TWM267509U - Improved structure of heat exchange radiator - Google Patents

Improved structure of heat exchange radiator Download PDF

Info

Publication number
TWM267509U
TWM267509U TW093217603U TW93217603U TWM267509U TW M267509 U TWM267509 U TW M267509U TW 093217603 U TW093217603 U TW 093217603U TW 93217603 U TW93217603 U TW 93217603U TW M267509 U TWM267509 U TW M267509U
Authority
TW
Taiwan
Prior art keywords
heat exchange
heat
longitudinal
side plate
chamber
Prior art date
Application number
TW093217603U
Other languages
Chinese (zh)
Inventor
Rung-Feng Huang
Jr-Jian Huang
Original Assignee
Forward Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Forward Electronics Co Ltd filed Critical Forward Electronics Co Ltd
Priority to TW093217603U priority Critical patent/TWM267509U/en
Priority to JP2004369179A priority patent/JP2006132913A/en
Priority to US11/052,029 priority patent/US20060090888A1/en
Publication of TWM267509U publication Critical patent/TWM267509U/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/0233—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with air flow channels
    • F28D1/024—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with air flow channels with an air driving element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
    • F28D1/05316—Assemblies of conduits connected to common headers, e.g. core type radiators
    • F28D1/05341—Assemblies of conduits connected to common headers, e.g. core type radiators with multiple rows of conduits or with multi-channel conduits combined with a particular flow pattern, e.g. multi-row multi-stage radiators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/0202—Header boxes having their inner space divided by partitions
    • F28F9/0204—Header boxes having their inner space divided by partitions for elongated header box, e.g. with transversal and longitudinal partitions
    • F28F9/0209—Header boxes having their inner space divided by partitions for elongated header box, e.g. with transversal and longitudinal partitions having only transversal partitions
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/04—Arrangements for sealing elements into header boxes or end plates
    • F28F9/16—Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling
    • F28F9/18—Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling by welding
    • F28F9/182—Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling by welding the heat-exchange conduits having ends with a particular shape, e.g. deformed; the heat-exchange conduits or end plates having supplementary joining means, e.g. abutments
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0031—Radiators for recooling a coolant of cooling systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

