CN211087154U - Heat dissipation device for chip board card - Google Patents
Heat dissipation device for chip board card Download PDFInfo
- Publication number
- CN211087154U CN211087154U CN201922419426.1U CN201922419426U CN211087154U CN 211087154 U CN211087154 U CN 211087154U CN 201922419426 U CN201922419426 U CN 201922419426U CN 211087154 U CN211087154 U CN 211087154U
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- CN
- China
- Prior art keywords
- heat
- heat dissipation
- shell
- chip
- baffle plate
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 44
- 239000011093 chipboard Substances 0.000 title description 3
- 239000004020 conductor Substances 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000006467 substitution reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a heat abstractor for chip integrated circuit board, the device includes: the heat dissipation device comprises a heat dissipation shell, a heat radiator and a heat conducting device, wherein multiple layers of heat dissipation fins are arranged in parallel in the heat dissipation shell, and the heat conducting device is fixed in the heat dissipation shell at a position opposite to a chip; the heat dissipation shell is detachably connected with the board card; the heat conductor is tightly attached to the chip. The utility model discloses a make the form of radiator with the integrated circuit board shell, the middle form through the heat pipe directly transmits the shell with the heat by the chip, and the structure with the fin on the shell can take away the medium of heat transfer outside, can reach simpler and easier equipment and better radiating effect.
Description
Technical Field
The utility model belongs to the technical field of the heat dissipation, concretely relates to heat abstractor for chip integrated circuit board.
Background
The existing board card with a chip and a radiator basically comprises a middle basket, the radiator and a shell, wherein the middle basket is arranged between the board card and the radiator and used for fixing the board card and the radiator. The shell is arranged on the outermost side and plays a role in protection. In such a structure, the air flow required by the heat sink for cooling can only take away heat by the air flow passing between the housing and the board card, which is called as effective air flow, and the air flow passing outside the housing cannot take away heat on the heat sink, which is called as ineffective air flow.
The existing chip board card heat dissipation structure needs to be locked with more screws, time is spent, the heat dissipation effect can only depend on the air flow passing through the limited space, and the heat dissipation efficiency is low.
SUMMERY OF THE UTILITY MODEL
The above-mentioned not enough to prior art, the utility model provides a heat abstractor for chip integrated circuit board to solve above-mentioned technical problem.
The embodiment of the application provides a heat abstractor for chip integrated circuit board, the device includes:
the heat dissipation device comprises a heat dissipation shell, a heat radiator and a heat conducting device, wherein multiple layers of heat dissipation fins are arranged in parallel in the heat dissipation shell, and the heat conducting device is fixed in the heat dissipation shell at a position opposite to a chip; the heat dissipation shell is detachably connected with the board card; the heat conductor is tightly attached to the chip.
In one embodiment of the present application, the heat dissipation housing includes an outer shell, a first baffle and a second baffle, the first baffle and the second baffle are fixed at two ends of the outer shell relatively, and both the first baffle and the second baffle are detachably connected to the main board; the multiple layers of radiating fins are parallel to the first baffle and the second baffle.
In one embodiment of the present application, the heat conductor includes a heat pipe, one end of the heat pipe is fixed on the heat dissipation housing, and the other end of the heat pipe is tightly attached to the chip.
In one embodiment of the present application, the heat conductive pipe is a U-shaped pipe.
In an embodiment of the present application, the heat conductor further includes a copper block, an insulating heat conducting fin is attached to one side of the copper block, which is attached to the chip, and the copper block is connected to the heat conducting pipe.
The utility model has the advantages that,
the utility model provides a heat abstractor for chip integrated circuit board through the form of making the radiator with the integrated circuit board shell, and the middle form through the heat pipe directly transmits the shell by the chip with the heat, and the structure with the fin on the shell can take away the medium of heat transfer outside, can reach simpler and easier equipment and better radiating effect.
Furthermore, the utility model relates to a principle is reliable, and simple structure has very extensive application prospect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of the structure of an apparatus according to an embodiment of the present application;
FIG. 2 is a schematic diagram of the structure of an apparatus according to an embodiment of the present application;
wherein, 1, a main board; 2. a chip; 3. a heat dissipating housing; 4. a heat sink; 5. a heat conductor; 51. a heat conducting pipe; 52. and (4) a copper block.
Detailed Description
In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Example 1
As shown in fig. 1, the present embodiment provides a heat dissipation device for a chip card, the device including:
the radiating shell 3 is internally provided with a plurality of layers of radiating fins 4 which are arranged in parallel, the radiating shell 3 comprises an outer shell plate, a first baffle plate and a second baffle plate, the first baffle plate and the second baffle plate are relatively fixed at two ends of the outer shell plate, and the first baffle plate and the second baffle plate are detachably connected with the main board 1; the multiple layers of fins 4 are parallel to the first and second baffles. A heat conductor 5 is fixed in the position, opposite to the chip 2, in the heat dissipation shell 3; the heat dissipation shell 3 is detachably connected with the board card 1, and the heat conductor 5 is tightly attached to the chip 2 under the connection state of the heat dissipation shell and the board card.
