CN220381550U - Liquid cooling device and computing equipment - Google Patents

Abstract

The application relates to a liquid cooling device and computing equipment, the inside of liquid cooling device has the assembly inner chamber that is used for assembling heating element, first heat transfer component sets up in the assembly inner chamber of liquid cooling device, second heat transfer component sets up in the assembly inner chamber of liquid cooling device, first heat transfer component's exit end and second heat transfer component's entrance point intercommunication, second heat transfer component is used for heat conduction to connect the heating element that is arranged in the assembly inner chamber, main heat exchanger's exit end and first heat transfer component's entrance point intercommunication, main heat exchanger's entrance point and second heat transfer component's exit end intercommunication. After the low-temperature second refrigerant flows into the first heat exchange element, the first refrigerant and the second refrigerant can exchange heat, the temperature is improved by a small margin, the second refrigerant enters the second heat exchange element after the temperature is improved, and a large amount of heat can be absorbed by the second refrigerant, so that the heat exchange process of absorbing a small amount of heat firstly and absorbing a large amount of heat later is completed, the heat exchange effect of the second refrigerant can be fully exerted, and the heat dissipation efficiency of single circulation of the second refrigerant is improved.

Description

Liquid cooling device and computing equipment

Technical Field

The present application relates to the field of liquid cooling technology, and in particular, to a liquid cooling apparatus and a computing device.

Background

The heat generated in the running process of the server affects the running efficiency of the server, so that the heat dissipation treatment in the running process of the server is important, at present, the server is mostly subjected to the heat dissipation treatment in a liquid cooling mode, for example, the server is placed in a cooling box body, the cooling box body is filled with a refrigerant, various heating components capable of generating heat in the server are in direct contact with the refrigerant, the heat emitted by the heating components is directly transferred to the refrigerant, the circulating refrigerant sends the heat into a liquid cooling host to exchange with cooling water and the like, and finally the cooling water brings the heat outdoors to dissipate the heat into the atmosphere, so that the circulating heat dissipation of the server is realized.

However, the structure of the server is complex, the variety of heating components in the server is various, the structure is complex, and the heat dissipation effect cannot be good and the actual heat dissipation requirement cannot be met by simply utilizing the refrigerant to contact with the server.

Disclosure of Invention

In view of the foregoing, it is desirable to provide a liquid cooling device and a computing device.

A liquid cooling apparatus, the liquid cooling apparatus comprising:

the liquid cooling device is internally provided with an assembling inner cavity for assembling the heating element;

the first heat exchange element is arranged in the assembly inner cavity of the liquid cooling device;

the second heat exchange element is arranged in the assembly cavity of the liquid cooling device, the outlet end of the first heat exchange element is communicated with the inlet end of the second heat exchange element, and the second heat exchange element is used for being in heat conduction connection with a heating element positioned in the assembly cavity;

the outlet end of the main heat exchanger is communicated with the inlet end of the first heat exchange element, and the inlet end of the main heat exchanger is communicated with the outlet end of the second heat exchange element.

In one embodiment, the first refrigerant is filled in the assembly cavity of the liquid cooling device, and the second refrigerant circularly flows in the main heat exchanger, the first heat exchange element and the second heat exchange element.

In one embodiment, the first refrigerant and the second refrigerant are the same; alternatively, the first refrigerant and the second refrigerant are different.

In one embodiment, the first refrigerant is a non-phase-change refrigerant, and the second refrigerant is water; or,

the first refrigerant is a non-phase-change refrigerant, and the second refrigerant is a non-phase-change refrigerant; or,

the first refrigerant is a non-phase-change refrigerant, and the second refrigerant is a phase-change refrigerant.

In one embodiment, the heating element comprises a main body region and at least one high heating region, the heating quantity of the high heating region is higher than that of the main body region, and the second heat exchange element is in heat conduction connection with the high heating region.

In one embodiment, the number of the high heat generating areas and the number of the second heat exchanging elements are multiple, the second heat exchanging elements are in one-to-one heat conducting connection with the high heat generating areas, and the outlet ends of the first heat exchanging elements are connected with the inlet ends of the plurality of heat exchanging elements in parallel.

