4 M267172 八、新型說明： 【新型所屬之技術領域】 本創作係一種自動於裝填晶片之紙帶體一側貼附膠膜 ’並且於膠膜上衝製細小的的機具。 【先前技術】 晶片之體積越來越小，為了方便製造，故將細小的晶 片置於線性的晶片帶内，以利後續將晶片——取出安裝， 而為了可以在同一機具上進行紙製晶片帶體的衝孔作業， 以及貼覆膠膜，於是有業者設計一如附件所示之公告第4 6 8 6 3 1號「晶片用之帶體的衝孔及貼帶機構一體化裝 置」新型專利案（以下簡稱參考案），主要是在一機台工 的同一條帶體傳輸線上組設衝孔機構5、貼帶機構6、間 歇帶料組7、進料組3、感測組4、傳動組9及調整組8 ，藉由皮帶輪9 1分別傳遞動力予衝孔機構5、貼帶機構 6及間歇帶料組7，使三者能夠相互協調同步施行帶體2 之衝孔及貼底帶2 2。 惟，上述簽考案雖然可以在同一機台上進行帶體衝孔 以及貼帶之作業，然而，晶片帶卻具有不方便置入之缺失 ，蓋因：如參考案之第八圖所示，晶片帶之上帶2 ^為紙 製帶體，#由衝孔機構5在上帶2工上衝製成型矩形的晶 片放置孔2 4，再將膠膜狀之底帶2 2貼附於上帶2丄底 部，完成後再予以捲繞收攏。待下一程序，再將晶片帶拉 直，置入晶片，然而，由於晶片放置孔2 4之空間極小， 内部具有空氣而會形成壓力，使晶片不易置入，甚至掉到 M267172 ♦ 外側，誠為業者亟需進一步改良者。 【新型内容】 為了改善上述缺失，本創作之主要目的在於提供一種 可供晶片順利置入晶片放置孔内的晶片帶體，以及製造該 種晶片帶體的膠膜衝孔機構。 基於上述目的，本創作之主要技術手段在於提供一種 晶片帶體，係由一紙帶以及一膠膜所貼合而成，紙帶上之 同一側設有一排定位穿孔，而另一側則設有一排晶片放置 孔，位於各晶片放置孔範圍内之膠膜上分別設有貫穿之出 氣孔。 藉由上述具有出氡孔之晶片帶體，當欲將晶片置入晶 片放置孔時，晶片即可以將空氣由出氣孔壓出，改善因為 放置孔之壓力過大，使晶片不易置入之缺失。 此外，本創作更進一步具體提供一種可以在晶片帶體 上衝製出氣孔的膠膜衝孔機構，其包括一結合於貼帶機之 機台上的下模打孔座、一嵌設於下模打孔座頂部之下模座 、一相應位於下模座上方並且可被驅動上下移動之上模座 、一驅動上模座作動之驅動裝置，其中，所述之下模座上 間隔δ又有一排上下貫穿之針孔，而上模座底部則突設有可 相應插入針孔内之衝針，又所述之驅動裝置係包括一樞設 於衝孔機之機台頂部之搖臂，搖臂其中一端樞設於上模座 ，另一端則樞設於一迴轉座，該迴轉座係以偏心狀樞設於 一減速裝置之動力輸出軸上。 實施上述技術手段以後，當減速裝置之動力輸出軸轉 * M267172 動牯，即可以使偏心狀的迴轉座產生迴轉，進而使搖臂上 下偏擺，帶動上模座升降，使上模座下降，以衝針在晶片 帶體之膠模上衝孔，或者上升離開下模打孔座之範圍。 【實施方式】 本創作所提供之晶片帶體（2 〇 )係如第一圖所示， 仍疋由一紙帶（2 1 )以及貼覆於紙帶（2丄）其中一側 面上之膠膜（22)所組成，其中，、紙帶⑴）上間隔 設有圓形之定位穿孔（211)，使紙帶（21)得以藉 由各定位穿孔（211)穿置於突出物上，沿著-定的方 向移動’又於紙帶（2 1 )上衝製有晶片放置孔（2工2 )，而為了方便晶片置入晶片放置孔（2工2 )内特別 於各曰曰片放置孔（2 1 2) 圍内之膠膜（22)上穿設 有出轧孔（2 2 1 )，藉由該出氣孔（2 2玉）的設計， 置入晶片的過程中，晶片即可以將空氣由出氣％ (2 2 i )壓出’改善因為放置孔之壓力過大，使晶片不易置入之 此外，本創作晶片帶體（2 〇 )亦可 = 下方之吸氣裝置使用，當置人晶片時， =吸氣裝置將晶片放置孔（212…空氣經由 =21)吸出’以產生吸力，將晶片順利吸入晶 放置孔（2 1 2 )内。 上述為本創作所提供之具有出 帶體、乙匕丄）之日日 )，而欲在晶片帶體（2 〇 )之膠膜（2 2 上成型出氣^ Κ Δ Δ 2 1 )，則有賴本創作之衝孔機構（ M267172 0 ) 〇 請參閱第二圖所示’本創作係實施於前述晶片帶之貼 帶機上，亦即於一機台（i 〇 )頂面一端設有一紙帶衝孔 機構（1 1)，中段設有一貼帶機構（丄3)，另設有由 兩導輪（1 20)以及兩導輪臂2 所組成之間歇 帶料組（12)，兩導輪（12)與兩導輪臂（121) 係分別位於貼帶機構（1 3 )之兩側，紙帶（2 i )經由 衝孔機構（1 1 )衝孔之後，再經由一導輪（1 2 〇 )與 導輪臂（1 2 1)配合往前輸送，藉由貼帶機構（1 3) 將膠膜（22)壓貼於紙帶（2 1)底面，再由另一導輪 (1 2 0 )與導輪臂（1 2 1 )配合將完成貼膜程序之晶 片帶體（20)送出。而為了在膠膜（2 2)上衝孔，本 創作係於機台（1 0 )之出料端〔即異於紙帶衝孔機構（ 1 1 )该知〕s又有一勝膜衝孔機構（3 〇 )，又紙帶衝孔 機構（1 1 )、間歇帶料組（1 2 )以及膠膜衝孔機構（ 30)均被一馬達（1 4)所帶動。 請同時參閱第二、三及四圖所示，該膠膜衝孔機構（ 3 0 )係包括一可被驅動上下移動之上模座（3丄）、一 結合於機台（1 0 )上之下模打孔座（3 2 )、一嵌設於 下模打孔座（3 2 )頂部之下模座（3 3 )、一驅動上模 座（3 1 )作動之驅動裝置（3 5 )，其中，於機台（工' 0 )之一側設有一立板（4 0 )，於立板（4 〇 )上結合 呈上下延伸之滑執（4 1 )’以供上模座（3 1 )纟士人 並且沿著滑軌（4 1 )升降，另於滑執（4 χ )下方姓人4 M267172 8. Description of the new model: [Technical field to which the new model belongs] This creation is a kind of machine that automatically attaches a film ′ on the side of the paper tape body on which the wafer is loaded, and punches a small film on the film. [Previous technology] The size of wafers is getting smaller and smaller. In order to facilitate manufacturing, small wafers are placed in linear wafer strips to facilitate subsequent wafer removal-installation, and