JP2004200630A - Package structure for high-pixel-quality image sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package structure for an image sensor which can elevate the quality of pixels by reducing impurities. <P>SOLUTION: This package structure possesses a board which is equipped with an upper surface and an under surface, a brim layer which shows box structure and is installed on the upper surface of the board and forms a concave groove with the board, an image sensing chip which is installed in the concave groove and is fixed to the upper surface of the board, a plurality of lead wires which electrically connect the image sensing chip to the board, an adhesive medium which is positioned within the concave groove, and a translucent layer which is installed on the brim layer and covers the image sensing chip, and impurities (particles) fall down into the concave groove and are bonded by the adhesive medium, so they never fall down to the detection region of the image sensing chip and a translucent layer, thus this package structure can improve the quality of pixels of the image sensing chip effectively. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a structure of an image sensor package, and more particularly, to a structure of an image sensor in which a light-transmitting layer is firmly fixed on a protruding layer, which is convenient in manufacturing and can effectively improve product yield. .
[0002]
[Prior art]
FIG. 1 is a schematic view of a known image sensor package structure including a substrate 10 having an upper surface 12 and a lower surface 14, a first contact 15 formed on the upper surface 12, and a lower surface. The second contact 16 is formed at 14. The ridge layer 18 has a first surface 20 and a second surface 22, the second surface 22 being adhered to the upper surface 12 of the substrate 10 to form a groove 24 with the substrate 10. The image sensing chip 26 is provided in the concave groove 24 formed by the substrate 10 and the convex layer 18, and is fixed on the upper surface 12 of the substrate 10. The plurality of wires 28 have a first end point 30 and a second end point 32, and the first end point 30 is electrically connected to the image sensing chip 26, and the second end point 32 is electrically connected to the first contact 15 of the substrate 10. It is articulated. The light transmitting layer 34 is adhered to the first surface 20 of the convex layer 18.
[0003]
Such an image sensor must be packaged in a very clean clean room, otherwise impurities in the air will enter the groove 24 and the pixel quality cannot be improved. However, even if a small amount of impurity particles fall into the concave groove 24 even if manufactured in a clean room, the pixel quality of the image sensor is affected. In addition, image sensor manufacturers must continually improve the level of the clean room, the expenditure is quite high, and the demand for completely eliminating impurities cannot be achieved.
[0004]
[Problems to be solved by the invention]
Accordingly, it is an object of the present invention to provide a high pixel quality image sensor package structure capable of reducing the impurities of the image sensor and improving the pixel quality thereof.
[0005]
[Means for Solving the Problems]
The invention according to claim 1 is a high pixel quality image sensor package structure electrically connected to a printed circuit board,
A substrate having an upper surface and a lower surface, wherein a plurality of first contacts are provided on the upper surface;
A projecting edge layer having a frame-shaped structure and being disposed on the upper surface of the substrate to form a groove with the substrate;
A plurality of bonding pads formed on the upper surface, installed in the concave grooves, and an image sensing chip fixed to the upper surface of the substrate;
A plurality of conductors for electrically connecting a bonding pad of the image sensing chip to a first contact of the substrate;
An adhesive medium located in the concave groove;
A light-transmitting layer disposed on the convex layer and covering the image sensing chip;
And a high pixel quality image sensor package structure.
According to a second aspect of the present invention, in the image sensor package structure of the first aspect, a plurality of second contacts are provided on a lower surface of the substrate for connection with a printed circuit board. And a high pixel quality image sensor package structure.
According to a third aspect of the present invention, in the high pixel quality image sensor package structure according to the first aspect, an adhesive medium is applied to an upper surface of the substrate. .
According to a fourth aspect of the present invention, in the high pixel quality image sensor package structure according to the first aspect, an adhesive medium is formed in the groove by spraying or coating. It has a package structure.
[0006]
BEST MODE FOR CARRYING OUT THE INVENTION
The present invention provides a kind of image sensor, comprising a substrate having an upper surface and a lower surface, and a protruding edge layer having a frame structure and being disposed on the upper surface of the substrate to form a groove with the substrate. An image sensing chip installed in the groove and fixed to the upper surface of the substrate; a plurality of conductive wires electrically connecting the image sensing chip to the substrate; An adhesive medium and a light-transmitting layer disposed on the edge layer and covering the image sensing chip.
[0007]
