TWI865774B - Conductive terminal - Google Patents
Conductive terminal Download PDFInfo
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- TWI865774B TWI865774B TW110115809A TW110115809A TWI865774B TW I865774 B TWI865774 B TW I865774B TW 110115809 A TW110115809 A TW 110115809A TW 110115809 A TW110115809 A TW 110115809A TW I865774 B TWI865774 B TW I865774B
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- platinum
- plating layer
- layer
- conductive terminal
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- 238000007747 plating Methods 0.000 claims abstract description 113
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 109
- 229910052751 metal Inorganic materials 0.000 claims abstract description 55
- 239000002184 metal Substances 0.000 claims abstract description 55
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 54
- 230000007797 corrosion Effects 0.000 claims abstract description 25
- 238000005260 corrosion Methods 0.000 claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 239000010949 copper Substances 0.000 claims abstract description 24
- 239000010410 layer Substances 0.000 claims description 144
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 43
- 238000000576 coating method Methods 0.000 claims description 39
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 39
- 229910052737 gold Inorganic materials 0.000 claims description 39
- 239000010931 gold Substances 0.000 claims description 39
- 239000011248 coating agent Substances 0.000 claims description 36
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical group [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 28
- 229910052759 nickel Inorganic materials 0.000 claims description 22
- 239000011247 coating layer Substances 0.000 claims description 18
- 229910052763 palladium Inorganic materials 0.000 claims description 14
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 abstract description 9
- 239000000126 substance Substances 0.000 abstract description 2
- 230000013011 mating Effects 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 19
- 229910052709 silver Inorganic materials 0.000 description 19
- 239000004332 silver Substances 0.000 description 19
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- 229910000629 Rh alloy Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052703 rhodium Inorganic materials 0.000 description 3
- 239000010948 rhodium Substances 0.000 description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 3
- 229910001080 W alloy Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001260 Pt alloy Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910021607 Silver chloride Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
本發明有關一種導電端子，尤其涉及一種抗電解腐蝕能力更強的導電端子。 The present invention relates to a conductive terminal, and more particularly to a conductive terminal with stronger resistance to electrolytic corrosion.
在習知技術中，中國發明專利第CN110829080A號揭示了一種導電端子，其表面電鍍有金屬鍍層，金屬鍍層包括自導電端子表面開始依次電鍍有鍍鎳層、鍍金層、第一銠合金鍍層、鍍金層、第一耐腐蝕層、鍍金層、第二銠合金鍍層及鍍金層。在上述專利中採用了兩層銠合金鍍層的技術，該技術不僅生產成本昂貴，而且技術複雜，且銠在地殼中的含量極低，故現在急需一種新的材料來取代銠。 In the prior art, Chinese invention patent No. CN110829080A discloses a conductive terminal, the surface of which is electroplated with a metal coating, which includes a nickel coating, a gold coating, a first rhodium alloy coating, a gold coating, a first corrosion-resistant layer, a gold coating, a second rhodium alloy coating and a gold coating. The above patent adopts a two-layer rhodium alloy coating technology, which is not only expensive to produce, but also complex in technology, and the content of rhodium in the earth's crust is extremely low, so a new material is urgently needed to replace rhodium.
在習知技術中，中國發明專利第CN110739569A號揭示了一種電接觸端子，其結構包括基底、鎳層、鎳鎢合金層或鈀層、金合金層及鉑層。該技術方案係由鎳鎢合金層或鈀層與鉑層的結合，其抗電解腐蝕效果不好，影響導電端子的使用壽命。 In the prior art, Chinese invention patent No. CN110739569A discloses an electrical contact terminal, whose structure includes a substrate, a nickel layer, a nickel-tungsten alloy layer or a palladium layer, a gold alloy layer and a platinum layer. This technical solution is a combination of a nickel-tungsten alloy layer or a palladium layer and a platinum layer, which has poor anti-electrolytic corrosion effect, affecting the service life of the conductive terminal.