to enable paper wafers to be processed on the same machine. The punching operation of the tape body and the application of the adhesive film, so the industry designed a new type of "Punching and tape mechanism integrated device for the tape body for wafers" as shown in the attached announcement No. 4 6 8 6 3 1 The patent case (hereinafter referred to as the reference case) mainly consists of a punching mechanism 5, a sticking mechanism 6, an intermittent feeding group 7, a feeding group 3, and a sensing group 4 on the same belt transmission line of a machine. The transmission group 9 and the adjustment group 8 transmit power to the punching mechanism 5, the sticking mechanism 6, and the intermittent tape group 7 through the pulley 9 1 so that the three can perform the punching and sticking of the belt 2 in synchronization with each other.底 带 2 2． However, although the above test case can be used for punching and attaching the tape on the same machine, the wafer has the disadvantage of being inconvenient to insert. The reason is: as shown in the eighth figure of the reference case, the wafer The tape 2 on the tape is a paper tape body. #A punching mechanism 5 punches a rectangular wafer placement hole 2 4 on the upper tape 2 and attaches a film-shaped bottom tape 2 2 to the upper. Tape the bottom of 2 丄 and wind it up when finished. Wait for the next procedure, then straighten the wafer tape and insert it into the wafer. However, the space for the wafer placement holes 24 is very small, and the inside has air to form pressure, which makes it difficult to insert the wafer and even fall to M267172. For the industry, there is an urgent need for further improvement. [New content] In order to improve the above-mentioned shortcomings, the main purpose of this creation is to provide a wafer tape body in which wafers can be smoothly placed in the wafer placement holes, and a film punching mechanism for manufacturing the wafer tape body. Based on the above purpose, the main technical means of this creation is to provide a wafer tape body made of a paper tape and an adhesive film. One side of the paper tape is provided with a row of positioning perforations, and the other side is provided with There is a row of wafer placement holes, and the adhesive films located within the range of each wafer placement hole are respectively provided with vent holes therethrough. With the above-mentioned wafer tape body having an exit hole, when the wafer is to be placed in the wafer placement hole, the wafer can press out the air from the exit hole, which is improved because the pressure of the placement hole is too large, which makes the wafer difficult to be inserted. In addition, this creation further specifically provides a rubber film punching mechanism capable of punching air holes on a