CN118830054A - 异常检测装置以及异常检测方法 - Google Patents

异常检测装置以及异常检测方法 Download PDF

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Publication number
CN118830054A
CN118830054A CN202380013027.1A CN202380013027A CN118830054A CN 118830054 A CN118830054 A CN 118830054A CN 202380013027 A CN202380013027 A CN 202380013027A CN 118830054 A CN118830054 A CN 118830054A
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CN
China
Prior art keywords
processing
abnormality detection
unit
abnormality
result
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380013027.1A
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English (en)
Chinese (zh)
Inventor
森靖英
普拉桑特·库玛·夏尔玛
滨本真生
大森健史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
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Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Publication of CN118830054A publication Critical patent/CN118830054A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N5/00—Computing arrangements using knowledge-based models
    • G06N5/02—Knowledge representation; Symbolic representation
    • G06N5/022—Knowledge engineering; Knowledge acquisition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • Data Mining & Analysis (AREA)
  • Computing Systems (AREA)
  • Evolutionary Computation (AREA)
  • Mathematical Physics (AREA)
  • Artificial Intelligence (AREA)
  • Automation & Control Theory (AREA)
  • Computational Linguistics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Medical Informatics (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Drying Of Semiconductors (AREA)
  • Testing And Monitoring For Control Systems (AREA)
CN202380013027.1A 2023-02-21 2023-02-21 异常检测装置以及异常检测方法 Pending CN118830054A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/006212 WO2024176347A1 (ja) 2023-02-21 2023-02-21 異常検出装置及び異常検出方法

Publications (1)

Publication Number Publication Date
CN118830054A true CN118830054A (zh) 2024-10-22

Family

ID=92500381

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380013027.1A Pending CN118830054A (zh) 2023-02-21 2023-02-21 异常检测装置以及异常检测方法

Country Status (6)

Country Link
US (1) US20250364334A1 (https=)
JP (1) JP7625133B2 (https=)
KR (1) KR20240131986A (https=)
CN (1) CN118830054A (https=)
TW (1) TWI895961B (https=)
WO (1) WO2024176347A1 (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005051269A (ja) * 2004-10-12 2005-02-24 Hitachi Ltd 半導体処理装置
JP2009054843A (ja) * 2007-08-28 2009-03-12 Omron Corp プロセス異常検出装置および方法並びにプログラム
JP5363213B2 (ja) * 2009-06-30 2013-12-11 東京エレクトロン株式会社 異常検出システム、異常検出方法、記憶媒体及び基板処理装置
US8406912B2 (en) * 2010-06-25 2013-03-26 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for data mining and feature tracking for fab-wide prediction and control
JP6824121B2 (ja) * 2017-07-14 2021-02-03 株式会社東芝 状態検知装置、状態検知方法及びプログラム
JP6778666B2 (ja) 2017-08-24 2020-11-04 株式会社日立製作所 探索装置及び探索方法
JP2020181959A (ja) * 2019-04-26 2020-11-05 東京エレクトロン株式会社 学習方法、管理装置および管理プログラム
JP7290484B2 (ja) * 2019-06-24 2023-06-13 東京エレクトロンデバイス株式会社 異常検知装置、異常検知システム、及び異常検知方法
JP7452990B2 (ja) * 2019-11-29 2024-03-19 東京エレクトロン株式会社 異常検知装置、異常検知方法及び異常検知プログラム
JPWO2021255784A1 (https=) * 2020-06-15 2021-12-23
CN114819242B (zh) * 2021-01-28 2025-05-09 联华电子股份有限公司 考虑整体特征与局部特征的半导体工艺预测方法与装置
US12222690B2 (en) * 2021-07-08 2025-02-11 Hitachi High-Tech Corporation Process recipe search apparatus, etching recipe search method and semiconductor device manufacturing system

Also Published As

Publication number Publication date
KR20240131986A (ko) 2024-09-02
JP7625133B2 (ja) 2025-01-31
US20250364334A1 (en) 2025-11-27
TWI895961B (zh) 2025-09-01
WO2024176347A1 (ja) 2024-08-29
JPWO2024176347A1 (https=) 2024-08-29
TW202435111A (zh) 2024-09-01

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