TWM243918U - Structure of heat conduction plate - Google Patents

Structure of heat conduction plate Download PDF

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Publication number
TWM243918U
TWM243918U TW092217849U TW92217849U TWM243918U TW M243918 U TWM243918 U TW M243918U TW 092217849 U TW092217849 U TW 092217849U TW 92217849 U TW92217849 U TW 92217849U TW M243918 U TWM243918 U TW M243918U
Authority
TW
Taiwan
Prior art keywords
board
heat
plate
fin
slot
Prior art date
Application number
TW092217849U
Other languages
Chinese (zh)
Inventor
Yaw-Huey Lai
Original Assignee
Tai Sol Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tai Sol Electronics Co Ltd filed Critical Tai Sol Electronics Co Ltd
Priority to TW092217849U priority Critical patent/TWM243918U/en
Priority to US10/717,588 priority patent/US20050072557A1/en
Publication of TWM243918U publication Critical patent/TWM243918U/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

M243918 明 說 創 五 種 1 指 是 乃 之 言 而 詳 更 關 有 1術 域技 領熱 術散 技與 之係。 屬作構 所_結 型本板 新 熱 [ 導 若較 置到 設達 方以 上藉 體積 板面 屬熱 金散 為大 皆加 般片 一鰭 ,等 板該 熱由 導藉 之可 1知而 術習, 技,片 前按鰭 先 之 散後 的 干佳 置 穿 \ϊ/ 11 6 Γν 管 導 熱 將 係 計 設 些 某 有 示 所 圖 。六 果第 效如 熱, 以予 ,能 度熱 速的 的上 遞片 傳鰭 熱將 間能 ς僅 (6構 片結 鰭種 加此 增, 來惟 用·, ,果 間效 之熱 3)散 (6的 片佳 鰭更 於求 效 有 以 予 量 熱 的 上 \ly ο 6 Γ\ 板 熱 導 將 效 有 能 不 並 失 缺 之 構 結 圖 六 第 述 前 , 善 遞 改 傳 欲 速。若 快出 以導 方 下 片 鰭 於 位 而 上 板 熱 導 該 於 置 貼 接: 直式 而, 管 導 熱 等 該 使 欲 方 種 二 有 只 則 片 鰭 等 該 於 置 穿 且 面 頂 板 熱 導 於 置 貼 管 導; 熱是 將或 一部 底 之 ,斷製, 槽以在整 須板 凹亦熱 的管導 管導之 導熱計 熱且設 置,種 容度此 有厚·, 具加内 其增槽 使而凹 ,構該 計結於 設種置 變此容 改應式 板因方 熱須之 導必形 將板扁 、熱呈 二導面 平差 不變 而果 形效 變的 會導 將傳 面熱 底致 則導 否會 ,亦 薄壁 太底 能槽 不凹 壁的 底厚 槽過 凹, 時而 造然M243918 states that the creation of five types of 1 refers to the meaning of the meaning, and more specifically related to the technical field of the field of heat and technology. Belonging to the structure _ new heat of the plate [If the guide is placed above the set square, the volume of the plate is hot and the gold is a large piece of fin, so the board can know the heat from the guide. Practice, technique, and stabbing according to the fins first and then after the fins will be worn and placed \ ϊ / 11 6 Γν The thermal conductivity of the tube will be set as shown in the figure. The six fruits are as effective as heat, so that the heat transfer speed of the heat transfer fin heat transfers the inter-energy energy only (6 framing and fin-type species are added in order to use only ,,, the heat of inter-effect heat 3 ) The good fins of 6 (6) are more effective for the amount of heat. \ Ly ο 6 Γ \ The thermal conductivity of the board will not be lacking in effectiveness and energy. Speed. If it comes out quickly, the lower plate fins are in place and the upper plate is thermally conductive. The upper plate should be attached: straight, and the tube should be thermally conductive. If there are two kinds of fins, the plate fins should be placed through and face the top plate. The heat guide is placed on the tube guide; the heat is the bottom or the bottom of the tube. The internal groove is increased and the concave is formed. The structure is based on the design of the change. This capacity change type plate will be flat because the heat of the square must be flat, and the heat will be the same as the second surface. The guide will pass the heat to the bottom, but will the guide be too thin? And then made

第5頁 M243918 五、創作說明(2) 【新型内容】 本創作之主要目的即在提供一種導熱板結構,其導熱 板可在固定的結構強度下,較習用者具有更薄的底板,而 具有較佳的熱傳導效果。 本創作之次一目的乃在提供一種導熱板結構,其所成 形之散熱結構具有優於習用者之散熱效果。 【實施方式】 為了詳細說明本創作之構造及特點所在,茲舉以下四 較佳實施例並配合圖式說明如后:Page 5 M243918 V. Creation Instructions (2) [New Content] The main purpose of this creation is to provide a heat-conducting plate structure. The heat-conducting plate can have a thinner base plate than a conventional user at a fixed structural strength. Better heat transfer effect. The second purpose of this creation is to provide a heat-conducting plate structure whose formed heat-dissipating structure has a better heat-dissipating effect than a user. [Embodiment] In order to explain the structure and characteristics of this creation in detail, the following four preferred embodiments are described in conjunction with the drawings as follows:

請參閱第一圖至第二圖’本創作第一較佳實施例所提 供之一種導熱板結構(1 0 ),包含有·· 一板體(1 1 ),具有一底板(1 2 ) ’該底板(1 2 )兩側分別 向上延伸預定寬度及高度之一立壁(14),而於該底板 (1 2 )、及該二立壁(丨4 )之間形成一容槽(丨6 ),該二立壁 ϋ ^平向外延伸一翼部(1 8 ),該翼部(1 8 )的高度較該底 ϋ 2為ΐ i該底板(12)之底面中央具有一向上凹設的凹 μ .. 社产上厂^熱疋件(圖中未示)接觸; 具“薄的;i因父:會因該凹槽(19)的設置而u 熱的效果。 L而具有較低的熱阻,可達到快速導 再者’藉由§亥凹槽Please refer to the first diagram to the second diagram 'a heat conducting plate structure (1 0) provided by the first preferred embodiment of the present invention includes a plate body (1 1) and a bottom plate (1 2)' The two sides of the bottom plate (1 2) each extend one upright wall (14) of a predetermined width and height upward, and a receiving groove (丨 6) is formed between the bottom plate (1 2) and the two upright walls (丨 4), The two vertical walls ϋ extend outwardly with a wing (1 8), the height of the wing (1 8) is higher than the bottom ϋ 2 ΐ i, the bottom surface of the bottom plate (12) has an upwardly concave recess μ. The company produces the factory ^ thermal parts (not shown) contact; with "thin; i because of the father: will be caused by the setting of the groove (19) u heat effect. L has a lower thermal resistance , Can achieve a quick guide again 'by § 海槽

上方的底板(1 2 )為厚) 9 )_兩側之底板(1 2 )(較凹槽(1 9 ) 另兩側,可產生—種_該二翼部(1 8 )位於該凹槽(1 9 )的 以框體的結構而繞設於該凹槽(1 9 )The upper bottom plate (1 2) is thick. 9) _ The bottom plates (1 2) on both sides (compared with the grooves (1 9) on the other side, can produce a kind of _ the two wings (1 8) are located in the grooves.) (1 9) is wound around the groove with a frame structure (1 9)

