WO2019080217A1 - Novel ic flip-chip packaging machine - Google Patents
Novel ic flip-chip packaging machineInfo
- Publication number
- WO2019080217A1 WO2019080217A1 PCT/CN2017/111520 CN2017111520W WO2019080217A1 WO 2019080217 A1 WO2019080217 A1 WO 2019080217A1 CN 2017111520 W CN2017111520 W CN 2017111520W WO 2019080217 A1 WO2019080217 A1 WO 2019080217A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- outer casing
- cover plate
- groove
- novel
- packaging machine
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
Definitions
- the utility model belongs to the technical field of processing, and in particular relates to a novel IC inverted packaging machine.
- Installation is a smart card production device. It passes the hot melt adhesive through the hot melt adhesive for a certain period of time, and is firmly bonded to the slot on the card conforming to the ISO standard.
- the packaging machine has the following components: a rack group, a pre-welding group, a module identification group, and a mold group.
- a novel IC reverse packaging machine includes an outer casing, the surface of the outer casing is provided with an exhaust port at an intermediate position of the surface, and the lower portion of the exhaust port is disposed a heat dissipation hole, a bottom end of the outer casing is provided with a foot, the heat dissipation hole and the foot are fixedly connected by welding, a side of the outer casing is provided with a switch, and a cover plate is disposed above the outer casing
- the inner surface of the cover plate is provided with a second groove, the inside of the second groove is provided with a block, the inside of the cover plate is provided with a silicone coating, and the middle position of the silicone coating is provided with a handle.
- a support plate is disposed above the cover plate, and an electrohydraulic telescopic rod is disposed below the support plate, wherein the support plate and the electro-hydraulic telescopic rod are fixedly connected by bolts, and a lower surface of the cover plate is provided with a card plate.
- the upper surface of the outer casing is provided with a first groove, and the inside of the first groove is provided with a rubber pad, and the electro-hydraulic telescopic rod is electrically connected to a power source.
- the rubber pad is similar in shape to the first groove, and is bonded to the inside of the first groove by glue bonding.
- the handle is provided with a common one, which is fixedly attached to the surface of the silicone coating by screws.
- the switch is located above one side of the outer casing and is fixedly coupled to one side surface of the outer casing by welding.
- the card board is fixedly attached to the lower surface of the cover by welding.
- the utility model has the beneficial effects that the practical design structure is scientific and reasonable, and the use is safe and convenient.
- We are provided with a rubber pad, and an electro-hydraulic telescopic rod is arranged above the cover plate, so that the cover plate can The cover is tighter to prevent air from entering the interior, and a rubber coating is placed inside the cover so that the interior of the entire device is always kept in a dry environment, which improves the quality of the product and improves its pass rate. , reducing waste.
- Figure 1 is a schematic view of the structure of the present invention
- Figure 2 is a partial structural view of the utility model
- Figure 3 is a schematic view showing the internal structure of the cover plate of the present invention.
- a novel IC reverse packaging machine includes an outer casing 2 , and a surface of the outer casing 2 is provided with an exhaust port at an intermediate position on the surface. 3.
- the heat dissipation hole 4 is disposed under the exhaust port 3, and the bottom end of the outer casing 2 is provided with a foot 5, and the heat dissipation hole 4 and the foot 5 are fixedly connected by welding, and one side of the outer casing 2 is provided with a switch 6, and the outer casing
- a cover plate 1 is disposed above the body 2, and a second groove 12 is disposed on the inner surface of the cover plate 1.
- the inside of the second groove 12 is provided with a card block 13.
- the inside of the cover plate 1 is provided with a silica gel coating 15 and is coated with a silicone rubber.
- a handle 14 is disposed at an intermediate position of the layer 15, and a support plate 7 is disposed above the cover plate 1.
- An electrohydraulic telescopic rod 8 is disposed below the support plate 7, and the support plate 7 and the electro-hydraulic telescopic rod 8 are fixedly connected by bolts.