是以，確有必要提供一種改進的導電端子，以克服上述缺陷。 Therefore, it is necessary to provide an improved conductive terminal to overcome the above defects.
本發明所要達成之目的係提供一種抗電解腐蝕能力更強的導電端子。 The purpose of the present invention is to provide a conductive terminal with stronger resistance to electrolytic corrosion.
為解決上述問題，本發明可採用如下技術方案：一種導電端子，其由金屬銅板製成，所述導電端子包括用來與一對接連接器對接的接觸區域， 所述接觸區域在金屬銅板表面電鍍形成有金屬鍍層；所述金屬鍍層至少包括第一鉑鍍層、第二鉑鍍層以及複數層耐腐蝕層。 To solve the above problems, the present invention can adopt the following technical solutions: a conductive terminal, which is made of a metal copper plate, and the conductive terminal includes a contact area for connecting with a pair of connectors. The contact area is electroplated on the surface of the metal copper plate to form a metal plating layer; the metal plating layer includes at least a first platinum plating layer, a second platinum plating layer and a plurality of corrosion-resistant layers.
與先前技術相比，本發明具有如下有益效果：本發明藉在導電端子的表面電鍍至少兩層鉑鍍層，從而可以提高導電端子的抗電解腐蝕及化學腐蝕，提升了導電端子的性能。 Compared with the prior art, the present invention has the following beneficial effects: the present invention can improve the resistance of the conductive terminal to electrolytic corrosion and chemical corrosion by electroplating at least two layers of platinum on the surface of the conductive terminal, thereby improving the performance of the conductive terminal.
1、2、3、4:金屬鍍層 1, 2, 3, 4: Metal coating
11、21、31、41:金屬銅板 11, 21, 31, 41: Metal copper plate
12、22、32、42:鎳鍍層 12, 22, 32, 42: Nickel plating layer
13、23、33、43:金鍍層 13, 23, 33, 43: Gold coating
14、25、36、45:銀鍍層/鈀鎳鍍層 14, 25, 36, 45: Silver coating/Palladium nickel coating
15:鉑鍍層 15: Platinum coating
24、34、44:第一鉑鍍層 24, 34, 44: First plating layer
26、35、46:第二鉑鍍層 26, 35, 46: Second platinum coating layer
37、47:第三鉑鍍層 37, 47: The third platinum coating layer
48:第四鉑鍍層 48: Fourth platinum coating layer
第一圖係本發明第一實施方式導電端子的金屬鍍層結構示意圖；第二圖係本發明第二實施方式導電端子的金屬鍍層結構示意圖；第三圖係本發明第三實施方式導電端子的金屬鍍層結構示意圖；以及第四圖係本發明第四實施方式導電端子的金屬鍍層結構示意圖。 The first figure is a schematic diagram of the metal plating structure of the conductive terminal of the first embodiment of the present invention; the second figure is a schematic diagram of the metal plating structure of the conductive terminal of the second embodiment of the present invention; the third figure is a schematic diagram of the metal plating structure of the conductive terminal of the third embodiment of the present invention; and the fourth figure is a schematic diagram of the metal plating structure of the conductive terminal of the fourth embodiment of the present invention.
