self-electricity. Coherence with the wind to increase the convenience of assembly The structure disclosed by the new model, the original structure and the shape of the structure, can be modified without violating the spirit of the new model The application is not self-limiting.

M275463 圖式簡單說明 【圖式簡單說明】 第一圖 第二圖 第三圖 第四圖 第五圖 第六圖 係本新型之分解圖。 係本新型另一角度之分解圖。 係本新型之組合狀態示意圖。 :、f三圖之4 —4方向局部剖面圖。 係本新型應用於電腦主機箱中之厂、音 係本新型應用於電腦主機箱中=思圖。 意圖。 另一組裝方式示 元件符號簡單說明】 2 0 )框體 (210)容置室 P( 2 11 )固定孔 (212)通風口 (2 1 4 )水箱固定孔(2 1 5 )液壓幫浦 (22)蓋板 (2 2 1 )通 π (30)散熱排 (3 1 )熱交換管 (312)出口 (32)鰭片 (5 0 )液壓幫浦 (5 1 )出口端 (5 3)固定舌板 (531)穿孔 (6 1 )進水口 (6 2 )出水口 (6 31 )穿孔 (7 〇 )液冷盒 17 2)水道 (721)水道進口 (222)固定孔 (3 11 )入 π (40)風扇 (5 2 )吸水口 (6 0)水箱 (6 3 )舌板部 (71)熱源 (722)水道出口 (21)本體 (21 3 )風扇固定孔M275463 Schematic description [Schematic description] The first diagram The second diagram The third diagram The fourth diagram The fifth diagram The sixth diagram is an exploded view of the new model. It is an exploded view from another angle of the new model. It is a schematic diagram of the combination state of the new model. : Partial cross-sectional views in directions 4-4 of the three pictures of f. The new model is used in the computer main box, the sound is the new model is used in the computer main box = Situ. intention. Another assembly method shows a simple explanation of the component symbols] 2 0) frame body (210) accommodation room P (2 11) fixing hole (212) vent (2 1 4) water tank fixing hole (2 1 5) hydraulic pump ( 22) The cover plate (2 2 1) is fixed through π (30) heat sink (3 1) heat exchange tube (312) outlet (32) fin (50) hydraulic pump (5 1) outlet end (5 3) fixed Tongue plate (531) perforated (6 1) water inlet (6 2) water outlet (6 31) perforated (7 〇) liquid cooling box 17 2) water channel (721) water channel inlet (222) fixing hole (3 11) into π (40) Fan (5 2) Suction port (60) Water tank (63) Tongue plate (71) Heat source (722) Water outlet (21) Body (21 3) Fan fixing hole

Claims (1)

