TWI849680B - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

The present invention relates to a substrate processing apparatus and a substrate processing method. The substrate processing method includes: acquiring information on a substrate; selecting either one of liquid change and concentration adjustment; performing, when the liquid change is selected in the selecting, first processing liquid adjustment by which at least a portion of a processing liquid in a processing tank is discharged from the processing tank and sulfuric acid and hydrogen peroxide are supplied to the processing tank if the processing liquid in the processing tank does not satisfy a specific condition; performing, when the concentration adjustment is selected in the selecting, second processing liquid adjustment by which the concentration of the processing liquid in the processing tank is adjusted while the processing liquid in the processing tank is circulated via a pipe connected to the processing tank; and immersing the substrate in the processing liquid in the processing tank while the processing liquid in the processing tank that has been adjusted in the first processing liquid adjustment or the second processing liquid adjustment is circulated via a pipe connected to the processing tank.

Description

Substrate processing device and substrate processing method

The present invention relates to a substrate processing device and a substrate processing method.

On the surface of the processed substrate, such as a semiconductor wafer (hereinafter referred to as a wafer), substances produced during the manufacturing steps of the semiconductor device may sometimes adhere to it. Since these substances may reduce the characteristics of the semiconductor device, a variety of chemical solutions are used to clean the wafer surface in order to remove these substances.

SPM liquid is used to clean the surface of wafers. SPM liquid is a mixture of sulfuric acid and hydrogen peroxide. In addition to stripping the anti-etching agent remaining on the surface of the wafer and removing the residue of the substrate after the anti-etching agent is ashed, SPM liquid is also used as a liquid for oxidation treatment of the substrate after the component is separated. SPM liquid can be used not only in single-wafer processing equipment that rotates the wafer held on a rotating platform while supplying liquid to its surface, but also in batch processing equipment that immerses multiple wafers in a processing tank filled with liquid and cleans them at the same time.

When using SPM liquid to process wafers in a batch substrate processing device, generally, for example, dozens of wafers are immersed in SPM liquid heated to 100℃~130℃, and the wafers are taken out after a specific time, and then the next wafer is immersed repeatedly to continuously process multiple wafers. In this continuous processing, since the SPM liquid in the processing tank will adhere to the surface of the wafer, part of it will be taken out of the processing tank and the liquid level will decrease, so sulfuric acid and hydrogen peroxide water must be added to the SPM liquid at a specific time sequence.

Furthermore, hydrogen peroxide is known to be a relatively unstable substance. Since hydrogen peroxide decomposes over time to produce water, even if sulfuric acid and hydrogen peroxide are replenished in accordance with the decrease in the liquid level, the sulfuric acid concentration in the SPM liquid will decrease over time. When the sulfuric acid concentration decreases, the ability to remove contaminants decreases, so the processing of the wafers in the processing tank is stopped periodically and the SPM liquid in the processing tank is replaced in full, resulting in a decrease in processing efficiency and/or an increase in the consumption of the chemical solution, and an increase in the cost of the chemical solution. Therefore, in batch substrate processing equipment, research is being conducted to suppress the decrease in the ability to remove contaminants (Patent Document 1).

In the substrate processing device of Patent Document 1, sulfuric acid is added to the circulation flow path at the downstream side of the heater. Patent Document 1 states that by adding sulfuric acid to the circulation flow path at the downstream side of the heater, hydrogen peroxide and peroxodic acid, which are believed to be helpful in effectively removing pollutants, are prevented from being directly heated and decomposed.

[Prior Art Literature] [Patent Literature]

[Patent document 1] Japanese Patent Publication No. 2011-114305

In the substrate processing apparatus of Patent Document 1, the SPM concentration of the processing tank is adjusted to be fixed regardless of the type of substrate. However, depending on the type of substrate, there are cases where the substrate can be properly processed even if the SPM concentration of the processing tank is not strictly adjusted. In the substrate processing apparatus of Patent Document 1, sulfuric acid and hydrogen peroxide are sometimes used unnecessarily compared to the amount of sulfuric acid and hydrogen peroxide required to process the substrate.

The present invention is completed in view of the above-mentioned problems, and its purpose is to provide a substrate processing device and substrate processing method that can avoid excessive use of sulfuric acid and hydrogen peroxide.

According to one aspect of the present invention, a substrate processing method processes the substrate by immersing the substrate in the processing liquid containing sulfuric acid and hydrogen peroxide in a processing tank storing the processing liquid. The substrate processing method includes the following steps: before immersing the substrate in the processing liquid in the processing tank, obtaining substrate information showing information related to the substrate; based on the substrate information, selecting either a liquid replacement step or a concentration adjustment step as a processing liquid adjustment step for adjusting the processing liquid; a first processing liquid adjustment step, in which, when the liquid replacement step is selected in the selection step, when the processing liquid in the processing tank does not meet a specific condition, at least a portion of the processing liquid in the processing tank is discharged from the processing tank, and the processing tank is supplied with a concentration adjustment step. The processing liquid in the processing tank is adjusted by adding sulfuric acid and hydrogen peroxide; the second processing liquid adjustment step, when the concentration adjustment step is selected in the above selection step, the concentration of the processing liquid in the processing tank is adjusted while the processing liquid in the processing tank is circulated through the pipe connected to the processing tank; and the processing liquid in the processing tank adjusted in the first processing liquid adjustment step or the second processing liquid adjustment step is circulated through the pipe connected to the processing tank, while the substrate is immersed in the processing liquid in the processing tank.

In a certain implementation form, in the step of obtaining the substrate information, when the substrate information shows that the anti-etching agent of the substrate has been subjected to ashing treatment, the liquid replacement step is selected in the selection step; in the step of obtaining the substrate information, when the substrate information shows that the anti-etching agent of the substrate has been subjected to ion implantation and the substrate has been subjected to device separation, the concentration adjustment step is selected in the selection step.

In a certain embodiment, in the first treatment liquid adjustment step, when the treatment liquid in the treatment tank meets specific conditions, the treatment liquid in the treatment tank is not discharged.

In a certain embodiment, the first processing liquid adjustment step includes the following steps: before immersing the substrate, the amount of the processing liquid discharged from the processing tank is set based on the time elapsed since the substrate was immersed in the processing liquid in the processing tank.

In a certain embodiment, the second treatment liquid adjustment step includes the following steps: adjusting the hydrogen peroxide concentration of the treatment liquid based on the measurement result of the concentration sensor for measuring the concentration of the treatment liquid in the treatment tank.

In a certain embodiment, the second treatment liquid adjustment step includes the following steps: supplying hydrogen peroxide to the treatment tank in a manner of increasing the hydrogen peroxide concentration of the treatment liquid in the treatment tank before immersing the substrate in the treatment liquid in the treatment tank; and reducing the hydrogen peroxide concentration of the treatment liquid in the treatment tank after immersing the substrate in the treatment liquid in the treatment tank.

According to another aspect of the present invention, a substrate processing device comprises: a processing tank storing a processing liquid including sulfuric acid and hydrogen peroxide; a circulation section having a pipe for circulating the processing liquid in the processing tank; a drain section discharging the processing liquid in the processing tank; a processing liquid supply section supplying sulfuric acid and hydrogen peroxide to the processing tank; a substrate holding section holding a substrate and immersing the substrate in the processing liquid in the processing tank; and a control section controlling the circulation section, the drain section, the processing liquid supply section and the substrate holding section. The control unit selects, before immersing the substrate in the treatment liquid in the treatment tank, either a liquid replacement step or a concentration adjustment step as a treatment liquid adjustment step for adjusting the treatment liquid based on substrate information that displays information related to the substrate; when the liquid replacement step is selected, the control unit controls the liquid discharge unit and the treatment liquid supply unit in a manner of performing the first treatment liquid adjustment step, and when the treatment liquid in the treatment tank does not meet a specific condition, the first treatment liquid adjustment step discharges at least a portion of the treatment liquid in the treatment tank from the treatment tank, and causes the treatment liquid supply unit to supply the sulfuric acid and the hydrogen peroxide solution to the treatment tank. Adjust the above-mentioned treatment liquid in the above-mentioned treatment tank; when the above-mentioned concentration adjustment step is selected, the above-mentioned control unit controls the above-mentioned circulation unit and the above-mentioned treatment liquid supply unit in a manner of performing the second treatment liquid adjustment step, and the above-mentioned second treatment liquid adjustment step circulates the above-mentioned treatment liquid in the above-mentioned treatment tank through the above-mentioned piping of the above-mentioned circulation unit while adjusting the concentration of the above-mentioned treatment liquid; the above-mentioned control unit controls the above-mentioned circulation unit and the above-mentioned substrate holding unit in a manner of immersing the above-mentioned substrate in the above-mentioned treatment liquid in the above-mentioned treatment tank while circulating the above-mentioned treatment liquid in the above-mentioned first treatment liquid adjustment step or the above-mentioned second treatment liquid adjustment step through the above-mentioned piping of the above-mentioned circulation unit.

According to the present invention, excessive use of sulfuric acid and hydrogen peroxide can be avoided.

10: Substrate processing system

20: Investment Department

22: Loading platform

30: Storage Department

40: Handover organization

50: Removal section

52: Loading platform

100: Substrate processing device

100A: 1st substrate processing device

100B: Second substrate processing device

100C: The third substrate processing device

110: Processing tank

112: Inner groove

114: External groove

116: Cover

116a,116b: Door opening

120: Substrate holding part

122: Main body plate

124: Holding rod

126: Lifting unit

130: Treatment fluid supply unit

132: Sulfuric acid supply department

132a: Piping

132b: Valve

134: Hydrogen peroxide supply unit

134a: Piping

134b: Valve

140: Circulation Department

141: Piping

142: Pump

143:Filter

144: Heater

145: Adjustment valve

146,152,154,155: Valve

148: Circulating fluid supply pipe

150: Drainage section

151: Drain pipe

153: Drain pipe

162: Concentration sensor

180: Control device

182: Control Department

182a: Substrate information acquisition unit

182b: Treatment liquid adjustment step selection section

182c: Processing fluid information acquisition department

184: Memory Department

BU: Buffer Unit

CTC: 1st conveying device

L: Treatment liquid

Lhc,Lhp,Lsc,Lsp:Line

Pc: Concentration adjustment period

Pp:Liquid replacement period

S10, S10A, S20, S30, S40, S50A, S50B: Steps

S102, S104, S106, S108, S110, S112, S114, S116, S118, S120: Steps

S202, S204, S206, S208, S210, S212, S214, S216, S218, S220: Steps

Th, Ts, Tsb: target concentration

Thd, Tsd: lower limit

Thu,Tsu: Upper limit

Tob1, Tob2: Target concentration

W: Substrate

WTR: Second transport device

Figures 1(a) and (b) are schematic three-dimensional diagrams of the substrate processing device of this embodiment.