The heat that chip 2 on the integrated circuit board 1 produced is transmitted heat dissipation casing 3 by thermal conductor 5, and the structure that has fin 4 on heat dissipation casing 3 can be taken away the medium of heat transmission outside to the wind current sees, can all effectively take away the heat through the wind current of heat dissipation casing 3 upper and lower side, compares and has the radiating structural design can reach better radiating effect now.
Example 2
This embodiment provides a heat abstractor for chip integrated circuit board, the device includes:
the radiating shell 3 is internally provided with a plurality of layers of radiating fins 4 which are arranged in parallel, the radiating shell 3 comprises an outer shell plate, a first baffle plate and a second baffle plate, the first baffle plate and the second baffle plate are relatively fixed at two ends of the outer shell plate, and the first baffle plate and the second baffle plate are detachably connected with the main board 1; the multiple layers of fins 4 are parallel to the first and second baffles. The whole inside space can be filled up to the fin structure, replaces different materials or thickness and can reach the better radiating effect and just have a plurality of heat pipes 51 to chip 2's rigidity in the radiating shell 3, and the heat pipe is the U-shaped pipe, and a plurality of heat pipes are placed in parallel, and U-shaped connects on one side on radiating shell 3, and chip 2 is hugged closely to the another side.
Example 3
This embodiment provides a heat abstractor for chip integrated circuit board, the device includes:
the heat dissipation device comprises a heat dissipation shell 3, wherein multiple layers of heat dissipation fins 4 which are arranged in parallel are arranged in the heat dissipation shell 3, the heat dissipation shell 3 comprises a first baffle and a second baffle, the first baffle and the second baffle are relatively fixed at two ends of an outer shell, and the first baffle and the second baffle are detachably connected with a main board 1; the multi-layer radiating fins 4 are parallel to the first baffle and the second baffle and are connected through a pair of parallel edges. A heat conductor 5 is fixed in the heat dissipation shell 3 at a position opposite to the chip 2, the heat conductor 5 comprises a heat conduction pipe 51 and a copper block 52, an insulating heat conduction sheet is attached to one side, close to the chip, of the copper block 52, the copper block 52 is connected with the heat conduction pipe 51, and the heat conduction pipe 51 is connected with the heat dissipation shell 3. The heat of the chip can be transferred to the copper block and then transferred to the heat dissipation housing 3 through the heat pipe.
Although the present invention has been described in detail by referring to the drawings in conjunction with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and substance of the present invention, and these modifications or substitutions are intended to be within the scope of the present invention/any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (5)
1. A heat dissipation device for a chip card, the device comprising:
the heat dissipation device comprises a heat dissipation shell, a heat radiator and a heat conducting device, wherein multiple layers of heat dissipation fins are arranged in parallel in the heat dissipation shell, and the heat conducting device is fixed in the heat dissipation shell at a position opposite to a chip; the heat dissipation shell is detachably connected with the board card; the heat conductor is tightly attached to the chip.
2. The device of claim 1, wherein the heat dissipation housing comprises an outer shell plate, a first baffle plate and a second baffle plate, the first baffle plate and the second baffle plate are fixed at two ends of the outer shell plate relatively, and the first baffle plate and the second baffle plate are detachably connected with the main board; the multiple layers of radiating fins are parallel to the first baffle and the second baffle.
3. The apparatus of claim 1, wherein the heat conductor comprises a heat pipe, one end of the heat pipe is fixed on the heat dissipation housing, and the other end of the heat pipe is tightly attached to the chip.
4. The apparatus of claim 3, wherein the heat conductive pipe is a U-shaped pipe.
5. The apparatus of claim 3, wherein the heat conductor further comprises a copper block, wherein the copper block is attached to the insulating heat conducting sheet on a side of the copper block adjacent to the chip, and wherein the copper block is connected to the heat conducting pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922419426.1U CN211087154U (en) | 2019-12-27 | 2019-12-27 | Heat dissipation device for chip board card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922419426.1U CN211087154U (en) | 2019-12-27 | 2019-12-27 | Heat dissipation device for chip board card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211087154U true CN211087154U (en) | 2020-07-24 |
Family
ID=71626336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922419426.1U Active CN211087154U (en) | 2019-12-27 | 2019-12-27 | Heat dissipation device for chip board card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211087154U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114639645A (en) * | 2022-03-28 | 2022-06-17 | 南昌黑鲨科技有限公司 | Heat dissipation system of chip and mobile terminal |
-
2019
- 2019-12-27 CN CN201922419426.1U patent/CN211087154U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114639645A (en) * | 2022-03-28 | 2022-06-17 | 南昌黑鲨科技有限公司 | Heat dissipation system of chip and mobile terminal |
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