M267509 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱器改良結構，尤指一種適用於 熱交換式散熱器改良結構。 【先前技術】 請參閱圖1，係習知液冷式電腦散熱裝置之系統架構 圖’如圖所示的液冷式電腦散熱器3，係架設於集熱器2之 後並與集熱器2結合成一液冷循環系統，當集熱器2吸收 10 了電細中央處理器（CPU)l的熱能後，帶有熱能的液體會被 运到散熱器3進行散熱，經過散熱後的液體再被送回到集熱 為2，形成循環。簡單來說，其作用係將電腦中央處理器 (CPU)l所發出的熱能散掉。 «月芩閱圖2 ’係習知液冷式電腦散熱裝置之立體圖， 15如圖所不，習知的散熱器3，因受限於傳熱導管^之彎折& 角331及傳熱導官33的排列方式，使得散熱器3的散熱籍片 32契傳熱導官33之接觸面積變小，亦使得散㈣心與風 扇31之間的吹拂面積變小，造成散熱器3的散熱效果無法充 分發揮，而非十分理想。 20 【新型内容】 μ士 Γίί上述之問題，本創作之—種熱交換式散熱器改 :彼此二？炅數個松向平行排列之散熱鰭片，其並沿縱 向彼此間隔—特定㈣，且每—散熱鰭片上開設有彼此對 M267509 應=複數個縱向通孔；複數個熱交換管，係分別縱向穿設 於每政熱鰭片之縱向通孔内；一上側板，係平行組設於 政熱·鰭片之第—縱向外側，且上側板開設有複數個縱向貫 孔其係分別對應套設並密封於熱交換管之上端外壁；一下 側板’係平行組設於散㈣片之第二縱向相，且下側板 ，設有複數個縱向穿孔其係分騎應套設並密封於熱交換 官之下蜱外壁；一上蓋，係密封罩蓋於上側板上，並於二 者間形成一上容室；以及一下蓋’係密封罩蓋於下側 並於二者間形成一下容室。 ίο 15 八中上合至包括有稷數個上隔板並將之分隔為 個密閉的上部小容室，且下衮宮勺紅士〜 I-马稷數 包括有讀個下隔板並將 之刀隔為複數個密閉的下部小容室；並且，上部小容 中之—係與至少一熱交換管之上端相互連通，且此 熱父換管之下端並連通到其中一下 丽述之其中一下部小容室再與至少一另一^又 相互連通，並且此至W、笔^ ^ …又換S之下端 如γ另—熱讀管之上端再連通至下 一個上部小容室内。 、王卜 ^ 、行 …u工π丨眾熱交換管之彎角之訊 =其所造成之問題，且可使得散熱㈣與熱交換管^ ，敢大的接觸面積，當再於散熱鰭片之-側加設-風; ::::增加風扇的吹拂面積’提升其散熱效果。此外羽 …、乂換官因去除彎角之設計，而可 片之中，相董+带忐^ ^ ^ 在集的排列於散熱鰭 對❿成一费集的液冷通路，使液體於熱交換管 20 M267509 中行進的路捏姆 增力…一;升=留在熱交換管内的時間〜 設有一入::之::=:熱::良結構，其下蓋係可開 容室之其中之一，+ ，、—者係可連通至下部小 之上蓋上，亦可將人水°與出水口分別開設在同側 /λ "为別開設在不同側之上蓋或下蓋上。 【實施方式】 10 15 例之：二：=1圖:、及圖5 ’係分別為本創作-較佳實施 …又、工散熱器改良結構之立體分解圖、本創作-較 土貫施例之熱交換式散熱器改良結構之立體組合圖、及本 創作-較佳實施例之熱交換式散熱器改良結構之剖視圖， 如圖所不’其中顯示有—熱交換式散熱器改良結構5,且盆 包括有複數個散熱鰭片53、複數個熱交換管54、一上側板 53卜-下側板532、一上蓋51、一下蓋52、以及一散熱風 扇55。其中，複數個散熱鰭片53係彼此橫向平行排列、並 沿縱向彼此間隔一特定距離，且每一散熱鰭片53上開設有 彼此對應之複數個縱向通孔53〇。 此外，複數個熱交換管54係分別縱向穿設於前述之縱 2〇向通孔53〇内；上側板53丨係平行組設於複數個散熱鰭片53 之第一縱向外側，於本實施例中，係位於散熱鰭片53之最 上側，且上側板531開設有複數個縱向貫孔5311，其係分別 對應套设並密封於熱交換管5 4之上端外壁；下側板5 3 2係平 行組設於複數個散熱鰭片53之第二縱向外側，於本實施例 M267509 中，係位於散熱鰭片53之最下側，且下側板532開設有複數 個縱向牙孔5321其係分別對應套設並密封於前述熱交換管 54之下端外壁；至於散熱風扇55則係組設於複數個散熱鰭 片53之一側緣。 5 請繼續參閱圖3、圖4、及圖5,如圖所示，上蓋51係密 封罩盍於上側板53丨上，並於二者間形成一上容室56〇 ;而 下盖52係密封罩蓋於下側板532下，並於二者間形成一下容 室 570 〇 此外，上容室560包括有複數個上隔板56並將之分隔為 ίο稷數個密閉的上部小容室561，且下容室57〇包括有複數個 下隔板57並將之分隔為複數個密閉的下部小容室57ι ;因 ,，上部小容室561之其中之一係與上述一熱交換管M之上 端相互連通，此熱交換管54之下端並連通到其中一下部小 容室571内，又此下部小容室571再與另一熱交換管54之下 15端相互連通，並且此另一熱交換管54之上端再連通至下一 個上部小容室561内，又此下一個上部小容室561再與一又 一熱父換官54之上端相互連通，此又一熱交換管54之下端 再連通至下一個下部小容室571内，依此類推。 在本例中下蓋52係各別開設有一入水口 521及一出水 20 口 522其係分別連通至下部小容室571之最外二側，促使一 液體能沿著下部小容室57卜熱交換管54、上部小容室Mb 另-熱交換管54、下_個下部小容室571···作單向流動；本 例之入水口 521與出水口 522不可同時開設在同一個上部小 容室561、或同-個下部小容室571，但可以分別開設在同 M267509 側之上蓋5丨或下蓋52上，亦可分別開設在不同側之上蓋5i 或下蓋52上。 v 本例中，如圖5所示，複數個熱交換管54之上端及下端 係分別凸設有一擴徑之上肩部541與下肩部542，其二者係 5分別擋止於上側板531之複數個縱向貫孔53ιι之第一縱向 外側、及下侧板532之複數個縱向穿孔53β之第二縱向外 側。 本例之散熱鰭片53係分別為一鋁片，而熱交換管54、 上側板531、下側板532、上蓋51、下蓋辦均係分別由銅 10所製成’並且本例所使用之密封手段，係將一鱗鋼焊棒加 熱炼化呈液態流體狀後並能自行流動，並使其經由毛細孔 擴散現象自行填入二銅件之間隙内，俾經冷卻而加以密 住其間隙。 ^ 藉由上述結構，可完全免除熱交換管54之彎角之設計 15及其所造成之問題，且可使得散熱續片53與熱交換管= 間有最大的接觸面積，同時散熱風扇55的吹拂面積可增 加，如此可提升其散熱效果。此外，熱交換管神去除彎 角之設計，而可很密集的排列於散熱鰭片53之中，相對形 成-密集的液冷通路，使液體於熱交換管54中行進的路徑 20增長，即液體停留在熱交換管54内的時間可以增加，如2 亦可提升散熱效果。 上述實施例僅係為了方便說明而舉例而已，本創作所 主張之權利範圍自應以申請專利範圍所述為準，而非僅限 於上述貫施例。 M267509 【圖式簡單說明】 圖1係習知液冷式電腦散熱裝置之系統架構圖。 圖2係習知液冷式電腦散熱裝置之立體圖。 圖3係本創作-較佳實施例之熱交換式散熱器改良結構之 立體分解圖。 10 圖4係本創作一較佳實施例 立體組合圖。 圖5係本創作一較佳實施例 剖視圖。 熱交換式散熱器改良結構之 熱交換式散熱器改良結構之 【主要元件符號說明】 電腦中央處理器（CPU)1 液冷式電腦散熱器3 散熱鰭片32 熱父換式散熱器改良結構5 入水口 521 通孔530 下側板532 上肩部5 41 上隔板5 6 下隔板57 集熱器2 風扇31 傳熱導管33 彎折R角331 上蓋51 下蓋52 出水口 522 散熱鰭片53 上側板531 貫孔53 11 穿孔5321 熱交換管54 下肩部542 散熱風扇5 5 上容室560 上部小容室561 下容室570 下部小容室571M267509 8. Description of the new type: [Technical field to which the new type belongs] This creation relates to an improved structure of a heat sink, especially an improved structure suitable for a heat exchange type heat sink. [Prior art] Please refer to FIG. 1, which is a system architecture diagram of a conventional liquid-cooled computer cooling device. The liquid-cooled computer radiator 3 shown in the figure is installed behind the heat collector 2 and connected with the heat collector 2 Combined into a liquid-cooled circulation system, when