Figure 2 is a schematic diagram of the substrate processing device of this embodiment.

FIG3 is a schematic block diagram of the substrate processing device of this embodiment.

FIG4 is a flow chart of the substrate processing method of this embodiment.

Figure 5 (a) to (c) are schematic diagrams used to illustrate the liquid replacement step in the substrate processing method of this embodiment.

FIG6 is a graph showing the time variation of the sulfuric acid concentration and hydrogen peroxide concentration in the processing tank during the liquid replacement step in the substrate processing method of this embodiment.

FIG. 7 is a flow chart for selecting the liquid replacement step in the substrate processing method of this embodiment.

Figure 8 (a) to (c) are schematic diagrams showing the concentration adjustment step in the substrate processing method of this embodiment.

FIG9 is a graph showing the time variation of sulfuric acid concentration and hydrogen peroxide concentration in the processing tank during concentration adjustment in the substrate processing method of this embodiment.

Figures 10(a) and (b) are graphs showing the time variation of the sulfuric acid concentration and hydrogen peroxide concentration in the processing tank in the substrate processing method of this embodiment.

FIG11 is a flow chart for selecting the concentration adjustment step in the substrate processing method of this embodiment.

FIG12 is a flow chart of the substrate processing method of this embodiment.

FIG. 13 is a schematic diagram of a substrate processing system having a substrate processing device according to this embodiment.

The following is a description of the implementation of the substrate processing device and substrate processing method of the present invention with reference to the drawings. In addition, the same reference symbols are used for the same or equivalent parts in the drawings without repeated description. In addition, in the description of this case, mutually orthogonal X-axis, Y-axis and Z-axis are sometimes recorded to facilitate the understanding of the invention. Typically, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

Referring to FIG. 1 , an embodiment of the substrate processing apparatus 100 of the present invention is described. FIG. 1( a ) and FIG. 1( b ) are schematic three-dimensional diagrams of the substrate processing apparatus 100 of the present embodiment. FIG. 1( a ) shows the substrate processing apparatus 100 before the substrate W is put into the processing tank 110. FIG. 1( b ) shows the substrate processing apparatus 100 after the substrate W is put into the processing tank 110.

The substrate processing device 100 processes the substrate W. The substrate processing device 100 processes the substrate W by performing at least one of etching, surface treatment, oxidation treatment, property imparting, film formation, removal, and cleaning of at least a portion of the film.

The substrate W is in the shape of a relatively thin plate. Typically, the substrate W is in the shape of a relatively thin, roughly circular plate. The substrate W includes, for example, semiconductor wafers, substrates for liquid crystal display devices, substrates for plasma displays, substrates for field emission displays (FED), substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells.

The substrate processing device 100 is a batch type substrate processing device. The substrate processing device 100 processes a plurality of substrates W at a time. Typically, the substrate processing device 100 processes a plurality of substrates W in groups. For example, one group includes 25 substrates W.

As shown in FIG. 1( a ), the substrate processing device 100 includes a processing tank 110 , a substrate holding portion 120 , and a processing liquid supply portion 130 . The processing tank 110 stores a processing liquid for processing a substrate W. The processing liquid is a mixed liquid including sulfuric acid and hydrogen peroxide. The processing liquid supply portion 130 supplies the processing liquid to the processing tank 110 . For example, the processing liquid supply portion 130 supplies sulfuric acid and hydrogen peroxide to the processing tank 110 , respectively. In one example, sulfuric acid and hydrogen peroxide are mixed in the processing tank 110 to produce a processing liquid. However, the sulfuric acid and hydrogen peroxide supplied from the processing liquid supply portion 130 may also be mixed before reaching the processing tank 110 to produce a processing liquid.

The substrate holding part 120 holds the substrate W. The normal direction of the main surface of the substrate W held by the substrate holding part 120 is parallel to the Y direction. The plurality of substrates W are arranged in a row along the Y direction. The plurality of substrates W are arranged approximately parallel to the horizontal direction. In addition, the normal of each of the plurality of substrates W extends in the Y direction, and each of the plurality of substrates W extends approximately parallel to the X direction and the Z direction.

Typically, the substrate holding part 120 collectively holds a plurality of substrates W. Here, the substrate holding part 120 holds the substrates W arranged in a row along the Y direction. The substrate holding part 120 moves the substrates W while holding the substrates W. For example, the substrate holding part 120 moves vertically upward or vertically downward along the vertical direction while holding the substrates W.

Specifically, the substrate holding part 120 includes a lifting part. The substrate holding part 120 moves directly upward or downward while holding a plurality of substrates W. By moving the substrate holding part 120 directly downward, the plurality of substrates W held by the substrate holding part 120 are immersed in the processing liquid L stored in the processing tank 110.

In FIG. 1(a), the substrate holding portion 120 is located above the processing tank 110. The substrate holding portion 120 is lowered directly downward (in the Z direction) while holding a plurality of substrates W. In this way, the plurality of substrates W are placed into the processing tank 110.

As shown in FIG. 1(b), when the substrate holding part 120 descends to the processing tank 110, a plurality of substrates W are immersed in the processing liquid in the processing tank 110. The substrate holding part 120 immerses a plurality of substrates W neatly arranged at specific intervals in the processing liquid stored in the processing tank 110.

The processing tank 110 has a double tank structure. The processing tank 110 has an inner tank 112 and an outer tank 114. The outer tank 114 surrounds the inner tank 112. Both the inner tank 112 and the outer tank 114 have an upper opening that opens upward.

The inner tank 112 and the outer tank 114 each store a processing liquid. A plurality of substrates W are placed in the inner tank 112. Specifically, the plurality of substrates W held in the substrate holding portion 120 are placed in the inner tank 112. By placing the plurality of substrates W in the inner tank 112, they are immersed in the processing liquid in the inner tank 112.

The substrate holding portion 120 includes a body plate 122 and a holding rod 124. The body plate 122 is a plate extending in the vertical direction (Z direction). The holding rod 124 extends from one main surface of the body plate 122 in the horizontal direction (X direction). In FIG. 1(a) and FIG. 1(b), three holding rods 124 extend from one main surface of the body plate 122 in the horizontal direction. A plurality of substrates W are arranged neatly at specific intervals, and are held in an upright position (vertical position) by a plurality of holding rods 124 abutting against the lower edge of each substrate W.

The substrate holding portion 120 may further include a lifting unit 126. The lifting unit 126 lifts the body plate 122 between a lower position (the position shown in FIG. 1(b)) where the plurality of substrates W held on the holding rod 124 are located in the processing tank 110 and an upper position (the position shown in FIG. 1(a)) where the plurality of substrates W held on the holding rod 124 are located above the processing tank 110. Therefore, by using the lifting unit 126 to move the body plate 122 to the lower position, the plurality of substrates W held on the holding rod 124 are immersed in the processing liquid.

The plurality of substrates W are held by a plurality of holding rods 124. Specifically, the plurality of substrates W are held in an upright position (vertical position) by the plurality of holding rods 124 by abutting the lower edge of each substrate W against the plurality of holding rods 124. More specifically, the plurality of substrates W held by the substrate holding portion 120 are neatly arranged at intervals along the Y direction. Therefore, the plurality of substrates W are arranged in a row along the Y direction. In addition, each of the plurality of substrates W is held in the substrate holding portion 120 in a position substantially parallel to the XZ plane.

The lifting unit 126 lifts and lowers the main body plate 122 and the holding rod 124. The lifting unit 126 lifts and lowers the main body plate 122 and the holding rod 124, and the main body plate 122 and the holding rod 124 move directly upward or downward while holding a plurality of substrates W. The lifting unit 126 has a driving source and a lifting mechanism, and the driving source drives the lifting mechanism to raise and lower the main body plate 122 and the holding rod 124. The driving source includes, for example, a motor. The lifting mechanism includes, for example, a gear/pinion mechanism or a ball screw.

More specifically, the lifting unit 126 lifts the substrate holding portion 120 between the processing position (the position shown in FIG. 1(b)) and the retreat position (the position shown in FIG. 1(a)). As shown in FIG. 1(b), when the substrate holding portion 120 moves to the processing position by descending directly downward (in the Z direction) while holding a plurality of substrates W, the plurality of substrates W are put into the inner tank 112. Specifically, the plurality of substrates W held by the substrate holding portion 120 are moved into the inner tank 112. As a result, the plurality of substrates W are immersed in the processing liquid in the inner tank 112 and processed by the processing liquid. On the other hand, as shown in FIG. 1(a), when the substrate holding portion 120 moves to the retracted position, the plurality of substrates W held in the substrate holding portion 120 move to the top of the inner tank 112 and are lifted from the processing liquid.

Next, referring to FIG. 1 and FIG. 2 , the substrate processing device 100 of the present embodiment is described. FIG. 2 is a schematic diagram of the substrate processing device 100 of the present embodiment.

As shown in FIG. 2 , the substrate processing device 100 includes a processing tank 110, a substrate holding portion 120, a processing liquid supply portion 130, a circulation portion 140, a liquid discharge portion 150, and a control device 180. The control device 180 controls the substrate holding portion 120, the processing liquid supply portion 130, the circulation portion 140, and the liquid discharge portion 150.

The processing tank 110 stores the processing liquid L. The substrate holding part 120 holds the substrate W. The substrate holding part 120 includes a lifting part. The substrate holding part 120 can be used to immerse a plurality of substrates W in the processing liquid L stored in the processing tank 110 at the same time.

The treatment liquid supply unit 130 supplies the treatment liquid to the treatment tank 110. The treatment liquid supply unit 130 has a sulfuric acid supply unit 132 and a hydrogen peroxide supply unit 134. The sulfuric acid supply unit 132 supplies sulfuric acid to the treatment tank 110. The hydrogen peroxide supply unit 134 supplies hydrogen peroxide water to the treatment tank 110.

As described above, hydrogen peroxide decomposes over time to produce water. Therefore, in order to maintain a constant concentration of the treatment solution in the treatment tank 110, the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide solution to the treatment tank 110. Typically, the amount of sulfuric acid supplied per unit time from the sulfuric acid supply unit 132 is greater than the amount of hydrogen peroxide solution supplied per unit time from the hydrogen peroxide supply unit 134. For example, the ratio of the supply amount (volume) of sulfuric acid to the supply amount (volume) of hydrogen peroxide solution is 5:1~10:1.

The circulation unit 140 circulates the processing liquid L stored in the processing tank 110. When the circulation unit 140 circulates the processing liquid L in the processing tank 110, the processing liquid is heated to a specific temperature. In addition, when the circulation unit 140 circulates the processing liquid L in the processing tank 110, the processing liquid can be filtered to remove impurities from the processing liquid.

The drain section 150 discharges the treatment liquid L stored in the treatment tank 110. The treatment liquid in the treatment tank 110 can be discharged through the drain section 150. In addition, the drain section 150 discharges the treatment liquid L stored in the treatment tank 110, and the sulfuric acid supply section 132 and the hydrogen peroxide supply section 134 supply sulfuric acid and hydrogen peroxide to the treatment tank 110, thereby replacing the treatment liquid L stored in the treatment tank 110 with a new treatment liquid.

As described above, the treatment tank 110 stores the treatment liquid L. The treatment liquid L is a mixed liquid of sulfuric acid and hydrogen peroxide. In the treatment liquid L, the concentration (mass concentration) of sulfuric acid is greater than 80% and less than 90%, and the concentration (mass concentration) of hydrogen peroxide is greater than 0.8% and less than 2.0%.

Here, the processing tank 110 is a double tank structure. The processing tank 110 has an inner tank 112 and an outer tank 114. The inner tank 112 and the outer tank 114 each have an upper opening that opens upward. The inner tank 112 is configured to store the processing liquid L and accommodate a plurality of substrates W. The outer tank 114 is disposed on the outer side of the upper opening of the inner tank 112. The height of the upper edge of the outer tank 114 is higher than the height of the upper edge of the inner tank 112.

The processing tank 110 further has a cover 116. The cover 116 can be opened and closed relative to the upper opening of the inner tank 112. By closing the cover 116, the cover 116 can seal the upper opening of the inner tank 112.

The cover 116 has an opening portion 116a and an opening portion 116b. The opening portion 116a is located on one side of the upper opening of the inner tank 112 in the X direction. The opening portion 116a is arranged near the upper edge of the inner tank 112 and can be opened and closed relative to the upper opening of the inner tank 112. The opening portion 116b is located on the other side of the upper opening of the inner tank 112 in the X direction. The opening portion 116b is arranged near the upper edge of the inner tank 112 and can be opened and closed relative to the upper opening of the inner tank 112. By closing the opening portion 116a and the opening portion 116b to cover the upper opening of the inner tank 112, the inner tank 112 of the processing tank 110 can be closed.

The substrate holding part 120 holds the substrate W. The substrate holding part 120 moves directly upward or downward while holding the substrate W. As the substrate holding part 120 moves directly downward, the substrate W held by the substrate holding part 120 is immersed in the processing liquid L stored in the inner tank 112.

The substrate holding portion 120 includes a body plate 122 and a holding rod 124. The body plate 122 is a plate extending in the vertical direction (Z direction). The holding rod 124 extends from one main surface of the body plate 122 in the horizontal direction (X direction). Here, three holding rods 124 extend from one main surface of the body plate 122 in the Y direction. When a plurality of substrates W are arranged in the near-front direction of the paper surface, a plurality of holding rods 124 abut against the lower edge of each substrate W, and the plurality of substrates W are held in an upright position (vertical position).

The substrate holding part 120 may further include a lifting unit 126. The lifting unit 126 lifts the main plate 122 between a processing position (the position shown in FIG. 2 ) where the substrate W held in the substrate holding part 120 is located in the inner tank 112 and a retreat position (not shown) where the substrate W held in the substrate holding part 120 is located above the inner tank 112. Therefore, by using the lifting unit 126 to move the main plate 122 to the processing position, the plurality of substrates W held in the holding rod 124 are immersed in the processing liquid. In this way, the substrate W is processed.

The sulfuric acid supply unit 132 includes a pipe 132a and a valve 132b. Sulfuric acid is sprayed from one end of the pipe 132a to the treatment tank 110. The pipe 132a is connected to a sulfuric acid supply source. A valve 132b is arranged in the pipe 132a. The supply of sulfuric acid to the treatment tank 110 can be controlled by the valve 132b. When the valve 132b is opened by the control of the control device 180, the sulfuric acid is supplied to the treatment tank 110 through the pipe 132a. In the treatment tank 110, the sulfuric acid is mixed with the treatment liquid of the treatment tank 110.

For example, sulfuric acid sprayed from the pipe 132a is supplied to the inner tank 112. When the treatment liquid overflows from the upper edge of the inner tank 112, the overflowed treatment liquid is received and recovered by the outer tank 114. Here, sulfuric acid is sprayed into the inner tank 112. One end of the pipe 132a that supplies sulfuric acid from the sulfuric acid supply unit 132 to the inner tank 112 can be arranged in the inner tank 112.

The hydrogen peroxide supply unit 134 includes a pipe 134a and a valve 134b. Hydrogen peroxide is sprayed from one end of the pipe 134a to the treatment tank 110. The pipe 134a is connected to a hydrogen peroxide supply source. A valve 134b is arranged in the pipe 134a. The supply of hydrogen peroxide to the treatment tank 110 can be controlled by the valve 134b. When the valve 134b is opened by the control of the control device 180, the hydrogen peroxide passing through the pipe 134a is supplied to the treatment tank 110. In the treatment tank 110, the hydrogen peroxide is mixed with the treatment liquid of the treatment tank 110.

For example, the hydrogen peroxide sprayed from the pipe 134a is supplied to the inner tank 112. When the treatment liquid overflows from the upper edge of the inner tank 112, the overflowed treatment liquid is received by the outer tank 114 and recovered. Here, the hydrogen peroxide is sprayed into the inner tank 112. One end of the pipe 134a that supplies the hydrogen peroxide from the hydrogen peroxide supply part 134 to the inner tank 112 can be arranged in the inner tank 112.

The circulation section 140 includes a pipe 141, a pump 142, a filter 143, a heater 144, a regulating valve 145, a valve 146, and a circulating fluid supply pipe 148. The pump 142, the filter 143, the heater 144, the regulating valve 145, and the valve 146 are arranged in order from the upstream to the downstream of the pipe 141.

The pipe 141 guides the treatment liquid discharged from the treatment tank 110 back to the treatment tank 110. Specifically, the upstream end of the pipe 141 is located in the outer tank 114, and the downstream end of the pipe 141 is located in the inner tank 112. The downstream end of the pipe 141 is connected to the circulating liquid supply pipe 148 located in the inner tank 112.

The pump 142 transports the treatment liquid from the pipe 141 to the circulating liquid supply pipe 148. The filter 143 filters the treatment liquid flowing through the pipe 141. The filter 143 filters and removes foreign matter such as particles in the treatment liquid flowing through the pipe 141.

The heater 144 heats the processing liquid flowing through the pipe 141. The temperature of the processing liquid is adjusted by the heater 144. The heater 144 heats the processing liquid flowing through the pipe 141 and adjusts it to a processing temperature (for example, about 100°C to 120°C). The heater 144 can also heat the processing liquid and measure the temperature of the processing liquid. In this case, the heater 144 has a heating part and a temperature measuring part.

The adjusting valve 145 adjusts the opening of the piping 141 to adjust the flow rate of the treatment fluid supplied to the circulating fluid supply pipe 148. The adjusting valve 145 adjusts the flow rate of the treatment fluid. The adjusting valve 145 includes a valve body (not shown) having a valve seat disposed therein, a valve body that opens and closes the valve seat, and an actuator (not shown) that moves the valve body between an open position and a closed position. The same is true for other adjusting valves. The valve 146 opens and closes the piping 141. In addition, the adjusting valve 145 may be omitted. In this case, the flow rate of the treatment fluid supplied to the circulating fluid supply pipe 148 is adjusted by controlling the control pump 142.

The circulating liquid supply pipe 148 is arranged in the inner tank 112. Here, the circulating liquid supply pipe 148 is arranged at the bottom of the inner tank 112 of the treatment tank 110. The circulating liquid supply pipe 148 is arranged in the treatment liquid L stored in the inner tank 112. The circulating liquid supply pipe 148 supplies the inner tank 112 with the circulated treatment liquid.

The drain section 150 has a drain pipe 151, a valve 152, a drain pipe 153, a valve 154, and a valve 155. The processing liquid in the inner tank 112 is discharged through the drain pipe 151 and the valve 152. The processing liquid in the outer tank 114 is discharged through the drain pipe 153, the valve 154, and the valve 155.

The bottom wall of the inner tank 112 is connected to the drain pipe 151. A valve 152 is arranged in the drain pipe 151. The valve 152 is opened and closed by the control device 180. The valve 152 is opened, and thereby the treatment liquid stored in the inner tank 112 is discharged to the outside through the drain pipe 151. The discharged treatment liquid is transported to the drainage treatment device (not shown) for treatment.