請參照第一圖所示，為本發明的第一實施方式，一種導電端子(未圖示)，其用於USB Type-C電連接器，該導電端子由金屬銅板11製成，所述導電端子包括用來與一對接連接器(未圖示)對接的接觸區域。所述接觸區域在金屬銅板11表面電鍍形成有金屬鍍層1，金屬鍍層1自金屬銅板11表面開始依次有：鎳鍍層12、金鍍層13、銀鍍層14、金鍍層13、鉑鍍層15及金鍍層13。在本實施方式中，金屬鍍層1中電鍍有一層鉑鍍層15，其厚度為0.5-1μm；金屬鍍層1中電鍍有一層銀鍍層14，其厚度為2-4μm；金屬鍍層1中電鍍有三層金鍍層13，三層金鍍層13的總厚度為0.1-0.25μm。採用鉑鍍層15與銀鍍層14相配合以使導電端子的抗電解腐蝕性能更優。在本發明中，還可以將銀鍍層14替換為鈀合金鍍層，鈀合金鍍層採用鈀鎳合金，藉此設置，達到的效果更佳。
Please refer to the first figure, which is a first embodiment of the present invention, a conductive terminal (not shown), which is used for a USB Type-C electrical connector, and the conductive terminal is made of a
在不同的電鍍層之間電鍍一層金鍍層13，係由於在不同的電鍍層之間存在一定的內應力，內應力影響了不同鍍層之間的粘附力，由於金具有較
好的延展性，可以緩衝或減小電鍍層之間的內應力，防止電鍍層出現裂縫。
A
同時，在本發明中，採用鉑鍍層和銀鍍層或者鈀鎳鍍層以替代其他貴金屬鍍層，在達到相同效果甚至優於其他貴金屬的效果的同時，還可以節省生產成本。 At the same time, in the present invention, platinum plating and silver plating or palladium nickel plating are used to replace other precious metal plating, which can achieve the same effect or even better than other precious metal effects while saving production costs.
請參照第二圖所示，為本發明的第二實施方式，一種導電端子(未圖示)，其由金屬銅板21製成，導電端子包括用來與一對接連接器(未圖示)對接的接觸區域，所述接觸區域在金屬銅板21表面電鍍形成有金屬鍍層2，金屬鍍層2自金屬銅板21表面開始依次電鍍有：鎳鍍層22、金鍍層23、第一鉑鍍層24、金鍍層23、銀鍍層或者鈀鎳鍍層25、金鍍層23、第二鉑鍍層26及金鍍層23。在本實施方式中，金屬鍍層2中含有四層金鍍層23，四層所述金鍍層的厚度總和為0.1-0.25μm。金屬鍍層2中電鍍有一層銀鍍層25，其厚度為2-4μm。第一鉑鍍層24和第二鉑鍍層26厚度之和為0.5-1μm，實驗證明，儘管兩層鉑鍍層(包括第一、第二鉑鍍層)的厚度之和等於一層鉑鍍層15的厚度，然鍍有第一、第二鉑鍍層24、26的兩層鉑鍍層的導電端子的抗電解腐蝕性能優於只鍍有一層鉑鍍層15的。具體講係因為中間層的填補，使得金屬鍍層中的各層之間保持的更加緻密，起到互相填補作用，同時阻隔了外部氯離子進入鎳鍍層進而對其腐蝕；就算氯離子突破了最外層鉑金屬，進入中間層銀鍍層或鈀鎳鍍層，氯離子會再與銀層反應，行成更大AgCl結晶來封閉原來的腐蝕通道，是故腐蝕通道需重新尋找，同時，內部底層增加鉑鍍層，可以阻隔金屬銅板21和鎳鍍層22中原子向外的熱遷移，從而可以降低電解腐蝕的速度，提高抗電解腐蝕的性能。
Please refer to the second figure, which is a second embodiment of the present invention, a conductive terminal (not shown), which is made of a
請參第三圖所示，為本發明的第三實施方式，一種導電端子(未圖示)，由金屬銅板31製成，所述導電端子包括用來與一對接連接器(未圖示)對接的接觸區域，所述接觸區域在金屬銅板31表面電鍍形成有金屬鍍層3，金屬鍍層3自金屬銅板31表面開始依次電鍍有：鎳鍍層32、金鍍層33、第一鉑鍍
層34、第二鉑鍍層35、金鍍層33、銀鍍層或者鈀鎳鍍層36、金鍍層33、第三鉑鍍層37及金鍍層33。在本實施方式中，金屬鍍層3包括三層鉑鍍層(包括第一、第二及第三鉑鍍層)，其總厚度為0.5-1μm。金屬鍍層3中電鍍有一層銀鍍層36，其厚度為2-4μm。金屬鍍層3中含有四層金鍍層33，四層所述金鍍層的厚度總和為0.1-0.25μm。當然，本發明不僅限於上述各鍍層的厚度，還可以根據需要進行適當調節。