In this way, since the impurities fall into the grooves and adhere to the adhesive medium, the impurities do not fall into the detection region and the light transmitting layer of the image sensing chip, so that the pixel quality of the image sensing chip can be effectively improved.
[0008]
【Example】
FIG. 2 is a cross-sectional view of a high pixel quality image sensor package structure according to the present invention. As shown, the present invention includes a substrate 40, a convex layer 42, an image sensing chip 44, a plurality of conductive wires 46, an adhesive medium. 48 and a light-transmitting layer 50.
[0009]
The substrate 40 has an upper surface 52 and a lower surface 54, and a first contact 56 is formed on the upper surface 52, and a second contact 58 is formed on the lower surface 54 for electrical connection with the printed circuit board 59. .
[0010]
The protruding edge layer 42 has a frame structure and has a first surface 60 and a second surface 62, and the second surface 62 is adhered to the upper surface 52 of the substrate 40 to form the substrate 40 and the concave groove 64.
[0011]
The image sensing chip 44 includes a plurality of bonding pads 66, which are provided in grooves 64 formed by the substrate 40 and the edge layer 42, and are fixed to the upper surface 52 of the substrate 40.
[0012]
The plurality of conductive wires 46 have a first end point 68 and a second end point 70, the first end point 68 is electrically connected to the bonding pad 66 of the image sensing chip 44, and the second end point 70 is electrically connected to the third end of the substrate 40. It is connected to one contact 56 and transmits the signal of the image sensing chip 44 to the substrate 40.
[0013]
The adhesive medium 48 is an adhesive in this embodiment, and is formed on the upper surface 52 in the groove 64 by coating or spraying.
[0014]
The light-transmitting layer 50 is made of light-transmitting glass, which is provided on the first surface 60 of the convex layer 42 and covers the image sensing chip 44, which transmits the light-transmitting layer 50. To receive an optical signal.
[0015]
【The invention's effect】
After the package work is completed, the impurities in the concave groove 64 slowly fall, but are adhered to the adhesive medium 48 and the image sensor is slightly shaken, so that the impurities on the detection area of the image sensing chip 44 are dropped and adhered. At this time, since the impurities which affect the sensing ability of the image sensing chip 44 are not present in the concave groove 64 at this time, the pixel quality can be improved.
[0016]
FIG. 3 is a schematic view showing a high pixel quality image sensor package structure according to the present invention. After the image sensing chip 44 is assembled in the groove 64, a plurality of conductors 46 are wire-bonded. Then, an adhesive medium 48 is formed on the upper surface 52 of the substrate by coating or spraying, and a coating operation with the light-transmitting layer 50 is performed. After the package is completed, impurities in the groove 64 are automatically bonded. It is dropped on the medium 48, thereby completing a package product of an image sensor with improved pixel quality.
[0017]
The above embodiments do not limit the scope of the present invention, and any modification or alteration of details that can be made based on the present invention shall fall within the scope of the present invention.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a known image sensor package structure.
FIG. 2 is a cross-sectional view of a high pixel quality image sensor package structure of the present invention.
FIG. 3 is a schematic diagram showing a high pixel quality image sensor package structure according to the present invention.
[Explanation of symbols]
REFERENCE SIGNS LIST 40 substrate 42 convex layer 44 image sensing chip 46 conductive wire 48 bonding medium 50 light transmitting layer 52 upper surface 54 lower surface 56 first contact 58 second contact 59 printed circuit board 60 first surface 62 second surface 64 concave groove 66 bonding pad 68 First endpoint 70 Second endpoint

Claims (4)

In a high pixel quality image sensor package structure electrically connected to a printed circuit board,
A substrate having an upper surface and a lower surface, wherein a plurality of first contacts are provided on the upper surface;
A projecting edge layer having a frame-shaped structure and being disposed on the upper surface of the substrate to form a groove with the substrate;
A plurality of bonding pads formed on the upper surface, installed in the concave grooves, and an image sensing chip fixed to the upper surface of the substrate;
A plurality of conductors for electrically connecting a bonding pad of the image sensing chip to a first contact of the substrate;
An adhesive medium located in the concave groove;
A light-transmitting layer disposed on the convex layer and covering the image sensing chip;
A high pixel quality image sensor package structure comprising: The high pixel quality image sensor package structure according to claim 1, further comprising a plurality of second contacts provided on a lower surface of the substrate for connection with a printed circuit board. Sensor package structure. 2. The high pixel quality image sensor package structure according to claim 1, wherein an adhesive medium is applied to an upper surface of the substrate. The high pixel quality image sensor package structure according to claim 1, wherein the adhesive medium is formed in the groove by spraying or coating.

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