In one embodiment, the second heat exchange element has a first heat exchange surface, the high heat generating region has a second heat exchange surface, and at least a portion of the first heat exchange surface is in thermally conductive contact with at least a portion of the second heat exchange surface without gaps.

In one embodiment, a plurality of unit devices are arranged in the assembly cavity of the liquid cooling device, the unit devices are provided with unit cavities, the unit cavities of the unit devices are used for assembling the heating element, the first heat exchange element is arranged in the assembly cavity of the liquid cooling device, the second heat exchange element is arranged in the unit cavities of the unit devices, and the second heat exchange element is in heat conduction connection with the heating element in the unit cavities of the unit devices.

In one embodiment, the liquid cooling device includes:

the liquid storage device is provided with a liquid storage inner cavity, the outlet end of the main heat exchanger is communicated with the inlet end of the liquid storage device, and the outlet end of the liquid storage device is communicated with the inlet end of the first heat exchange element; and/or the number of the groups of groups,

the driving pump body is arranged between the outlet end of the main heat exchanger and the inlet end of the first heat exchange element.

A computing device, the computing device comprising:

the liquid cooling device;

and the heating element is arranged in the assembly cavity of the liquid cooling device.

In the liquid cooling device and the computing equipment, after the low-temperature second refrigerant flows into the first heat exchange element, the first heat exchange element is soaked in the first refrigerant, so that the first refrigerant and the second refrigerant can exchange heat, the low-temperature second refrigerant just entering the first heat exchange element absorbs heat of the first refrigerant, the temperature is slightly increased, the low-temperature second refrigerant enters the second heat exchange element after being increased, and the second refrigerant entering the second heat exchange element can absorb a large amount of heat due to direct heat conduction contact between the second heat exchange element and the heating element mainly generating heat, thereby completing the heat exchange process of firstly absorbing a small amount of heat and then absorbing a large amount of heat, and the heat exchange effect of the second refrigerant can be fully exerted and the heat dissipation efficiency of single circulation of the second refrigerant is improved.

Drawings

Fig. 1 is a schematic structural diagram of a liquid cooling device according to an embodiment of the present disclosure.

Fig. 2 is a schematic diagram of a part of a liquid cooling device according to an embodiment of the present application.

Fig. 3 is a schematic view of a part of a liquid cooling device according to another embodiment of the present disclosure.

Reference numerals:

a. a first refrigerant; b. a second refrigerant;

100. a heating element; 110. a body region; 120. a high heat generation region;

1000. a liquid cooling device; 2000. a first heat exchange element; 3000. a second heat exchange element; 4000. a main heat exchanger; 5000. a liquid storage device; 6000. driving the pump body;

1000a, assembling an inner cavity; 1100. a unit device; 1100a, cell lumen.

Detailed Description

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.

In the description of the present application, it should be understood that, if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., these terms refer to the orientation or positional relationship based on the drawings, which are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.

In this application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

Referring to fig. 1 to 3, an embodiment of the present application provides a liquid cooling device, the liquid cooling device includes a liquid cooling device 1000, a first heat exchange element 2000, a second heat exchange element 3000 and a main heat exchanger 4000, an assembling cavity 1000a for assembling a heating element 100 is provided in the liquid cooling device 1000, the assembling cavity 1000a is a sealed cavity space, so that a refrigerant filled in the assembling cavity 1000a can be ensured to be stable and not leaked, the first heat exchange element 2000 is disposed in the assembling cavity 1000a of the liquid cooling device 1000, the second heat exchange element 3000 is disposed in the assembling cavity 1000a of the liquid cooling device 1000, an outlet end of the first heat exchange element 2000 is communicated with an inlet end of the second heat exchange element 3000, the second heat exchange element 3000 is used for thermally connecting the heating element 100 located in the assembling cavity 1000a, an outlet end of the main heat exchanger 4000 is communicated with an inlet end of the first heat exchange element 2000, and an inlet end of the main heat exchanger 4000 is communicated with an outlet end of the second heat exchange element 3000.