the heat collector 2 absorbs 10 heat energy of the electric central processing unit (CPU) 1, the liquid with the heat energy will be transported to the radiator 3 for heat dissipation, and the liquid after heat dissipation will be again Return to the heat collection of 2 to form a cycle. In simple terms, its role is to dissipate the heat generated by the computer's central processing unit (CPU). «Monthly reading Figure 2 'is a perspective view of a conventional liquid-cooled computer cooling device, 15 as shown in the figure, and the conventional heat sink 3 is limited by the bending of the heat transfer tube ^ & angle 331 and heat transfer The arrangement of the guide 33 makes the contact area of the heat transfer guide 33 of the heat sink 3 32 of the heat sink 3 smaller, and also makes the blowing area between the diffuser and the fan 31 smaller, causing the heat dissipation of the heat sink 3 The effect is not fully realized, but it is not ideal. 20 [New content] μShi ΓίίThe above question, the creation of this kind-a heat exchange type radiator change: two each other?炅 Several loose fins arranged in parallel in parallel and spaced apart from each other in the longitudinal direction—specific ㈣, and each—the heat fins are provided with pairs of M267509 corresponding to each other; a plurality of longitudinal through holes; a plurality of heat exchange tubes, each longitudinally Perforated in the longitudinal through holes of each political heat fin; an upper side plate is arranged in parallel to the first-longitudinal outer side of the political heat · fin, and the upper side plate is provided with a plurality of vertical through holes, which are respectively correspondingly set And sealed to the outer wall of the upper end of the heat exchange tube; the lower side plate is a second longitudinal phase grouped in parallel to the scattered piece, and the lower side plate is provided with a plurality of longitudinal perforations; The outer wall of the lower tick; an upper cover, which is a sealing cover on the upper side plate, and forms an upper containing room therebetween; and a lower cover, which is a sealing cover on the lower side and forms a lower containing room therebetween. ίο 15 The upper middle of the eighth high school includes several upper partitions and divides them into a closed upper small compartment, and the lower palace palace spoon reds ~ I-horse number includes reading a lower partition and The knife compartment is a plurality of closed lower small chambers; and, in the upper small chamber, it is connected to the upper end of at least one heat exchange tube, and the lower end of the heat exchange tube is connected to the lower one of them. A lower small chamber is in communication with at least one other ^, and from this point, W, pen ^ ^, and then the lower end of S is changed to γ, the upper end of the thermal reading tube is then connected to the next upper small chamber. ， 王 卜 ^ ， 行 ... u 工 π 丨 The angle of the heat exchange tube = the problem it caused, and it can make the heat sink ㈣ and the heat exchange tube ^, dare to have a large contact area, and then the heat sink fin Zhi-side installation-wind; :::: Increase the blowing area of the fan 'to improve its cooling effect. In addition, the feathers ..., 乂 change the official design because of the removal of the corners, but in the film, the phase of the + + 忐 ^ ^ ^ in the set arranged on the heat sink fins to form a cost-efficient liquid cooling path, so that the liquid in heat exchange Luminum boosting in tube 20 M267509 ... I; liter = time to stay in the heat exchange tube ~ There is one inlet :: of :: =: heat :: good structure, the lower cover of which can open the capacity room One, + ,,-can be connected to the lower small cover, or the water and the water outlet can