- the lower surface of the plate 1 is provided with a card plate 9.
- the upper surface of the outer casing 2 is provided with a first groove 11, and the inside of the first groove 11 is provided with a rubber pad 10, and the electro-hydraulic telescopic rod 8 is electrically connected to a power source.
- the preferred rubber pad 10 is similar in shape to the first recess 11, which is bonded to the inside of the first recess 11 by glue bonding.
- a preferred one of the handles 14 is provided, which is fixedly attached to the surface of the silicone coating 15 by screws.
- the preferred switch 6 is located above one side of the outer casing 2, which is fixedly attached to one side surface of the outer casing 2 by welding.
- the preferred card 9 is fixedly attached to the lower surface of the cover 1 by welding.
- the working principle and the use flow of the utility model the practical design structure is scientific and reasonable, and the use is safe and convenient.
- the device can be used after being installed. After the power is turned on, the IC to be packaged is first placed into the outer casing 2, and then the cover is covered.
- the upper cover 1 is such that the card 9 on the cover 1 is engaged with the rubber pad 10 inside the first recess 11, and then the entire cover 1 is pressed down by the electro-hydraulic telescopic rod 8, so that the card 9 and the rubber are
- the pad 10 is firmly attached so that it is more tightly fixed and more airtight, and then the air in the outer casing 2 is discharged through the exhaust port 3, so that the inside thereof is in a vacuum environment, and there is a cover plate 1 underneath.
- the surface of the surface is provided with a silicone coating 15 which has a drying effect so that the interior thereof is always in a dry environment, which can improve the quality of the product, thereby improving the yield and reducing waste.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Buffer Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Disclosed is an IC flip-chip packaging machine, comprising an outer housing (2), wherein an air discharge port (3) is provided at a middle position of a surface of the outer housing; a heat dissipation hole (4) is provided below the air discharge port; a base foot (5) is arranged at a bottom end of the outer housing; the heat dissipation hole is fixedly connected to the base foot by means of welding; a switch (6) is arranged at one side of the outer housing; a cover plate (1) is arranged above the outer housing; a second groove (12) is provided on an inner side surface of the cover plate; a clamping block (13) is arranged in the second groove; and a silica gel coating layer (15) is arranged in the cover plate. The IC flip-chip packaging machine has a scientific and rational structure and is safe and convenient to use. A rubber gasket and an electrohydraulic telescopic rod allow for tighter coverage of the cover plate and prevent air from entering the interior of the machine, and the silica gel coating layer is further arranged in the cover plate, so that the interior of the entire apparatus is always kept in a dry environment, thereby improving the product quality and yield.
Description
本实用新型属于加工技术领域，具体涉及一种新型IC倒封装机。The utility model belongs to the technical field of processing, and in particular relates to a novel IC inverted packaging machine.
装机是一种智能卡生产设备。它将模块通过热熔胶经过一定时间、压力热焊后牢固粘贴在符合ISO标准的卡片上的槽孔内。一般来说，封装机有如下几部分组成：料架组、预焊组、模块好坏识别组、模具组。Installation is a smart card production device. It passes the hot melt adhesive through the hot melt adhesive for a certain period of time, and is firmly bonded to the slot on the card conforming to the ISO standard. Generally speaking, the packaging machine has the following components: a rack group, a pre-welding group, a module identification group, and a mold group.
现有的IC倒封装机，我们在使用的时候，会由于其气密性不好，导致我们封装出来的产品质量不好，机器内部存在有水分的时候，使其加工出来的产品质量不佳的问题，为此我们提出一种新型IC倒封装机。The existing IC inverted packaging machine, when we use it, due to its poor air tightness, the quality of the products we package is not good, when there is moisture inside the machine, the quality of the processed products is not good. For this problem, we propose a new IC flip package machine.
实用新型内容Utility model content
本实用新型的目的在于提供一种新型IC倒封装机，以解决上述背景技术中提出的问题。It is an object of the present invention to provide a novel IC over-packaging machine to solve the problems set forth in the above background art.