The drain pipe 153 is connected to the pipe 141. Here, the drain pipe 153 is connected to the pipe 141 at a position downstream of the pump 142. In the pipe 141, a valve 154 is arranged downstream of the connection with the drain pipe 153. The valve 155 is located in the drain pipe 153. By opening the valve 154 and closing the valve 155, the treatment liquid in the treatment tank 110 can be returned to the treatment tank 110 through the pipe 141, and the treatment liquid in the treatment tank 110 can be circulated. In addition, by closing the valve 154 and opening the valve 155, the treatment liquid in the treatment tank 110 can be discharged through the pipe 141 and the drain pipe 153.

In addition, in FIG. 2, to avoid making the diagram too complicated, one adjusting valve 145 and one valve 146 are shown, but at least one of the adjusting valve 145 and the valve 146 may be provided in plural.

The control device 180 is constructed using a microcomputer, for example. The control device 180 has a computing unit such as a central processing unit (CPU), a fixed memory device, a memory unit such as a hard disk, and an input/output unit. The memory unit stores a program executed by the computing unit.

Next, referring to FIG. 1 to FIG. 3 , the implementation form of the substrate processing device 100 of the present invention is described. FIG. 3 is a schematic block diagram of the substrate processing device 100 of the present implementation form.

As shown in FIG. 3 , the control device 180 includes a control unit 182 and a memory unit 184. The control unit 182 controls the operation of each unit of the substrate processing device 100.

The control unit 182 includes a processor. The processor, for example, has a central processing unit (CPU). Alternatively, the processor may also have a general-purpose processor.

The memory unit 184 stores data and computer programs. The memory unit 184 includes a main memory device and an auxiliary memory device. The main memory device is, for example, a semiconductor memory. The auxiliary memory device is, for example, a semiconductor memory and/or a hard disk. The memory unit 184 may also include a removable medium. The processor of the control unit 182 executes the computer program stored in the memory unit 184 to execute the substrate processing method.

The control device 180 controls the substrate holding part 120, the sulfuric acid supply part 132, the hydrogen peroxide supply part 134, the circulation part 140 and the drainage part 150 according to the preset program. In detail, the control device 180 controls the actions of the lifting unit 126, the pump 142, the filter 143, the heater 144, etc. In addition, the control device 180 controls the opening and closing actions of the valve 132b, the valve 134b, the valve 146, the valve 152, the valve 154, and the valve 155. Furthermore, the control device 180 controls the opening adjustment action of the adjustment valve 145.

The substrate processing apparatus 100 has a concentration sensor 162. The concentration sensor 162 measures the concentration of sulfuric acid and hydrogen peroxide in the processing liquid in the processing tank 110.

For example, the concentration sensor 162 is installed in the processing tank 110. The concentration sensor 162 measures a value representing the specific gravity of the processing liquid stored in the processing tank 110. The concentration sensor 162 measures the back pressure of the processing tank 110.

For example, the front end of the concentration sensor 162 is arranged at a position at a specific depth from the treatment liquid surface of the treatment tank 110. In the concentration sensor 162, gas is supplied to the front end of the concentration sensor 162 to form bubbles in the treatment liquid of the treatment tank 110. In this way, the liquid pressure of the treatment liquid stored in the treatment tank 110 is detected as the gas pressure of the front end of the concentration sensor 162 arranged at a specific depth from the liquid surface of the treatment tank 110. As the gas, nitrogen is typically used. By pre-measuring the relationship between the gas pressure and the sulfuric acid concentration and hydrogen peroxide concentration of the treatment liquid, a comparison table showing the relationship between the gas pressure and the treatment liquid is prepared in advance, and the specific gravity of the treatment liquid can be measured based on the gas pressure of the bubbles formed by the gas.

Furthermore, the control unit 182 functions as a substrate information acquisition unit 182a and a processing liquid adjustment step selection unit 182b by executing a computer program stored in the memory unit 184. Therefore, the control unit 182 includes the substrate information acquisition unit 182a and the processing liquid adjustment step selection unit 182b.

The substrate information acquisition unit 182a acquires substrate information indicating information related to the substrate W before the substrate processing apparatus 100 processes the substrate W. The substrate information may also be displayed on the processing performed before the substrate W is moved into the substrate processing apparatus 100.

The processing liquid adjustment step selection unit 182b selects which of the liquid replacement step and the concentration adjustment step is to be performed as the processing liquid adjustment step for adjusting the processing liquid in the processing tank 110. The processing liquid adjustment step selection unit 182b selects either the liquid replacement step or the concentration adjustment step based on the substrate information. The liquid replacement step and the concentration adjustment step will be described later.

Furthermore, the control unit 182 functions as a processing liquid information acquisition unit 182c by executing a computer program stored in the memory unit 184. Therefore, the control unit 182 includes a processing liquid information acquisition unit 182c. The processing liquid information acquisition unit 182c acquires processing liquid information representing information related to the processing liquid in the processing tank 110. For example, the processing liquid information acquisition unit 182c acquires the processing liquid information based on the measurement result of the concentration sensor 162.

Next, referring to Figures 1 to 4, the substrate processing method of this embodiment is described. Figure 4 is a flow chart of the substrate processing method of this embodiment.

As shown in FIG. 4 , in step S10, substrate information indicating information related to the substrate processed by the substrate processing device 100 is obtained. For example, the substrate information acquisition unit 182a obtains the substrate information from the memory unit 184.

For example, the substrate information shows the processing performed on the substrate W before being carried into the substrate processing device 100. In one example, the substrate information shows that the anti-etching agent has been ashed before the substrate W is carried into the substrate processing device 100. Or, the substrate information shows that the anti-etching agent has been ion implanted before the substrate W is carried into the substrate processing device 100. Or, the substrate information shows that the substrate W is in a state before the device separation oxidation process is performed.

In step S20, a processing liquid adjustment step is selected. The control unit 182 selects either a liquid replacement step or a concentration adjustment step as the processing liquid adjustment step based on the substrate information. For example, the processing liquid adjustment step selection unit 182b selects either a liquid replacement step or a concentration adjustment step.

For example, when the substrate W is a substrate that can be properly processed even when the concentration range of the processing liquid required for the substrate to be properly processed as the processing object of the substrate processing device 100 is set relatively loosely, the control unit 182 selects the liquid replacement step as the processing liquid adjustment step. As an example, when the substrate is processed to remove residues from a substrate that has been subjected to an ashing treatment with an anti-etching agent, the substrate can be properly processed even when the concentration range of the processing liquid is set relatively loosely. Therefore, when the substrate is a substrate that has been subjected to an ashing treatment with an anti-etching agent, the control unit 182 selects the liquid replacement step.

On the other hand, when the substrate W is a substrate that cannot be properly processed unless the concentration range of the processing liquid required for properly processing the target substrate is set relatively narrow, the control unit 182 selects the concentration adjustment step as the processing liquid adjustment step. As an example, when the substrate W has an anti-etching agent that has been ion-implanted, the anti-etching agent cannot be properly removed or stripped unless the concentration range of the processing liquid is set relatively strictly. Therefore, when the substrate W is a substrate that has an anti-etching agent that has been ion-implanted, the control unit 182 selects the concentration adjustment step.

Or, when the substrate after component separation is subjected to oxidation treatment, the substrate cannot be properly treated unless the concentration range of the treatment solution is set relatively strictly. Therefore, when the substrate W is a substrate to be subjected to oxidation treatment after component separation, the control unit 182 selects the concentration adjustment step.

Thus, the control unit 182 selects either a liquid replacement step or a concentration adjustment step for the processing liquid in the processing tank 110 based on the substrate information. Typically, before the target substrate arrives at the substrate processing apparatus 100, the control unit 182 selects the processing liquid adjustment step based on the substrate information.

When the liquid replacement step is selected in step S20, the process proceeds to step S30. On the other hand, when the concentration adjustment step is selected in step S20, the process proceeds to step S40.

In step S30, a liquid replacement step is performed. The treatment liquid in the treatment tank 110 is adjusted by the liquid replacement step. In this specification, the adjustment of the treatment liquid when the liquid replacement step is selected is sometimes recorded as the first treatment liquid adjustment step.

In this case, it is determined whether the treatment liquid in the treatment tank 110 meets the benchmark. The benchmark can be set based on the sulfuric acid concentration and/or hydrogen peroxide concentration of the treatment liquid in the treatment tank 110.

Alternatively, the benchmark may be set based on the time since the treatment liquid in the treatment tank 110 was replaced. Alternatively, the benchmark may be set based on the number of substrates W processed after the treatment liquid in the treatment tank 110 was replaced. The benchmark may also be set based on the time since the previous substrate was immersed in the treatment liquid in the treatment tank 110.

When the treatment liquid in the treatment tank 110 meets the standard, the treatment liquid in the treatment tank 110 is not discharged. However, even in this case, in order to maintain the concentration of hydrogen peroxide for decomposition of hydrogen peroxide, the hydrogen peroxide supply unit 134 can continue to supply hydrogen peroxide to the treatment tank 110 at a fixed amount.

On the other hand, when the treatment liquid in the treatment tank 110 does not meet the standard, at least a portion of the treatment liquid in the treatment tank 110 is replaced. In this case, at least a portion of the treatment liquid in the treatment tank 110 is discharged, and on the other hand, the treatment liquid is supplied to the treatment tank 110.

When discharging the treatment liquid of the treatment tank 110, in one example, the treatment liquid of the outer tank 114 is discharged. In this case, the control unit 182 drives the pump 142, opens the valve 155 and closes the valve 154. In this way, the treatment liquid of the outer tank 114 can be discharged. In addition, the treatment liquid of the inner tank 112 is discharged. For example, the control unit 182 discharges the treatment liquid of the inner tank 112 by opening the valve 152.

