TWI863260B - 半導體雷射光源裝置 - Google Patents
半導體雷射光源裝置 Download PDFInfo
- Publication number
- TWI863260B TWI863260B TW112116961A TW112116961A TWI863260B TW I863260 B TWI863260 B TW I863260B TW 112116961 A TW112116961 A TW 112116961A TW 112116961 A TW112116961 A TW 112116961A TW I863260 B TWI863260 B TW I863260B
- Authority
- TW
- Taiwan
- Prior art keywords
- aforementioned
- dielectric substrate
- metal base
- source device
- light source
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 91
- 239000000758 substrate Substances 0.000 claims abstract description 105
- 229910052751 metal Inorganic materials 0.000 claims abstract description 72
- 239000002184 metal Substances 0.000 claims abstract description 72
- 238000003466 welding Methods 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000010521 absorption reaction Methods 0.000 claims description 5
- 230000005684 electric field Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000001465 metallisation Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000007789 sealing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0265—Intensity modulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0231—Stems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/022332 WO2023233589A1 (ja) | 2022-06-01 | 2022-06-01 | 半導体レーザ光源装置 |
| WOPCT/JP2022/022332 | 2022-06-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202349809A TW202349809A (zh) | 2023-12-16 |
| TWI863260B true TWI863260B (zh) | 2024-11-21 |
Family
ID=89026083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112116961A TWI863260B (zh) | 2022-06-01 | 2023-05-08 | 半導體雷射光源裝置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250096524A1 (https=) |
| JP (1) | JP7635886B2 (https=) |
| CN (1) | CN119213643A (https=) |
| TW (1) | TWI863260B (https=) |
| WO (1) | WO2023233589A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117178445A (zh) * | 2021-04-27 | 2023-12-05 | 三菱电机株式会社 | 半导体激光光源装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112189285A (zh) * | 2018-05-29 | 2021-01-05 | 三菱电机株式会社 | 光模块以及光发送器 |
| JP6984801B1 (ja) * | 2021-04-27 | 2021-12-22 | 三菱電機株式会社 | 半導体レーザ光源装置 |
| TW202205569A (zh) * | 2020-03-24 | 2022-02-01 | 日商新光電氣工業股份有限公司 | 半導體封裝用管座以及半導體封裝 |
| JP7020590B1 (ja) * | 2020-12-08 | 2022-02-16 | 三菱電機株式会社 | レーザ光源装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4586337B2 (ja) * | 2002-08-26 | 2010-11-24 | 住友電気工業株式会社 | 半導体レーザモジュールおよび半導体レーザ装置 |
| JP4578164B2 (ja) * | 2004-07-12 | 2010-11-10 | 日本オプネクスト株式会社 | 光モジュール |
| JP2011108937A (ja) * | 2009-11-19 | 2011-06-02 | Nippon Telegr & Teleph Corp <Ntt> | Ｔｏ−ｃａｎ型ｔｏｓａモジュール |
| JP7419188B2 (ja) * | 2019-11-01 | 2024-01-22 | ＣＩＧ Ｐｈｏｔｏｎｉｃｓ Ｊａｐａｎ株式会社 | 光サブアッセンブリ |
-
2022
- 2022-06-01 WO PCT/JP2022/022332 patent/WO2023233589A1/ja not_active Ceased
- 2022-06-01 CN CN202280090369.9A patent/CN119213643A/zh active Pending
- 2022-06-01 JP JP2024524078A patent/JP7635886B2/ja active Active
- 2022-06-01 US US18/727,643 patent/US20250096524A1/en active Pending
-
2023
- 2023-05-08 TW TW112116961A patent/TWI863260B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112189285A (zh) * | 2018-05-29 | 2021-01-05 | 三菱电机株式会社 | 光模块以及光发送器 |
| TW202205569A (zh) * | 2020-03-24 | 2022-02-01 | 日商新光電氣工業股份有限公司 | 半導體封裝用管座以及半導體封裝 |
| JP7020590B1 (ja) * | 2020-12-08 | 2022-02-16 | 三菱電機株式会社 | レーザ光源装置 |
| JP6984801B1 (ja) * | 2021-04-27 | 2021-12-22 | 三菱電機株式会社 | 半導体レーザ光源装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7635886B2 (ja) | 2025-02-26 |
| US20250096524A1 (en) | 2025-03-20 |
| TW202349809A (zh) | 2023-12-16 |
| WO2023233589A1 (ja) | 2023-12-07 |
| JPWO2023233589A1 (https=) | 2023-12-07 |
| CN119213643A (zh) | 2024-12-27 |
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