M246919 五、創作說明（1) 技術領域 ^本創作為一種具高像素之影像感測器封^構造’ f別 係只一種可有效減少雜質（Part i cl e)，以提并其感測能 力’而具有較佳解析度者。 術 按，一般感測器可用來感測一訊號，該訊號可能為一 光訊號，或一聲音訊號，本案之感測器係用來，收一光a 號或一影像訊號。當接收該光訊號後，町透過该影像感測 器將光訊號轉變成一電訊號，藉由基板傳遞I電路板上。 按，請參閱圖1，為習知影像感測器封裝構造’其包括 有一基板1 〇 ’其設有"上表面1 2及一下表面14上表面12 形成有第一接點1 5，下表面1 4形成有第二接點1 6 ; —凸緣 層18，設有一第一表面2 0及一第二表面22，第二表面2 2係 黏著固定於基板1 0之上表面1 2上，而與基板1 0形成一凹槽 2 4 ; —影像感測晶片2 6係設於基板1 〇與凸緣層1 8所形成之 凹槽2 4内，並固定於基板1 〇之上表面1 2上；複數條導線 28，其具有一第一端點30及一第二端點32，第一端點3〇係 電連接至該影像感測晶片2 6，第二端點3 2係電連接至基板 1 〇之第一接點1 5上；及一透光層3 4係黏設於凸緣層1 8之第 一表面20上。 惟，此種影像感測器必須在非常潔靜之無塵室内進行 封裝製造，否則空氣内中之雜質（particle)將進入凹槽24 内，而使其像素無法有效提高。然，即使在潔靜之無^室M246919 V. Creation Instructions (1) Technical Field ^ This creation is a high-sensor image sensor package ^ Structure 'f is only one type which can effectively reduce impurities (Part i cl e) to improve its sensing ability 'And those with better resolution. According to the technique, a general sensor can be used to sense a signal. The signal may be a light signal or a sound signal. The sensor in this case is used to receive a light a or an image signal. When the optical signal is received, the optical signal is converted into an electrical signal by the image sensor, and the I circuit board is transmitted through the substrate. Press, please refer to FIG. 1, which is a conventional image sensor package structure including a substrate 10, which is provided with an upper surface 12 and a lower surface 14 and an upper surface 12 with a first contact 15. The second contact 16 is formed on the surface 14; the flange layer 18 is provided with a first surface 20 and a second surface 22, and the second surface 22 is adhesively fixed to the upper surface 12 of the substrate 10 And a groove 2 4 is formed with the substrate 10; the image sensing wafer 26 is disposed in the groove 24 formed by the substrate 10 and the flange layer 18 and fixed on the upper surface of the substrate 10 12 on; a plurality of wires 28 having a first terminal 30 and a second terminal 32, the first terminal 30 is electrically connected to the image sensing chip 26, and the second terminal 3 2 is The first contact 15 is electrically connected to the substrate 10; and a light transmitting layer 34 is adhered to the first surface 20 of the flange layer 18. However, such an image sensor must be packaged and manufactured in a very clean and dust-free room, otherwise particles in the air will enter the recess 24, and its pixels cannot be effectively improved. Of course, even in the clean and quiet room
五 内 感 斷 法 、創作說明⑵ " ' —--— __—— -- =之之粒子會掉入凹槽24内，而影響到影像 的提昇“且致使影像感測器之製造業者必需不 遠到：：f 以至其廠房支出相當高淨，亦無 達到元全無雜質之需求。 田° 神，：：二’本創？人本於精益求精，創新突旅之精 ， 本創作具高像素之影像感測器封裝構造，其可 改進上述習知影像感測器封裝構造之缺失，使苴更為實用 者0 '、 新型内t 本創作之主要目的，在於提供一種具高像素之影像感 測器封裝構造，其具有可降低影像感測器之雜質之功效， 以達到提高其像素之目的。 為達上述之目的，本創作之特徵在於包有一基板，其 設有一上表面及一下表面，該上表面設有複數個第一接 點；一凸緣層，為一框型結構，係設置於該基板之上表面 上’並與該基板形成有一凹槽；一影像感測晶片’其上$又 有複數個焊墊，其係設置於該凹槽内，並固定於該基板之 上表面上；複數條導線，其係電連接該影像感測晶片之焊 墊至該基板之第一接點；及一黏著介質，其係位於該凹槽 内；一透光層，其係蓋設於該凸緣層上’用以將該影像感 測器覆蓋住。 