TWM251440U - Dual heat radiating systems integration module - Google Patents

Description

M251440 V. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation is about a dual cooling system integration module, especially a structural design with two fan modules inside a fan body. [Previous technology] According to the principle, semiconductor elements are used in a wide range of heat sinks in order to avoid heat dissipation from the semiconductor elements. The heat sinks are provided with multiple folds to increase the heat dissipation area and accelerate the heat dissipation efficiency. Air is directly introduced into the cooling fin air as a heat dissipation medium, and the air fan is rolled and circulated to take away the heat. 'Hot air cannot be immediately cooled down' Although it can avoid poor semiconductor elements, and the height of the heat sink plus the carrying device cannot be used for this. In addition, 'existing fan knot fan blades, if a larger fan is needed, this pair has a space problem. To solve the problem of confined space heat pipes (Head Pipes) instead of fans due to the ratings of the components, maintain its normality. Derive a plurality of heat sink fins to increase the gap between the tops of the heat sinks. The heat is not good, the heat is replaced by gas, and the parts are overheated and burned on the fan. Thermal mode. The structural design is difficult to flow, and it increases the heat dissipation method of the heat dissipation element, which consumes power and burns out. A heat sink is provided on the body element and a fan is radiated to the air. With the aforementioned heat dissipation conductor, the air is especially formed in a dense hot air flow. However, for example, the heat generated by the note must be in the wave of the ore sheet. The external method is to use a cooling effect-type computer in a continuous closed space to circulate a certain rotor and a rotor to drive one. Then you need to add another wind and cost. Assembly problems, and there is heat

M251440 V. Creation instructions (2) The principle of changing liquid 'and the inner wall surface of the heat pipe is filled with the changing liquid's boiling point and then sublimates into a gaseous state. The hot air flows to the heat pipe cloth, and when it is cold, the phase changes and returns to a liquid state. The regenerative region sublimates into a gaseous state, and this heat dissipation mode has a better heat dissipation liquid which is slower. [Content] [Creation purpose] The main purpose of this creation is to provide a group 'mainly to change the existing fan from top to bottom, and at the same time, the two fan blades on the upper and lower sides of the stator and the two rotor structure are turned to the fan blades. The airflow outside the rotating area with the blades circulates through the cooling fins and circulates in the air, increasing the airflow flow force and heat velocity ', and reducing the space allocation and increasing the cost. Another purpose of the creation is outside the area where the blades rotate. A plurality of cover plates are sealed, and the water or phase change is injected into an appropriate position of the fan body and can be connected to an extension pipe to guide the internal liquid area. The fan blades promote the liquid heating efficiency and heat dissipation area, and at the same time Wind is a capillary fiber. When the heat ‘uses hot air to the place where no heat is generated’ and the capillary fibers circulate in this way, the heat effect is dissipated, but only by the amount of siphons when the siphon volume exceeds the phase of cold air flow. The design of the double-flow airflow of the suction pipe is the same, and the fan fans are added in a plurality of pieces, and the cooling fins are re-cooled when the cooling system is set to the side. The cooling fin gap of the fan body is provided with a heat path. There is a liquid on the lower sides. The flow is fast, and the flow has another outflow pipe and the outflow pipe needs heat dissipation. The flow and heat pipe integrated mold flow mode is on the top and bottom of the fan. The two fans dissipate heat. Can speed up dispersion. Choose one on the wind side with an inflow pipe, and the area of the inflow pipe or cold to increase the dispersion

M251440 V. Creation Instructions (3) ---- Functions in one form. Another purpose of this creation is to cover the upper and lower sides of the fan with cover plates and seal them on the upper and lower sides of the fan body. A first-rate outlet pipe and an inflow pipe are provided at appropriate positions on both sides of the fan, and water or phase is injected into the enclosed space. Changing the liquid, the outflow pipe and the inflow pipe can be connected to the extension pipe to divert the internal liquid to other areas that need heat dissipation or cold areas. The two fan blades promote the liquid to accelerate its flow rate, thereby increasing heat dissipation efficiency and heat dissipation area. [Embodiment] [First Embodiment] As shown in the first and second figures, the present creation includes: a fan body 10, which is provided with concave accommodation areas 11 and 12 on the upper and lower sides. A hole 13 is provided in the center of the accommodating areas 11 and 12. A partition 14 is extended from the edge of the hole 13 to the center of the hole. The partition 14 is formed in the middle to the upper valley accommodating area 11. The through-pillar is provided with a spacer 15 at the center of the central through-pillar to distinguish the central through-pillar into upper and lower central through-pillars 16, I ?; and a plurality of sides are provided on one side of the upper and lower accommodation areas 11, 12个 radical fins 18. A fan stator includes an electromagnet 20 and two bearings 21; the electromagnet 20 is sleeved in the hole 13 around the upper and lower middle through-pillars 16, I ?; the two bearings 21 are respectively sleeved on the upper, Inside the lower middle post i 6, i 7. The two fan rotor sections include two fan rotating shafts 22 and two fan blades 23 24. The fan rotating shaft 22 is sleeved into the first bearing 21 and is connected to the fan blades 23 and 24 in the upper and lower accommodation areas U, respectively. In 12, the permanent magnets are fixed in the fan blades 23 and 24

