CN218735519U - Embedded industrial personal computer and electronic equipment - Google Patents
Embedded industrial personal computer and electronic equipment Download PDFInfo
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- CN218735519U CN218735519U CN202222917828.6U CN202222917828U CN218735519U CN 218735519 U CN218735519 U CN 218735519U CN 202222917828 U CN202222917828 U CN 202222917828U CN 218735519 U CN218735519 U CN 218735519U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The application relates to industrial computer technical field, especially relates to an embedded industrial computer and electronic equipment, and the embedded industrial computer includes: the box body comprises a plurality of plate parts, and an accommodating space for accommodating electronic devices of the embedded industrial personal computer is defined by the plate parts; at least one plate part in the plurality of plate parts is a heat dissipation wall plate, a cavity is formed inside the heat dissipation wall plate, and the heat absorption working medium is filled in the cavity; the heat dissipation part is arranged on the heat dissipation wall plate. The application provides an embedded industrial computer does not need radiator fan, does not influence the overall arrangement of box inner space, carries out structural improvement to the wallboard of embedded industrial computer box to can cool down the internal environment of box effectively, thereby make electron device release in the box in time sparse to outside the box, thereby make under electron device can be in the suitable operational environment of temperature all the time, reduce this embedded industrial computer because the radiating effect is not good and lead to taking place the probability of dying.
Description
Technical Field
The application relates to the technical field of industrial personal computers, in particular to an embedded industrial personal computer and electronic equipment.
Background
At present, an embedded industrial personal computer is a reinforced industrial personal computer, can be used as an industrial controller to reliably operate in an industrial environment, and is widely applied due to the reliable performance, small volume and low price of the embedded industrial personal computer. Compared with a traditional industrial personal computer, the embedded industrial personal computer is not internally provided with a fan for heat dissipation, the heat dissipation capability of the embedded industrial personal computer is influenced to a certain extent, and the embedded industrial personal computer is likely to overheat and stop running.
SUMMERY OF THE UTILITY MODEL
An object of this application is to provide an embedded industrial computer and electronic equipment to solve the heat-sinking capability that exists current embedded industrial computer among the prior art to a certain extent and remain to improve, in order to reduce the technical problem that embedded industrial computer takes place the abnormal situation.
The application provides an embedded industrial computer, include: the box body comprises a plurality of plate parts, and a containing space for containing electronic devices of the embedded industrial personal computer is formed by the plate parts in an enclosing manner;
the heat absorption working medium is filled in the cavity, at least one plate part in the plurality of plate parts is a heat dissipation wall plate, and a cavity is formed inside the heat dissipation wall plate;
the heat dissipation piece is arranged on the heat dissipation wall plate.
In the above technical solution, further, the heat absorbing working medium is a cooling liquid or a phase change material.
In any of the above technical solutions, further, a plurality of partition plates are arranged inside the heat dissipation wall plate, the partition plates partition a flow channel in the heat dissipation wall plate, and the heat absorption working medium flows in the flow channel.
In any of the above technical solutions, further, the heat dissipation member is disposed on a side wall surface of the heat dissipation wall plate away from the accommodation space;
the quantity of radiating piece is a plurality of, and is a plurality of the radiating piece is along the length direction of heat dissipation wallboard arranges at interval in order.
In any of the above technical solutions, further, the heat sink has a flat plate or sheet structure, a cavity is formed inside the heat sink, and the cavity is communicated with the cavity;
a capillary liquid absorption core is arranged in the cavity; the height of the capillary liquid absorption core extends along the direction perpendicular to the plate surface of the heat dissipation wall plate, and one end of the capillary liquid absorption core is in contact with the heat absorption working medium.
In any one of the above technical solutions, further, a liquid inlet and a liquid outlet are disposed on the side wall of the heat dissipation wall plate, and the liquid inlet and the liquid outlet are respectively communicated with the flow channel.
In any of the above technical solutions, further, a heat conducting member is disposed on a surface of the heat dissipating wall plate located in the accommodating space, and the electronic device is attached to the heat conducting member.
In any one of the above technical solutions, further, at least one of the plurality of plate members is a panel, the panel is provided with a connection socket, and the electronic device is electrically connected to the connection socket.
