CN115867864A - 感光性元件、抗蚀剂图案的形成方法及印刷线路板的制造方法 - Google Patents

感光性元件、抗蚀剂图案的形成方法及印刷线路板的制造方法 Download PDF

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Publication number
CN115867864A
CN115867864A CN202180047105.0A CN202180047105A CN115867864A CN 115867864 A CN115867864 A CN 115867864A CN 202180047105 A CN202180047105 A CN 202180047105A CN 115867864 A CN115867864 A CN 115867864A
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CN
China
Prior art keywords
barrier layer
mass
layer
photosensitive
meth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN202180047105.0A
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English (en)
Chinese (zh)
Inventor
贺口阳介
小野博史
粂壮和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
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Showa Denko KK
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Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of CN115867864A publication Critical patent/CN115867864A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • Materials For Photolithography (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
CN202180047105.0A 2020-07-20 2021-06-25 感光性元件、抗蚀剂图案的形成方法及印刷线路板的制造方法 Pending CN115867864A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-123768 2020-07-20
JP2020123768 2020-07-20
PCT/JP2021/024156 WO2022019046A1 (ja) 2020-07-20 2021-06-25 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
CN115867864A true CN115867864A (zh) 2023-03-28

Family

ID=79729437

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180047105.0A Pending CN115867864A (zh) 2020-07-20 2021-06-25 感光性元件、抗蚀剂图案的形成方法及印刷线路板的制造方法

Country Status (5)

Country Link
JP (2) JPWO2022019046A1 (https=)
KR (1) KR102870994B1 (https=)
CN (1) CN115867864A (https=)
TW (1) TWI902842B (https=)
WO (1) WO2022019046A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025047730A1 (ja) * 2023-08-30 2025-03-06 富士フイルム株式会社 転写フィルム、パターン形成方法、積層体、半導体パッケージ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102654084B1 (ko) * 2015-07-08 2024-04-04 가부시끼가이샤 레조낙 감광성 엘리먼트, 적층체, 레지스터 패턴의 형성 방법 및 프린트 배선판의 제조 방법
WO2019215848A1 (ja) 2018-05-09 2019-11-14 日立化成株式会社 感光性エレメント、バリア層形成用樹脂組成物、レジストパターンの形成方法及びプリント配線板の製造方法
WO2020054075A1 (ja) * 2018-09-14 2020-03-19 日立化成株式会社 転写型感光性フィルム、樹脂硬化膜の形成方法及び樹脂硬化膜付センサ基板の製造方法
WO2020105457A1 (ja) * 2018-11-20 2020-05-28 富士フイルム株式会社 転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法
JP2022120464A (ja) * 2021-02-05 2022-08-18 昭和電工マテリアルズ株式会社 メタルマスクの製造方法

Also Published As

Publication number Publication date
TWI902842B (zh) 2025-11-01
KR20230041976A (ko) 2023-03-27
KR102870994B1 (ko) 2025-10-16
JPWO2022019046A1 (https=) 2022-01-27
JP2026063359A (ja) 2026-04-10
TW202206944A (zh) 2022-02-16
WO2022019046A1 (ja) 2022-01-27

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