TWI881174B - 氮化硼粉末、及氮化硼粉末之製造方法 - Google Patents

氮化硼粉末、及氮化硼粉末之製造方法 Download PDF

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Publication number
TWI881174B
TWI881174B TW110136135A TW110136135A TWI881174B TW I881174 B TWI881174 B TW I881174B TW 110136135 A TW110136135 A TW 110136135A TW 110136135 A TW110136135 A TW 110136135A TW I881174 B TWI881174 B TW I881174B
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TW
Taiwan
Prior art keywords
boron nitride
nitride powder
powder
particles
less
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TW110136135A
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English (en)
Chinese (zh)
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TW202216585A (zh
Inventor
竹田豪
塩月宏幸
田中孝明
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日商電化股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C01B21/0648—After-treatment, e.g. grinding, purification
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/50—Agglomerated particles
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/42—Magnetic properties
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/80—Compositional purity

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Products (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW110136135A 2020-09-30 2021-09-29 氮化硼粉末、及氮化硼粉末之製造方法 TWI881174B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020165644 2020-09-30
JP2020-165644 2020-09-30

Publications (2)

Publication Number Publication Date
TW202216585A TW202216585A (zh) 2022-05-01
TWI881174B true TWI881174B (zh) 2025-04-21

Family

ID=80951628

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110136135A TWI881174B (zh) 2020-09-30 2021-09-29 氮化硼粉末、及氮化硼粉末之製造方法

Country Status (5)

Country Link
US (1) US20230357007A1 (https=)
JP (2) JPWO2022071227A1 (https=)
KR (1) KR102871805B1 (https=)
TW (1) TWI881174B (https=)
WO (1) WO2022071227A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202506541A (zh) * 2023-04-27 2025-02-16 日商德山股份有限公司 六方晶氮化硼粉末的製造方法及六方晶氮化硼粉末

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0676624A (ja) * 1992-08-31 1994-03-18 Shin Etsu Chem Co Ltd 電気絶縁性部材
TW201536672A (zh) * 2014-02-12 2015-10-01 Denki Kagaku Kogyo Kk 氮化硼微粒子及其製造方法
TW201711954A (zh) * 2015-06-17 2017-04-01 聖戈本歐洲研習中心 以氮化硼為底的聚集體之粉末
JP2018108970A (ja) * 2017-01-05 2018-07-12 デンカ株式会社 六方晶窒化ホウ素粉末及び化粧料
JP2019218254A (ja) * 2018-06-22 2019-12-26 株式会社トクヤマ 六方晶窒化ホウ素粉末及びその製造方法
WO2020032060A1 (ja) * 2018-08-07 2020-02-13 デンカ株式会社 六方晶窒化ホウ素粉末、及び六方晶窒化ホウ素粉末の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130011317A1 (en) 2009-03-19 2013-01-10 Emanual Prilutsky Method for the preparation of boron nitride powder
CN102574684B (zh) * 2009-10-09 2015-04-29 水岛合金铁株式会社 六方氮化硼粉末及其制备方法
JP6109466B2 (ja) 2011-02-25 2017-04-05 水島合金鉄株式会社 化粧料用の六方晶窒化ホウ素粉末およびその製造方法
JP6822836B2 (ja) 2016-12-28 2021-01-27 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
KR102619752B1 (ko) * 2017-10-13 2023-12-29 덴카 주식회사 질화붕소 분말, 그 제조 방법 및 그것을 사용한 방열 부재
JP7069485B2 (ja) 2017-12-27 2022-05-18 昭和電工株式会社 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材
CN111566048B (zh) * 2018-01-26 2023-05-09 电化株式会社 非晶质二氧化硅粉末及其制造方法、用途
JP7165070B2 (ja) 2018-04-02 2022-11-02 株式会社トクヤマ 六方晶窒化ホウ素粉末およびその製造方法
CN114728790B (zh) * 2019-12-19 2024-10-18 株式会社德山 六方氮化硼粉末及其制造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0676624A (ja) * 1992-08-31 1994-03-18 Shin Etsu Chem Co Ltd 電気絶縁性部材
TW201536672A (zh) * 2014-02-12 2015-10-01 Denki Kagaku Kogyo Kk 氮化硼微粒子及其製造方法
TW201711954A (zh) * 2015-06-17 2017-04-01 聖戈本歐洲研習中心 以氮化硼為底的聚集體之粉末
JP2018108970A (ja) * 2017-01-05 2018-07-12 デンカ株式会社 六方晶窒化ホウ素粉末及び化粧料
JP2019218254A (ja) * 2018-06-22 2019-12-26 株式会社トクヤマ 六方晶窒化ホウ素粉末及びその製造方法
WO2020032060A1 (ja) * 2018-08-07 2020-02-13 デンカ株式会社 六方晶窒化ホウ素粉末、及び六方晶窒化ホウ素粉末の製造方法

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Publication number Publication date
KR102871805B1 (ko) 2025-10-15
JPWO2022071227A1 (https=) 2022-04-07
JP2023058634A (ja) 2023-04-25
KR20230074740A (ko) 2023-05-31
TW202216585A (zh) 2022-05-01
JP7458523B2 (ja) 2024-03-29
WO2022071227A1 (ja) 2022-04-07
US20230357007A1 (en) 2023-11-09

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