TWI863481B - 切割－晶粒接合一體型薄膜之製造方法 - Google Patents

切割－晶粒接合一體型薄膜之製造方法 Download PDF

Info

Publication number
TWI863481B
TWI863481B TW112128988A TW112128988A TWI863481B TW I863481 B TWI863481 B TW I863481B TW 112128988 A TW112128988 A TW 112128988A TW 112128988 A TW112128988 A TW 112128988A TW I863481 B TWI863481 B TW I863481B
Authority
TW
Taiwan
Prior art keywords
meth
group
acrylic resin
adhesive
adhesive layer
Prior art date
Application number
TW112128988A
Other languages
English (en)
Chinese (zh)
Other versions
TW202413444A (zh
Inventor
田耕治
今井佑哉
丸野晃暉
佐佐木一博
Original Assignee
日商力森諾科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202413444A publication Critical patent/TW202413444A/zh
Application granted granted Critical
Publication of TWI863481B publication Critical patent/TWI863481B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04—Acids; Metal salts or ammonium salts thereof
    • C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
    • C08G18/622—Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
    • C08G18/6225—Polymers of esters of acrylic or methacrylic acid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2438/00—Living radical polymerisation
    • C08F2438/03—Use of a di- or tri-thiocarbonylthio compound, e.g. di- or tri-thioester, di- or tri-thiocarbamate, or a xanthate as chain transfer agent, e.g . Reversible Addition Fragmentation chain Transfer [RAFT] or Macromolecular Design via Interchange of Xanthates [MADIX]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polymerisation Methods In General (AREA)
TW112128988A 2022-08-03 2023-08-02 切割－晶粒接合一體型薄膜之製造方法 TWI863481B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022124248 2022-08-03
JP2022-124248 2022-08-03

Publications (2)

Publication Number Publication Date
TW202413444A TW202413444A (zh) 2024-04-01
TWI863481B true TWI863481B (zh) 2024-11-21

Family

ID=89848763

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112128988A TWI863481B (zh) 2022-08-03 2023-08-02 切割－晶粒接合一體型薄膜之製造方法

Country Status (5)

Country Link
JP (1) JPWO2024029315A1 (https=)
KR (1) KR20240151838A (https=)
CN (1) CN119013314A (https=)
TW (1) TWI863481B (https=)
WO (1) WO2024029315A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119144213B (zh) * 2024-11-18 2025-03-11 安徽中研电气有限责任公司 一种耐磨隔热涂料及其制备方法及应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017066372A (ja) * 2015-09-30 2017-04-06 日本合成化学工業株式会社 アクリル系樹脂、アクリル系粘着剤組成物、粘着シート

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005307097A (ja) * 2004-04-26 2005-11-04 Kaneka Corp マクロモノマー
JP2016145304A (ja) * 2015-02-09 2016-08-12 ユニマテック株式会社 重合性不飽和基を有する含フッ素２ブロック共重合体
US10825711B2 (en) * 2015-10-05 2020-11-03 Lintec Corporation Sheet for semiconductor processing
JP6747661B2 (ja) * 2015-12-28 2020-08-26 綜研化学株式会社 粘着剤用組成物、粘着剤層および粘着シート
CN111164738B (zh) * 2017-12-07 2023-03-28 琳得科株式会社 工件加工用片及已加工工件的制造方法
JP6539383B2 (ja) 2018-06-18 2019-07-03 積水化学工業株式会社 粘着テープ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017066372A (ja) * 2015-09-30 2017-04-06 日本合成化学工業株式会社 アクリル系樹脂、アクリル系粘着剤組成物、粘着シート

Also Published As

Publication number Publication date
KR20240151838A (ko) 2024-10-18
TW202413444A (zh) 2024-04-01
JPWO2024029315A1 (https=) 2024-02-08
WO2024029315A1 (ja) 2024-02-08
CN119013314A (zh) 2024-11-22

Similar Documents

Publication Publication Date Title
JP5513866B2 (ja) 電子部品加工用粘着シート
TWI666288B (zh) 晶圓保護用黏著薄片
KR20190059907A (ko) 반도체 가공용 점착 테이프 및 반도체 장치의 제조 방법
KR20100138979A (ko) 에너지선 경화형 중합체, 에너지선 경화형 점착제 조성물, 점착 시트 및 반도체 웨이퍼의 가공방법
WO2009110426A1 (ja) 粘着シート
KR20110131772A (ko) 자외선 경화성 점착수지 조성물 및 이를 포함하는 다이싱용 또는 표면보호용 점착 테이프
JP7547499B2 (ja) 粘着テープ及び加工方法
JP6618038B2 (ja) 粘着剤組成物
JP2000044890A (ja) 再剥離型粘着剤組成物
TWI754679B (zh) 半導體加工用黏著片
TWI863481B (zh) 切割－晶粒接合一體型薄膜之製造方法
JP6129541B2 (ja) ダイシングシート
JP3516384B2 (ja) 再剥離型粘着剤組成物
TW201918537A (zh) 半導體加工用黏著帶以及半導體裝置的製造方法
JP7726414B2 (ja) 粘着剤組成物、及び粘着シート
JP7723601B2 (ja) シリコーン系グラフト共重合体、粘着剤組成物、粘着テープ、及び、半導体装置の製造方法
TW202506742A (zh) 改質（甲基）丙烯酸樹脂之製造方法
TW202506766A (zh) 改質（甲基）丙烯酸系樹脂、黏著劑組成物，及黏著薄片
TWI922983B (zh) 黏著劑組成物及黏著薄片
KR101138796B1 (ko) 아크릴계 점착 수지 조성물 및 이를 포함하는 광경화형 점착 조성물
JP4017132B2 (ja) 再剥離型粘着剤組成物
TWI905380B (zh) 半導體加工用黏著薄片及半導體裝置的製造方法
TW202432775A (zh) （甲基）丙烯酸樹脂
TW202436563A (zh) 黏著劑組成物，及黏著薄片
CN121406249A (zh) 加强膜、带有加强膜的器件及其制造方法