M243918 五、創作說明(3) 四周’進而具有支撐凹槽(19)上方的底板(12)的效果,藉 由此種結構,可容許凹槽(1 9 )上方的底板(1 2 )以較薄的形 態存在而不會變形,甚至於可薄至1 m m以下,更薄的底板 (1 2 )則具有更小的熱阻,而具有更佳的導熱效果。一 此外,該二立壁(14)亦會將該底板(12)的熱能傳導至 該二翼部(18)而至該等鰭片,有助於散熱。 請再參閱第三圖,本創作第二較佳實施例所提供之一 種散熱結構(3 0 ),係使用前實施例中之導熱板再配合至少 , 一熱導管(31)以及若干鰭片(33)所組成,其中: 口 該等熱導管(3 1 ),本實施例中係以三條為例,設置於 該導熱板(10)之容槽(16)内且貼接於該底板(12)頂 若干鰭片(33),立設於導熱板(1〇)以及該等熱導管 翁 (31)上,該等鰭片(33)之底部係跨置於該容槽(16、\上,且 連接於該等熱導管(31)表面以及該等翼部(18)之頂面。 =述之散熱結構(30)在使用時,該導熱板(1〇)的底 U ΐ央對應凹槽(圖中未示)之位置較薄’其熱阻較小, I L速的將發熱元件(圖中未示)的熱能由該底板(丨 =至頂面,並藉由該等熱導管(31)將熱能快速的導 至所,鰭片(3 3 );其散熱效果較習用者佳。 導 凊再參閱第四圖,本創作第三較佳實施例所提供之一 種散熱結構(4 0 ),主要概同於前揭實施例,不同之處在 於· 山該等熱導管(41)除了設置於該容槽(16)内,更以其一 _ 端向外向上延伸,並穿設於該等鰭片(43)。 、M243918 Fifth, the creation description (3) surrounds' thereby having the effect of supporting the bottom plate (12) above the groove (19). With this structure, the bottom plate (1 2) above the groove (19) can be allowed to be more The thin form exists without deformation, and can even be thinner than 1 mm. The thinner base plate (1 2) has smaller thermal resistance and better thermal conductivity. 1. In addition, the two vertical walls (14) will also conduct the thermal energy of the bottom plate (12) to the two wings (18) and to the fins, which helps to dissipate heat. Please refer to the third figure again. A heat dissipation structure (30) provided in the second preferred embodiment of the present invention is a heat conducting plate in the previous embodiment, which is further matched with at least one heat pipe (31) and a plurality of fins ( 33), including: the heat pipes (3 1). In this embodiment, three heat pipes are used as an example. The heat pipes (10) are arranged in the groove (16) of the heat conducting plate (10) and attached to the bottom plate (12). ), A plurality of fins (33) are erected on the heat conducting plate (10) and the heat pipe members (31), and the bottoms of the fins (33) are placed across the receiving groove (16, \ 上) And connected to the surfaces of the heat pipes (31) and the top surfaces of the wings (18). = When the heat dissipation structure (30) is described, the bottom UU of the heat conducting plate (10) corresponds to the concave. The slot (not shown in the figure) is thinner, and its thermal resistance is smaller. The IL speed will transfer the thermal energy of the heating element (not shown) from the bottom plate (丨 = to the top surface, and through the heat pipes ( 31) Quickly guide the thermal energy to the fins (3 3); its heat dissipation effect is better than the user. Please refer to the fourth figure again, a heat dissipation provided by the third preferred embodiment of this creation The structure (40) is mainly similar to the previously disclosed embodiment, except that the heat pipes (41) such as the mountain are provided in the tank (16) and extend outward with one of their ends. And put on these fins (43).

M243918 五、創作說明(4) 本實施例之使用方 請再參閱第五圖, 種散熱結構(5 0 ),主要 於: 更具有一頂板(5 5 ) 該等熱導管(5 1 )除 端向外向上延伸,並反 本實施例之散熱結 導熱板(10)的熱能直接 該導熱板(1 0 )係呈均溫 散出。 經由上述之方法及 藉由該凹槽(19)四 可形成一類似框體的支 方的底板(1 2 )厚度設計 阻,而達到較佳之導熱 式概同於前揭實施例,& 本創作f四較佳實施例ί J J J: 概同於前揭實施例,不η 个同之處在 ,設置於該等鰭片(5 3 )上方· 了設置於該容槽(16)内,更以其一 向延伸穿置於該頂板(5 5 )内。〃 構(50)係藉由該等熱導管(51)將該 傳導至該頂板(5 5 ),該頂板(5 5 )與 狀態,再藉由該等鰭片(5 3 )將熱量 結構,本創作可產生如下優點: 周的較厚底板(12)以及翼部(18), 撐結構,以結構可容許凹槽(1 9 )上 得極薄而不致變形,藉以減少熱 果。M243918 V. Creation instructions (4) Please refer to the fifth figure again for the user of this embodiment. A heat dissipation structure (50) is mainly provided by: It also has a top plate (55). The heat pipes (51) are divided. The heat energy of the heat dissipation plate (10) of the heat dissipation junction heat dissipation plate (10) of this embodiment is extended outward and upward, and the heat dissipation plate (10) is directly radiated at a uniform temperature. Through the above-mentioned method and the thickness of the bottom plate (1 2) which can form a branch similar to the frame through the groove (19), a better thermal conductivity type is achieved, which is similar to the previously disclosed embodiment. The four preferred embodiments of creation f JJJ: The same as the previous embodiment, there are no differences, they are set above the fins (5 3), and they are set in the tank (16), more It extends through the top plate (5 5). The structure (50) conducts the heat to the top plate (5 5), the top plate (5 5) and the state through the heat pipes (51), and then the heat structure is formed by the fins (5 3), This creation can produce the following advantages: The thicker base plate (12), wings (18), and bracing structures around the structure can allow the grooves (19) to be extremely thin without deforming, thereby reducing hot fruit.