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Iron 25 and metal ring 26. As far as the plate 2 7 is concerned, a number of cutouts 11 are formed in the material corresponding to the fan blades 23 and 24 to control 2: 2: The circuit board 29 that rotates in 24 is set in the upper accommodation area and can rotate at the same time. The T sub-section generates electromagnetic force to drive the two fan rotor sections. As shown in FIG. 2, the I accommodating areas 11 and 12 respectively generate an air flow. The direction of rotation is the same. When the two fan blades 23 and 24 rotate, the direction of the airflow generated is the same as that of the lower capacity area 7 and the direction of the airflow is the same, respectively, through the directions of the arrows shown above. Between the gaps (as shown in the figure and by the airflow flowing through the gap of the cooling fins 18, ...% of the 18 multiplied by the heat dissipation function of the rotor, which produces a dual airflow heat dissipation effect, which has the [first embodiment] four As shown in the five figures, this embodiment includes: 32, from the hole 33 up to the spacer 35, the area 31, the fan body 30, and the upper and lower sides are provided with a concave container 詈 詈There are holes ^ ^ ^ ^ ^ ^ ^ in the center of the placement areas 31 and 32. The edge of each lower placement area 32 is extended with a bucket to the center of the hole 33. First, the plate 34 and the partition 34 are The upper accommodation area 31 is formed with a Zhongtong Han ^ Difficult, the middle of the central pillar is right and the middle pillar is divided into upper and lower middle & τ days you recognize ^ τ through pillars 36, 37; A plurality of cooling fins are provided on one side of the top surface, and a first-rate outlet pipe 311 and an inlet pipe 312 are provided at the position. Prepare & There are-electromagnet 40 and two bearings 41; the fifth, creative instructions (5) The magnet 40 is sleeved on the upper and lower middle bearings 4 "and placed in the upper and lower middle through-pillars 36, = holes 33; The 21 fan rotor unit includes Gu Yiling, ", two permanent magnets 45 and two fan rotations: 42, two fan blades 43 are inserted into the aforementioned two bearings 41 and divided into two 6, and the fan rotation shaft 42 is sleeved. Belonging to the 1st ring ::, the fan blade 43 is provided with a permanent magnetic fan blade cover 43 and 48. The upper cover 4 7 corresponds to the closed accommodation area 42 of the upper accommodation area 31 and has several hollowed-out areas. 471 'The lower cover is used for dense 31 internal control: the rotating circuit board 49 is located in the upper accommodation area and rotates at the same time. The β fan rotor part generates electromagnetic force to drive the two fan rotors into the housing area, as shown in the figure. 32 is a closed area, which is filled with liquids such as shim 43, 4ii (such as water) or phase change liquid 50. When-wind tail = flow turn = = fan blades in zone 32 "straight ^ heat dissipation: please : ^ 3 The fan blade 43 still generates airflow through the extension tube 51. The ::: The outflow tube 311 of the lower containing area 32 can be connected to the liquid 50 to conduct more: S. It can be configured to connect the inflow in the lower accommodation area 32 to the inflow ^ = enlarge the heat dissipation area 'the heat transfer h12' generated by the extension tube 51 to form a circulation circuit. The liquid 50 contained in the semiconductor element feels this f fan body 3 At 0 o’clock, the heat stored in the lower containing area 32 evaporates or sublimates into a gas. Through the lower containing M251440 5. Creation instructions (6) ---- 32 The fan blade 44 in the 32 rotates and flows quickly. From the outflow tube 3] i flows out to the extension tube 51 and cools down to liquid, and then flows back from the inflow tube 312 to the lower containing area 32 (as shown by the arrow). Due to the thrust generated by the fan blades to rotate, the liquid 50 The flow rate is better than the aforementioned heat pipe, and the heat dissipation area can be enlarged. = The heat of the conductor element without being carried away by the liquid 50 will continue to be conducted upward to the heat dissipation fins 38 of the upper valley placement area 31, and the airflow (shown by the arrow) generated by the fan blade 43 of the upper accommodation area 31 will be dissipated into the air . [Second Embodiment] As shown in the seventh and eighth figures, a fan body 60 and 62 are provided. The accommodation area 6 1 extends from the edge of the hole 63 to the hole to the upper accommodation area 61 and 65. Fitting pipes 61, 62 in the column area accommodating areas 61 2, 62 2 〇 A fan stator magnet 70 is sleeved on the upper bearing 71 is sleeved on the two fan rotor portion 74, a permanent magnet is inserted into the aforementioned two bearings 71 In this embodiment of the lower accommodation area 61, 62, the middle of the upper, upper, and 62 are extended into a middle divided into upper and lower positions, including, lower middle pass, upper and lower middle, including 75 and two gold. The fan includes: The lower side is provided with a recessed receiving area 6 1 and a hole 63 is provided at the center. The lower receiving area 62 is provided with a partition 64, and the partition 64 is connected to the opening. Column 'The center of the middle post is provided with lower middle post 66, 67; the top and bottom are provided with first-class outlet pipes 611, 6 2 1 and flow one electromagnet 70 and two bearings 71; the electric post 66, 67 In the surrounding hole 63; inside the two-way posts 66, 67. Two fan rotating shafts 72 and two fan blades 73 belong to the ring 76; the fan rotating shaft 72 is sleeved to connect the two fan blades 73 and 74 on the upper side, and the permanent magnets are fixed in the blades 73 and 74.