Please refer to the third figure, which is a third embodiment of the present invention. A conductive terminal (not shown) is made of a
請參第四圖所示，為本發明的第四實施方式，一種導電端子(未圖示)，由金屬銅板41製成，所述導電端子包括用來與一對接連接器(未圖示)對接的接觸區域，所述接觸區域在金屬銅板41表面電鍍形成有金屬鍍層4，金屬鍍層4自金屬銅板41表面開始依次電鍍有：鎳鍍層42、金鍍層43、第一鉑鍍層44、金鍍層43、銀鍍層或者鈀鎳鍍層45、金鍍層43、第二鉑鍍層46、金鍍層43、銀鍍層或者鈀鎳鍍層45、金鍍層43、第三鉑鍍層47、金鍍層43、銀鍍層或者鈀鎳鍍層45及第四鉑鍍層48。在本實施方式中，採用多層鉑鍍層(包括第一、第二、第三及第四鉑鍍層)及多層銀鍍層的結構，導電端子抗電解腐蝕的效果更優。本發明的導電端子可用於USB Type-C電連接器，也可以用於其它類型連接器，導電端子的應用包括但不限於此。
Please refer to the fourth figure, which is a fourth embodiment of the present invention. A conductive terminal (not shown) is made of a
綜上所述，本發明所述導電端子的有益效果為：本發明在所述導電端子表面鍍有銀鍍層或者鈀鎳鍍層和鉑鍍層，藉銀鍍層或者鈀鎳鍍層和鉑鍍層相配合，以使所述導電端子抗電解腐蝕性能更優，還可以降低所述導電端子的生產成本，使用地殼含量較高的貴金屬鉑和銀來代替含量低的銠釕金屬，更具有可持續性。本發明中，鈀合金指合金成分中有鈀元素的所有合金，且無關鈀元素在該合金中的比重；另外，鉑鍍層指純鉑鍍層或鉑合金鍍層。 In summary, the conductive terminal of the present invention has the following beneficial effects: the conductive terminal is plated with a silver plating layer or a palladium nickel plating layer and a platinum plating layer on its surface. The silver plating layer or the palladium nickel plating layer and the platinum plating layer cooperate to make the conductive terminal more resistant to electrolytic corrosion, and can also reduce the production cost of the conductive terminal. The noble metals platinum and silver with a high content in the earth's crust are used to replace the low content of rhodium and ruthenium metal, which is more sustainable. In the present invention, palladium alloy refers to all alloys with palladium in the alloy composition, and the proportion of palladium in the alloy is irrelevant; in addition, the platinum plating layer refers to a pure platinum plating layer or a platinum alloy plating layer.
以上所述僅為本發明的部分實施方式，不是全部的實施方式，本領域普通技術人員藉閱讀本發明說明書而對本發明技術方案採取的任何等效的變化，均為本發明的權利要求所涵蓋。 The above is only a partial implementation of the present invention, not all implementations. Any equivalent changes made to the technical solution of the present invention by ordinary technicians in this field after reading the specification of the present invention are covered by the claims of the present invention.
