TWI910362B - 樹脂組成物及其製造方法以及接著薄膜及層間接著用黏合片 - Google Patents

樹脂組成物及其製造方法以及接著薄膜及層間接著用黏合片

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Publication number
TWI910362B
TWI910362B TW111119481A TW111119481A TWI910362B TW I910362 B TWI910362 B TW I910362B TW 111119481 A TW111119481 A TW 111119481A TW 111119481 A TW111119481 A TW 111119481A TW I910362 B TWI910362 B TW I910362B
Authority
TW
Taiwan
Prior art keywords
component
styrene
resin composition
resin
butadiene
Prior art date
Application number
TW111119481A
Other languages
English (en)
Chinese (zh)
Other versions
TW202313831A (zh
Inventor
日馬宗俊
宇佐美遼
Original Assignee
日商納美仕有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW202313831A publication Critical patent/TW202313831A/zh
Application granted granted Critical
Publication of TWI910362B publication Critical patent/TWI910362B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06—Copolymers with styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW111119481A 2021-06-02 2022-05-25 樹脂組成物及其製造方法以及接著薄膜及層間接著用黏合片 TWI910362B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021092967 2021-06-02
JP2021-092967 2021-06-02

Publications (2)

Publication Number Publication Date
TW202313831A TW202313831A (zh) 2023-04-01
TWI910362B true TWI910362B (zh) 2026-01-01

Family

ID=84323206

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111119481A TWI910362B (zh) 2021-06-02 2022-05-25 樹脂組成物及其製造方法以及接著薄膜及層間接著用黏合片

Country Status (3)

Country Link
JP (1) JPWO2022255078A1 (https=)
TW (1) TWI910362B (https=)
WO (1) WO2022255078A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202502994A (zh) * 2023-04-06 2025-01-16 日商Ｄｉｃ股份有限公司 熱硬化型黏著片及印刷配線板
TW202506937A (zh) * 2023-08-10 2025-02-16 日商Ｄｉｃ股份有限公司 熱硬化型黏著片及印刷配線板
TW202509166A (zh) * 2023-08-10 2025-03-01 日商Ｄｉｃ股份有限公司 熱硬化型黏著片及印刷配線板
WO2025105009A1 (ja) * 2023-11-17 2025-05-22 ナミックス株式会社 接着フィルム、半導体装置および半導体装置の製造方法
JP7569954B1 (ja) * 2024-03-29 2024-10-18 デクセリアルズ株式会社 熱硬化性接着剤組成物、熱硬化性接着シート及びプリント配線板
CN118165663B (zh) * 2024-05-15 2024-07-30 山东同有新材料科技有限公司 一种燃料电池单电池用密封材料及其制备方法
JP2026066923A (ja) * 2024-10-07 2026-04-17 デクセリアルズ株式会社 熱硬化性接着剤組成物、熱硬化性接着シート及びプリント配線板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI678380B (zh) * 2014-10-22 2019-12-01 日商納美仕股份有限公司 樹脂組成物、以及使用其之絕緣薄膜及半導體裝置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6578142B2 (ja) * 2014-06-26 2019-09-18 住友電気工業株式会社 接着剤組成物、プリント配線板用カバーレイ、プリント配線板用ボンディングフィルム及びプリント配線板
JP6863126B2 (ja) * 2017-06-22 2021-04-21 昭和電工マテリアルズ株式会社 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
JP7090428B2 (ja) * 2018-02-05 2022-06-24 デクセリアルズ株式会社 接着剤組成物、熱硬化性接着シート及びプリント配線板
JP7020332B2 (ja) * 2018-07-26 2022-02-16 味の素株式会社 樹脂組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI678380B (zh) * 2014-10-22 2019-12-01 日商納美仕股份有限公司 樹脂組成物、以及使用其之絕緣薄膜及半導體裝置

Also Published As

Publication number Publication date
WO2022255078A1 (ja) 2022-12-08
JPWO2022255078A1 (https=) 2022-12-08
TW202313831A (zh) 2023-04-01

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