In addition, a treatment liquid is supplied to the treatment tank 110. In this case, the treatment liquid supply unit 130 supplies the treatment liquid to the treatment tank 110. For example, the sulfuric acid supply unit 132 supplies sulfuric acid to the treatment tank 110. The hydrogen peroxide supply unit 134 supplies hydrogen peroxide to the treatment tank 110. In this way, the treatment liquid in the treatment tank 110 is adjusted. The sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide respectively in a ratio such that the treatment liquid containing sulfuric acid and hydrogen peroxide supplied to the treatment tank 110 has a specific concentration. In this case, the temperature of the treatment liquid rises by reacting with sulfuric acid and hydrogen peroxide.

In addition, in order to maintain the processing liquid at a specific temperature, the processing liquid can be heated while circulating by driving the pump 142 and the heater 144. In this case, the heater 144 heats the processing liquid as needed. For example, when the temperature of the processing liquid is lower than a specific temperature, the heater 144 heats the processing liquid in a manner of raising the temperature to a specific temperature. On the other hand, when the temperature of the processing liquid rises to a temperature higher than a specific temperature by reacting with sulfuric acid and hydrogen peroxide, the heater 144 stops heating the processing liquid in a manner of lowering the temperature to the processing liquid. Then, the processing proceeds to step S50A.

In step S50A, the substrate W is immersed in the processing liquid in the processing tank 110. Thereafter, the substrate W is taken out from the processing liquid in the processing tank 110. The substrate processing is terminated as above.

In step S40, a concentration adjustment step is performed. The treatment liquid in the treatment tank 110 is adjusted by the concentration adjustment step. In this specification, the adjustment of the treatment liquid when the concentration adjustment step is selected is sometimes described as the second treatment liquid adjustment step.

In this case, the concentration of the treatment solution in the treatment tank 110 is adjusted. For example, the concentration of hydrogen peroxide in the treatment solution in the treatment tank 110 is adjusted. In one example, the concentration of hydrogen peroxide in the treatment solution in the treatment tank 110 is increased.

Or, adjust the sulfuric acid concentration in the treatment solution of the treatment tank 110. In one example, increase the sulfuric acid concentration in the treatment solution of the treatment tank 110.

Typically, the treatment liquid supply unit 130 supplies the treatment liquid to the treatment tank 110. For example, the sulfuric acid supply unit 132 supplies sulfuric acid to the treatment tank 110. The hydrogen peroxide supply unit 134 supplies hydrogen peroxide to the treatment tank 110. The sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide, respectively, in a ratio such that the treatment liquid containing sulfuric acid and hydrogen peroxide supplied to the treatment tank 110 has a specific concentration.

For example, when the concentration of hydrogen peroxide in the treatment solution of the treatment tank 110 is increased, the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide in a manner that increases the ratio of hydrogen peroxide to increase the concentration of hydrogen peroxide in the treatment tank 110.

In this case, the processing liquid in the processing tank 110 is circulated. Here, in order to maintain the processing liquid at a specific temperature, the processing liquid can also be heated while circulating by driving the pump 142 and the heater 144.

The control unit 182 supplies sulfuric acid and hydrogen peroxide until the sulfuric acid concentration and/or hydrogen peroxide concentration measured by the concentration sensor 162 reaches a specific concentration. In addition, the control unit 182 supplies sulfuric acid and hydrogen peroxide in such a manner that the sulfuric acid concentration and/or hydrogen peroxide concentration measured by the concentration sensor 162 maintains a specific concentration. In this way, the control unit 182 can use the concentration sensor 162 to adjust the sulfuric acid concentration and/or hydrogen peroxide concentration by feedback control. In addition, the concentration adjustment is performed immediately before the substrate W is immersed in the processing tank 110. When the substrate W is not immersed in the processing tank 110 during the specific period, it is preferred not to perform the concentration adjustment. Then, the process proceeds to step S50B.

In step S50B, the substrate is immersed in the treatment solution whose hydrogen peroxide concentration has been adjusted. Thereafter, the substrate W is taken out from the treatment solution in the treatment tank 110. The substrate treatment is terminated as above.

According to the present embodiment, a substrate is processed by a processing liquid adjusted in different ways according to the substrate W. For example, in the case where the substrate to be processed in the substrate processing device 100 can also be processed by a processing liquid adjusted to a relatively loose concentration range, the processing liquid in the processing tank 110 is adjusted in the liquid replacement step. Thereby, the processing liquid in the processing tank 110 is replaced with liquid only when the benchmark is not met. Therefore, the replacement frequency of the processing liquid in the processing tank 110 can be suppressed, and the cost of the processing liquid can be reduced. In addition, in the case where the substrate to be processed in the substrate processing device 100 needs to be processed with a processing liquid adjusted to a relatively strict concentration range, the processing liquid in the processing tank 110 is adjusted in the concentration adjustment step. In this way, it is possible to avoid maintaining the processing liquid in the processing tank 110 in a state after adjusting the concentration when no substrate is moved in, and to properly process the moved in substrate. Therefore, according to this embodiment, it is possible to avoid excessive use of sulfuric acid and hydrogen peroxide according to the substrate W.

Next, referring to FIG. 1 to FIG. 5 , the liquid replacement step of the substrate processing device 100 of this embodiment is described. FIG. 5(a) to FIG. 5(c) are schematic diagrams for describing the liquid replacement step in the substrate processing method of this embodiment.

As shown in FIG. 5(a), the processing liquid is stored in the processing tank 110. Here, a fixed amount of processing liquid is stored in each of the inner tank 112 and the outer tank 114. As described above, the processing liquid overflowing from the inner tank 112 flows into the outer tank 114. The fixed amount of the inner tank 112 is set to the maximum amount of the container of the inner tank 112.

The fixed amount of the outer tank 114 is set to be less than the maximum amount of the container of the outer tank 114. When more than the fixed amount of processing liquid flows into the outer tank 114, the control unit 182 drives the pump 142 to make the processing liquid in the outer tank 114 flow out to the outside.

As shown in FIG. 5( b ), the treatment liquid in the treatment tank 110 is discharged. For example, when discharging the treatment liquid in the inner tank 112 , the control unit 182 opens the valve 152 to discharge the treatment liquid in the inner tank 112 .

Furthermore, when discharging the treatment liquid from the outer tank 114, the control unit 182 drives the pump 142, closes the valve 154 and opens the valve 155 to discharge the treatment liquid from the outer tank 114.

The amount of the treatment liquid discharged from the treatment tank 110 can also be set according to the time that has passed since the last liquid replacement. For example, when the time that has passed since the last liquid replacement is relatively long, the amount of the treatment liquid discharged from the treatment tank 110 is set to be relatively large. Conversely, when the time that has passed since the last liquid replacement is relatively short, the amount of the treatment liquid discharged from the treatment tank 110 is set to be relatively small.

Alternatively, the amount of the processing liquid discharged from the processing tank 110 may also be set according to the time that has passed since the last immersion of the substrate. When the time that has passed since the last immersion of the substrate is relatively long, the amount of the processing liquid discharged from the processing tank 110 is set to be relatively large. Conversely, when the time that has passed since the last immersion of the substrate is relatively short, the amount of the processing liquid discharged from the processing tank 110 is set to be relatively small.

Typically, when the processing liquid is discharged from the processing tank 110, the processing liquid in the processing tank 110 is not circulated. However, the processing liquid in the processing tank 110 may be circulated while the processing liquid is discharged from the processing tank 110.

As shown in FIG. 5(c), the treatment liquid supply unit 130 supplies the treatment liquid to the treatment tank 110. Specifically, the sulfuric acid supply unit 132 supplies sulfuric acid to the treatment tank 110. In addition, the hydrogen peroxide supply unit 134 supplies hydrogen peroxide water to the treatment tank 110. In this case, the control unit 182 controls the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 in such a manner that the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide water to the treatment tank 110, respectively.

After the treatment liquid is supplied to the treatment tank 110, the treatment liquid in the treatment tank 110 circulates through the circulation unit 140. For example, the control unit 182 drives the pump 142 to open the regulating valve 145 and the valve 146, and opens the valve 154 and closes the valve 155, so that the treatment liquid in the treatment tank 110 circulates from the treatment tank 110 to the treatment tank 110 through the piping 141. In addition, the control unit 182 drives the heater 144 to heat the treatment liquid flowing through the piping 141.

At this time, in order to maintain the treatment liquid in the treatment tank 110, the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 can supply sulfuric acid and hydrogen peroxide to the treatment tank 110. The ratio of the amount of sulfuric acid supplied from the sulfuric acid supply unit 132 and the amount of hydrogen peroxide supplied from the hydrogen peroxide supply unit 134 is the same as before the liquid is replaced.

As described above, the processing liquid in the processing tank 110 can be adjusted by replacing the liquid. According to this embodiment, a portion of the processing liquid in the processing tank 110 can be discharged and the processing liquid can be supplied to the processing tank 110. Therefore, the processing liquid in the processing tank 110 can be quickly adjusted to a processing condition suitable for substrate processing. In addition, since the processing liquid in the processing tank 110 is not completely discarded, the substrate processing cost can be reduced.

Next, referring to FIG. 1 to FIG. 6 , the liquid replacement step in the substrate processing method of this embodiment is described. FIG. 6 is a graph showing the time variation of the sulfuric acid concentration and the hydrogen peroxide concentration in the processing tank 110 during the liquid replacement step in the substrate processing method of this embodiment. In FIG. 6 , line Lsp represents the time variation of the sulfuric acid concentration. Line Lhp represents the time variation of the hydrogen peroxide concentration.

As shown by line Lsp, the sulfuric acid concentration is roughly constant before the liquid replacement period Pp. However, strictly speaking, the sulfuric acid concentration will gradually decrease over time. This is because hydrogen peroxide and sulfuric acid react and decompose in the treatment tank 110 to produce water.

During the liquid replacement period Pp, the treatment liquid in the treatment tank 110 is at least partially discharged. Also, during the liquid replacement period Pp, sulfuric acid and hydrogen peroxide are re-supplied to the treatment tank 110. Typically, after the treatment liquid in the treatment tank 110 is discharged, new treatment liquid is supplied to the treatment tank 110. However, the discharge and supply of the treatment liquid in the treatment tank 110 may be performed at any timing.