如是，該凹槽内之雜質（Particle)將掉落並黏著於該 黏著介質上，而不致散落於影像感測晶片之感測區及透光Five internal sensing methods, creation instructions ⑵ " '----- __——-= the particles will fall into the groove 24, which will affect the improvement of the image "and make it necessary for manufacturers of image sensors It is not far to :: f, and its plant expenses are quite high and net, and it does not meet the requirement of being completely free of impurities. Tian ° God, :: Two's originality? Humanity is based on excellence, innovation is the essence of the journey, and this creation is high Pixel image sensor package structure, which can improve the lack of the conventional image sensor package structure, making it more practical. The main purpose of this novel is to provide an image with high pixels. The sensor package structure has the effect of reducing the impurities of the image sensor to achieve the purpose of increasing its pixel. In order to achieve the above-mentioned purpose, the feature of this creation is a substrate with an upper surface and a lower surface The upper surface is provided with a plurality of first contacts; a flange layer is a frame structure and is arranged on the upper surface of the substrate; and a groove is formed with the substrate; and an image sensing wafer is provided. There is a reply on $ A pad, which is disposed in the groove and is fixed on the upper surface of the substrate; a plurality of wires, which electrically connect the pad of the image sensing chip to the first contact of the substrate; and An adhesive medium is located in the groove; a light-transmitting layer is disposed on the flange layer to cover the image sensor. If so, the impurities in the groove will be Drop and adhere to the adhesive medium without scattering in the sensing area and light transmission of the image sensing chip
M246919 五、創作說明（3) |層上丄因此，可有效提高影像感測器之像素。 丨本發明之上述及其他目的、優點和特色由以下較佳實 施例之詳細說明並參考圖式俾p v & 才匕 平乂 1主頁 八1早侍以更深入了解。 實施方式 請參關2，為本創作具高像素之影像感測器封裝構造 剖視圖、，其包括有-基板4〇、一凸緣層42、一影像感測 晶片44、複數條導線46、一黏著介質48及透光層5〇 : 基板40設有一上表面52及一下表面54，上表面52形成 |有第一接點56，下表面5 4形成有第二接點58，用以電連接 I至印刷電路板5 9上。 j 凸緣層4 2為一框型結構，其設有一第一表面6 0及一第 一表面62，第二表面6 2係黏著固定於基板4〇之上表面52 I上，而與基板10形成一凹槽64。 影像感測晶片4 4設有複數個焊墊6 6，其係設於基板4 0 |與凸緣層42所形成之凹槽64内，並固定於基板40之上表面 5 2上。 端點 複數條導線4 6，其具有一第一端點6 8及一第 ’第一端點68係電連接至影像感測晶片44之焊墊66，第 二端點7 0係電連接至基板4 0之第一接點5 6上，用以使影像 |感測晶片44之訊號傳遞至基板40上。 黏著介質4 8，在本實施例中為黏膠，其係以塗佈或喷 |灑方式黏著於凹槽64内之上表面52上。及 透光層5 0為透光玻璃，係蓋設於凸緣層42之第一表面M246919 V. Creative Instructions (3) | On the layer, therefore, the pixels of the image sensor can be effectively increased.丨 The above and other objects, advantages, and features of the present invention are described in detail in the following preferred embodiments with reference to the drawings 俾 p v & For details, please refer to Section 2 for a cross-sectional view of the packaging structure of the image sensor with high pixels. The embodiment includes a substrate 40, a flange layer 42, an image sensing chip 44, a plurality of wires 46, and Adhesive medium 48 and light transmitting layer 50: The substrate 40 is provided with an upper surface 52 and a lower surface 54. The upper surface 52 is formed with a first contact 56 and the lower surface 54 is formed with a second contact 58 for electrical connection. I to the printed circuit board 59. j The flange layer 42 is a frame-type structure, which is provided with a first surface 60 and a first surface 62, and the second surface 62 is adhered and fixed on the upper surface 52I of the substrate 40, and the substrate 10 A groove 64 is formed. The image sensing wafer 44 is provided with a plurality of solder pads 66, which are disposed in the groove 64 formed by the substrate 40 and the flange layer 42 and fixed on the upper surface 52 of the substrate 40. The terminal has a plurality of wires 46, which has a first terminal 68 and a first terminal 68 which are electrically connected to the pad 66 of the image sensing chip 44 and a second terminal 70 which is electrically connected to The first contact 56 of the substrate 40 is used for transmitting the signal of the image | sensor chip 44 to the substrate 40. The adhesive medium 48, in this embodiment, is an adhesive, which is adhered to the inner upper surface 52 of the groove 64 in a coating or spraying manner. And the light-transmitting layer 50 is light-transmitting glass, which is disposed on the first surface of the flange layer 42