The heat generating element 100 may be any electrical element that needs to perform heat dissipation, and the heat generating element 100 may be a single body, or the heat generating element 100 may also be an element formed by combining a plurality of unit parts, where the heat generating element 100 may include a body area 110 and a plurality of high heat generating areas 120, and the plurality of high heat generating areas 120 may be the same type of area or different types of areas, for example, the plurality of high heat generating areas 120 may have the same heat generating property or different heat generating properties, and the unit heat generating amount of the high heat generating area 120 per unit time and unit area may be higher, lower, or equal than the unit heat generating amount of the body area 110 per unit time and unit area, depending on the different types of the body area 110 and the high heat generating area 120, which is not limited herein.

In one embodiment, the heat generation amount of the high heat generation area 120 may be higher than the heat generation amount of the main body area 110, so the second heat exchange element 3000 may be thermally connected to the high heat generation area 120, and thus the main heat dissipation treatment is mainly performed on the area with high heat generation amount. For example, the heating element 100 may be a server or other types of electronic devices, and the server may include a circuit board, a plurality of processors, a plurality of controllers, and other devices, where the processors or controllers, and the like, as main operation devices, are mainly heat-generating parts in the server, so that the server may be subjected to targeted heat dissipation treatment for the mainly heat-generating parts such as the processors or the controllers, and a person skilled in the art may determine the type or structure of the heating element 100 according to the needs, and the utility model is not limited herein. The number of the high heat generating areas 120 and the number of the second heat exchanging elements 3000 may be plural, the second heat exchanging elements 3000 are in one-to-one heat conducting connection with the high heat generating areas 120, and the outlet ends of the first heat exchanging elements 2000 are connected in parallel with the inlet ends of the plural heat exchanging elements.

Referring to fig. 1 and 2, the assembly cavity 1000a of the liquid cooling device 1000 may be used to accommodate the heating element 100, and since the assembly cavity 1000a has a sealing property, the assembly cavity 1000a may be filled with the first refrigerant a while circulating the second refrigerant b among the main heat exchanger 4000, the first heat exchanging element 2000 and the second heat exchanging element 3000. The first refrigerant a and the second refrigerant b may be the same or different, for example, the first refrigerant a is a non-phase-change refrigerant, and the second refrigerant b is water; or the first refrigerant a is a non-phase-change refrigerant, and the second refrigerant b is a non-phase-change refrigerant; or the first refrigerant a is a non-phase-change refrigerant, and the second refrigerant b is a phase-change refrigerant. A person skilled in the art may select a suitable specific refrigerant according to the requirement, where the first refrigerant a and the second refrigerant b may be single-phase refrigerants or phase-change refrigerants, where the phase-change refrigerants may form a phase change when the temperature reaches a specific value, that is, change from a liquid refrigerant to a gaseous refrigerant or from a gaseous refrigerant to a liquid refrigerant, and the phase-change refrigerants may be any type, for example, "eosin SFM-5016N" phase-change refrigerants with an evaporation temperature of 47 degrees celsius, "3m Novec 649" phase-change refrigerants with an evaporation temperature of 49 degrees celsius, "3m Novec 7000" phase-change refrigerants with an evaporation temperature of 34 degrees celsius, "3m Novec 7100" phase-change refrigerants with an evaporation temperature of 61 degrees celsius, "curtain chemical Opteon SF33" phase-change refrigerants with an evaporation temperature of 33.4 degrees celsius, "curtain chemical veriel XF" phase-change refrigerants with an evaporation temperature of 55 degrees celsius, and so on, and the present utility model is not limited.