M275463M275463 l · 一種液冷式散熱模組,係包括: 框體:含有容置室’並於其一側側板上,穿設 口 ,以連通該容置室者; =排’裝置於該框體之容置室中,該散熱排含有熱交 換官,並於該熱交換管上,嵌套多數链 風扇,鎖固於該框體上,且對正於心風口之外側者; 液壓幫^,於其外殼體,係鎖接固定舌板,並穿設有穿 孔,以藉螺絲穿經後,鎖接於該框體上者; 水箱’於其外殼體’係鎖接有舌板部,並於該舌板部上 ,穿設有多數穿孔,以藉螺絲穿經後,鎖接於該框體上者 液冷盒,緊貼於熱源上,該液冷盒内設有水道者;其中 令該液壓幫浦之出口端,以輸液管銜接至液冷盒之水道 進口始:液冷盒之水道出口 ’以輸液管銜接至散熱排之 熱3換官的入口,並使熱交換管之出口以輸液管銜接至 水粕之進水口 ’巾水相之出水口,以輸液管銜接至液壓 幫浦之吸水口者。 2·如申請專利範圍第1項所述之液冷式散熱模組,其中該 框體係含有:本體,於其第一側面,凹設凹部,以形成 •該谷置至’於該容置室之相對兩側,分別相對地穿設有 多數固定孔,以鎖接散熱排於内,並於該本體之第二側 面,即第一侧面之相對面,穿設有通風口,以連通該容 置室,且於該本體位於該通風口之外圍,穿設有多數風 扇固定孔’以對應地鎖接風扇,另於該本體上穿設有水l · A liquid-cooled heat-dissipation module, comprising: a frame body containing a containing chamber 'and a side plate on one side thereof, through which openings are connected to communicate with the containing chamber; In the accommodating room, the heat sink includes a heat exchange officer, and a plurality of chain fans are nested on the heat exchange tube, which are locked on the frame and aligned with the outside of the heart air vent; The outer shell is locked and fixed with a tongue plate, and is provided with a perforation to lock the frame body after passing through the screw; the water tank 'on its outer shell' is locked with a tongue plate portion, and The tongue plate part is provided with a plurality of perforations, so that the liquid-cooled box on the frame is fastened to the heat source after passing through the hole, and the liquid-cooled box is provided with a water channel; The outlet end of the hydraulic pump is connected to the water channel inlet of the liquid cooling box by an infusion tube: the water channel outlet of the liquid cooling box is connected to the heat inlet of the radiator by the infusion tube, and the outlet of the heat exchange tube is The infusion tube is connected to the water inlet of the water meal and the water outlet of the water phase, and the infusion tube is connected to the suction of the hydraulic pump. Mouth person. 2. The liquid-cooled heat dissipation module according to item 1 of the scope of the patent application, wherein the frame system includes: a body, a concave portion is recessed on the first side thereof to form the valley to be placed in the accommodation room On the opposite sides, a plurality of fixing holes are respectively penetrated to lock the heat dissipation row inside, and a vent is formed on the second side of the body, that is, the opposite side of the first side, to communicate with the container. A room is installed, and the body is located at the periphery of the vent, and is provided with a plurality of fan fixing holes' to lock the fans correspondingly, and water is provided on the body. M275463 五、申請專利範圍 箱固定孔及液壓幫浦固定孔,以分別對應地鎖接水箱及 液壓幫浦者;以及蓋板,鎖接於該本體之第一側面,於 該蓋板上係設有通口,以連通該容置室,並且於該蓋板 上,設有多數固定孔,以便藉螺絲鎖接於電腦主機箱中 者。 3.如申請專利範圍第2項所述之液冷式散熱模組,其中該 蓋板之各該固定孔之間距,係吻合、對應電腦主機箱所 預設用以鎖接一般散熱風扇之孔距者。M275463 V. Patent application scope Box fixing hole and hydraulic pump fixing hole to lock the water tank and hydraulic pump respectively; and a cover plate, which is locked on the first side of the body, and is set on the cover plate There are openings to communicate with the accommodating room, and the cover plate is provided with a plurality of fixing holes for being screwed into the computer main body box by screws. 3. The liquid-cooled heat dissipation module according to item 2 of the scope of the patent application, wherein the distance between each of the fixing holes of the cover plate is consistent and corresponds to the hole preset for the computer main box to lock a general cooling fan. Distance 第13頁Page 13
TW94207273U 2005-05-06 2005-05-06 Liquid cooling heat dissipation module TWM275463U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94207273U TWM275463U (en) 2005-05-06 2005-05-06 Liquid cooling heat dissipation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94207273U TWM275463U (en) 2005-05-06 2005-05-06 Liquid cooling heat dissipation module

Publications (1)

Publication Number Publication Date
TWM275463U true TWM275463U (en) 2005-09-11

Family

ID=37008500

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94207273U TWM275463U (en) 2005-05-06 2005-05-06 Liquid cooling heat dissipation module

Country Status (1)

Country Link
TW (1) TWM275463U (en)

Similar Documents

Publication Publication Date Title
TWI302242B (en) Liquid cooling jacket
TWI257838B (en) Cooling device and electronic equipment
US20060021737A1 (en) Liquid cooling device
US20060185378A1 (en) Liquid-cooling heat dissipation assembly
TW201251591A (en) Computer case
TW200421073A (en) System and method for cooling an electronic device
JP2003152376A (en) Electronic equipment
US7013959B2 (en) Integrated liquid cooling system for electrical components
TW200903236A (en) Heat dissipation module
TWM508885U (en) Electronic device and the liquid cooling type heat dissipation structure thereof
US20230164947A1 (en) Water cooler assembly and system
TWM275463U (en) Liquid cooling heat dissipation module
JP2007004765A (en) Liquid-cooled computer device
TWM628952U (en) Liquid-cooling type heat dissipation module
CN211607189U (en) Liquid cooling device with pumping structure
JP2003008274A (en) Electronic apparatus system
KR200425267Y1 (en) Water-cooling heat dissipation device
TWI300894B (en) Thermal module
TWI312653B (en) Heat dissipation device
TWI711367B (en) Heat dissipation system
TWI300691B (en) Heat sink and liquid-cooling apparatus employing the same
JP2005353098A (en) Heat transport device
JP3982936B2 (en) Heat dissipation structure for electronic elements
TW202130256A (en) Liquid cooling device with pump structure
JPH10107469A (en) Cooling device for heat accumulated part and electronic device

Legal Events

Date Code Title Description
MK4K Expiration of patent term of a granted utility model