wafer tape body, which includes a lower die punching seat combined with a machine table of a tape attaching machine, and an embedded in the lower part. The lower die seat at the top of the die punching seat, a corresponding upper die seat that can be driven up and down and can be driven to move up and down, and a driving device for driving the upper die seat, wherein the interval δ on the lower die seat is There is a row of pinholes penetrating up and down, and the bottom of the upper die seat is provided with a punching pin that can be inserted into the pinhole correspondingly. The driving device includes a swing arm that is pivoted on the top of the punching machine. One end of the rocker arm is pivotally mounted on the upper die seat, and the other end is pivotally mounted on a swivel seat, which is eccentrically pivoted on a power output shaft of a reduction gear. After the implementation of the above technical means, when the power output shaft of the reduction gear rotates * M267172, the eccentric swivel seat can be rotated, and the swing arm can sway up and down, which drives the upper mold seat to move up and down and lower the upper mold seat. Use a punch pin to punch holes in the rubber mold of the wafer band, or rise away from the range of the lower die punching seat. [Embodiment] As shown in the first figure, the wafer body (20) provided by this creation is still made of a paper tape (2 1) and an adhesive tape attached to one side of the paper tape (2). The film (22) is composed of circular positioning perforations (211) on the paper tape ⑴), so that the paper tape (21) can be put on the protrusion through each positioning perforation (211), Moving in a fixed direction ', a wafer placement hole (2nd process 2) is punched on the paper tape (2 1), and in order to facilitate the placement of the wafer into the wafer placement hole (2nd process 2), the wafer placement is particularly special. A hole (2 2 1) is provided on the adhesive film (22) in the periphery of the hole (2 1 2). With the design of the air hole (2 2 jade), the wafer can be placed in the process of inserting the wafer. Pressing the air out of the gas outlet% (2 2 i) 'improves because the pressure of the placement hole is too large, making it difficult to place the wafer. In addition, the original wafer band (20) can also be used as the suction device below. When a person holds a wafer, a suction device sucks out the wafer placement hole (212 ... air via = 21) to generate a suction force, and the wafer is smoothly sucked into the wafer placement hole (2 1 2). The above is the date provided for the creation with a tape body and a dagger.), And it is necessary to form a gas on the film (2 2) of the wafer tape body (2 0) ^ κ Δ Δ 2 1) The punching mechanism of this creation (M267172 0) 〇 Please refer