Page 10 M251440 V. Creative Instructions (7) Iron 75 and metal ring π. The upper and lower cover plates 77 and 78 are respectively used to seal the upper and lower accommodation areas 61 and 62. The circuit board 79 for controlling the rotation of the fan blades 73 and 74 is provided in the upper accommodation area 61 to control the fan stator. An electromagnetic force is generated to drive the two fan rotors to rotate at the same time. In addition, the circuit board 79 and the electromagnet 70 are covered with a ballast 791 to seal and isolate the two components.彳,, as shown in the eighth figure, the upper and lower containing areas 61 and 62 are closed areas', which are filled with liquids such as low-boiling-point liquids (such as water) or phase-change liquids 80, and two fan blades 73 and 74. When rotating, the two winds 73, 74 in the heart of the upper and lower accommodation areas 61 directly push the liquid 80 to flow, generating a liquid flow. As shown in the ninth figure, the outflow pipes of the upper and lower accommodation areas 61 and 62] empty P distribution \ bit connection-extended dumping, by extending the L of the extension pipes 81 and 82 and the lower accommodation areas 61 and 62 The internal liquid is conducted to more than 1 and the heat dissipation area is extended. The extension tubes 81 and 82 are connected to each other to form a liquid circulation circuit. When the liquid of the semiconductor element 2 is 80, the body 60 is stored in the lower accommodation area 62: ^ • First, the heat is evaporated and the fan blades 74 in the area 62 are turned into: Π two out to the extension tube 82 After cooling, it is reduced to liquid] Out: I in the containing area 62 (as shown by the arrow) = Since: In, the heat returned by 622 will continue to be transmitted upward to the upper 2nd. The liquid 82 in the 5362 is less than the upper containing area 61 The liquid 80 inside feels the same as the poverty, and it exists in the 'through the upper containing area 61 or sublimates into a gas to rotate and flow quickly, flowing

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V. Creation instructions (8) The outlet pipe 6 11 flows out to the extension pipe 8 1 and cools down to a liquid, and then flows back from the inflow pipe 612 to the upper containing area 61 (as shown by the arrow). Due to the thrust generated by the rotation of the fan blades 73 and 74, the flow rate of the liquid 80 is superior to the aforementioned heat pipe, and the heat dissipation area can be enlarged. At the same time, the second fan blades 73 and 74 provided in this embodiment provide the driving force for the liquid 80 to flow. The place where the heat dissipation and cooling action occurs is not necessarily the fan body, but can be designed at the extension tubes 81 and 82. The installation position of the fan body 60 is not limited to the surface of the semiconductor element, and can be changed by the designer according to the actual space configuration. In summary, the dual cooling system integration module provided by this creation,

It can effectively solve the heat dissipation shortcomings of the existing fans, heat sinks and heat pipes = greatly increase the heat dissipation efficiency, reduce the installation space and cost, and is unprecedented. It has deep industrial utilization value and has met the requirements of the new patent < Submitting an application, Qijun Bureau will grant a quasi-patent at an early date, and it is a real virtue. ‘Ling Yi The above has made a detailed description of this creation, but the above, +, 1 丨 workers corpse juice fans, is only one of the preferred embodiments of this creation, it should not be limited to this 钿 Congye Mawei. That is to say, all equal changes according to the scope of the application for this creation 1 ^ τ and K Xing modified 莼 should still fall within the scope of the patent for this creation. White