be opened on the same side / λ " for different sides on the upper or lower cover. [Implementation] 10 15 Example: Two: = 1 Figure: and Figure 5 'are respectively the creation of this invention-a better implementation ... and a three-dimensional exploded view of the improved structure of the industrial radiator, this creation-a more conventional example A three-dimensional combined drawing of the improved structure of the heat exchange type radiator, and a sectional view of the improved structure of the heat exchange type radiator of the present invention-preferred embodiment, as shown in the figure, which shows the improved structure of the heat exchange type radiator 5, The basin includes a plurality of heat dissipation fins 53, a plurality of heat exchange tubes 54, an upper side plate 53 and a lower side plate 532, an upper cover 51, a lower cover 52, and a heat dissipation fan 55. Wherein, the plurality of heat dissipation fins 53 are arranged parallel to each other horizontally and spaced apart from each other by a specific distance in the longitudinal direction, and each heat dissipation fin 53 is provided with a plurality of longitudinal through holes 53 corresponding to each other. In addition, the plurality of heat exchange tubes 54 are respectively longitudinally disposed in the aforementioned longitudinal 20-direction through hole 53; the upper side plate 53 is arranged in parallel to the first longitudinal outer side of the plurality of heat dissipation fins 53, and is implemented in this embodiment. In the example, it is located on the uppermost side of the heat dissipation fins 53, and the upper side plate 531 is provided with a plurality of longitudinal through holes 5311, which are respectively correspondingly sleeved and sealed to the outer wall of the upper end of the heat exchange tube 5 4; the lower side plate 5 3 2 is The parallel group is disposed on the second longitudinal outer side of the plurality of heat dissipation fins 53. In this embodiment M267509, it is located at the lowermost side of the heat dissipation fins 53, and the lower side plate 532 is provided with a plurality of longitudinal perforations 5321, which respectively correspond to The outer wall of the lower end of the heat exchange tube 54 is sleeved and sealed, and the cooling fan 55 is arranged on one side edge of the plurality of heat dissipation fins 53. 5 Please continue to refer to FIG. 3, FIG. 4, and FIG. 5. As shown in the figure, the upper cover 51 is a sealing cover on the upper side plate 53 丨, and an upper chamber 56 is formed therebetween; and the lower cover 52 is The sealing cover is covered under the lower side plate 532 and forms a lower container 570 therebetween. In addition, the upper container 560 includes a plurality of upper partitions 56 and partitions them into several closed upper small containers 561. The lower storage chamber 57 includes a plurality of lower partitions 57 and divides them into a plurality of closed lower small storage chambers 57 ι; therefore, one of the upper small storage chambers 561 is connected to the heat exchange tube M described above. The upper ends communicate with each other. The lower end of this heat exchange tube 54 is connected to the lower small volume chamber 571, and the lower small volume chamber 571 communicates with the 15 lower ends of the other heat exchange tube 54. The upper end of the heat exchange tube 54 communicates with the next upper small chamber 561, and the next upper small chamber 561 communicates with the upper end of the heat exchanger 54, which is another heat exchange tube 54. The lower end communicates with the next lower small chamber 571, and so on. In this example, the lower cover 52 is provided with a water inlet 521 and a water outlet 20 522 respectively, which are respectively connected to the outermost two sides of the lower small chamber 571, so that a liquid can be heated along the lower small chamber 57 The exchange tube 54 and the upper small storage chamber Mb. The heat exchange tube 54 and the next lower small storage chamber 571 ... are used for one-way flow. In this example, the water inlet 521 and the water outlet 522 cannot be opened at the same time. The storage room 561 or the same lower small storage room 571 can be respectively opened on the upper cover 5 丨 or the lower cover 52 on the same M267509 side, and can also be respectively opened on the upper cover 5i or the lower cover 52 on different sides. v In this example, as shown in FIG. 5, the upper end and the lower end of the plurality of heat exchange tubes 54 are respectively provided with an enlarged upper shoulder 541 and a lower shoulder 542, both of which are blocked by the upper side plate 5 respectively. The first longitudinal outer side of the plurality of longitudinal through holes 53m in 531 and the second longitudinal outer side of the plurality of longitudinal holes 53β in the lower side plate 532. The heat dissipation fins 53 in this example are each an aluminum sheet, and the heat exchange tubes 54, the upper side plate 531, the lower side plate 532, the upper cover 51, and the lower cover office are all made of copper 10 'and used in this example. The sealing method is that a scale steel welding rod is heated and refined into a liquid state and can flow by itself, and it is filled into the gap between the two copper parts by capillary diffusion, and then the gap is sealed after cooling. . ^ With the above structure, the design of the corner 15 of the heat exchange tube 54 and the problems caused by it can be completely eliminated, and the maximum contact area between the heat sink fin 53 and the heat exchange tube = can be eliminated, and the The blowing area can be increased, which can improve its heat dissipation effect. In addition, the heat exchange tube is designed to remove the corners, and can be densely arranged in the heat dissipation fins 53 to relatively form a dense liquid cooling path, so that the path 20 of the liquid traveling in the heat exchange tube 54 increases, that is, The time that the liquid stays in the heat exchange tube 54 can be increased, such as 2 can also improve the heat dissipation effect. The above embodiments are just examples for convenience of explanation. The scope of the rights claimed in this creation shall be based on the scope of the patent application, rather than being limited to the above-mentioned embodiments. M267509 [Schematic description] Figure 1 is a system architecture diagram of a conventional liquid-cooled computer cooling device. FIG. 2 is a perspective view of a conventional liquid-cooled computer cooling device. FIG. 3 is an exploded perspective view of the improved structure of the heat exchange type heat sink of the present invention-preferred embodiment. 10 Figure 4 is a three-dimensional combination diagram of a preferred embodiment of the present invention. Fig. 5 is a sectional view of a preferred embodiment of the present invention. Improved structure of heat exchange type heat sink Improved structure of heat exchange type heat sink [Description of main component symbols] Computer central processing unit (CPU) 1 Liquid-cooled computer heat sink 3 Heat sink fins 32 Water inlet 521 through hole 530 lower side plate 532 upper shoulder 5 41 upper partition 5 6 lower partition 57 collector 2 fan 31 heat transfer pipe 33 bent R angle 331 upper cover 51 lower cover 52 water outlet 522 heat sink fin 53 Upper side plate 531 Through hole 53 11 Perforation 5321 Heat exchange tube 54 Lower shoulder 542 Cooling fan 5 5 Upper chamber 560 Upper chamber 561 Lower chamber 570 Lower chamber 571