M243918 明 說 單 簡 式 圖 底 由 示 顯 圖 體 立 之 例 施 實 佳 較一 第 作 明本 說係 單圖 簡一 式第 圖 圖 視 剖 之 線 剖 2 I 2 中 圖一 第 ;沿 態係 狀圖 的二 視第 觀 部 圖圖圖 意意意 示示示 態態態 狀狀狀 合合合 aaa 之之之 例例例 施施施 實實實 佳佳佳 較較fe 二三四 第第第 作作作 ruj TnJ »nw 本本本 係係係 圖圖圖 三四五 第第第 及 以 圖 意 示 構 結 之 構 結 熱 散 用 習 係 圖 六 第 圖式符號說明】 (1 0 )導熱板 (14)立壁 (19)凹槽 (3 0 )散熱結構 (4 0 )散熱結構 (5 0 )散熱結構 (5 5 )頂板 (1 1)板體 (16)容槽 (31)熱導管 (41)熱導管 (51)熱導管 (12)底板 (1 8 )翼部 (3 3 )鰭片 (4 3 )鰭片 (5 3 )鰭片 丨M243918 The example of the simple figure drawing is shown by the example of the display. Shi Shijia is better than the first one. The book is a single figure. The figure is the line of the view. I 2 is the first figure in the figure. The second view of the second part of the diagram is an example of the state of the state of the aaa, and the example of the combination of aaa, Shishi Shishi, real, good, better than fe 234, the first work As ruj TnJ »nw books, books, books, drawings, diagrams, diagrams, diagrams, diagrams, and diagrams of the structure and heat dissipation. Figure 6 (Symbol Explanation of Symbols) (1 0) ) Vertical wall (19) Groove (3 0) Heat dissipation structure (40) Heat dissipation structure (50) Heat dissipation structure (55) Top plate (1 1) Plate body (16) Receptacle (31) Heat pipe (41) Heat Conduit (51) Heat pipe (12) Bottom plate (1 8) Wing (3 3) Fin (4 3) Fin (5 3) Fin 丨

第9頁Page 9

Claims (1)