为实现上述目的，本实用新型提供如下技术方案：一种新型IC倒封装机，包括外壳体，所述外壳体的表面设置有表面中间位置设置有排气口，所述排气口的下方设置有散热孔，所述外壳体的底端设置有底脚，所述散热孔与底脚通过焊接固定连接，所述外壳体的一侧设置有开关，所述外壳体的上方设置有盖板，所述盖板内侧表面设置有第二凹槽，所述第二凹槽的内部设置有卡块，所述盖板的内部设置有硅胶涂层，所述硅胶涂层的中间位置设置有拉手，所述盖板的上方设置有支撑板，所述支撑板的下方设置有电动液压伸缩杆，是支撑板与电动液压伸缩杆通过螺栓固定连接，所述盖板的下表面设置有卡板，所述外壳体的上表面设置有第一凹槽，所述第一凹槽的内部设置有橡胶垫，所述电动液压伸缩杆与电源电连接。In order to achieve the above object, the present invention provides the following technical solution: a novel IC reverse packaging machine includes an outer casing, the surface of the outer casing is provided with an exhaust port at an intermediate position of the surface, and the lower portion of the exhaust port is disposed a heat dissipation hole, a bottom end of the outer casing is provided with a foot, the heat dissipation hole and the foot are fixedly connected by welding, a side of the outer casing is provided with a switch, and a cover plate is disposed above the outer casing The inner surface of the cover plate is provided with a second groove, the inside of the second groove is provided with a block, the inside of the cover plate is provided with a silicone coating, and the middle position of the silicone coating is provided with a handle. a support plate is disposed above the cover plate, and an electrohydraulic telescopic rod is disposed below the support plate, wherein the support plate and the electro-hydraulic telescopic rod are fixedly connected by bolts, and a lower surface of the cover plate is provided with a card plate. The upper surface of the outer casing is provided with a first groove, and the inside of the first groove is provided with a rubber pad, and the electro-hydraulic telescopic rod is electrically connected to a power source.
优选的，所述橡胶垫与第一凹槽的形状相似，其通过胶水粘合连接在第一凹槽的内部。
Preferably, the rubber pad is similar in shape to the first groove, and is bonded to the inside of the first groove by glue bonding.
优选的，所述拉手共设置有一个，其通过螺丝固定连接在硅胶涂层的表面。Preferably, the handle is provided with a common one, which is fixedly attached to the surface of the silicone coating by screws.
优选的，所述开关位于外壳体的一侧上方，其通过焊接固定连接在外壳体的一侧表面。Preferably, the switch is located above one side of the outer casing and is fixedly coupled to one side surface of the outer casing by welding.
优选的，所述卡板通过焊接固定连接在盖板的下表面。Preferably, the card board is fixedly attached to the lower surface of the cover by welding.
与现有技术相比，本实用新型的有益效果是：该实用型设计结构科学合理，使用安全方便，我们设置有橡胶垫，还在盖板的上方设置有电动液压伸缩杆，使得盖板能盖的更紧，防止空气进入其内部，还在盖板的内部设置有橡胶涂层，使得整个装置的内部始终保持一个干燥的环境，这样可以提高该产品的质量，使得其合格率得到了提高，减少了浪费。Compared with the prior art, the utility model has the beneficial effects that the practical design structure is scientific and reasonable, and the use is safe and convenient. We are provided with a rubber pad, and an electro-hydraulic telescopic rod is arranged above the cover plate, so that the cover plate can The cover is tighter to prevent air from entering the interior, and a rubber coating is placed inside the cover so that the interior of the entire device is always kept in a dry environment, which improves the quality of the product and improves its pass rate. , reducing waste.