Claims (1)

M267509 九、申請專利範圍： \ 1 · 種熱父換式散熱器改良結構，包括·· 複數個散熱鰭片，其係彼此橫向平行排列、並沿縱向 5 彼此間隔-特定距離，且每一散熱鰭片上開設有彼此對應 之複數個縱向通孔； 内；複數個熱交換管’其係分別縱向穿設於該等縱向通孔 10 -上側板，係平行組設於該等散熱.續片之第—縱向外 貝’，且该上侧板開設有複數個縱向貫孔其係 並密封於該等熱交換管之上端外壁； 心#°又 一下側板，卿行組設於該#散制片 =該，開設:複數個縱向穿孔其係分應= 亚饴封於5亥專熱父換管之下端外壁； ’、、 15 一上盍，係密封罩蓋於該上側 一上容室；以及 j板上並於二者間形成 下盍，係密封罩蓋於該下側板 一下容室； j孜卜亚於二者間形成 其特徵在於： 口亥上谷室包括有複數個上 分隔為複數個密閉的下部小容室；並且 阳板亚將之 該等上部小容室中至少其中 之上端相互連通，該 ’、/、至少一熱交換管 -下部小容室内，又;：中熱爾之下端並連通到其中 亥其中-下部小容室再與至少—另一 11 M267509 熱父換管之下端相互連通 5 10 15 上端再連通至下—個上部小容室内/另一熱父換官之 社構2.复如由申請專利範圍第1項所述之熱交換式散熱器改良 部小容室之其中之―。 其料通至該等下 社構3.1如/請專·㈣1項料之熱交換式散熱器改良 ;二;:其=細核有-出水口其係連通至該等下 牡構4，.Λ申請專利範圍第1項所述之熱交換式散熱器改良 :籌-中’該等熱交換管之上端係分別凸設有—㈣之 向=其係分別擋止於該上側板之該等縱向貫孔之第一縱 社姓 、处'^熱父換式散敎哭S 其中’該等熱交換管之下端係分別凸設有 向：：其係分別措止於該下側板之該等縱向穿孔之第: 6. 結構， 侧緣。 如申請專利範圍第1項所述 其更包括有一散熱風扇，係 之熱交換式散熱器改良 組設於該等散熱鰭片之M267509 Nine, patent application scope: \ 1 · Improved structure of a heat-replaceable heat sink, including a plurality of heat dissipation fins, which are arranged parallel to each other horizontally and spaced apart from each other along the longitudinal direction-a specific distance, and each heat dissipation The fins are provided with a plurality of longitudinal through holes corresponding to each other; inside; a plurality of heat exchange tubes' which are longitudinally passed through the longitudinal through holes 10-upper side plates, respectively, and are arranged in parallel in the heat dissipation. No. 1-longitudinal outer shell, and the upper side plate is provided with a plurality of longitudinal through-holes, which are sealed to the outer walls of the upper ends of the heat exchange pipes; = Yes, open: a plurality of longitudinal perforations and their respective components should be equal to = Aya sealed on the outer wall of the lower end of the heat-exchange parent tube of 5H; ',, 15 is closed, and a sealing cover is placed on the upper side of an upper chamber; and A lower chin is formed on the j plate and between them, and a sealing cover covers the lower chamber of the lower side plate; j Ziya is formed between the two. Its characteristics are as follows: The upper valley chamber of the mouth includes a plurality of upper partitions. Hermetically sealed lower chamber; and Connect at least one of the upper small chambers to the upper end of each other, the ', /, at least one heat exchange tube-the lower small chamber, and; The room is connected to at least—another 11 M267509 lower end of the hot parent tube 5 10 15 The upper end is connected to the next—the upper small capacity room / another hot parent office structure One of the small-capacity rooms of the heat-exchanger-type radiator improvement unit according to item 1-. It is expected to pass through to the lower social structure 3.1 such as / please make the heat exchange radiator improvement of item 1; II ;: it = fine core with-water outlet, it is connected to the lower structure 4, .Λ The heat exchange type radiator improvement described in item 1 of the scope of the patent application: Chip-Medium 'The upper ends of these heat exchange tubes are respectively convexly provided-the direction of 其 = which is the longitudinal direction of the upper side plate respectively The first through-hole surname of the first vertical company, the place of the hot-swappable parent, where the lower ends of the heat exchange tubes are respectively convex: they are respectively fixed to the longitudinal directions of the lower side plate. Number of perforations: 6. Structure, side edges. As described in item 1 of the scope of the patent application, it further includes a cooling fan, which is an improved heat exchange type heat sink set on the cooling fins. 1212
TW093217603U 2004-11-03 2004-11-03 Improved structure of heat exchange radiator TWM267509U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW093217603U TWM267509U (en) 2004-11-03 2004-11-03 Improved structure of heat exchange radiator
JP2004369179A JP2006132913A (en) 2004-11-03 2004-12-21 Heat exchange type cooler
US11/052,029 US20060090888A1 (en) 2004-11-03 2005-02-08 Heat-exchange type cooler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093217603U TWM267509U (en) 2004-11-03 2004-11-03 Improved structure of heat exchange radiator

