TWI863993B - 半導體檢查方法及半導體檢查裝置 - Google Patents

半導體檢查方法及半導體檢查裝置 Download PDF

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Publication number
TWI863993B
TWI863993B TW109116147A TW109116147A TWI863993B TW I863993 B TWI863993 B TW I863993B TW 109116147 A TW109116147 A TW 109116147A TW 109116147 A TW109116147 A TW 109116147A TW I863993 B TWI863993 B TW I863993B
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Taiwan
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image
pattern image
pattern
aforementioned
semiconductor device
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TW109116147A
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English (en)
Chinese (zh)
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TW202101292A (zh
Inventor
竹嶋智親
樋口貴文
堀田和宏
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日商濱松赫德尼古斯股份有限公司
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/045—Combinations of networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/0464—Convolutional networks [CNN, ConvNet]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/09—Supervised learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T3/00—Geometric image transformations in the plane of the image
    • G06T3/40—Scaling of whole images or parts thereof, e.g. expanding or contracting
    • G06T3/4053—Scaling of whole images or parts thereof, e.g. expanding or contracting based on super-resolution, i.e. the output image resolution being higher than the sensor resolution
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/392—Floor-planning or layout, e.g. partitioning or placement
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Biophysics (AREA)
  • Software Systems (AREA)
  • Computational Linguistics (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Computing Systems (AREA)
  • Biomedical Technology (AREA)
  • Artificial Intelligence (AREA)
  • Mathematical Physics (AREA)
  • Data Mining & Analysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Quality & Reliability (AREA)
  • Computer Hardware Design (AREA)
  • Architecture (AREA)
  • Geometry (AREA)
  • Image Analysis (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW109116147A 2019-06-03 2020-05-15 半導體檢查方法及半導體檢查裝置 TWI863993B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019103831 2019-06-03
JP2019-103831 2019-06-03

Publications (2)

Publication Number Publication Date
TW202101292A TW202101292A (zh) 2021-01-01
TWI863993B true TWI863993B (zh) 2024-12-01

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TW109116147A TWI863993B (zh) 2019-06-03 2020-05-15 半導體檢查方法及半導體檢查裝置

Country Status (8)

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US (1) US12211199B2 (https=)
EP (1) EP3958210B1 (https=)
JP (1) JP7413376B2 (https=)
KR (1) KR20220016030A (https=)
CN (1) CN113966524A (https=)
SG (1) SG11202111977XA (https=)
TW (1) TWI863993B (https=)
WO (1) WO2020246150A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12340504B2 (en) * 2020-06-08 2025-06-24 Hamamatsu Photonics K.K. Semiconductor inspecting method and semiconductor inspecting device
US20220067525A1 (en) * 2020-08-25 2022-03-03 Nvidia Corporation Techniques for pruning neural networks
JP2022135215A (ja) 2021-03-05 2022-09-15 株式会社日立ハイテク 学習器の学習方法、及び画像生成システム
KR20250107055A (ko) * 2024-01-04 2025-07-11 삼성전자주식회사 반도체 패턴의 생성 방법 및 장치

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080298719A1 (en) * 2001-05-30 2008-12-04 Dcg Systems, Inc. Sub-resolution alignment of images
JP2009162718A (ja) * 2008-01-10 2009-07-23 Olympus Corp 基板検査装置および検査領域設定方法
US20170148226A1 (en) * 2015-11-19 2017-05-25 Kla-Tencor Corporation Generating simulated images from design information
US20170177997A1 (en) * 2015-12-22 2017-06-22 Applied Materials Israel Ltd. Method of deep learining-based examination of a semiconductor specimen and system thereof
US20170193680A1 (en) * 2016-01-04 2017-07-06 Kla-Tencor Corporation Generating high resolution images from low resolution images for semiconductor applications
US20170345140A1 (en) * 2016-05-25 2017-11-30 Kla-Tencor Corporation Generating simulated images from input images for semiconductor applications
TW201837458A (zh) * 2016-11-28 2018-10-16 美商克萊譚克公司 用於從低解析度檢測影像重建高解析度點擴散函數之系統及方法
JP2018195069A (ja) * 2017-05-17 2018-12-06 キヤノン株式会社 画像処理装置および画像処理方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104000655B (zh) * 2013-02-25 2018-02-16 西门子公司 用于腹腔镜外科手术的组合的表面重构和配准
JP2015098342A (ja) 2013-11-19 2015-05-28 株式会社エンプラス 密閉容器および密閉容器セット
CN105849882B (zh) 2013-12-26 2019-04-30 浜松光子学株式会社 图像处理方法、图像处理装置、图像处理程序及存储有图像处理程序的存储介质
DE112015006619T5 (de) * 2015-07-24 2018-05-09 Olympus Corporation Bildverarbeitungsgerät, Bildverarbeitungsverfahren und Programm
US10282833B2 (en) 2015-11-30 2019-05-07 Trustees Of Boston University Gate-level mapping of integrated circuits using multi-spectral imaging
US10282510B2 (en) 2017-04-07 2019-05-07 Fei Company Alignment of CAD data to images in high resolution optical fault analysis
US10733744B2 (en) * 2017-05-11 2020-08-04 Kla-Tencor Corp. Learning based approach for aligning images acquired with different modalities
CN107481188A (zh) * 2017-06-23 2017-12-15 珠海经济特区远宏科技有限公司 一种图像超分辨率重构方法
JP7002949B2 (ja) * 2018-01-22 2022-01-20 株式会社日立ハイテク 画像評価方法及び画像評価装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080298719A1 (en) * 2001-05-30 2008-12-04 Dcg Systems, Inc. Sub-resolution alignment of images
JP2009162718A (ja) * 2008-01-10 2009-07-23 Olympus Corp 基板検査装置および検査領域設定方法
US20170148226A1 (en) * 2015-11-19 2017-05-25 Kla-Tencor Corporation Generating simulated images from design information
US20170177997A1 (en) * 2015-12-22 2017-06-22 Applied Materials Israel Ltd. Method of deep learining-based examination of a semiconductor specimen and system thereof
US20170193680A1 (en) * 2016-01-04 2017-07-06 Kla-Tencor Corporation Generating high resolution images from low resolution images for semiconductor applications
US20170345140A1 (en) * 2016-05-25 2017-11-30 Kla-Tencor Corporation Generating simulated images from input images for semiconductor applications
TW201837458A (zh) * 2016-11-28 2018-10-16 美商克萊譚克公司 用於從低解析度檢測影像重建高解析度點擴散函數之系統及方法
JP2018195069A (ja) * 2017-05-17 2018-12-06 キヤノン株式会社 画像処理装置および画像処理方法

Also Published As

Publication number Publication date
EP3958210A1 (en) 2022-02-23
EP3958210A4 (en) 2023-05-03
JP7413376B2 (ja) 2024-01-15
US12211199B2 (en) 2025-01-28
WO2020246150A1 (ja) 2020-12-10
KR20220016030A (ko) 2022-02-08
CN113966524A (zh) 2022-01-21
EP3958210B1 (en) 2025-05-28
TW202101292A (zh) 2021-01-01
SG11202111977XA (en) 2021-11-29
JPWO2020246150A1 (https=) 2020-12-10
US20220301135A1 (en) 2022-09-22

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