M251440 Brief description of the diagram The first diagram is a perspective view of the first embodiment of the creation; the second diagram is an exploded perspective view of the first diagram; the third diagram is an AA sectional view of the first diagram; the fourth diagram is A three-dimensional exploded view of the second embodiment of this creation; the fifth diagram is a cross-sectional view of BB in FIG. 4; the sixth diagram is a schematic diagram of the use of the second embodiment of the creation; the seventh diagram is the third embodiment of the creation The three-dimensional exploded view of the embodiment; the eighth figure is a cross-sectional view taken along the line C_C in FIG. 7; the ninth figure is a schematic diagram of the third embodiment of the creation. Figure number description:

Page 13 10 Fan body 11 Upper receiving area 12 Lower receiving area 13 Hole 14 Baffle 15 Spacer 16 Upper center post 17 Lower center post 18 Radiating fins 20 Electromagnet 21 Bearing 22 Fan shaft 23 Fan blades 24 Fan blade 25 Permanent magnet 26 Metal ring 27 Cover plate 28 Hollow-out area 29 Circuit board 30 Fan body 31 Upper receiving area 311 Outflow pipe 312 Inflow pipe 32 Lower accommodation area 33 Hole M251440 Brief description of the diagram 34 Shelf 3 6 Upper Central post 38 Radiating fin 40 Electromagnet 4 2 Fan rotating shaft 44 Fan blade 46 Metal ring 471 Hollow area 48 Lower cover 50 Liquid 6 0 Fan body 611 Outflow pipe 62 Lower accommodation area 621 Outflow pipe 64 Partition 66 On In the post 70 electromagnet 72 fan shaft 74 fan blade 76 metal ring 7 8 lower cover 791 film 80 liquid 82 extension tube

35 Spacer 37 Lower center column 41 Bearing 43 Fan blade 45 Permanent magnet 47 Upper cover 49 Circuit board 51 Extension tube 61 Upper accommodation area 612 Inflow tube 63 Hole 622 Inflow tube 65 Separator 67 Lower center column 71 Bearing 73 Fan blade 75 Permanent magnet 77 Upper cover 79 Circuit board 81 Extension tube

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Claims (1)