Publications (1)

Publication Number Publication Date
TWM267509U true TWM267509U (en) 2005-06-11

Family

ID=36260470

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093217603U TWM267509U (en) 2004-11-03 2004-11-03 Improved structure of heat exchange radiator

Country Status (3)

Country Link
US (1) US20060090888A1 (en)
JP (1) JP2006132913A (en)
TW (1) TWM267509U (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI304814B (en) * 2001-05-10 2009-01-01 Sumitomo Chemical Co
US20080179041A1 (en) * 2007-01-31 2008-07-31 Man Zai Industrial Co., Ltd. Heat dissipating device for heat dissipation of an electronic component
CN101158525A (en) * 2007-09-11 2008-04-09 东莞高宝铝材制品厂有限公司 Condensator and heat radiation net of integrated molding fin type aluminium alloy compound material seamless micropore heat radiating fin
US9927181B2 (en) * 2009-12-15 2018-03-27 Rouchon Industries, Inc. Radiator with integrated pump for actively cooling electronic devices
US20110214842A1 (en) * 2010-03-05 2011-09-08 Lea-Min Technologies Co., Ltd. Heat sink
DE202010007533U1 (en) * 2010-06-02 2010-08-19 Tfc Cooling Products E.K. heat exchangers
DE102011003609A1 (en) * 2011-02-03 2012-08-09 J. Eberspächer GmbH & Co. KG Finned tube heat exchanger
DE102011076871A1 (en) * 2011-06-01 2012-12-06 Trumpf Laser- Und Systemtechnik Gmbh Heat exchanger for a gas laser and gas laser with it
US11480398B2 (en) * 2015-05-22 2022-10-25 The Johns Hopkins University Combining complex flow manifold with three dimensional woven lattices as a thermal management unit
TWI634304B (en) * 2016-03-01 2018-09-01 雙鴻科技股份有限公司 A water cooling device
KR200494468Y1 (en) * 2017-02-23 2021-10-18 엘에스일렉트릭(주) Cooling system using modular cooling apparatus
EP3410054B1 (en) 2017-05-30 2022-10-26 Ge Avio S.r.l. Additively manufactured heat exchanger
CN110230938B (en) * 2018-03-06 2024-07-19 山东豪迈化工技术有限公司 Heat exchange device and microreactor

