CN211297529U - Heat radiation structure of communication equipment - Google Patents
Heat radiation structure of communication equipment Download PDFInfo
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- CN211297529U CN211297529U CN202020170477.5U CN202020170477U CN211297529U CN 211297529 U CN211297529 U CN 211297529U CN 202020170477 U CN202020170477 U CN 202020170477U CN 211297529 U CN211297529 U CN 211297529U
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Abstract
The utility model provides a communication equipment's heat radiation structure, it includes: a printed circuit board on which a chip is disposed; the shell and the printed circuit board are arranged on two sides of the chip; the chip and the shell are directly clamped with a heat conducting plate, the area of the heat conducting plate is larger than that of the chip, and the chip is positioned in the center of the heat conducting plate when viewed from top; a heat-resistant plate made of heat-resistant material is arranged between the heat-conducting plate and the shell, the area of the heat-resistant plate is larger than that of the heat-conducting plate, and the heat-conducting plate is positioned in the center of the heat-resistant plate when viewed from top. The heat conducting plate with the area larger than that of the chip is arranged between the shell and the chip, and the heat resisting plate is further arranged between the heat conducting plate and the shell, so that the chip serving as a point-shaped heat source does not directly transmit heat to a local area of the shell in a centralized manner, and the heat of the chip is radiated more uniformly; on the other hand, the heat conducting plate and the heat resisting plate are simple in structure, lower in cost and higher in safety.
Description
Technical Field
The utility model relates to a communication equipment's heat radiation structure.
Background
At present, in order to improve the processing capacity of the device, many communication devices (such as a router, a base station, a television box, etc.) include a chip with high performance, and in order to dissipate heat of the chip, the prior art generally adopts means such as a fan to transfer heat on the chip to a vent of a device housing. However, since the volume of the communication device is smaller than that of other devices (such as a computer host, a server, etc.) with heat dissipation requirements, the volume of the chip is also smaller. The volume of the fan and the motor is difficult to set in a narrow space, so that the communication equipment adopting the fan heat dissipation scheme cannot be miniaturized.
In view of this, document 1 (publication number: CN105207924A) discloses a WIFI router based on a 3G network, which is used to solve the problem of low heat dissipation efficiency of the existing router. The invention comprises a shell, wherein a PCB is arranged in the shell, the PCB is connected with an antenna, the PCB is provided with a chip, the PCB is provided with a heat dissipation device arranged above the chip, the heat dissipation device comprises an upper shell and a lower shell arranged above the chip, the upper shell is arranged above the lower shell and forms a vacuum steam cavity with the lower shell, the inner wall of the steam cavity is provided with a spiral diversion trench, the outer surface of the spiral diversion trench is provided with a liquid absorption core matched with the spiral diversion trench, and the inside of the steam cavity is filled with working liquid.
That is, in document 1, the chip is cooled by liquid cooling. However, such a solution has the disadvantages that: on one hand, the water cooling system needs a controller, a pump, a circulating pipeline, a condensing part and other parts to be matched with each other, wherein especially the pipeline filled with liquid reduces the safety redundancy of the equipment, once blockage or leakage occurs, the cooling liquid can soak the circuit in the equipment to cause damage, and the failure rate is higher; on the other hand, the laying of the pipeline in narrow equipment results in concentrated heat conduction on the casing of the equipment adjacent to the pipeline, so that the temperature of the casing in this part is too high, which is particularly prominent in equipment with a metal part of the casing; furthermore, the liquid cooling device is expensive and not suitable for mass production.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a communication equipment's heat radiation structure that the security is higher, the cost is lower and be difficult to lead to the too high of shell local temperature in order to overcome among the prior art communication equipment heat dissipation pipeline and the redundancy is low, with high costs easily.
The utility model discloses an above-mentioned technical problem is solved through following technical scheme:
a heat radiation structure of a communication apparatus, characterized in that it comprises: the chip comprises a printed circuit board, a chip and a chip, wherein the chip is arranged on the printed circuit board; the shell and the printed circuit board are arranged on two sides of the chip; the chip and the shell are directly clamped with a heat conducting plate, the area of the heat conducting plate is larger than that of the chip, and the chip is positioned in the center of the heat conducting plate when viewed from top; a heat-resistant plate made of heat-resistant material is arranged between the heat-conducting plate and the shell, the area of the heat-resistant plate is larger than that of the heat-conducting plate, and the heat-conducting plate is positioned in the center of the heat-resistant plate when viewed from top.
