KR102870994B1 - 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법 - Google Patents

감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법

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Publication number
KR102870994B1
KR102870994B1 KR1020227045886A KR20227045886A KR102870994B1 KR 102870994 B1 KR102870994 B1 KR 102870994B1 KR 1020227045886 A KR1020227045886 A KR 1020227045886A KR 20227045886 A KR20227045886 A KR 20227045886A KR 102870994 B1 KR102870994 B1 KR 102870994B1
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South Korea
Prior art keywords
barrier layer
layer
mass
photosensitive
meth
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KR1020227045886A
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English (en)
Korean (ko)
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KR20230041976A (ko
Inventor
요스케 카구치
히로시 오노
마사카즈 쿠메
Original Assignee
가부시끼가이샤 레조낙
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/02—Homopolymers or copolymers of unsaturated alcohols
    • C08L29/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • Materials For Photolithography (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
KR1020227045886A 2020-07-20 2021-06-25 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법 Active KR102870994B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-123768 2020-07-20
JP2020123768 2020-07-20
PCT/JP2021/024156 WO2022019046A1 (ja) 2020-07-20 2021-06-25 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Publications (2)

Publication Number Publication Date
KR20230041976A KR20230041976A (ko) 2023-03-27
KR102870994B1 true KR102870994B1 (ko) 2025-10-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227045886A Active KR102870994B1 (ko) 2020-07-20 2021-06-25 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법

Country Status (5)

Country Link
JP (2) JPWO2022019046A1 (https=)
KR (1) KR102870994B1 (https=)
CN (1) CN115867864A (https=)
TW (1) TWI902842B (https=)
WO (1) WO2022019046A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025047730A1 (ja) * 2023-08-30 2025-03-06 富士フイルム株式会社 転写フィルム、パターン形成方法、積層体、半導体パッケージ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020054075A1 (ja) * 2018-09-14 2020-03-19 日立化成株式会社 転写型感光性フィルム、樹脂硬化膜の形成方法及び樹脂硬化膜付センサ基板の製造方法
WO2020105457A1 (ja) * 2018-11-20 2020-05-28 富士フイルム株式会社 転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102654084B1 (ko) * 2015-07-08 2024-04-04 가부시끼가이샤 레조낙 감광성 엘리먼트, 적층체, 레지스터 패턴의 형성 방법 및 프린트 배선판의 제조 방법
WO2019215848A1 (ja) 2018-05-09 2019-11-14 日立化成株式会社 感光性エレメント、バリア層形成用樹脂組成物、レジストパターンの形成方法及びプリント配線板の製造方法
JP2022120464A (ja) * 2021-02-05 2022-08-18 昭和電工マテリアルズ株式会社 メタルマスクの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020054075A1 (ja) * 2018-09-14 2020-03-19 日立化成株式会社 転写型感光性フィルム、樹脂硬化膜の形成方法及び樹脂硬化膜付センサ基板の製造方法
WO2020105457A1 (ja) * 2018-11-20 2020-05-28 富士フイルム株式会社 転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法

Also Published As

Publication number Publication date
TWI902842B (zh) 2025-11-01
KR20230041976A (ko) 2023-03-27
JPWO2022019046A1 (https=) 2022-01-27
JP2026063359A (ja) 2026-04-10
TW202206944A (zh) 2022-02-16
CN115867864A (zh) 2023-03-28
WO2022019046A1 (ja) 2022-01-27

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