Based on the heating element 100 accommodated in the assembly cavity 1000a, the liquid cooling device provides a second heat exchange element 3000 capable of performing targeted heat dissipation on a specific position of the heating element 100, the second heat exchange element 3000 has a heat exchange cavity, and as shown in fig. 1 and 2, the outlet end of the first heat exchange element 2000 is communicated with the inlet end of the second heat exchange element 3000, the outlet end of the main heat exchanger 4000 is communicated with the inlet end of the first heat exchange element 2000, and the inlet end of the main heat exchanger 4000 is communicated with the outlet end of the second heat exchange element 3000, so as to form a circulation flow path.

Therefore, after the low-temperature second refrigerant b outside the liquid cooling device 1000 flows into the first heat exchanging element 2000, the first heat exchanging element 2000 is immersed in the first refrigerant a, so that the first refrigerant a and the second refrigerant b can form sensible heat exchange, the low-temperature second refrigerant b just entering the first heat exchanging element 2000 absorbs the heat of the first refrigerant a, the temperature is slightly increased, and then enters the second heat exchanging element 3000 after being increased, and the second heat exchanging element 3000 is in direct heat conduction contact with the heating element 100 mainly generating heat, so that the second refrigerant b entering the second heat exchanging element 3000 can absorb a large amount of heat, and sensible heat exchange and phase change heat exchange are performed in the second heat exchanging element 3000, thereby completing the heat exchanging process of firstly absorbing a small amount of heat and then absorbing a large amount of heat, and the process can fully play the heat exchanging effect of the second refrigerant b, and improve the heat dissipation efficiency of single cycle of the second refrigerant b.

In this process, if a single-phase refrigerant such as water is used as the second refrigerant b, the temperature of the water will be greatly increased, and if a phase-change refrigerant is used as the second refrigerant b, at least part of the second refrigerant b is evaporated to form a gas-liquid two-phase flow. The second refrigerant b can be driven by the power of a pump, the surface of the second heat exchange element 3000 has better liquid supply and gas separation capacity due to the power of the pump, the heat exchange capacity is stronger, and the heat can be dissipated after the second refrigerant b with the temperature rising or two-phase flow comes out of the second heat exchange element 3000 and enters the main heat exchanger 4000, so that a cycle is completed. Depending on the type of refrigerant used for the second refrigerant b, the active driving by the pump may be maintained in a different pressure range, for example, 200kPa to 300kPa, such as a fluorinated liquid typically below 200kPa.

For example, in one embodiment, the liquid cooling device comprises a drive pump 6000, the drive pump 6000 being disposed between the outlet end of the main heat exchanger 4000 and the inlet end of the first heat exchange element 2000. Meanwhile, the liquid cooling device may also include a liquid storage device 5000, the liquid storage device 5000 has a liquid storage cavity, the outlet end of the main heat exchanger 4000 is communicated with the inlet end of the liquid storage device 5000, the outlet end of the liquid storage device 5000 is communicated with the inlet end of the first heat exchange element 2000, and the second refrigerant b after absorbing heat and raising temperature dissipates heat through the main heat exchanger 4000 and returns to the liquid storage device 5000, such as a liquid storage tank, to complete a cycle.

After the second refrigerant b enters the heat exchange cavity of the second heat exchange element 3000, the second refrigerant b in the heat exchange cavity of the second heat exchange element 3000 can exchange heat with a specific position in the server with high efficiency, so as to perform targeted heat dissipation treatment on the specific position of the server, for example, a processor, a controller and the like in the server have higher heat dissipation capacity, and the second heat exchange element 3000 can be in heat conduction connection with the high heat generating element 100 in the server, such as the processor, the controller and the like, and perform targeted heat exchange treatment on the high heat generating element 100 by using the second refrigerant b. At this time, when the second refrigerant b is a phase-change refrigerant, the second refrigerant b absorbs more heat, thereby increasing the temperature to above the evaporation temperature, then converting the liquid refrigerant into a gaseous refrigerant, and then discharging the gaseous refrigerant, thereby taking away the heat and further realizing heat dissipation.