After the liquid replacement period Pp, the sulfuric acid concentration increased compared to before the liquid replacement period Pp. Thereafter, the sulfuric acid concentration gradually decreased with the passage of time.

As shown by line Lhp, the concentration of hydrogen peroxide is roughly constant before the liquid replacement period Pp. However, strictly speaking, the concentration of hydrogen peroxide gradually decreases with the passage of time. This is because hydrogen peroxide and sulfuric acid react and decompose in the treatment tank 110 to produce water.

After the liquid replacement period Pp ended, the hydrogen peroxide concentration increased compared to before the liquid replacement period Pp. Thereafter, the hydrogen peroxide concentration decreased as time passed.

In addition, in FIG. 6 , before and after the liquid replacement period Pp, the processing liquid in the processing tank 110 is heated while circulating through the circulation part 140. Alternatively, during the liquid replacement period Pp, the processing liquid in the processing tank 110 is heated while circulating through the circulation part 140.

Next, referring to Figures 1 to 7, the substrate processing method of this embodiment is described. Figure 7 is a flow chart when selecting the liquid replacement step in the substrate processing method of this embodiment.

As shown in FIG. 7 , in step S102, it is determined whether the substrate W processed by the substrate processing device 100 is a target substrate for the liquid replacement step. For example, when the substrate W is a substrate that has been ashed with an anti-etching agent, the control unit 182 determines that the substrate W is a target substrate for the liquid replacement step. Typically, before the substrate arrives at the substrate processing device 100, the control unit 182 determines whether the substrate W is a target substrate.

When substrate W is not the target substrate (No in step S102), the process returns to step S102. On the other hand, when substrate W is the target substrate (Yes in step S102), the process proceeds to step S104.

In step S104, it is determined whether the processing liquid in the processing tank 110 meets a specific standard. The specific standard is set as an indicator indicating that the substrate W can be properly processed without adjusting the processing liquid in the processing tank 110. When the processing liquid in the processing tank 110 meets the specific standard, the processing liquid in the processing tank 110 is not discharged. On the other hand, when the processing liquid in the processing tank 110 does not meet the specific standard, the processing liquid in the processing tank 110 is discharged and adjusted.

The specific benchmark can be set based on the concentration of the treatment liquid in the treatment tank 110. For example, the specific benchmark is set based on the concentration of hydrogen peroxide in the treatment liquid in the treatment tank 110. In one example, when the concentration of hydrogen peroxide in the treatment liquid in the treatment tank 110 is above a specific value, the control unit 182 determines that the specific benchmark is met. On the other hand, when the concentration of hydrogen peroxide in the treatment liquid in the treatment tank 110 is lower than a specific value, the control unit 182 determines that the specific benchmark is not met.

When the treatment liquid in the treatment tank 110 meets the specific standard (yes in step S104), the treatment proceeds to step S112. On the other hand, when the treatment liquid in the treatment tank 110 does not meet the specific standard (no in step S104), the treatment proceeds to step S106.

In step S106, the treatment liquid in the treatment tank 110 is discharged. At least a portion of the treatment liquid stored in the treatment tank 110 is discharged. The control unit 182 discharges the treatment liquid in the outer tank 114 by driving the pump 142, opening the valve 154 and closing the valve 155. In addition, the control unit 182 discharges the treatment liquid in the inner tank 112 by opening the valve 152.

In step S108, the treatment liquid is supplied to the treatment tank 110. The treatment liquid supply unit 130 supplies the treatment liquid to the treatment tank 110. Under the control of the control unit 182, the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide to the treatment tank 110.

In step S110, the supply of the treatment liquid to the treatment tank 110 is stopped. Under the control of the control unit 182, the supply of sulfuric acid and hydrogen peroxide from the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 to the treatment tank 110 is stopped.

In step S112, the treatment liquid in the treatment tank 110 is circulated while being heated. Under the control of the control unit 182, the pump 142 is driven and the regulating valves 145 and 146 are opened, and the valve 154 is opened and the valve 155 is closed, so that the treatment liquid in the treatment tank 110 is circulated from the treatment tank 110 to the treatment tank 110 through the piping 141. In addition, under the control of the control unit 182, the heater 144 heats the treatment liquid flowing through the piping 141.

In step S114, it is determined whether the temperature of the processing liquid is a specific temperature. When the temperature of the processing liquid is not a specific temperature (No in step S114), the process returns to step S112. On the other hand, when the temperature of the processing liquid is a specific temperature (Yes in step S114), the process proceeds to step S116.

In step S116, the substrate W is immersed in the treatment liquid of the treatment tank 110. Typically, the substrate holding part 120 descends toward the treatment tank 110 while holding the substrate W, and immerses the substrate W in the treatment liquid of the treatment tank 110. At this time, the treatment liquid supply part 130 may not supply sulfuric acid and hydrogen peroxide to the treatment tank 110. Alternatively, the treatment liquid supply part 130 may only supply hydrogen peroxide to the treatment tank 110. In either case, it is preferred to drive the heater 144 together with the pump 142, thereby circulating the treatment liquid in the treatment tank 110 while heating the treatment liquid in the treatment tank 110.

Thereafter, the substrate W is lifted from the processing tank 110. Typically, the substrate W is unloaded from the substrate processing apparatus 100.

In step S118, it is determined whether the substrate W to be processed next by the substrate processing device 100 is a target substrate. Typically, before the next substrate arrives at the substrate processing device 100, the control unit 182 determines whether the substrate W is a target substrate.

When the next substrate W is not the target substrate (No in step S118), the processing ends. On the other hand, when the next substrate W is the target substrate (Yes in step S118), the processing proceeds to step S120.

In step S120, it is determined whether the treatment liquid in the treatment tank 110 meets a specific standard. The specific standard is set in the same way as step S104.

When the treatment liquid in the treatment tank 110 does not meet the specific standard (No in step S120), the process returns to step S106. On the other hand, when the treatment liquid in the treatment tank 110 meets the specific standard (Yes in step S120), the process returns to step S116. In this case, the treatment liquid supply unit 130 may not supply sulfuric acid and hydrogen peroxide to the treatment liquid in the treatment tank 110. Or, the treatment liquid supply unit 130 may only supply hydrogen peroxide to the treatment liquid in the treatment tank 110. In either case, it is preferred to drive the heater 144 together with the pump 142, so that the treatment liquid in the treatment tank 110 is circulated while the treatment liquid in the treatment tank 110 is heated.

In this embodiment, as described above, when the treatment liquid in the treatment tank 110 meets a specific standard, the treatment liquid is not discharged and the substrate W is immersed. On the other hand, when the treatment liquid in the treatment tank 110 does not meet the specific standard, at least a portion of the treatment liquid in the treatment tank 110 is discharged, and sulfuric acid and hydrogen peroxide are re-supplied to at least partially replace the treatment liquid in the treatment tank 110. In this way, the number of times the treatment liquid is replaced can be reduced, and the cost increase of the treatment liquid can be suppressed.

As mentioned above, the liquid replacement step and the flow chart for selecting the liquid replacement step in the substrate processing method of this embodiment have been described with reference to FIGS. 5 to 7. In addition, the concentration adjustment step in the substrate processing method of this embodiment is performed as follows.

Next, referring to Figures 1 to 8, the concentration adjustment step in the substrate processing method of this embodiment is described. Figures 8(a) to 8(c) are schematic diagrams used to illustrate the concentration adjustment step in the substrate processing method of this embodiment.

As shown in FIG8(a), the state of the treatment liquid in the treatment tank 110 is maintained. Here, a fixed amount of treatment liquid is stored in each of the inner tank 112 and the outer tank 114. For example, the treatment liquid in the treatment tank 110 is maintained in a fixed state by circulating and heating at the same time.

For example, the treatment liquid in the treatment tank 110 maintains a sulfuric acid concentration of 75% or more and 90% or less, a hydrogen peroxide concentration of 0.8% or more and 2.0% or less, and a temperature of 100°C or more and 140°C or less. In one example, the treatment liquid in the treatment tank 110 maintains a sulfuric acid concentration of 82%, a hydrogen peroxide concentration of 1.0%, and a temperature of 110°C.

The temperature of the treatment liquid in the treatment tank 110, the sulfuric acid concentration of the treatment liquid, and the hydrogen peroxide concentration in the treatment liquid are maintained by the control of the control unit 182. Specifically, the sulfuric acid supply unit 132 supplies a specific amount of sulfuric acid to the treatment tank 110, and the hydrogen peroxide supply unit 134 supplies a specific amount of hydrogen peroxide water to the treatment tank 110. In addition, the heater 144 heats the treatment liquid with a constant amount of electricity.

As shown in FIG8(b), the concentration of the treatment liquid in the treatment tank 110 is adjusted. At this time, the ratio of the amount of sulfuric acid supplied from the sulfuric acid supply unit 132 and the amount of hydrogen peroxide supplied from the hydrogen peroxide supply unit 134 is changed. For example, the concentration of the treatment liquid in the treatment tank 110 is adjusted before the substrate W is immersed in the treatment liquid in the treatment tank 110.

Here, the concentration of hydrogen peroxide is increased while maintaining the concentration of sulfuric acid in the treatment solution of the treatment tank 110. In this case, the control unit 182 controls the hydrogen peroxide supply unit 134 by increasing the supply amount of hydrogen peroxide water until the concentration of hydrogen peroxide in the treatment solution in the treatment tank 110 increases. In addition, the control unit 182 controls the sulfuric acid supply unit 132 by supplying sulfuric acid according to the degree of maintaining the concentration of sulfuric acid in the treatment solution in the treatment tank 110.

In one example, the treatment liquid maintained in the treatment tank 110 has a sulfuric acid concentration of 82%, a hydrogen peroxide concentration of 1.4%, and a temperature of 110°C.