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3749621A (en) * 1971-06-09 1973-07-31 Fluorodynamics Inc Securing and/or forming of coverings and the like of tetrafluorinated ethylene and fluorinated ethylene polymers
US4198739A (en) * 1976-05-19 1980-04-22 Rodel, Inc. Printing roller with polymeric coner and method of making the same
SE411862B (en) * 1977-12-19 1980-02-11 Flink Axel Birger SET AND DEVICE TO MAKE SUCCESSFUL BY TWO WELDING WELDING UNITS
US4358887A (en) * 1980-04-04 1982-11-16 Creps John A Method for galvanizing and plastic coating steel
DE3240225C2 (en) * 1982-10-29 1984-08-30 Automation Industrielle S.A., Vouvry Packing room
US5275232A (en) * 1993-03-15 1994-01-04 Sandia National Laboratories Dual manifold heat pipe evaporator
JPH07151488A (en) * 1993-11-29 1995-06-16 Sanden Corp Heat exchanger and manufacture thereof
US5940270A (en) * 1998-07-08 1999-08-17 Puckett; John Christopher Two-phase constant-pressure closed-loop water cooling system for a heat producing device
EP1035398B1 (en) * 1999-03-05 2004-01-14 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
TW556328B (en) * 2001-05-11 2003-10-01 Denso Corp Cooling device boiling and condensing refrigerant
US20040142135A1 (en) * 2003-01-21 2004-07-22 3M Innovative Properties Company Fuel management system comprising a fluoroelastomer layer having a hydrotalcite compound
US6902208B1 (en) * 2003-12-10 2005-06-07 Dayco Product, Llc Gas impermeable tube joint and method of forming same
JP2005229032A (en) * 2004-02-16 2005-08-25 Hitachi Ltd Electronic apparatus having liquid-cooled system, its radiator, and its manufacturing method
US7263975B2 (en) * 2005-01-25 2007-09-04 Dana Corporation Plastic coated metal fuel rail
US20060162144A1 (en) * 2005-01-25 2006-07-27 Stieler David C Method of coupling fuel system components

Also Published As

Publication number Publication date
JP2006132913A (en) 2006-05-25
US20060090888A1 (en) 2006-05-04

Similar Documents

Publication Publication Date Title
TWM267509U (en) Improved structure of heat exchange radiator
CN108966611B (en) Liquid immersion cooling type exchanger and exchanger unit
US20020108743A1 (en) Porous media heat sink apparatus
TWM289878U (en) Heat-dissipation structure of water-cooling type parallel runner
JP2006148047A (en) Modularization radiator
TWI535989B (en) Heat dissipation device and electronic device having the same
TW201210454A (en) Server cabinet and liquid cooling system thereof
TW200532157A (en) Compact radiator for an electronic device
TW201228570A (en) Liquid heat dissipation device
JP2006226628A (en) Thermal storage device
TWM250533U (en) Flow channel structure of collector of liquid-cooling heat dissipating device
CN212873401U (en) Whole parallel flow cold plate liquid cooling system of server
US20160007502A1 (en) Heat exchanger, cooling system, and electronic device
TWM267825U (en) Improved heat sink structure of liquid-cooling type heat sink device
CN211087154U (en) Heat dissipation device for chip board card
JP2004047789A (en) Heat sink
CN114485228B (en) Hollow polygonal prism-shaped heat exchanger
TWM323069U (en) Liquid-cooling heat-absorbing device
CN221510105U (en) Heat exchange structure and power electronic equipment
CN215991793U (en) Radiator for high heat flux density electronic product
RU2289895C1 (en) Heat sink for electronic-device cooling system
CN217363632U (en) Heat dissipation device
CN103346001A (en) Plate-fin radiator
CN218735519U (en) Embedded industrial personal computer and electronic equipment
CN208861235U (en) Liquid cooling radiator and computing equipment comprising same