When the heating element 100 transfers heat to the liquid second refrigerant b, bubbles are generated on the surface of the heating element 100, the heat transfer effect is affected by the generation of the bubbles, for example, bubbles are generated on the surface of the high heating area 120 in the heating element 100, the heat transfer effect of the heating element 100 is affected by the generation of the bubbles, the bubbles are continuously generated in the phase change evaporation process of the second refrigerant b, only if the bubbles are separated from the surface of the heating element 100 as soon as possible, and the second refrigerant b is continuously supplemented to the surface of the heating element 100, the heat exchange of the heating element 100 can be continuously performed by using the liquid second refrigerant b, and normally, the bubbles are immersed in the liquid second refrigerant b, the separation speed of the bubbles from the surface of the heating element 100 is slow, the heat exchange capacity is affected by the slow separation speed of the bubbles, and if the liquid second refrigerant b is not supplemented timely, the surface of the heating element 100 is dried, so that the heat exchange capacity is rapidly reduced.

The second heat exchanging element 3000 can thus be connected to the surface of the heat generating element 100 in a seamless manner, as defined by the second heat exchanging element 3000 having a first heat exchanging surface, the high heat generating region 120 having a second heat exchanging surface, at least a part of the first heat exchanging surface being in thermally conductive contact with at least a part of the second heat exchanging surface without gaps. The first heat exchange surface and the second heat exchange surface can be both planes, one of the first heat exchange surface and the second heat exchange surface can be a convex surface and the other of the first heat exchange surface and the second heat exchange surface can be a concave surface, the convex surface and the concave surface can be in fit connection with each other in a seamless manner, wherein the first heat exchange surface and the second heat exchange surface can be any other surface shape which can be fit in a seamless manner, the surface shape is not limited, and therefore the heat transfer effect is not influenced by bubbles generated at the part of the seamless fit between the first heat exchange surface and the second heat exchange surface, and the heat transfer efficiency is further improved. Meanwhile, when the second heat exchange element 3000 adopts a liquid cooling plate, air bubble removal can be accelerated, so that rapid replenishment of the liquid second refrigerant b is realized, the liquid cooling plate is in a super-liquid supply state, and the heat exchange capability is stronger and more stable.

When the second refrigerant b is a phase-change refrigerant, expansion occurs in the process of converting the liquid second refrigerant b into the gaseous second refrigerant b, and then expansion pressure is applied to the environment, and when the heat exchange cavity of the second heat exchange element 3000 is used as the expansion environment, the expansion of the second refrigerant b can be limited in the heat exchange cavity of the second heat exchange element 3000, and at this time, only the pressure resistance value of the heat exchange cavity of the second heat exchange element 3000 needs to be set to be a safe value, for example, the second heat exchange element is a liquid cooling plate, and the liquid cooling plate has higher strength, so that the heat exchange cavity formed inside the liquid cooling plate has higher pressure resistance value. The environment where the second refrigerant b expands is converted in the heat exchange cavity of the second heat exchange element 3000, so that the strength of the liquid cooling device 1000 can be reduced, and the liquid cooling device 1000 only needs to ensure sealing, without requiring a higher pressure resistance value or structural strength, and without requiring a higher expansion pressure, compared with the case where the second refrigerant b expands in the assembly cavity 1000a of the liquid cooling device 1000.

Referring to fig. 3, in one embodiment, a plurality of unit devices 1100 are disposed in the assembly cavity 1000a of the liquid cooling device 1000, the unit devices 1100 have a unit cavity 1100a, the unit cavity 1100a of the unit devices 1100 is used for assembling the heating element 100, the first heat exchanging element 2000 is disposed in the assembly cavity 1000a of the liquid cooling device 1000, the second heat exchanging element 3000 is disposed in the unit cavity 1100a of the unit devices 1100, and the second heat exchanging element 3000 is thermally connected with the heating element 100 in the unit cavity 1100a of the unit devices 1100. The number of the unit devices 1100 can be set according to the requirement, the unit devices 1100 are located in the assembly cavity 1000a of the liquid cooling device 1000, and the unit cavity 1100a of the unit device 1100 is assembled with the heating element 100, so that the heating element 100 is also assembled in the assembly cavity 1000a of the liquid cooling device 1000, except that the assembly cavity 1000a of the liquid cooling device 1000 and the unit cavity 1100a of the unit device 1100 are divided into different cavity spaces which are mutually contained, and are relatively isolated, and a plurality of unit devices 1100 can realize simultaneous large-quantity heat exchange, thereby improving the heat exchange efficiency of the refrigerant.