Afterwards, the control unit 182 immerses the substrate W in the treatment liquid in the treatment tank 110, and maintains the temperature of the treatment liquid in the treatment tank 110, the sulfuric acid concentration of the treatment liquid, and the hydrogen peroxide concentration in the treatment liquid, until the substrate W is lifted out of the treatment liquid in the treatment tank 110. Specifically, the sulfuric acid supply unit 132 supplies a specific amount of sulfuric acid to the treatment tank 110, and the hydrogen peroxide supply unit 134 supplies a specific amount of hydrogen peroxide water to the treatment tank 110. In addition, the heater 144 heats the treatment liquid with a constant amount of electricity.

After lifting the substrate W from the processing liquid in the processing tank 110, the control unit 182 changes the temperature of the processing liquid in the processing tank 110, the sulfuric acid concentration of the processing liquid, and the hydrogen peroxide concentration in the processing liquid. Typically, the control unit 182 changes any one of the temperature of the processing liquid in the processing tank 110, the sulfuric acid concentration of the processing liquid, and the hydrogen peroxide concentration in the processing liquid to the state before the substrate W is immersed.

As shown in FIG8(c), the state of the treatment liquid in the treatment tank 110 is restored. Here, the concentration of hydrogen peroxide is reduced while maintaining the concentration of sulfuric acid in the treatment liquid in the treatment tank 110. In this case, the control unit 182 controls the hydrogen peroxide supply unit 134 by reducing the supply amount of hydrogen peroxide until the concentration of hydrogen peroxide in the treatment liquid in the treatment tank 110 is reduced. In addition, the control unit 182 controls the sulfuric acid supply unit 132 by supplying sulfuric acid in accordance with the degree of maintaining the concentration of sulfuric acid in the treatment liquid in the treatment tank 110. At this time, the ratio of the amount of sulfuric acid supplied from the sulfuric acid supply unit 132 and the amount of hydrogen peroxide supplied from the hydrogen peroxide supply unit 134 is changed again.

In one example, the treatment liquid maintained in the treatment tank 110 has a sulfuric acid concentration of 82%, a hydrogen peroxide concentration of 1.0%, and a temperature of 110°C.

Thereafter, the control unit 182 maintains the temperature of the treatment liquid in the treatment tank 110, the sulfuric acid concentration of the treatment liquid, and the hydrogen peroxide concentration in the treatment liquid. Specifically, the sulfuric acid supply unit 132 supplies a specific amount of sulfuric acid to the treatment tank 110, and the hydrogen peroxide supply unit 134 supplies a specific amount of hydrogen peroxide water to the treatment tank 110. In addition, the heater 144 heats the treatment liquid with a constant amount of electricity.

Next, referring to FIG. 1 to FIG. 9 , the concentration adjustment step in the substrate processing method of this embodiment is described. FIG. 9 is a graph showing the time variation of the sulfuric acid concentration and the hydrogen peroxide concentration in the processing tank 110 during the concentration adjustment step in the substrate processing method of this embodiment. In FIG. 9 , line Lsc represents the time variation of the sulfuric acid concentration. Line Lhc represents the time variation of the hydrogen peroxide concentration.

As shown by line Lsc, before the concentration adjustment period Pc, the sulfuric acid concentration maintains the target concentration Tsb. However, strictly speaking, the sulfuric acid concentration changes relative to the target concentration Tsb as time passes. This is because the sulfuric acid supply unit 132 intermittently supplies sulfuric acid to the treatment tank 110 based on the measurement result of the concentration sensor 162. Here, when the sulfuric acid concentration decreases and reaches the target concentration Tsb, the sulfuric acid supply unit 132 supplies a specific amount of sulfuric acid to the treatment tank 110. Therefore, the sulfuric acid concentration temporarily increases from the target concentration Tsb.

During the concentration adjustment period Pc, sulfuric acid and hydrogen peroxide, which become new treatment liquids during the liquid replacement period Pp, are supplied to the treatment tank 110. Typically, the concentration adjustment period Pc is the period immediately before the substrate W is immersed in the treatment liquid of the treatment tank 110.

Here, the sulfuric acid concentration also maintains the target concentration Tsb after the concentration adjustment period Pc compared to before the concentration adjustment period Pc. In this case, strictly speaking, the sulfuric acid concentration also changes relative to the target concentration Tsb as time passes.

On the other hand, as shown by line Lhc, before the concentration adjustment period Pc, the hydrogen peroxide concentration maintains the target concentration Tob1. However, strictly speaking, the hydrogen peroxide concentration changes relative to the target concentration Tob1 as time passes. This is because the hydrogen peroxide supply unit 134 intermittently supplies hydrogen peroxide water to the treatment tank 110. Here, when the hydrogen peroxide concentration decreases and reaches the target concentration Tob1, the hydrogen peroxide supply unit 134 also supplies a specific amount of hydrogen peroxide water to the treatment tank 110. Therefore, the hydrogen peroxide concentration temporarily increases from the target concentration Tob1.

The hydrogen peroxide concentration increases after the concentration adjustment period Pc compared to before the concentration adjustment period Pc. This is because the target concentration of hydrogen peroxide water has been changed from target concentration Tob1 to target concentration Tob2 by the concentration adjustment. However, strictly speaking, the hydrogen peroxide concentration changes relative to the target concentration Tob2 as time passes. As described above, this is because the hydrogen peroxide supply unit 134 intermittently supplies hydrogen peroxide water to the processing tank 110.

Thereafter, if the substrate W is not immersed in the processing liquid of the processing tank 110 after a certain period of time, the target concentration of hydrogen peroxide is restored from the target concentration Tob2 to the target concentration Tob1.

Next, referring to FIG. 1 to FIG. 10 , the implementation form of the substrate processing device 100 of the present invention is described. FIG. 10 (a) is a graph showing the time variation of the sulfuric acid concentration in the processing tank 110 in the substrate processing method of the present implementation form, and FIG. 10 (b) is a graph showing the time variation of the hydrogen peroxide concentration in the processing tank 110 in the substrate processing method of the present implementation form.

As shown in Figure 10(a), the sulfuric acid concentration varies relative to the target concentration Ts. This is because the sulfuric acid supply unit 132 intermittently supplies sulfuric acid to the treatment tank 110 based on the measurement results of the concentration sensor 162.

In detail, after the sulfuric acid supply unit 132 stops supplying sulfuric acid for a specific period of time, the sulfuric acid concentration gradually decreases as time passes. When the concentration sensor 162 determines that the sulfuric acid concentration reaches the lower limit Tsd, the control unit 182 controls the sulfuric acid supply unit 132 in such a manner that the sulfuric acid supply unit 132 supplies a specific amount of sulfuric acid to the treatment tank 110. In addition, the amount of sulfuric acid supplied by the sulfuric acid supply unit 132 is set in such a manner that the sulfuric acid concentration measured by the concentration sensor 162 does not exceed the upper limit Tsu. Therefore, the sulfuric acid concentration changes relative to the target concentration Ts as time passes.

As shown in FIG10(b), the hydrogen peroxide concentration varies relative to the target concentration Th. This is because the hydrogen peroxide supply unit 134 intermittently supplies hydrogen peroxide water to the processing tank 110 based on the measurement result of the concentration sensor 162.

In detail, when the hydrogen peroxide supply unit 134 stops supplying hydrogen peroxide for a specific period of time, the concentration of hydrogen peroxide gradually decreases as time passes. When the concentration sensor 162 determines that the hydrogen peroxide concentration reaches the lower limit Thd, the control unit 182 controls the hydrogen peroxide supply unit 134 in such a manner that the hydrogen peroxide supply unit 134 supplies a specific amount of hydrogen peroxide to the treatment tank 110. In addition, the amount of hydrogen peroxide supplied by the hydrogen peroxide supply unit 134 is set in such a manner that the hydrogen peroxide concentration measured by the concentration sensor 162 does not exceed the upper limit Thu. Therefore, the hydrogen peroxide concentration changes relative to the target concentration Th as time passes.

In addition, as shown in Figure 10(a) and Figure 10(b), the sulfuric acid concentration and hydrogen peroxide concentration can also be feedback controlled to the target concentration. In addition, feedback control is suitable for the concentration adjustment step. However, feedback control can also be performed in the liquid replacement step.

Next, referring to Figures 1 to 11, the concentration adjustment step in the substrate processing method of this embodiment is described. Figure 11 is a flow chart for selecting the concentration adjustment step in the substrate processing method of this embodiment.

As shown in FIG. 11 , in step S202, the state of the treatment liquid in the treatment tank 110 is maintained. The control unit 182 maintains the temperature of the treatment liquid in the treatment tank 110, the sulfuric acid concentration of the treatment liquid, and the hydrogen peroxide concentration of the treatment liquid. Based on the result of the concentration sensor 162, the control unit 182 controls the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 in such a manner that the sulfuric acid concentration and the hydrogen peroxide concentration of the treatment liquid become specific values, respectively. In addition, the control unit 182 controls the heater 144 in such a manner that the treatment liquid maintains a specific temperature based on the temperature measured by the heater 144.

In step S204, it is determined whether the substrate W processed by the substrate processing device 100 is a target substrate for concentration adjustment. Typically, before the substrate arrives at the substrate processing device 100, the control unit 182 determines whether the substrate W is a target substrate.

For example, when the substrate W is a substrate having an anti-etching agent that has been ion-implanted, the control unit 182 determines that the substrate W is a target substrate for concentration adjustment. Or, when the substrate W is a substrate that has been oxidized after device separation, the control unit 182 determines that the substrate W is a target substrate for concentration adjustment.

When substrate W is not the target substrate (No in step S204), the process returns to step S202. On the other hand, when substrate W is the target substrate (Yes in step S204), the process proceeds to step S206.

In step S206, the concentration of hydrogen peroxide in the treatment solution in the treatment tank 110 is increased. Typically, the control unit 182 controls the hydrogen peroxide supply unit 134 by increasing the supply amount of hydrogen peroxide until the concentration of hydrogen peroxide in the treatment solution in the treatment tank 110 increases. In addition, the control unit 182 controls the sulfuric acid supply unit 132 by supplying sulfuric acid at a level that maintains the concentration of sulfuric acid in the treatment solution in the treatment tank 110.

