JPWO2022019046A1 - - Google Patents
Info
- Publication number
- JPWO2022019046A1 JPWO2022019046A1 JP2022538654A JP2022538654A JPWO2022019046A1 JP WO2022019046 A1 JPWO2022019046 A1 JP WO2022019046A1 JP 2022538654 A JP2022538654 A JP 2022538654A JP 2022538654 A JP2022538654 A JP 2022538654A JP WO2022019046 A1 JPWO2022019046 A1 JP WO2022019046A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structural Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Architecture (AREA)
- Materials For Photolithography (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2026009778A JP2026063359A (ja) | 2020-07-20 | 2026-01-23 | 感光性エレメント |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020123768 | 2020-07-20 | ||
| PCT/JP2021/024156 WO2022019046A1 (ja) | 2020-07-20 | 2021-06-25 | 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2026009778A Division JP2026063359A (ja) | 2020-07-20 | 2026-01-23 | 感光性エレメント |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022019046A1 true JPWO2022019046A1 (https=) | 2022-01-27 |
Family
ID=79729437
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022538654A Pending JPWO2022019046A1 (https=) | 2020-07-20 | 2021-06-25 | |
| JP2026009778A Pending JP2026063359A (ja) | 2020-07-20 | 2026-01-23 | 感光性エレメント |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2026009778A Pending JP2026063359A (ja) | 2020-07-20 | 2026-01-23 | 感光性エレメント |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JPWO2022019046A1 (https=) |
| KR (1) | KR102870994B1 (https=) |
| CN (1) | CN115867864A (https=) |
| TW (1) | TWI902842B (https=) |
| WO (1) | WO2022019046A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025047730A1 (ja) * | 2023-08-30 | 2025-03-06 | 富士フイルム株式会社 | 転写フィルム、パターン形成方法、積層体、半導体パッケージ |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017007001A1 (ja) * | 2015-07-08 | 2017-01-12 | 日立化成株式会社 | 感光性エレメント、積層体、レジストパターンの形成方法及びプリント配線板の製造方法 |
| WO2020054075A1 (ja) * | 2018-09-14 | 2020-03-19 | 日立化成株式会社 | 転写型感光性フィルム、樹脂硬化膜の形成方法及び樹脂硬化膜付センサ基板の製造方法 |
| WO2020105457A1 (ja) * | 2018-11-20 | 2020-05-28 | 富士フイルム株式会社 | 転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019215848A1 (ja) | 2018-05-09 | 2019-11-14 | 日立化成株式会社 | 感光性エレメント、バリア層形成用樹脂組成物、レジストパターンの形成方法及びプリント配線板の製造方法 |
| JP2022120464A (ja) * | 2021-02-05 | 2022-08-18 | 昭和電工マテリアルズ株式会社 | メタルマスクの製造方法 |
-
2021
- 2021-06-25 KR KR1020227045886A patent/KR102870994B1/ko active Active
- 2021-06-25 CN CN202180047105.0A patent/CN115867864A/zh active Pending
- 2021-06-25 JP JP2022538654A patent/JPWO2022019046A1/ja active Pending
- 2021-06-25 WO PCT/JP2021/024156 patent/WO2022019046A1/ja not_active Ceased
- 2021-07-06 TW TW110124706A patent/TWI902842B/zh active
-
2026
- 2026-01-23 JP JP2026009778A patent/JP2026063359A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017007001A1 (ja) * | 2015-07-08 | 2017-01-12 | 日立化成株式会社 | 感光性エレメント、積層体、レジストパターンの形成方法及びプリント配線板の製造方法 |
| WO2020054075A1 (ja) * | 2018-09-14 | 2020-03-19 | 日立化成株式会社 | 転写型感光性フィルム、樹脂硬化膜の形成方法及び樹脂硬化膜付センサ基板の製造方法 |
| WO2020105457A1 (ja) * | 2018-11-20 | 2020-05-28 | 富士フイルム株式会社 | 転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI902842B (zh) | 2025-11-01 |
| KR20230041976A (ko) | 2023-03-27 |
| KR102870994B1 (ko) | 2025-10-16 |
| JP2026063359A (ja) | 2026-04-10 |
| TW202206944A (zh) | 2022-02-16 |
| CN115867864A (zh) | 2023-03-28 |
| WO2022019046A1 (ja) | 2022-01-27 |
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