Preferably, an insulating layer is arranged between the heat conducting plate and the chip, and the heat conducting plate is made of metal.
Preferably, a heat conduction layer is arranged between the insulating layer and the chip, the heat conduction layer is overlapped with the chip in a overlooking mode, the area of the heat conduction layer is not larger than that of the chip, and the heat conduction plate is made of metal aluminum.
Preferably, the heat-resistant plate, the heat-conducting layer and the insulating layer are arranged in a clinging manner.
Preferably, the portion of the housing overlapping the heat resistant plate is made of metal in a plan view.
Preferably, the thickness of the heat conducting layer is larger than that of the heat conducting layer.
Preferably, the area ratio of the heat conducting plate to the chip is greater than 1.2: 1.
The utility model discloses an actively advance the effect and lie in: the heat conducting plate with the area larger than that of the chip is arranged between the shell and the chip, and the heat resisting plate is further arranged between the heat conducting plate and the shell, so that the chip serving as a point-shaped heat source does not directly transmit heat to a local area of the shell in a centralized manner, and the heat of the chip is radiated more uniformly; on the other hand, the heat conducting plate and the heat resisting plate are simple in structure, low in cost and high in redundancy of safety and the like.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation structure of a communication device according to a preferred embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a communication device according to a preferred embodiment of the present invention.
Detailed Description
The present invention will be more clearly and completely described below by way of examples and with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a heat dissipation structure of a communication device in this embodiment, and fig. 2 is a schematic structural diagram of a communication device in this embodiment. As shown in fig. 1 to 2, the heat dissipation structure 100 of the communication device according to the present embodiment is disposed at the bottom of the communication device 200, and includes: a printed circuit board 1, a housing 7, a heat conducting plate 5 and a heat resistant plate 6.
The printed circuit board 1 is provided with a chip 2, and the shell 7 and the printed circuit board 1 are arranged on two sides of the chip 2. The heat conducting plate 5 is directly clamped between the chip 2 and the shell 7, the area of the heat conducting plate 5 is larger than that of the chip 2, and the chip 2 is positioned at the center of the heat conducting plate 5 in overlooking; a heat-resistant plate 6 made of a heat-resistant material is arranged between the heat-conducting plate 5 and the shell 7, the area of the heat-resistant plate 6 is larger than that of the heat-conducting plate 5, and the heat-conducting plate 5 is positioned at the center of the heat-resistant plate 6 in a overlooking mode. The portion of the housing 7 overlapping the heat blocking plate 6 in a plan view is made of metal.
Specifically, in the present embodiment, the communication device 200 is a router or a switch, and the printed circuit board 1 with the chip 2 is located at the bottom of the communication device 200. The housing 7 at the bottom of the communication device 200 may be made entirely of metal or may be made partially of metal. Thus, the housing can have good mechanical strength and a certain noise suppression function. In addition, the central position mentioned above refers to the middle, in other words, the vertical projection of the chip 2 is located in the middle of the heat conducting plate 5, completely coincides with the heat conducting plate 5 and is surrounded or semi-surrounded by the edge portion of the heat conducting plate 5.
After heat is transferred to the heat conducting plate 5 having a larger area on the chip 2, the heat of the same spot on the chip 2 is partially blocked by the heat blocking plate 6, and thus the heat is not transferred to the case 7, but is uniformly distributed according to the shape of the heat conducting plate 5.
Because the area of hindering hot plate 6 is greater than heat-conducting plate 5, and the area of heat-conducting plate 5 is greater than chip 2, and chip 2 is located the middle part of heat-conducting plate 5, and the heat part that directly transmits to shell 7 originally is hindered the hot plate separation, and in the amount that the heat distributes, the heat is originally transmitted to the partial heat of shell 7 by heat-conducting plate 5 and can only be transmitted through distributing to the air, and the heat dissipation is more even like this.
Further, be provided with one deck insulating layer 4 between heat-conducting plate 5 and chip 2, be provided with heat-conducting layer 3 between insulating layer 4 and the chip 2, heat-conducting layer 3 overlaps with chip 2 when overlooking, and the area of heat-conducting layer 3 is not more than the area of chip 2. The heat-conducting plate 5 is made of metallic aluminum.