The application also provides electronic equipment, including any one of the above technical schemes the embedded industrial personal computer, therefore, all beneficial technical effects of the embedded industrial personal computer are achieved, and the description is omitted.
In the above technical solution, further, the electronic device further includes:
the air conditioner comprises a shell, a fan and a controller, wherein the shell is provided with an air inlet and an air outlet;
and the radiating fan and the embedded industrial personal computer are arranged in the shell.
Compared with the prior art, the beneficial effect of this application is:
the application provides an embedded industrial computer includes: the box body comprises a plurality of plate parts, and an accommodating space for accommodating electronic devices of the embedded industrial personal computer is defined by the plate parts; at least one plate part in the plurality of plate parts is a heat dissipation wall plate, a cavity is formed inside the heat dissipation wall plate, and the heat absorption working medium is filled in the cavity; the heat dissipation piece is arranged on the heat dissipation wall plate.
The application provides an embedded industrial computer does not need radiator fan, does not influence the overall arrangement of box inner space, carries out structural improvement to the wallboard of embedded industrial computer box to can cool down the internal environment of box effectively, thereby make electron device release in the box in time sparse to outside the box, thereby make under electron device can be in the suitable operational environment of temperature all the time, reduce this embedded industrial computer because the radiating effect is not good and lead to taking place the probability of dying.
The application provides an electronic equipment, including the aforesaid embedded industrial computer, therefore, can effectively avoid embedded industrial computer because the radiating effect is not good and the high temperature that appears leads to unusual circumstances such as crash through this embedded industrial computer to effectively ensure this electronic equipment working process's stability.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of an embedded industrial personal computer provided in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a heat dissipation wall plate of an embedded industrial personal computer provided in an embodiment of the present application.
Reference numerals: the heat-absorbing device comprises a box body 1, a panel 101, a first heat-radiating wall plate 2, a connecting socket 3, a cavity 4, a capillary liquid-absorbing core 5, a heat-absorbing working medium 6, a heat-radiating part 7 and a heat-conducting part 8.
Detailed Description
The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.
The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application.
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
An embedded industrial personal computer and an electronic device according to an embodiment of the present application are described below with reference to fig. 1 and 2.
Referring to fig. 1 and 2, an embodiment of the present application provides an embedded industrial personal computer, including: the box body 1 comprises a plurality of plate parts, and a containing space for containing electronic devices of the embedded industrial personal computer is defined by the plate parts; the heat absorption working medium 6 is filled in the cavity 4, and at least one plate part in the plurality of plate parts is a heat dissipation wall plate, a cavity 4 is formed inside the heat dissipation wall plate; the heat dissipation piece 7, the heat dissipation piece 7 sets up in the heat dissipation wallboard.
Specifically, the number of plate parts is six, and each plate part all has a flat structure, and six plate parts enclose out box 1 that has the cuboid structure jointly to the inside cavity of box 1 forms accommodation space, and the accommodation space of box 1 inside is used for holding its control action's electron device. One or more of the plurality of plate members is a heat dissipating wall plate, preferably, the upper wall plate of the case 1 is a heat dissipating wall plate, and more preferably, five of the six plate members are heat dissipating wall plates, and have the same structure except for a slight difference in size, and the other of the six plate members is a panel 101 described below.
It should be noted that, inside box 1, be provided with to being used for supporting and fixing the support of the essential part of industrial computers such as PCB, hard disk, the integration has a plurality of electron device on the PCB, and this embedded industrial computer is at the course of the work, and electron device can release certain heat, and not only self temperature can rise, and the temperature of the inner space of box 1 also can rise, and the heat dissipation wallboard can play the heat dissipation effect, in time with heat evacuation outside box 1.
Furthermore, the inside of the heat dissipation wall plate is hollow to form a cavity 4, the heat absorption working medium 6 is filled in the cavity 4, and the temperature of the heat absorption working medium 6 is lower than that of the heat in the box body 1, so that the heat absorption working medium 6 can absorb the heat of the box body 1 to achieve the purpose of reducing the temperature in the box body 1, and the electronic device is prevented from being always in a high-temperature environment.
The heat dissipation part 7 is arranged on the heat dissipation wall plate, the temperature of the heat absorption working medium 6 can rise to a certain degree after absorbing heat, the heat of the heat absorption working medium 6 can be transmitted to the heat dissipation part 7, and the heat is evacuated to the outside of the embedded industrial personal computer through the heat dissipation part 7.