M251440 6. Scope of patent application 1. A type of dual cooling system integration module 'includes a fan body, which has recessed accommodation areas on the upper and lower sides, and a hole in the center of the accommodation area. A partition is extended from the edge of the hole to the center of the hole in the lower receiving area, and a middle post is formed from the partition to the upper receiving area. The middle of the middle post is provided with a spacer to connect the middle post. It is divided into upper and lower middle through-pillars; a fan stator part is provided in the aforementioned hole and the upper and lower middle through-pillars; two fan rotor parts are provided at the periphery of the fan stator part and are respectively connected with two fan blades on the upper part And lower accommodation area; two covers for covering the upper and lower accommodation areas. 2 · The dual cooling system integration module as described in item 1 of the scope of patent application, wherein one side of the upper and lower accommodation areas is respectively provided with a plurality of heat dissipation fins. The dual cooling system integration module described above, wherein the fan stator includes an electromagnet and two bearings; the electromagnet is sleeved in the holes around the upper and lower middle through-pillars; and the two bearings are sleeved in the upper and lower parts respectively. Inside the through column. 4. The dual cooling system integration module as described in item 1 of the scope of the patent application, wherein the fan rotor section includes a fan shaft, a permanent magnet and a metal ring; the fan shaft is sleeved into the aforementioned two bearings and connected respectively In the fan blade, the permanent magnet and the metal ring are fixed in the fan blade. 5. The dual heat dissipation system integrated module according to item 1 of the scope of the patent application, wherein the cover plate has a plurality of hollow areas formed at the fan blades. 6. The dual cooling system integration module as described in item 1 of the scope of patent application, Page 15 M251440 VI. Scope of patent application ~ 1 It also includes a circuit board located in the upper accommodation area to control the rotation of the fan. 7 · The dual heat dissipation system integration module as described in item 1 of the scope of patent application, wherein the fan blades located in the upper and lower accommodation areas generate airflow through the aforementioned heat dissipation fins to dissipate heat. 8. · A dual cooling system integration module, comprising: a fan body, the upper and lower sides of which are provided with a recessed accommodation area, a hole is provided in the center of the accommodation area, and the lower accommodation area is provided from the hole. A partition plate extends from the edge to the center of the hole. The partition plate is formed with a middle column from the upward to the upper accommodation area. The middle column is provided with a spacer to distinguish the middle column into upper and lower middle columns. In addition, a plurality of heat dissipation fins are provided on one side of the upper accommodation area, and a first-rate outlet pipe and an inflow pipe are provided at an appropriate position in the lower accommodation area. A fan stator portion is provided in the aforementioned hole and upper, lower, middle In the through-pillar; two fan rotors are located on the periphery of the fan stator and are connected to the two fan blades in the upper and lower accommodation areas; upper and lower cover plates, the upper cover plates corresponding to the fans in the upper accommodation area Several hollow areas are formed at the blades, and the lower cover plate is used to seal the lower accommodating area. 9. The dual heat dissipation system integrated module according to item 8 of the scope of patent application, wherein the lower accommodating area is in a closed state, and a liquid is injected therein. I 0 · The dual heat dissipation system integration module as described in item 9 of the scope of patent application, wherein the liquid system is a low boiling point liquid or a phase change liquid. II · The dual heat dissipation system integration module as described in item 8 of the scope of patent application, wherein the outflow pipe is connected to an extension pipe to an inflow pipe to form a liquid circulation M251440 6. Scope of Patent Application Circuit. 1 2 · The dual heat dissipation system integration module described in item 8 of the scope of the patent application, wherein the fan blades in the lower accommodation area provide the driving force for liquid flow. 1 3 · The dual heat dissipation system integration module as described in item 8 of the scope of the patent application, wherein the fan stator section includes an electromagnet and two bearings; the electromagnet is set in the upper and lower mid-pass post surrounding parks. In the hole; the two bearings are respectively sleeved in the upper and lower middle through-pillars. 1 4. The dual heat dissipation system integration module as described in item 8 of the scope of patent application, wherein the fan rotor portion includes a fan shaft, a permanent magnet and a metal ring; the fan shaft is sleeved into the two bearings described above, and The permanent magnets and the metal rings are fixedly connected to the fan blades, respectively. 15. The dual heat dissipation system integration module described in item 8 of the scope of patent application, which further includes a circuit board located in the upper accommodation area for controlling the rotation of the fan. 1 6 · An integrated module for dual cooling system, including: a fan body, the upper and lower sides of which are provided with a recessed accommodation area, and a hole is provided in the center of the accommodation area. A partition plate is extended from the edge of the hole to the center of the hole. The partition plate is formed with a middle post from the upward to the upper accommodation area. The middle of the middle post is provided with a spacer to center the middle through area. Lower middle pass column; In addition, the appropriate positions in the upper and lower accommodation areas = Equipped with first-rate outlet and inflow pipes; ^ A fan stator section is located in the aforementioned hole and the upper and lower middle pass columns; two fan rotors Is located at the periphery of the fan stator, and each fan blade is located in the upper and lower accommodation area; M251440 6. Scope of patent application The upper and lower covers are used to seal the upper and lower storage areas respectively. 1 7. The dual heat dissipation system integration module as described in item 16 of the scope of patent application, wherein the upper and lower accommodating areas are in a closed state, and liquid is injected thereinto. 1 As described in scope 1 of patent application scope 7 The dual heat dissipation system integrated module according to the item, wherein the liquid system is a low boiling point liquid or a phase change liquid. 19. The dual heat dissipation system integration module according to item 16 of the scope of patent application, wherein the outflow pipe is connected to an extension pipe to an inflow pipe to form a liquid flow circuit. 20. The dual heat dissipation system integration module as described in item 16 of the scope of patent application, wherein the fan blades in the lower accommodation area provide a driving force for liquid flow. 21. As described in item 16 of the scope of patent application Dual heat dissipation system integration module, wherein the fan stator includes an electromagnet and two bearings; the electromagnet is sleeved in the holes around the upper and lower middle through-pillars; the two bearings are respectively placed in the upper and lower middle through Inside the column. 2 2. The dual heat dissipation system integration module as described in item 16 of the scope of the patent application, wherein the fan rotor includes a fan shaft, a permanent magnet and a metal ring; the fan shaft is sleeved into the aforementioned two bearings, And are respectively connected to the fan blade, and the permanent magnet and the metal ring are fixed in the fan blade. 23. The dual heat dissipation system integration module described in item 16 of the scope of patent application, wherein the two fan blades in the upper and lower accommodation areas provide the driving force for liquid flow. 24. Dual heat dissipation system integration module as described in item 16 of the scope of patent application Page 18 M251440 Page 19