Specifically, the heat capacity of the metal aluminum is low, and the heat can be absorbed quickly, so that the heat conducting plate 5 can quickly disperse point-like heat into planar heat when being matched with the heat resisting plate. The oxide layer formed on the surface of the oxidized metal aluminum can well protect the heat conducting plate 5 from further corrosion. Due to the conductivity of metallic aluminum, an insulating layer 4 needs to be provided between the heat conductive plate 5 and the chip. The insulating layer 4 may be an insulating coating or an insulating pad, and in this embodiment, an insulating pad is used.
The heat-conducting layer 3 with the area not larger than that of the chip 2 is arranged between the insulating layer 4 and the chip 2, the heat on the chip can penetrate through the insulating layer more easily, the heat-insulating plate 6, the heat-conducting plate 5, the heat-conducting layer 3 and the insulating layer 4 can be stacked to form a laminated body, the printed circuit board 1 and the shell 7 jointly form an I-shaped structure, a step is arranged on the laminated body, and the heat-radiating area exposed in the air can be increased by matching the I-shaped structure. The step-like layered body conforms to the tendency of heat radiation in a state where the point-like heat source spreads to the planar heat distribution portion.
In addition, the heat-blocking plate 6, the heat-conducting plate 5, the heat-conducting layer 3, and the insulating layer 4 are disposed in close contact with each other for more efficient heat transfer. Since the heat conductive plate 5 occupies the highest contribution when the point heat source is spread in a planar shape, providing the heat conductive plate 5 with a thickness larger than that of the heat conductive layer 3 can further enhance the spreading effect. The area ratio of the heat conducting plate 5 to the chip 2 is more than 1.2: 1.
The position of the housing 7 opposite to the heat-generating chip 2 is the highest temperature position of the bottom surface of the communication device 200. Under the same test condition, the temperature of the shell 7 on the vertical projection point corresponding to the chip 2 is 45.8 ℃ through measurement when the heat-resistant plate is not used. According to the solution of the present embodiment, the measured temperature of the metal housing 7 at the vertical projection and the peripheral position corresponding to the chip 2 is 42.8 ℃.
Although particular embodiments of the present invention have been described above, it will be appreciated by those skilled in the art that these are examples only and that the scope of the present invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and the principles of the present invention, and these changes and modifications are all within the scope of the present invention.
Claims (7)
1. A heat dissipation structure of a communication apparatus, characterized by comprising:
the chip comprises a printed circuit board, a chip and a chip, wherein the chip is arranged on the printed circuit board;
the shell and the printed circuit board are arranged on two sides of the chip;
the chip and the shell are directly clamped with a heat conducting plate,
the area of the heat conducting plate is larger than that of the chip, and the chip is positioned in the center of the heat conducting plate when viewed from top;
a heat-resistant plate made of heat-resistant material is arranged between the heat-conducting plate and the shell,
the area of the heat-resistant plate is larger than that of the heat-conducting plate, and the heat-conducting plate is positioned in the center of the heat-resistant plate when viewed from top.
2. The heat dissipation structure of a communication device of claim 1,
an insulating layer is arranged between the heat conducting plate and the chip,
the heat conducting plate is made of metal.
3. The heat dissipation structure of a communication device of claim 2,
a heat conducting layer is arranged between the insulating layer and the chip,
the heat conduction layer is overlapped with the chip in a top view, the area of the heat conduction layer is not larger than that of the chip,
the heat conducting plate is made of metal aluminum.
4. The heat dissipation structure of a communication device of claim 3,
the heat-resisting plate, the heat-conducting layer and the insulating layer are arranged in a clinging manner.
5. The heat dissipation structure of a communication device of claim 4,
the portion of the housing overlapping the heat blocking plate is made of metal in a plan view.
6. The heat dissipation structure of a communication device of claim 5,
the thickness of the heat conducting plate is larger than that of the heat conducting layer.
7. The heat dissipation structure of a communication device of claim 6,
the area ratio of the heat conducting plate to the chip is larger than 1.2: 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020170477.5U CN211297529U (en) | 2020-02-14 | 2020-02-14 | Heat radiation structure of communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020170477.5U CN211297529U (en) | 2020-02-14 | 2020-02-14 | Heat radiation structure of communication equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211297529U true CN211297529U (en) | 2020-08-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020170477.5U Active CN211297529U (en) | 2020-02-14 | 2020-02-14 | Heat radiation structure of communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211297529U (en) |
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2020
- 2020-02-14 CN CN202020170477.5U patent/CN211297529U/en active Active
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