CN2562363Y - Extra-thin IC package device - Google Patents
Extra-thin IC package device Download PDFInfo
- Publication number
- CN2562363Y CN2562363Y CN 02226931 CN02226931U CN2562363Y CN 2562363 Y CN2562363 Y CN 2562363Y CN 02226931 CN02226931 CN 02226931 CN 02226931 U CN02226931 U CN 02226931U CN 2562363 Y CN2562363 Y CN 2562363Y
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- CN
- China
- Prior art keywords
- thin
- vacuum
- ultra
- packaging system
- template
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
An ultra-thin IC packaging device is provided, which relates to the packaging technique of IC module in the field of electronic technology. The technical scheme is that a rotating supporter and a vacuum suction bench are arranged on a pedestal, supporting rods are arranged symmetrically inside the rotating supporter and each are provided with a regulating block, a connecting shaft is arranged between the regulating blocks and arranged thereon with a locking block and a locking spiral handle, and a template is arranged inside the locking block. The utility model has advantages of simple structure, convenient use, high efficiency, and controllable thickness.
Description
Technical field
The utility model relates to electronic technology field, particularly the encapsulation correlation technique of IC module in the electronic technology field.
Technical background
The encapsulation of existing IC module is generally all finished by packaging line, for small-scale encapsulation, generally with compact package machine or manual finishing.But the IC module that these sealed in units encapsulate comparatively speaking is thicker, concerning the IC module that volume requirement approaches, just be not suitable for, and waste material.For manual encapsulation, it is low to have production efficiency, and quality can not get the deficiency of aspects such as guaranteeing.
Technology contents
The purpose of this utility model is at the deficiencies in the prior art, design a kind of simple in structure, easy to use, the ultra-thin IC packaging system that can carry out ultra-thin IC encapsulation.
The purpose of this utility model can be achieved through the following technical solutions:
A kind of ultra-thin IC packaging system is located at swinging mounting and vacuum and is inhaled platform on the base of described ultra-thin IC packaging system; Be respectively equipped with regulating block on the symmetrically arranged pole in the swinging mounting, be provided with connecting axle between the regulating block, establish clamp on it, by chucking spiral shell handle card chucking template, vacuum is inhaled platform and is provided with suction hole and vacuum slot in the clamp; Module is provided with the module hole.For regulating the displacement that vacuum is inhaled platform, be provided with left position-adjusting handle, right position-adjusting handle and front and back position-adjusting handle on the described base.Connecting axle is provided with counterweight.
Technological progress of the present utility model is simple in structure, and is easy to use, the efficient height, and thickness is adjustable.
Description of drawings
Fig. 1 is a perspective view of the present utility model.
Specific implementation method
A kind of ultra-thin IC packaging system, the base 1 of described ultra-thin IC packaging system are provided with swinging mounting 2 and vacuum is inhaled platform 3; Vacuum is inhaled platform and is placed on the base 1.Be respectively equipped with regulating block 22 and 23 on the symmetrically arranged pole 20 and 21 in the swinging mounting 2, to regulate the height of template.Be provided with connecting axle 24 between the regulating block 22 and 23, establish fixture block 25 on it, by chucking spiral shell handle 250 chucking templates 4, captured template 4 can be lifted around connecting axle 24 in the fixture block 25.Vacuum is inhaled platform 3 and is provided with suction hole 31 and vacuum slot 30, and vacuum slot 30 connects vacuum pump.Template 4 is provided with module hole 40.For regulating the displacement that vacuum is inhaled platform 3, also be provided with left position-adjusting handle 10,100, right position-adjusting handle 11,110 and front and back position-adjusting handle 12 on base 1, regulating handle 10,11,12 can be regulated the position that vacuum is inhaled platform 3 relative templates 4.Connecting axle 24 is provided with counterweight 26, and template can easily be lifted.When the utility model uses, when the IC core that will encapsulate is placed on the module hole 40 of choosing the thickness template, starts vacuum pump the IC wicking is invested on the vacuum suction platform 3, on module hole 40, draw together packaging plastic, take off packaged module at last and get final product.Flow and frictioning for ease of glue, also be provided with guiding gutter 41 on the module 4.
Claims (4)
1, a kind of ultra-thin IC packaging system is characterized in that: the base of described ultra-thin IC packaging system (1) is provided with swinging mounting (2) and vacuum is inhaled platform (3); Be respectively equipped with regulating block (22) and (23) in the swinging mounting (2) on symmetrically arranged pole (20) and (21), be provided with connecting axle (24) between regulating block (22) and (23), establish fixture block (25) on it, be arranged with template (4) by chucking spiral shell handle (250) in the fixture block (25), vacuum is inhaled platform (3) and is provided with suction hole (30) and vacuum slot (31); Template (4) is provided with module hole (40).
2, ultra-thin IC packaging system according to claim 1 is characterized in that: on the described base (1), for regulating the displacement that vacuum is inhaled platform (3), be provided with left position-adjusting handle (10), right position-adjusting handle (11) and front and back position-adjusting handle (12).
3, ultra-thin IC packaging system according to claim 1 and 2 is characterized in that, connecting axle (24) is provided with counterweight (26).
4, super book IC packaging system according to claim 1 and 2 is characterized in that described template (4) is provided with guiding gutter (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02226931 CN2562363Y (en) | 2002-04-19 | 2002-04-19 | Extra-thin IC package device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02226931 CN2562363Y (en) | 2002-04-19 | 2002-04-19 | Extra-thin IC package device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2562363Y true CN2562363Y (en) | 2003-07-23 |
Family
ID=33703821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02226931 Expired - Fee Related CN2562363Y (en) | 2002-04-19 | 2002-04-19 | Extra-thin IC package device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2562363Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102723298A (en) * | 2012-05-11 | 2012-10-10 | 哈尔滨工业大学 | Electromagnetic preload XY precision motion platform |
| CN102723296A (en) * | 2012-05-11 | 2012-10-10 | 哈尔滨工业大学 | XY motion platform driven by double-layer linear motor |
| CN102723297A (en) * | 2012-05-11 | 2012-10-10 | 哈尔滨工业大学 | XY precision motion platform provided with terminal load support and symmetrical structure |
| WO2019080217A1 (en) * | 2017-10-29 | 2019-05-02 | 江苏纳沛斯半导体有限公司 | Novel ic flip-chip packaging machine |
-
2002
- 2002-04-19 CN CN 02226931 patent/CN2562363Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102723298A (en) * | 2012-05-11 | 2012-10-10 | 哈尔滨工业大学 | Electromagnetic preload XY precision motion platform |
| CN102723296A (en) * | 2012-05-11 | 2012-10-10 | 哈尔滨工业大学 | XY motion platform driven by double-layer linear motor |
| CN102723297A (en) * | 2012-05-11 | 2012-10-10 | 哈尔滨工业大学 | XY precision motion platform provided with terminal load support and symmetrical structure |
| WO2019080217A1 (en) * | 2017-10-29 | 2019-05-02 | 江苏纳沛斯半导体有限公司 | Novel ic flip-chip packaging machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |