TWI902842B - 感光性元件、光阻圖案之形成方法及印刷配線板之製造方法 - Google Patents

感光性元件、光阻圖案之形成方法及印刷配線板之製造方法

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Publication number
TWI902842B
TWI902842B TW110124706A TW110124706A TWI902842B TW I902842 B TWI902842 B TW I902842B TW 110124706 A TW110124706 A TW 110124706A TW 110124706 A TW110124706 A TW 110124706A TW I902842 B TWI902842 B TW I902842B
Authority
TW
Taiwan
Prior art keywords
layer
photosensitive
mass
blocking layer
meth
Prior art date
Application number
TW110124706A
Other languages
English (en)
Chinese (zh)
Other versions
TW202206944A (zh
Inventor
賀口陽介
小野博史
粂壯和
Original Assignee
日商力森諾科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202206944A publication Critical patent/TW202206944A/zh
Application granted granted Critical
Publication of TWI902842B publication Critical patent/TWI902842B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • Materials For Photolithography (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
TW110124706A 2020-07-20 2021-07-06 感光性元件、光阻圖案之形成方法及印刷配線板之製造方法 TWI902842B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-123768 2020-07-20
JP2020123768 2020-07-20

Publications (2)

Publication Number Publication Date
TW202206944A TW202206944A (zh) 2022-02-16
TWI902842B true TWI902842B (zh) 2025-11-01

Family

ID=79729437

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110124706A TWI902842B (zh) 2020-07-20 2021-07-06 感光性元件、光阻圖案之形成方法及印刷配線板之製造方法

Country Status (5)

Country Link
JP (2) JPWO2022019046A1 (https=)
KR (1) KR102870994B1 (https=)
CN (1) CN115867864A (https=)
TW (1) TWI902842B (https=)
WO (1) WO2022019046A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025047730A1 (ja) * 2023-08-30 2025-03-06 富士フイルム株式会社 転写フィルム、パターン形成方法、積層体、半導体パッケージ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020054075A1 (ja) * 2018-09-14 2020-03-19 日立化成株式会社 転写型感光性フィルム、樹脂硬化膜の形成方法及び樹脂硬化膜付センサ基板の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102654084B1 (ko) * 2015-07-08 2024-04-04 가부시끼가이샤 레조낙 감광성 엘리먼트, 적층체, 레지스터 패턴의 형성 방법 및 프린트 배선판의 제조 방법
WO2019215848A1 (ja) 2018-05-09 2019-11-14 日立化成株式会社 感光性エレメント、バリア層形成用樹脂組成物、レジストパターンの形成方法及びプリント配線板の製造方法
WO2020105457A1 (ja) * 2018-11-20 2020-05-28 富士フイルム株式会社 転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法
JP2022120464A (ja) * 2021-02-05 2022-08-18 昭和電工マテリアルズ株式会社 メタルマスクの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020054075A1 (ja) * 2018-09-14 2020-03-19 日立化成株式会社 転写型感光性フィルム、樹脂硬化膜の形成方法及び樹脂硬化膜付センサ基板の製造方法

Also Published As

Publication number Publication date
KR20230041976A (ko) 2023-03-27
KR102870994B1 (ko) 2025-10-16
JPWO2022019046A1 (https=) 2022-01-27
JP2026063359A (ja) 2026-04-10
TW202206944A (zh) 2022-02-16
CN115867864A (zh) 2023-03-28
WO2022019046A1 (ja) 2022-01-27

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