2:金屬鍍層 2:Metal coating
21:金屬銅板 21:Metal copper plate
22:鎳鍍層 22: Nickel plating
23:金鍍層 23: Gold plating
24:鉑鍍層 24: Platinum coating
25:銀鍍層/鈀合金鍍層 25: Silver coating/palladium alloy coating
26:鉑鍍層 26: Platinum coating
Claims (8)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010369353.4A CN111525314B (en) | 2020-05-05 | 2020-05-05 | Conductive terminal |
| CN202010369353.4 | 2020-05-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202211553A TW202211553A (en) | 2022-03-16 |
| TWI865774B true TWI865774B (en) | 2024-12-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110115809A TWI865774B (en) | 2020-05-05 | 2021-04-30 | Conductive terminal |
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| CN (1) | CN111525314B (en) |
| TW (1) | TWI865774B (en) |
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| CN112376094A (en) * | 2020-11-06 | 2021-02-19 | 东莞市川富电子有限公司 | Functional electroplating coating method for charging and discharging module block connecting terminal |
| CN113215570A (en) * | 2021-05-13 | 2021-08-06 | 东莞市川富电子有限公司 | Design method of electrolytic plating resistance of terminal |
| CN113789558B (en) * | 2021-09-28 | 2023-06-16 | 万明电镀智能科技(东莞)有限公司 | Plug-resistant non-porous nickel-based composite coating and preparation method thereof |
| CN114250494A (en) * | 2021-12-30 | 2022-03-29 | 东莞中探探针有限公司 | Easily-welded workpiece and production method thereof |
| CN114990653A (en) * | 2022-06-22 | 2022-09-02 | 深圳市中正天科技有限公司 | Plating structure and substrate plating method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1191392A (en) * | 1997-02-20 | 1998-08-26 | 三星航空产业株式会社 | Multi-layer plated lead frame |
| TWI466773B (en) * | 2012-06-27 | 2015-01-01 | Jx Nippon Mining & Metals Corp | Electronic material for electronic parts and method for manufacturing the same, use of its connector terminals, connectors and electronic parts |
| CN110829080A (en) * | 2019-10-30 | 2020-02-21 | 富士康(昆山)电脑接插件有限公司 | Conductive terminal |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1285915C (en) * | 2001-07-02 | 2006-11-22 | 日本发条株式会社 | Conductive contact |
| JP3795898B2 (en) * | 2003-06-20 | 2006-07-12 | アルプス電気株式会社 | Connected device |
| CN104218447B (en) * | 2013-05-31 | 2018-03-13 | 山东华光光电子股份有限公司 | A kind of semiconductor laser chip Ohm contact electrode and preparation method and application |
| US10568213B2 (en) * | 2014-07-31 | 2020-02-18 | Skyworks Solutions, Inc. | Multilayered transient liquid phase bonding |
| CN107250430A (en) * | 2016-02-16 | 2017-10-13 | 思力柯集团 | Product and method including laminated coating |
| CN208501124U (en) * | 2018-04-16 | 2019-02-15 | 东莞普瑞得五金塑胶制品有限公司 | A kind of anti-corrosion electroplating layer with silver alloy coating |
| CN209607940U (en) * | 2018-12-19 | 2019-11-08 | 东莞普瑞得五金塑胶制品有限公司 | A corrosion-resistant electroplating, terminal and electronic interface |
-
2020
- 2020-05-05 CN CN202010369353.4A patent/CN111525314B/en active Active
-
2021
- 2021-04-30 TW TW110115809A patent/TWI865774B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1191392A (en) * | 1997-02-20 | 1998-08-26 | 三星航空产业株式会社 | Multi-layer plated lead frame |
| TWI466773B (en) * | 2012-06-27 | 2015-01-01 | Jx Nippon Mining & Metals Corp | Electronic material for electronic parts and method for manufacturing the same, use of its connector terminals, connectors and electronic parts |
| US10530084B2 (en) * | 2012-06-27 | 2020-01-07 | Jx Nippon Mining & Metals Corporation | Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same |
| CN110829080A (en) * | 2019-10-30 | 2020-02-21 | 富士康(昆山)电脑接插件有限公司 | Conductive terminal |
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| CN111525314B (en) | 2023-06-20 |
| TW202211553A (en) | 2022-03-16 |
| CN111525314A (en) | 2020-08-11 |
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