第7頁 M246919 五 、創作說明（4) 60上’而將影像感測晶片44覆蓋住，使影像感測晶片44 過透光層5 0接收光訊號。 當完成封蓋作業後，凹槽6 4内之雜質將慢慢地落下， 而被黏著介質48黏住，且可輕微得搖晃影像感測器，使与 像感測晶片44之感測區上之雜質掉落下來，同時被黏著= 5黏住’ A時’凹槽64内將不再有雜質影響到影像 ： 片44之感測能力，而可提高其像素。 、El曰 清參閱圖3，為本創作具高像素之影像感測器封 ^不意圖，首先在完成影像感測晶片44組裝於凹槽化 ^二並進行複數條導線46之打線作業，而後以塗佈 方式使黏著介質48黏著基板之上表面52上， y喷歲 么◦之2蓋作業’而封蓋完成後’凹槽64内之雜質：自2 測器之封裝產品。 风回像素之影像感 在較佳實施例之詳細說明中所提出之具 了易於說明本發明之技術内容，並非將本發明私例僅為 於實施例，凡依本發明之精神及以下申+義地限制 所作種種變化實施均屬本發明之範圍。 靶圍之情況Page 7 M246919 V. Creative Instructions (4) 60 on the image sensor chip 44 so that the image sensor chip 44 receives the light signal through the light transmitting layer 50. After the capping operation is completed, the impurities in the grooves 64 will slowly fall and be stuck by the adhesive medium 48, and the image sensor can be slightly shaken, so that the image sensor chip 44 is placed on the sensing area of the image sensor chip 44. Impurities fall off and are stuck at the same time = 5 When the 'A' is stuck, there will no longer be impurities in the groove 64 to affect the image: The sensing ability of the sheet 44 can increase its pixels. 3, El Yueqing Refer to FIG. 3, for the purpose of creating a high-pixel image sensor package, it is not intended. First, after the image sensor chip 44 is assembled in the groove ^ 2, and a plurality of wires 46 are wired, then The coating medium is used to make the adhesive medium 48 adhere to the upper surface 52 of the substrate. After the capping operation is completed, the impurities in the groove 64 are the packaged products from the 2 detectors. The image sense of the wind return pixel is provided in the detailed description of the preferred embodiment to easily explain the technical content of the present invention. The private example of the present invention is not merely an embodiment. It is within the scope of the present invention to restrict the implementation of various changes in a meaningful sense. Target Circumstances
第8頁 M246919 圖式簡單說明 圖1為習知影像感測器封裝構造的剖視圖。 圖2為本創作具高像素之影像感測器封裝構造的剖視圖 圖3為本創作具高像素之影像感測器封裝構造的示意圖 符 號 簡 單 說 明 基 板 40 凸 緣 層 42 影 像 感 測 晶 片 44 複 數 條 導線 46 黏 著 介 質 48 透 光 層 50 上 表 面 52 下 表 面 54 第 接 點 56 第 二 接 點 58 印 刷 電 路 板 59 第 _ 一 表 面 60 第 二 表 面 62 凹 槽 64 複 數 個 焊 墊 66 第 一 端 點 68 第 _㈣ 端 點 70 mPage 8 M246919 Brief Description of Drawings Figure 1 is a cross-sectional view of a conventional image sensor package structure. FIG. 2 is a cross-sectional view of a packaging structure of an image sensor with high pixels. FIG. 3 is a schematic diagram of a packaging structure of an image sensor with high pixels. Symbols briefly explain the substrate 40, the flange layer 42, the image sensing chip 44, and the like. Conductor 46 Adhesive medium 48 Light-transmitting layer 50 Upper surface 52 Lower surface 54 First contact 56 Second contact 58 Printed circuit board 59 First surface 60 Second surface 62 Groove 64 Multiple solder pads 66 First end point 68 End_70 m
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