TWI895961B - 異常檢測裝置及異常檢測方法 - Google Patents

異常檢測裝置及異常檢測方法

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Publication number
TWI895961B
TWI895961B TW113103436A TW113103436A TWI895961B TW I895961 B TWI895961 B TW I895961B TW 113103436 A TW113103436 A TW 113103436A TW 113103436 A TW113103436 A TW 113103436A TW I895961 B TWI895961 B TW I895961B
Authority
TW
Taiwan
Prior art keywords
processing
abnormality detection
unit
abnormality
evaluation value
Prior art date
Application number
TW113103436A
Other languages
English (en)
Chinese (zh)
Other versions
TW202435111A (zh
Inventor
森靖英
普拉尚特庫馬爾 夏爾馬
濱本真生
大森健史
Original Assignee
日商日立全球先端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日立全球先端科技股份有限公司 filed Critical 日商日立全球先端科技股份有限公司
Publication of TW202435111A publication Critical patent/TW202435111A/zh
Application granted granted Critical
Publication of TWI895961B publication Critical patent/TWI895961B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N5/00—Computing arrangements using knowledge-based models
    • G06N5/02—Knowledge representation; Symbolic representation
    • G06N5/022—Knowledge engineering; Knowledge acquisition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • Data Mining & Analysis (AREA)
  • Computing Systems (AREA)
  • Evolutionary Computation (AREA)
  • Mathematical Physics (AREA)
  • Artificial Intelligence (AREA)
  • Automation & Control Theory (AREA)
  • Computational Linguistics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Medical Informatics (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Drying Of Semiconductors (AREA)
  • Testing And Monitoring For Control Systems (AREA)
TW113103436A 2023-02-21 2024-01-30 異常檢測裝置及異常檢測方法 TWI895961B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2023/006212 2023-02-21
PCT/JP2023/006212 WO2024176347A1 (ja) 2023-02-21 2023-02-21 異常検出装置及び異常検出方法

Publications (2)

Publication Number Publication Date
TW202435111A TW202435111A (zh) 2024-09-01
TWI895961B true TWI895961B (zh) 2025-09-01

Family

ID=92500381

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113103436A TWI895961B (zh) 2023-02-21 2024-01-30 異常檢測裝置及異常檢測方法

Country Status (6)

Country Link
US (1) US20250364334A1 (https=)
JP (1) JP7625133B2 (https=)
KR (1) KR20240131986A (https=)
CN (1) CN118830054A (https=)
TW (1) TWI895961B (https=)
WO (1) WO2024176347A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102299044A (zh) * 2010-06-25 2011-12-28 台湾积体电路制造股份有限公司 工艺控制系统及其实现方法
TWI425329B (zh) * 2009-06-30 2014-02-01 東京威力科創股份有限公司 An abnormality detection system, an abnormality detection method, a memory medium, and a substrate processing apparatus
TWI678602B (zh) * 2017-07-14 2019-12-01 日商東芝股份有限公司 異常檢測裝置、異常檢測方法以及電腦可讀取記錄媒體
JP2020181959A (ja) * 2019-04-26 2020-11-05 東京エレクトロン株式会社 学習方法、管理装置および管理プログラム
CN114819242A (zh) * 2021-01-28 2022-07-29 联华电子股份有限公司 考虑整体特征与局部特征的半导体工艺预测方法与装置
TWI780764B (zh) * 2020-06-15 2022-10-11 日商日立全球先端科技股份有限公司 裝置診斷裝置、裝置診斷方法、電漿處理裝置及半導體裝置製造系統

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005051269A (ja) * 2004-10-12 2005-02-24 Hitachi Ltd 半導体処理装置
JP2009054843A (ja) * 2007-08-28 2009-03-12 Omron Corp プロセス異常検出装置および方法並びにプログラム
JP6778666B2 (ja) 2017-08-24 2020-11-04 株式会社日立製作所 探索装置及び探索方法
JP7290484B2 (ja) * 2019-06-24 2023-06-13 東京エレクトロンデバイス株式会社 異常検知装置、異常検知システム、及び異常検知方法
JP7452990B2 (ja) * 2019-11-29 2024-03-19 東京エレクトロン株式会社 異常検知装置、異常検知方法及び異常検知プログラム
US12222690B2 (en) * 2021-07-08 2025-02-11 Hitachi High-Tech Corporation Process recipe search apparatus, etching recipe search method and semiconductor device manufacturing system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425329B (zh) * 2009-06-30 2014-02-01 東京威力科創股份有限公司 An abnormality detection system, an abnormality detection method, a memory medium, and a substrate processing apparatus
CN102299044A (zh) * 2010-06-25 2011-12-28 台湾积体电路制造股份有限公司 工艺控制系统及其实现方法
TWI678602B (zh) * 2017-07-14 2019-12-01 日商東芝股份有限公司 異常檢測裝置、異常檢測方法以及電腦可讀取記錄媒體
JP2020181959A (ja) * 2019-04-26 2020-11-05 東京エレクトロン株式会社 学習方法、管理装置および管理プログラム
TWI780764B (zh) * 2020-06-15 2022-10-11 日商日立全球先端科技股份有限公司 裝置診斷裝置、裝置診斷方法、電漿處理裝置及半導體裝置製造系統
CN114819242A (zh) * 2021-01-28 2022-07-29 联华电子股份有限公司 考虑整体特征与局部特征的半导体工艺预测方法与装置

Also Published As

Publication number Publication date
KR20240131986A (ko) 2024-09-02
JP7625133B2 (ja) 2025-01-31
CN118830054A (zh) 2024-10-22
US20250364334A1 (en) 2025-11-27
WO2024176347A1 (ja) 2024-08-29
JPWO2024176347A1 (https=) 2024-08-29
TW202435111A (zh) 2024-09-01

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