图1为本实用新型的结构示意图；Figure 1 is a schematic view of the structure of the present invention;
图2为本实用新型的局部结构示意图；Figure 2 is a partial structural view of the utility model;
图3为本实用新型的盖板的内部结构示意图；Figure 3 is a schematic view showing the internal structure of the cover plate of the present invention;
图中：1-盖板、2-外壳体、3-排气口、4-散热孔、5-底脚、6-开关、7-支撑板、8-电动液压伸缩杆、9-卡板、10-橡胶垫、11-第一凹槽、12-第二凹槽、13-卡块、14-拉手、15-硅胶涂层。In the figure: 1-cover, 2-outer body, 3-exhaust port, 4-heat vent, 5-foot, 6-switch, 7-support plate, 8-electro-hydraulic telescopic rod, 9-card board, 10-Rubber pad, 11-first groove, 12-second groove, 13-block, 14-handle, 15-silicone coating.
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本实用新型一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本实用新型保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. example. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
请参阅图1、图2和图3，本实用新型提供一种技术方案：一种新型IC倒封装机，包括外壳体2，外壳体2的表面设置有表面中间位置设置有排气口
3，排气口3的下方设置有散热孔4，外壳体2的底端设置有底脚5，散热孔4与底脚5通过焊接固定连接，外壳体2的一侧设置有开关6，外壳体2的上方设置有盖板1，盖板1内侧表面设置有第二凹槽12，第二凹槽12的内部设置有卡块13，盖板1的内部设置有硅胶涂层15，硅胶涂层15的中间位置设置有拉手14，盖板1的上方设置有支撑板7，支撑板7的下方设置有电动液压伸缩杆8，是支撑板7与电动液压伸缩杆8通过螺栓固定连接，盖板1的下表面设置有卡板9，外壳体2的上表面设置有第一凹槽11，第一凹槽11的内部设置有橡胶垫10，电动液压伸缩杆8与电源电连接。Referring to FIG. 1 , FIG. 2 and FIG. 3 , the present invention provides a technical solution: a novel IC reverse packaging machine includes an outer casing 2 , and a surface of the outer casing 2 is provided with an exhaust port at an intermediate position on the surface.
3. The heat dissipation hole 4 is disposed under the exhaust port 3, and the bottom end of the outer casing 2 is provided with a foot 5, and the heat dissipation hole 4 and the foot 5 are fixedly connected by welding, and one side of the outer casing 2 is provided with a switch 6, and the outer casing A cover plate 1 is disposed above the body 2, and a second groove 12 is disposed on the inner surface of the cover plate 1. The inside of the second groove 12 is provided with a card block 13. The inside of the cover plate 1 is provided with a silica gel coating 15 and is coated with a silicone rubber. A handle 14 is disposed at an intermediate position of the layer 15, and a support plate 7 is disposed above the cover plate 1. An electrohydraulic telescopic rod 8 is disposed below the support plate 7, and the support plate 7 and the electro-hydraulic telescopic rod 8 are fixedly connected by bolts. The lower surface of the plate 1 is provided with a card plate 9. The upper surface of the outer casing 2 is provided with a first groove 11, and the inside of the first groove 11 is provided with a rubber pad 10, and the electro-hydraulic telescopic rod 8 is electrically connected to a power source.
为了连接更加方便，本实施例中，优选的橡胶垫10与第一凹槽11的形状相似，其通过胶水粘合连接在第一凹槽11的内部。In order to facilitate the connection, in the present embodiment, the preferred rubber pad 10 is similar in shape to the first recess 11, which is bonded to the inside of the first recess 11 by glue bonding.
为了方便更换，本实施例中，优选的拉手14共设置有一个，其通过螺丝固定连接在硅胶涂层15的表面。In order to facilitate the replacement, in the present embodiment, a preferred one of the handles 14 is provided, which is fixedly attached to the surface of the silicone coating 15 by screws.
为了固定更加牢固，本实施例中，优选的开关6位于外壳体2的一侧上方，其通过焊接固定连接在外壳体2的一侧表面。In order to make the fixing stronger, in the present embodiment, the preferred switch 6 is located above one side of the outer casing 2, which is fixedly attached to one side surface of the outer casing 2 by welding.