Among the six wall surfaces of the box body 1, the upper wall plate, the bottom wall plate, the left side plate, the right side plate and the back plate are all heat dissipation wall plates.
It is thus clear that the embedded industrial computer that this application provided does not need radiator fan, does not influence the overall arrangement of 1 inner space of box, carries out structural improvement to the wallboard of embedded industrial computer box 1, thereby can cool down the internal environment of box 1 effectively, thereby make electron device release in 1 in the box heat in time sparse to the box 1 beyond, thereby make under the electron device can be in the suitable operational environment of temperature all the time, reduce this embedded industrial computer because the radiating effect is not good and lead to taking place the probability of crashing.
Further, the heat absorbing working medium 6 in this embodiment may be a common cooling liquid, and may also be a phase change material, specifically, the heat absorbing working medium 6 in the heat dissipating wall plate of the upper wall plate is a cooling liquid, and in order to avoid the influence caused by the action of gravity, the heat absorbing working medium 6 in the heat dissipating wall plates of the left side plate, the right side plate, the bottom wall plate, and the back plate are all phase change materials filled in the cavity 4.
In one embodiment of the present application, it is preferable that at least the heat dissipating wall plate among the plurality of plate members has thermal conductivity.
In this embodiment, preferably, the six plate members are made of a metal having thermal conductivity, and the heat dissipation wall plate should have good thermal conductivity, so that heat in the accommodating space can be quickly transferred to the heat dissipation wall plate, and the heat absorbing working medium 6 can effectively and quickly absorb the heat transferred to the heat dissipation wall plate.
When the heat dissipation wallboard only serves as the upper wallboard of the box body 1, other wallboards can have solid flat plate structures, and other wallboards also have heat conductivity and can also play a role in assisting heat dissipation.
In one embodiment of the present application, preferably, a plurality of partition plates are disposed inside the heat dissipation wall plate, the partition plates divide a flow channel inside the heat dissipation wall plate, and the heat absorption working medium 6 flows in the flow channel.
In this embodiment, for convenience of description, the technical solution provided by this embodiment is clearer, the heat dissipation wall plate serving as the upper wall plate of the box body 1 is defined as a first heat dissipation wall plate 2, and when other wall plates of the box body 1 also perform a heat dissipation function, the other heat dissipation wall plates are defined as second heat dissipation wall plates.
In the inside of first heat dissipation wallboard 2, a plurality of baffles are arranged along the length direction of first heat dissipation wallboard 2 interval in order, and arbitrary two adjacent baffles dislocation set, the one end of one of them baffle in two is connected with the internal face of the preceding lateral wall of first heat dissipation wallboard 2, form the clearance between the internal face of the back lateral wall of the other end and first heat dissipation wallboard 2, the one end of another baffle in two is connected with the internal face of the back lateral wall of first heat dissipation wallboard 2, form the clearance between the front wall of the other end and first heat dissipation wallboard 2, a plurality of baffles are all arranged according to this law, thereby make the inside of first heat dissipation wallboard 2 form continuous S-shaped runner, liquid heat absorption working medium 6 (coolant) can flow in the runner, the baffle can also play the vortex effect simultaneously.
In one embodiment of the present application, preferably, the heat dissipation member 7 is disposed on a side wall surface of the heat dissipation wall plate away from the accommodating space;
the number of the heat dissipation members 7 is plural, and the plurality of heat dissipation members 7 are sequentially arranged at intervals along the length direction of the heat dissipation wall plate.
In one embodiment of the present application, preferably, the heat sink 7 has a flat plate or sheet structure, and a cavity is formed inside the heat sink 7, and the cavity is communicated with the cavity 4;
a capillary liquid absorption core 5 is arranged in the cavity; the height of the capillary liquid absorption core 5 extends along the direction perpendicular to the plate surface of the heat dissipation wall plate, and one end of the capillary liquid absorption core 5 is in contact with the heat absorption working medium 6.