M243918 六 圍 範 利 專 請 構 結 板 熱 導 種 1 1X 底一, 一壁 有立 具一 ,之 體度 板高 一及 度 寬 ,板而 有 含 包 定成 預形 伸間 延之 上壁 向立 別二 分該 側及 兩、 板板 底底 該該 ,於 中 有 面 具 底 而 之 , 板 薄 底 較 該 度 , 厚 部 的 翼 置 一 位 伸 槽 延 凹 外;該 向槽應 平凹對 水之在 壁設板 立凹底 二上該 該向, ,一此 槽有藉 容具 一央 熱_ 導第 速圍 快範 fuj ty 達專 可請 ,中 阻據 熱依 的2· 低 較 果 效 的 中 其 構 結 板 熱 導 之 述 所 項 有 含 包 ο 5 高構 更結 板熱 底散 該種 較一 βΓ . 立口 3 翼 該 預形 伸間 延之 上壁 向立 別二 分該 側及 兩、 板板 底*底* 該該 ,於 板而 底 , 一壁 有立 具一 ,之 板度 熱高 導及 一度 寬 定 部 翼 一 伸; 延槽 外凹 向之 平設 水凹 壁上 立向二一 該有 ,具 槽位 容部 一央 成中 面 底 之 板 底 該 等面 該表 , 管 上導 管熱 導等 熱該 等於 ;該接 中及連 槽以且 容板, 該熱上 於導槽 置該容 設於該 ,設於 管立置 導,跨 熱片係 一鰭部 少干底 至若之 片 鰭 述J 所Μ 二 3 第端 圍一 。範少 面利至 頂專其 之請以 部申係 翼據管 等依導 該4.熱 及 等 以 該 中 其 構 結 熱 散 之 等 該 於 設 穿 並 延 彎 上 片 鰭 中 其 , 構 結 熱 散 之 述 所 項 3 第 圍 範 利 專 請 申 據 依 5 以 係 管 導 熱。 等内 該板 ,頂 方該 上於 片設 鰭穿 等並 該, 於延 置彎 設上 ,向 板外 頂向 一端 有一 含少 包至 更其 第10頁M243918 Liu Wei Fan Li specially asked to construct the plate heat guide 1 1X bottom one, one wall with stand one, the height of the plate is one and the width is wide, and the plate has the upper wall that is set to form a pre-extension interval. Divide the side and the two, the bottom and the bottom of the board, and the bottom of the board, and the bottom of the board. The bottom of the board is more than that, and the wings of the thick part are set to extend out of the groove; the groove should be flat. The water should be on the bottom of the wall and the bottom of the board. The slot should be equipped with a central heat. The guide can be requested. The middle resistance is based on the low 2 of the heat. The more effective description of the thermal conductivity of the structural plate includes the following: ο 5 high-structure and more structural plate thermal dissipation, this kind of β Γ. Riser 3 wings, the pre-formed extension interval, the upper wall is standing apart Two sides of the side and two, the bottom of the board, the bottom of the board, the bottom of the board, there should be one on the wall, the thermal conductivity of the board, and the wings of the once-defining section. The recessed walls should be vertical to two, one with a slot and a central portion at the bottom. The surface of the bottom surface of the board should be equal to the thermal conductivity of the pipe on the tube; the connection and the slot should be connected to the plate; the heat should be placed on the guide slot; the container should be placed on the tube; The hot fin is a fin with less dry bottom and the fin fin described by J So M 2 3 at the first end. Fan Shao face to the top, please follow the instructions of the Ministry of wing, according to the management, etc. 4. The heat and the heat dissipation of the structure should be penetrated and extended in the upper fins. According to item 3 of the description of heat dissipation, Fan Li specially requested the application to conduct heat conduction by the tube according to 5. Inside the board, the top side should be set on the piece with fins and so on, and on the extension curve, the top side of the board should have a small bag to the top. Page 10
TW092217849U 2003-10-03 2003-10-03 Structure of heat conduction plate TWM243918U (en)

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TW092217849U TWM243918U (en) 2003-10-03 2003-10-03 Structure of heat conduction plate
US10/717,588 US20050072557A1 (en) 2003-10-03 2003-11-21 Heat-conductive structure

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Cited By (1)

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TWI400032B (en) * 2008-02-05 2013-06-21 Delta Electronics Inc Heat dissipation module and supporting element thereof

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CN109210766B (en) * 2017-06-30 2020-05-19 杭州三花研究院有限公司 Electric heater
CN109210767B (en) * 2017-06-30 2021-01-12 杭州三花研究院有限公司 Electric heater
CN109219171B (en) * 2017-06-30 2021-01-12 杭州三花研究院有限公司 Electric heater
KR102405738B1 (en) 2017-06-30 2022-06-07 항저우 산후아 리서치 인스티튜트 컴퍼니 리미티드 electric heater

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US5699853A (en) * 1996-08-30 1997-12-23 International Business Machines Corporation Combined heat sink and sink plate
US6068051A (en) * 1998-03-23 2000-05-30 Intel Corporation Channeled heat sink
TW423674U (en) * 1999-05-15 2001-02-21 Foxconn Prec Components Co Ltd Buckle of heat dissipation device
TW468820U (en) * 2000-03-15 2001-12-11 Foxconn Prec Components Co Ltd Cooler device
US6959755B2 (en) * 2002-01-30 2005-11-01 Kuo Jui Chen Tube-style radiator structure for computer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400032B (en) * 2008-02-05 2013-06-21 Delta Electronics Inc Heat dissipation module and supporting element thereof

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