为了固定更加紧密，本实施例中，优选的卡板9通过焊接固定连接在盖板1的下表面。In order to fix the tighter, in the present embodiment, the preferred card 9 is fixedly attached to the lower surface of the cover 1 by welding.
本实用新型的工作原理及使用流程：该实用型设计结构科学合理，使用安全方便，该设备安装后便可使用，接通电源后，首先将要封装的IC放进外壳体2的内部，接着盖上盖板1，使得盖板1上的卡板9与第一凹槽11内部的橡胶垫10贴合，接着通过电动液压伸缩杆8将整个盖板1往下压，使得卡板9与橡胶垫10贴合的牢固，使得其固定更加紧密，气密性更好，接着将外壳体2内的空气通过排气口3排出来，使得其内部处于一个真空的环境，有盖板1的下表面内部设置有硅胶涂层15，硅胶涂层15具有干燥的作用，使得其内部始终处于一个干燥的环境，这样可以提高该产品的质量，使得其合格率得到了提高，减少了浪费。
The working principle and the use flow of the utility model: the practical design structure is scientific and reasonable, and the use is safe and convenient. The device can be used after being installed. After the power is turned on, the IC to be packaged is first placed into the outer casing 2, and then the cover is covered. The upper cover 1 is such that the card 9 on the cover 1 is engaged with the rubber pad 10 inside the first recess 11, and then the entire cover 1 is pressed down by the electro-hydraulic telescopic rod 8, so that the card 9 and the rubber are The pad 10 is firmly attached so that it is more tightly fixed and more airtight, and then the air in the outer casing 2 is discharged through the exhaust port 3, so that the inside thereof is in a vacuum environment, and there is a cover plate 1 underneath. The surface of the surface is provided with a silicone coating 15 which has a drying effect so that the interior thereof is always in a dry environment, which can improve the quality of the product, thereby improving the yield and reducing waste.
尽管已经示出和描述了本实用新型的实施例，对于本领域的普通技术人员而言，可以理解在不脱离本实用新型的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型，本实用新型的范围由所附权利要求及其等同物限定。
While the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art The scope of the invention is defined by the appended claims and their equivalents.
Claims (5)
- 一种新型IC倒封装机，包括外壳体(2)，其特征在于：所述外壳体(2)的表面设置有表面中间位置设置有排气口(3)，所述排气口(3)的下方设置有散热孔(4)，所述外壳体(2)的底端设置有底脚(5)，所述散热孔(4)与底脚(5)通过焊接固定连接，所述外壳体(2)的一侧设置有开关(6)，所述外壳体(2)的上方设置有盖板(1)，所述盖板(1)内侧表面设置有第二凹槽(12)，所述第二凹槽(12)的内部设置有卡块(13)，所述盖板(1)的内部设置有硅胶涂层(15)，所述硅胶涂层(15)的中间位置设置有拉手(14)，所述盖板(1)的上方设置有支撑板(7)，所述支撑板(7)的下方设置有电动液压伸缩杆(8)，是支撑板(7)与电动液压伸缩杆(8)通过螺栓固定连接，所述盖板(1)的下表面设置有卡板(9)，所述外壳体(2)的上表面设置有第一凹槽(11)，所述第一凹槽(11)的内部设置有橡胶垫(10)，所述电动液压伸缩杆(8)与电源电连接。A novel IC reverse packaging machine includes an outer casing (2), characterized in that: a surface of the outer casing (2) is provided with an exhaust port (3) at an intermediate position of the surface, and the exhaust port (3) a heat dissipation hole (4) is disposed under the outer casing (2), and the bottom end of the outer casing (2) is provided with a foot (5), and the heat dissipation hole (4) and the foot (5) are fixedly connected by welding, the outer casing a switch (6) is disposed on one side of the (2), a cover plate (1) is disposed above the outer casing (2), and a second groove (12) is disposed on an inner surface of the cover plate (1). The inside of the second groove (12) is provided with a block (13), the inside of the cover plate (1) is provided with a silicone coating (15), and the middle position of the silicone coating (15) is provided with a handle (14) A support plate (7) is disposed above the cover plate (1), and an electrohydraulic telescopic rod (8) is disposed below the support plate (7), which is a support plate (7) and an electro-hydraulic expansion and contraction The rod (8) is fixedly connected by bolts, the lower surface of the cover plate (1) is provided with a card plate (9), and the upper surface of the outer casing body (2) is provided with a first groove (11), the first A recess (11) is internally provided with a rubber pad (10), and the electro-hydraulic telescopic rod (8) and the power source Connection.