The application also provides a computing device comprising the liquid cooling device and a heating element 100, the heating element 100 being disposed in the assembly cavity 1000a of the liquid cooling device 1000. Because the specific structure, functional principle and technical effect of the liquid cooling device are described in detail above, the detailed description is omitted herein, and any technical content related to the liquid cooling device can be referred to the description above.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims (10)

1. A liquid cooling apparatus, comprising:

the liquid cooling device is internally provided with an assembling inner cavity for assembling the heating element;

the first heat exchange element is arranged in the assembly inner cavity of the liquid cooling device;

the second heat exchange element is arranged in the assembly cavity of the liquid cooling device, the outlet end of the first heat exchange element is communicated with the inlet end of the second heat exchange element, and the second heat exchange element is used for being in heat conduction connection with a heating element positioned in the assembly cavity;

the outlet end of the main heat exchanger is communicated with the inlet end of the first heat exchange element, and the inlet end of the main heat exchanger is communicated with the outlet end of the second heat exchange element.

2. The liquid cooling device according to claim 1, wherein the first refrigerant is filled in an assembly cavity of the liquid cooling device, and the second refrigerant circularly flows in the main heat exchanger, the first heat exchange element and the second heat exchange element.

3. The liquid cooling apparatus according to claim 2, wherein the first refrigerant and the second refrigerant are the same; alternatively, the first refrigerant and the second refrigerant are different.

4. The liquid cooling apparatus according to claim 3, wherein the first refrigerant is a non-phase-change refrigerant, and the second refrigerant is water; or,

the first refrigerant is a non-phase-change refrigerant, and the second refrigerant is a non-phase-change refrigerant; or,

the first refrigerant is a non-phase-change refrigerant, and the second refrigerant is a phase-change refrigerant.

5. The liquid cooling apparatus according to claim 1, wherein the heat generating element includes a main body region and at least one high heat generating region, the heat generating amount of the high heat generating region is higher than the heat generating amount of the main body region, and the second heat exchanging element is thermally connected to the high heat generating region.

6. The liquid cooling apparatus according to claim 5, wherein the number of the heat generating regions and the number of the second heat exchanging elements are plural, the second heat exchanging elements are in one-to-one heat conducting connection with the heat generating regions, and the outlet ends of the first heat exchanging elements are connected in parallel with the inlet ends of the plural heat exchanging elements.

7. The liquid cooling apparatus of claim 5, wherein the second heat exchanging element has a first heat exchanging surface, the high heat generating region has a second heat exchanging surface, and at least a portion of the first heat exchanging surface and at least a portion of the second heat exchanging surface are in thermally conductive contact without gaps.

8. The liquid cooling apparatus according to claim 1, wherein a plurality of unit devices are provided in an assembly cavity of the liquid cooling device, the unit devices having a unit cavity for assembling the heating element, the first heat exchanging element being provided in the assembly cavity of the liquid cooling device, the second heat exchanging element being provided in the unit cavity of the unit device, the second heat exchanging element being thermally connected with the heating element in the unit cavity of the unit device.

9. The liquid cooling apparatus according to claim 1, wherein the liquid cooling apparatus comprises:

the liquid storage device is provided with a liquid storage inner cavity, the outlet end of the main heat exchanger is communicated with the inlet end of the liquid storage device, and the outlet end of the liquid storage device is communicated with the inlet end of the first heat exchange element; and/or the number of the groups of groups,

the driving pump body is arranged between the outlet end of the main heat exchanger and the inlet end of the first heat exchange element.

10. A computing device, the computing device comprising:

the liquid cooling apparatus according to any one of claims 1 to 9;

and the heating element is arranged in the assembly cavity of the liquid cooling device.