In this embodiment, the heat dissipation member 7 has two types, one type is the sheet structure, can be the radiating fin of the common type among the prior art, the length direction interval arrangement in order of radiating fin 7 along the second radiating wallboard that has the sheet structure, the radiating fin 7 of this type sets up in the planking face of second radiating wallboard, phase change material fills in the cavity 4 of second radiating wallboard, phase change material absorbs the heat and carries out the latent heat after, phase change material's heat can transmit to the radiating fin fast and release outside this embedded industrial computer.
Further, another form of the heat dissipation member 7 is a flat plate structure having a certain thickness, and a cavity is formed inside the flat plate structure, and the cavity is communicated with the cavity 4 of the first heat dissipation wall plate 2.
In the cavity of heat dissipation member 7, be provided with capillary wick 5, along vertical direction from top to bottom, capillary wick 5's hole increases gradually. The liquid heat absorption working medium 6 in the cavity 4 of the first heat dissipation wall plate 2 has a lower boiling point, the liquid heat absorption working medium 6 absorbs heat and then evaporates, at least part of the liquid heat absorption working medium 6 is changed into a gas state from the liquid state and upwards escapes to the outer wall surface of the first heat dissipation wall plate 2, the gas heat absorption working medium 6 is cooled down again and changed into the liquid state along with the heat evacuation outside the first heat dissipation wall plate 2, and at the moment, the heat absorption working medium 6 is absorbed back into the cavity 4 of the first heat dissipation wall plate 2 by the capillary force of the vein fine liquid absorption core and is converged with the rest heat absorption working medium 6, so that the circulation is realized.
Preferably, two adjacent heat dissipation members 7 have the same length but different heights, so that the heat dissipation effect can be prevented from being affected by too dense arrangement between the heat dissipation members 7.
In one embodiment of the present application, it is preferable that the side wall of the first heat dissipation wall plate 2 is provided with a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are respectively communicated with the flow channel.
In this embodiment, the inlet is used for letting in the coolant liquid, and the liquid outlet is used for flowing out the coolant liquid to inlet and liquid outlet communicate with the both ends of runner respectively, are convenient for let in the coolant liquid to the runner on the one hand, perhaps change new clean coolant liquid, can also make the coolant liquid be in the state that the circulation flows all the time through the mode of external pump body, further improve the radiating effect of first heat dissipation wallboard 2.
In an embodiment of the present application, preferably, a plate surface of the heat dissipation wall plate located in the accommodating space is provided with a heat conduction member 8, and the electronic device is attached to the heat conduction member 8.
In this embodiment, in the accommodating space, the inner wall surfaces of the heat dissipating wall plates (including the first heat dissipating wall plate 2 and the second heat dissipating wall plate) are provided with the heat conducting members 8, and the heat conducting members 8 may be heat conducting gaskets, and the heat conducting gaskets are disposed between the electronic device and the inner wall surfaces of the heat dissipating wall plates, so that the electronic device serves as a heat source, and the heat released by the electronic device can be transmitted to the heat dissipating wall plates in time through the heat conducting gaskets. Preferably, the area of the heat conducting gasket is not smaller than that of one side wall surface of the electronic device facing the heat radiating wall plate, so that the efficiency and effect of heat transfer are ensured.
The heat conducting piece 8 can also be a temperature equalizing plate, preferably, the temperature equalizing plate covers the whole plate surface of the heat dissipation wall plate, the electronic devices are in contact with the temperature equalizing plate, heat released by the electronic devices can be transmitted to the heat dissipation wall plate in time, the temperature equalizing plate can play a temperature equalizing role, heat of a plurality of electronic devices is transmitted to the temperature equalizing plate firstly, the heat is distributed on the temperature equalizing plate more uniformly, the overheating condition of individual electronic devices can be avoided, and the normal work of each electronic device can be ensured.
In one embodiment of the present application, preferably, at least one of the plurality of board parts is a panel 101, the panel 101 is provided with a connection jack 3, and the electronic device is electrically connected to the connection jack 3.
In this embodiment, the embedded industrial personal computer is normally placed in a working position, the front panel surface of the box 1 is used as a panel 101, the panel 101 is provided with a plurality of connection sockets 3, preferably, the number of the connection sockets 3 is multiple, the connection sockets 3 are divided into a plurality of different types, such as USB interfaces, type-c interfaces, network cable interfaces, HDMI interfaces, and the like, and the connection sockets 3 are connected with electronic devices on the pcb and used for externally connecting various lines, devices, and the like.
To sum up, the embedded industrial computer that this application provided can effectively improve the radiating effect of embedded industrial computer to ensure that this embedded industrial computer can normally work, avoid appearing the high abnormal conditions such as dead halt that lead to embedded industrial computer of high temperature.
The embodiment of the application also provides electronic equipment which comprises the embedded industrial personal computer in any one of the embodiments, so that the embedded industrial personal computer has all beneficial technical effects, and the details are not repeated herein.
In one embodiment of the present application, preferably, the electronic device further includes:
the air conditioner comprises a shell, a fan and a controller, wherein the shell is provided with an air inlet and an air outlet;
the cooling fan, the cooling fan and the embedded industrial personal computer are arranged in the shell, the cooling fan forms directional air flow in the shell, and the directional air flow passes through the radiating piece 7.
In this embodiment, air intake and air outlet have been seted up to the casing, and after radiator fan started, wind then flowed out from the air outlet in getting into the casing from the air intake for form directional air current in the inside of casing, and directional air current flows through the clearance between two adjacent radiating piece 7, or stated otherwise, radiator fan can be to the directional air supply of radiating piece 7, thereby can take away the heat on the radiating piece 7 fast, thereby further improve the radiating effect of the embedded industrial computer in above-mentioned embodiment.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. An embedded industrial personal computer, which is characterized by comprising:
the box body comprises a plurality of plate parts, and an accommodating space for accommodating electronic devices of the embedded industrial personal computer is defined by the plate parts;
at least one of the plate parts is a heat dissipation wall plate, a cavity is formed inside the heat dissipation wall plate, and the heat absorption working medium is filled in the cavity;
the heat dissipation piece is arranged on the heat dissipation wall plate.
2. The embedded industrial personal computer of claim 1, wherein the heat-absorbing working medium is a cooling fluid or a phase-change material.
3. The embedded industrial personal computer of claim 1, wherein a plurality of partition plates are arranged inside the heat dissipation wall plate, the partition plates divide a flow channel in the heat dissipation wall plate, and the heat absorption working medium flows in the flow channel.
4. The embedded industrial personal computer according to claim 1, wherein the heat dissipation member is disposed on a side wall surface of the heat dissipation wall plate away from the accommodating space;
the quantity of radiating piece is a plurality of, and is a plurality of the radiating piece is along the length direction of heat dissipation wallboard arranges at interval in order.
5. The embedded industrial personal computer according to claim 1, wherein the heat dissipation member has a flat plate or sheet structure, a cavity is formed inside the heat dissipation member, and the cavity is communicated with the cavity;
a capillary liquid absorption core is arranged in the cavity; the height of the capillary liquid absorption core extends along the direction perpendicular to the plate surface of the heat dissipation wall plate, and one end of the capillary liquid absorption core is in contact with the heat absorption working medium.
6. The embedded industrial personal computer according to claim 3, wherein a liquid inlet and a liquid outlet are arranged on the side wall of the heat dissipation wall plate, and the liquid inlet and the liquid outlet are respectively communicated with the flow channel.
7. The embedded industrial personal computer of claim 1, wherein a heat conducting member is disposed on a surface of the heat dissipation wall plate located in the accommodating space, and the electronic device is attached to the heat conducting member.
8. The embedded industrial personal computer of any one of claims 1 to 7, wherein at least one of the plurality of board parts is a panel provided with a connection socket, the electronics being electrically connected with the connection socket.
9. An electronic device, characterized by comprising an embedded industrial personal computer of any one of claims 1 to 8.
10. The electronic device of claim 9, further comprising:
the air conditioner comprises a shell, a fan and a controller, wherein the shell is provided with an air inlet and an air outlet;
and the radiating fan and the embedded industrial personal computer are arranged in the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222917828.6U CN218735519U (en) | 2022-10-31 | 2022-10-31 | Embedded industrial personal computer and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222917828.6U CN218735519U (en) | 2022-10-31 | 2022-10-31 | Embedded industrial personal computer and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218735519U true CN218735519U (en) | 2023-03-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222917828.6U Active CN218735519U (en) | 2022-10-31 | 2022-10-31 | Embedded industrial personal computer and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218735519U (en) |
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- 2022-10-31 CN CN202222917828.6U patent/CN218735519U/en active Active
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