to the second figure, 'This creation is implemented on the above-mentioned wafer tape applicator, that is, a paper tape is provided on one end of the top surface of a machine (i 〇). Punching mechanism (1 1), a tape sticking mechanism (丄 3) is set in the middle section, and an intermittent tape group (12) composed of two guide wheels (1 20) and two guide wheel arms 2 is provided, and two guide wheels (12) and the two guide wheel arms (121) are respectively located on both sides of the sticking mechanism (1 3). After the paper tape (2 i) is punched through the punching mechanism (1 1), it is then passed through a guide wheel (1 2 〇) Conveying forward with the guide arm (1 2 1), pressing the adhesive film (22) against the bottom surface of the paper tape (2 1) by the sticking mechanism (1 3), and then by another guide wheel ( 1 2 0) Cooperate with the guide wheel arm (1 2 1) to send out the wafer tape body (20) that has completed the filming process. In order to punch holes on the adhesive film (2 2), this creation is based on the output end of the machine (1 0) (that is, different from the tape punching mechanism (1 1)). There is also a winning film punching. The mechanism (30), the paper tape punching mechanism (1 1), the intermittent tape feeding group (12), and the film punching mechanism (30) are all driven by a motor (14). Please also refer to the second, third and fourth figures at the same time. The film punching mechanism (30) includes an upper die seat (3 可) which can be driven to move up and down, and a combination of the upper die seat (1). Lower die punch seat (3 2), a lower die seat (3 3) embedded in the top of the lower die punch seat (3 2), and a driving device (3 5) for driving the upper die seat (3 1). ), Where a vertical plate (40) is provided on one side of the machine (work '0), and a sliding handle (4 1)' extending up and down is combined on the vertical plate (40) for the upper mold base ( 3 1) Just men and descend along the slide rail (4 1), and the surname is below the slide handle (4 χ)
I M267172 所述之下模打孔座（3 2 )，下模打孔座（3 2 )係突伸 立板（4 0 )表面，於下模打孔座（3 2 )頂面嵌設一相 應位於上模座（31)下方之下模座（33)，於下模座 (33)及下模打孔座（3 2)頂面凹設有一道供第一圖 所示之晶片帶體（20)通過之凹槽（320) ( 3 3 0 )’又於凹槽（3 3 0 )内間隔設有數個上下貫穿之針孔 (331)，針孔（3 3 1 )之間距即為第一圖之晶片帶 體（2 0 )的晶片放置孔（2 1 2 )間距。 所述之上模座（3 1 )底部突設數支可以相應插置於 各針孔（3 3 1 )内之衝針（3 1 0 )，另於下模打孔座 (3 2 )頂部結合一壓板（3 4 )，壓板（3 4 )係局部 覆蓋於凹槽（320) (330)上方，使晶片帶體（2 0 )可以順利通過凹槽（3 2 〇 ) ( 3 3 0 )與壓板（3 4 )之間’壓板（3 4 )之覆蓋範圍不及於各針孔（3 3 1 )’使各衝針（3 1 0 )可以順利地對插置於針孔（3 3 1 )。