- 根据权利要求1所述的一种新型IC倒封装机，其特征在于：所述橡胶垫(10)与第一凹槽(11)的形状相似，其通过胶水粘合连接在第一凹槽(11)的内部。A novel IC over-packaging machine according to claim 1, wherein the rubber pad (10) is similar in shape to the first groove (11), and is bonded to the first groove by glue bonding ( 11) inside.
- 根据权利要求1所述的一种新型IC倒封装机，其特征在于：所述拉手(14)共设置有一个，其通过螺丝固定连接在硅胶涂层(15)的表面。A novel IC package-wrapping machine according to claim 1, characterized in that the handle (14) is provided in a total of one, which is fixedly attached to the surface of the silicone coating (15) by screws.
- 根据权利要求1所述的一种新型IC倒封装机，其特征在于：所述开关(6)位于外壳体(2)的一侧上方，其通过焊接固定连接在外壳体(2)的一侧表面。A novel IC package-wrapping machine according to claim 1, wherein said switch (6) is located above one side of the outer casing (2), and is fixedly connected to one side of the outer casing (2) by welding. surface.
- 根据权利要求1所述的一种新型IC倒封装机，其特征在于：所述卡板(9)通过焊接固定连接在盖板(1)的下表面。 A novel IC over-packaging machine according to claim 1, characterized in that the card board (9) is fixedly attached to the lower surface of the cover (1) by soldering.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721406038.4U CN207409462U (en) | 2017-10-29 | 2017-10-29 | A kind of novel I C falls sealing machine |
| CN201721406038.4 | 2017-10-29 |
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| Publication Number | Publication Date |
|---|---|
| WO2019080217A1 true WO2019080217A1 (en) | 2019-05-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2017/111520 WO2019080217A1 (en) | 2017-10-29 | 2017-11-17 | Novel ic flip-chip packaging machine |
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| CN (1) | CN207409462U (en) |
| WO (1) | WO2019080217A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06310563A (en) * | 1993-01-20 | 1994-11-04 | Toshiba Corp | Semiconductor device and manufacture thereof |
| CN2562363Y (en) * | 2002-04-19 | 2003-07-23 | 何忠亮 | Extra-thin IC package device |
| CN201522996U (en) * | 2009-10-13 | 2010-07-07 | 刘义清 | Sealing machine |
| CN205789888U (en) * | 2016-06-01 | 2016-12-07 | 南通尚明精密模具有限公司 | A kind of surface-mounted integrated circuit encapsulating mould |
-
2017
- 2017-10-29 CN CN201721406038.4U patent/CN207409462U/en active Active
- 2017-11-17 WO PCT/CN2017/111520 patent/WO2019080217A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06310563A (en) * | 1993-01-20 | 1994-11-04 | Toshiba Corp | Semiconductor device and manufacture thereof |
| CN2562363Y (en) * | 2002-04-19 | 2003-07-23 | 何忠亮 | Extra-thin IC package device |
| CN201522996U (en) * | 2009-10-13 | 2010-07-07 | 刘义清 | Sealing machine |
| CN205789888U (en) * | 2016-06-01 | 2016-12-07 | 南通尚明精密模具有限公司 | A kind of surface-mounted integrated circuit encapsulating mould |
Also Published As
| Publication number | Publication date |
|---|---|
| CN207409462U (en) | 2018-05-25 |
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