又該上模座（3 1 )係被一驅動裝置（3 5 )所 驅動，以沿著滑轨（4 1 )升降，當其下降時，即可以使 衝針（3 1 〇 )穿過位在下模打孔座（3 2 )、下模座（ 3 凹槽（320) (330)上之晶片帶體（2〇) ^閱第圖）的晶片放置孔（212)，以在膠膜（ 上衝出出氣孔（2 2 1 )，並配合一位在下模打孑lAccording to I M267172, the lower die punching seat (3 2), the lower die punching seat (3 2) is the surface of the protruding stand (40), and one is embedded in the top surface of the lower die punching seat (3 2). Correspondingly located on the lower mold base (33) below the upper mold base (31), a wafer tape body is recessed on the top surface of the lower mold base (33) and the lower mold punching base (32), as shown in the first figure. (20) Passing groove (320) (3 3 0) 'is also provided with several pin holes (331) penetrating up and down in the groove (3 3 0). The distance between the pin holes (3 3 1) is The pitch of the wafer placement holes (2 1 2) of the wafer band (20) in the first figure. The bottom of the upper die seat (3 1) is provided with a plurality of protruding needles (3 1 0) that can be inserted into the respective pin holes (3 3 1), and the top of the lower die punch seat (3 2). Combined with a pressure plate (3 4), the pressure plate (3 4) is partially covered above the groove (320) (330), so that the wafer band body (2 0) can pass through the groove (3 2 0) (3 3 0). The coverage of the pressure plate (3 4) is less than that of the pinholes (3 3 1) between the pressure plate and the pressure plate (3 4), so that each punching pin (3 1 0) can be smoothly inserted into the pinhole (3 3 1) ). The upper die seat (3 1) is driven by a driving device (3 5) to rise and fall along the slide rail (4 1), and when it is lowered, the punching pin (3 1 〇) can pass through. Place wafer holes (212) in the die holder (3 2) and wafer holder (20) on the lower die holder (3 grooves (320) (330) ^ see the figure), so that Punch out the air hole (2 2 1), and cooperate with one to doze in the lower die.
座 ^ Π Q X )底部之吸氣裝置（3 6 )將膠膜屑吸走。 所述驅動裝置（3 5 )係包括一固定於機台（ 頂部之播臂古p ^, 播<支撐立板（35〇)、一樞設於搖臂支撐立柄 M267172 (3 5 〇)上之搖臂（3 5 i )，該搖臂 中一端係樞設於所述之上模座（3 1 ) 2 八 一迴轉座（352)，該迴轉座（3 5 2 ^端則枢設於 槌設於-減速裝置（3 5 3 )之動 二偏心狀態 ，該減速裝置（3 5 3 )之動力輸入端二:3 5 4 )上 達（14)連動。由於迴轉座（匕皮帶與馬 於動力輸出轴（3 5 4 )上，故當動力=== =，迴轉座…2”卩會繞著動力二3(5“ 二::而=搖臂（351)偏擺，即使得上 (41)升降，配合間”料組 下模Γη'晶片㈣（2〇)被輸送至上模座（31)與 之間時，即停止輸送動作，以上模座（3 广〇)之膠膜（22)上衝孔，所產生二= 曰由銜接於下模打孔座（32)底部之吸 吸走，待上模座衣置（36) ?)將曰η姓 1 )上升之後，再以間歇帶料組（工 2)將曰曰片帶體（2〇)往前輸送，而後使上模 )下降作衝孔動作，藉此即可依次在晶片帶體（ 各晶片放置孔1 Ο、 (2 2 ]、 2 1 2 )上的膠膜（2 2 )上衝製出氣孔 (J 2 1 )以利晶片置入。 【圖式簡單說明】 =圖係本創作之晶片帶體的立體局部剖面示意圖。 第^圖係本創作安裝於貼帶機上之平面示意圖。 第三圖係本創作之立體外觀示意圖。 M267172 圖 第四圖係本創作安裝㈣帶機上之局部平面放大示意 第五圖係本創作衝孔時 【主要元件符號說明】 (1 〇)機台 (1 2 )間歇帶料組 (121)導輪臂 (1 4 )馬達 (2 〇 )晶片帶體 (2 1 1 )定位穿孔 (2 2 )膠膜 (3 〇 )膠膜衝孔機構 (3 1 〇 )衝針 (3 2 )下模打孔座 (3 3 )下模座 (3 3 1 )針孔 (3 5 )驅動裝置 (3 5 1 )搖臂 (3 5 3 )減速裝置 (3 6 )吸氣裝置 (4 1 )滑軌 之局部平面放大示意圖 (11)紙帶衝孔機構 (1 2 〇 )導輪 (1 3 )貼帶機構 (21)紙帶 (2 1 2 )晶片放置孔 (2 2 1 )出氣孔 (31)上模座 (3 2 〇 )凹槽 (3 3 〇 )凹槽 (3 4 )壓板 (3 5 0 )搖臂支撐立板 (3 5 2 )迴轉座 (3 5 4 )動力輪出軸 (4 〇 )立板The suction device (36) at the bottom of the base ^ Π Q X) sucks away the film dust. The driving device (3 5) includes a rigging arm on the top of the machine (播, & < support stand (35)), a pivotal support arm shank M267172 (3 5 〇) The upper rocker arm (3 5 i), one end of the rocker arm is pivoted on the upper mold base (3 1) 2 the Bayi swivel base (352), and the swivel base (3 5 2 ^ end is pivoted) When the mallet is set to the eccentric state of the second gear reduction device (3 5 3), the power input end of the gear reduction device (3 5 3): 3 5 4) is linked up to (14). Because the rotary seat (dagger belt and horse On the power output shaft (3 5 4), so when the power ====, the swivel seat ... 2 "卩 will sway around the power 2 3 (5" 2 :: == rocker arm (351), which makes the upper (41) Lifting and matching, the lower mold Γη 'wafer ㈣ (20) is transported to the upper mold base (31) and between, then the conveying operation is stopped, and the film of the upper mold base (3 wide 0) ( 22) Punching on the top, resulting in two = is sucked away by the suction connected to the bottom of the punching seat (32) of the lower die, after the upper die seat clothes (36)?) Raise the last name 1), and then The intermittent tape feeding group (Work 2) transports the sheet tape body (20) forward, and Lowering the upper die) for punching, so that air holes (2 2) can be punched out in sequence on the adhesive film (2 2) on the wafer strip body (each wafer placing hole 10, (2 2), 2 1 2). J 2 1) Eli chip placement. [Simplified illustration of the drawing] = The drawing is a three-dimensional partial cross-sectional schematic diagram of the wafer belt of the original creation. The third figure is a schematic plan view of the original installation on a tape mounter. The third image This is a schematic diagram of the three-dimensional appearance of this creation. M267172 The fourth picture is an enlarged illustration of the partial plane on the installation installation belt machine. The fifth picture is the punching of this creation. [Description of the main component symbols] (1 〇) Machine (1 2 ) Intermittent tape group (121) Guide wheel arm (1 4) Motor (20) Wafer tape body (2 1 1) Positioning perforation (2 2) Adhesive film (30) Adhesive film punching mechanism (3 1 〇) Punching pin (3 2) Lower die punching seat (3 3) Lower die seat (3 3 1) Pin hole (3 5) Driving device (3 5 1) Rocker arm (3 5 3) Reducer (3 6) Suction Air device (4 1) enlarged partial schematic view of the slide rail (11) paper tape punching mechanism (1 2 0) guide wheel (1 3) tape attaching mechanism (21) paper tape (2 1 2) wafer placement hole (2 2 1) die holder (3 2 〇) on air outlet (31) Grooves (33 square) recess (34) platen (350) supporting the rocker arm vertical plate (352) swivel (354) a power output shaft wheel (4 billion) riser
附件：公 及貼帶機構一 告第468631號「 體化裝置」新型專利案 晶片用之帶體 之公報影本。 的衝孔 10Attachment: A copy of the Bulletin of the Public Patent and Tape Adhesive Agency Report No. 468631 "Incorporated Device" New Patent Case Punching 10