In step S208, it is determined whether the concentration adjustment of the treatment solution is completed. When the concentration of hydrogen peroxide increases and the concentration sensor 162 displays a specific value, the concentration adjustment of the treatment solution is completed.

When the adjustment of the treatment liquid is not completed (No in step S208), the process returns to step S208. On the other hand, when the adjustment of the treatment liquid is completed (Yes in step S208), the process proceeds to step S210.

In step S210, the state of the treatment liquid in the treatment tank 110 is maintained. The control unit 182 maintains the temperature of the treatment liquid in the treatment tank 110, the sulfuric acid concentration of the treatment liquid, and the hydrogen peroxide concentration in the treatment liquid. Specifically, the sulfuric acid supply unit 132 supplies a specific amount of sulfuric acid to the treatment tank 110, and the hydrogen peroxide supply unit 134 supplies a specific amount of hydrogen peroxide water to the treatment tank 110. In addition, the heater 144 heats the treatment liquid with a constant amount of electricity.

In step S212, the substrate W is immersed in the processing liquid in the processing tank 110. Typically, the substrate W is moved into the substrate processing device 100 and immersed in the processing liquid in the processing tank 110. Thereafter, the substrate W is moved in from the substrate processing device 100. Thereafter, the processing proceeds to step S214.

In step S214, it is determined whether there is a substrate W to be processed next by the substrate processing device 100, and whether the substrate W is a target substrate. Typically, before the next substrate arrives at the substrate processing device 100, the control unit 182 determines whether there is a next substrate W and whether the next substrate W is a target substrate.

When there is no next substrate W or the next substrate W is not the target substrate (No in step S214), the process proceeds to step S216. On the other hand, when there is a next substrate W and the substrate W is the target substrate (Yes in step S214), the process returns to step S210.

In step S216, the concentration of hydrogen peroxide in the treatment solution in the treatment tank 110 is reduced. Typically, the control unit 182 controls the hydrogen peroxide supply unit 134 by reducing the supply amount of hydrogen peroxide until the concentration of hydrogen peroxide in the treatment solution in the treatment tank 110 is reduced. In addition, the control unit 182 controls the sulfuric acid supply unit 132 by supplying sulfuric acid at a level that maintains the concentration of sulfuric acid in the treatment solution in the treatment tank 110.

In step S218, it is determined whether the concentration adjustment of the treatment liquid is completed. When the concentration of hydrogen peroxide decreases and the concentration sensor 162 displays a specific value, the concentration adjustment of the treatment liquid is completed.

When the adjustment of the treatment liquid is not completed (No in step S218), the process returns to step S216. On the other hand, when the adjustment of the treatment liquid is completed (Yes in step S218), the process proceeds to step S220.

In step S220, the state of the treatment liquid in the treatment tank 110 is maintained. The control unit 182 maintains the temperature of the treatment liquid in the treatment tank 110, the sulfuric acid concentration of the treatment liquid, and the hydrogen peroxide concentration in the treatment liquid. Specifically, the sulfuric acid supply unit 132 supplies a specific amount of sulfuric acid to the treatment tank 110, and the hydrogen peroxide supply unit 134 supplies a specific amount of hydrogen peroxide water to the treatment tank 110. In addition, the heater 144 heats the treatment liquid with a constant amount of electricity.

According to this embodiment, as described above, the concentration of the treatment liquid in the treatment tank 110 is adjusted. According to this embodiment, the treatment liquid in the treatment tank 110 is adjusted to a concentration suitable for treating the substrate W just before the substrate W is immersed in the treatment tank 110. Therefore, in the case of a substrate that is not the object of concentration adjustment, the concentration of the treatment liquid in the treatment tank 110 may not be adjusted, thereby avoiding excessive use of hydrogen peroxide.

In addition, in FIG. 9 and FIG. 11, as an example of concentration adjustment, when substrate W is a target substrate, the concentration of hydrogen peroxide is increased, but the present embodiment is not limited to this. When substrate W is a target substrate, the concentration of sulfuric acid can also be increased.

Furthermore, in the flowchart shown in FIG. 4 , the processing liquid adjustment step is selected based on substrate information indicating information related to the substrate performed before the substrate processing apparatus 100 processes the substrate, but the present embodiment is not limited thereto. The processing liquid adjustment step may also be selected based on the substrate information and other information.

Next, referring to Figures 1 to 12, the substrate processing method of this embodiment is described. Figure 12 is a flow chart of the substrate processing method of this embodiment.

As shown in FIG. 12 , in step S10, substrate information related to the substrate W processed by the substrate processing device 100 is obtained. For example, the substrate information acquisition unit 182a obtains the substrate information from the storage unit 184.

In step S10A, treatment liquid information indicating the state of the treatment liquid in the treatment tank 110 is obtained. The treatment liquid information may indicate any one of the sulfuric acid concentration, hydrogen peroxide concentration, and temperature in the treatment liquid in the treatment tank 110. For example, the concentration sensor 162 measures the sulfuric acid concentration and hydrogen peroxide concentration in the treatment liquid in the treatment tank 110. In addition, the heater 144 measures the temperature of the treatment liquid. The treatment liquid information acquisition unit 182c obtains the treatment liquid information from the concentration sensor 162 and/or the heater 144.

In step S20, a processing liquid adjustment step is selected. The control unit 182 selects whether to adjust the processing liquid in the processing tank 110 by a liquid replacement step or a concentration adjustment step based on the substrate information and the processing liquid information. Typically, the control unit 182 selects the processing liquid adjustment step based on the substrate information and the processing liquid information before the substrate W arrives at the substrate processing device 100.

For example, based on the substrate information, the target value of the processing liquid in the processing tank 110 is set. In one example, the target sulfuric acid concentration, target hydrogen peroxide concentration and target temperature in the processing liquid in the processing tank 110 are set based on the processing performed on the substrate W before being moved into the substrate processing device 100.

The treatment liquid adjustment step selection unit 182b selects a treatment liquid adjustment step. For example, the treatment liquid adjustment step selection unit 182b selects a treatment liquid adjustment step from the difference between the target sulfuric acid concentration, target hydrogen peroxide concentration, and target temperature set based on the substrate information and the sulfuric acid concentration, target hydrogen peroxide concentration, and target temperature of the treatment liquid in the treatment tank 110 shown in the treatment liquid information. For example, when the difference is relatively large, the treatment liquid adjustment step selection unit 182b selects a liquid replacement step as the treatment liquid adjustment step. On the other hand, when the difference is relatively small, the processing liquid adjustment step selection unit 182b selects the concentration adjustment step as the processing liquid adjustment step.

When the liquid replacement step is selected in step S20, the processing proceeds to step S30. On the other hand, when the concentration adjustment step is selected in step S20, the processing proceeds to step S40.

In step S30, a liquid replacement step is performed. The treatment liquid in the treatment tank 110 is adjusted by the liquid replacement step. As described above, it is determined whether the treatment liquid in the treatment tank 110 meets the standard. When the treatment liquid meets the standard, the treatment liquid in the treatment tank 110 is not discharged. When the treatment liquid does not meet the standard, the treatment liquid in the treatment tank 110 is discharged and sulfuric acid and hydrogen peroxide are re-supplied to the treatment tank 110. Thereafter, the treatment proceeds to step S50A.

In step S50A, the substrate W is immersed in the processing liquid in the processing tank 110. Thereafter, the substrate W is taken out from the processing liquid in the processing tank 110. The substrate processing is terminated as above.

In step S40, a concentration adjustment step is performed. In this case, the concentration of the treatment liquid in the treatment tank 110 is adjusted. Then, the treatment proceeds to step S50B.

In step S50B, the substrate is immersed in the processing liquid in the processing tank 110. Thereafter, the substrate W is taken out from the processing liquid in the processing tank 110. The substrate processing is terminated as above.

According to this embodiment, not only substrate information but also process liquid information is considered to select the process liquid adjustment step. Therefore, the time required to adjust the process liquid can also be considered to appropriately process the substrate W.

In addition, in the above description with reference to FIG. 1 to FIG. 12, in order to avoid the invention being too complicated, the substrate W is processed in one substrate processing device 100, but the present embodiment is not limited thereto. The substrate W can also be processed in two or more substrate processing devices 100.

Next, referring to FIG. 13 , a substrate processing system 10 having a substrate processing device 100 of the present embodiment will be described. FIG. 13 is a schematic diagram of a substrate processing system 10 having a substrate processing device 100 of the present embodiment. The substrate processing system 10 shown in FIG. 13 has a first substrate processing device 100A to a third substrate processing device 100C.

As shown in FIG. 13 , the substrate processing system 10 includes an input section 20, a plurality of storage sections 30, a transfer mechanism 40, a removal section 50, a buffer unit BU, a first transport device CTC, a second transport device WTR, a plurality of substrate processing devices 100, and a control device 180.

The plurality of substrate processing apparatuses 100 include a first substrate processing apparatus 100A, a second substrate processing apparatus 100B, and a third substrate processing apparatus 100C. The first substrate processing apparatus 100A, the second substrate processing apparatus 100B, and the third substrate processing apparatus 100C are arranged in a row in one direction. For example, the first substrate processing apparatus 100A, the second substrate processing apparatus 100B, and the third substrate processing apparatus 100C are adjacent to the transport path of the first transport apparatus CTC, and the first substrate processing apparatus 100A, the second substrate processing apparatus 100B, and the third substrate processing apparatus 100C are arranged in sequence near the transport path of the first transport apparatus CTC.

Here, the first substrate processing device 100A to the third substrate processing device 100C store a processing solution including sulfuric acid and hydrogen peroxide. The first substrate processing device 100A to the third substrate processing device 100C can also be fed with substrates W that have undergone different processing.

The substrate W processed by the substrate processing device 100 is carried in from the loading section 20. The loading section 20 includes a plurality of loading tables 22. The substrate W processed by the substrate processing device 100 is carried out from the unloading section 50. The unloading section 50 includes a plurality of loading tables 52.

The storage section 30 containing the substrate W is placed in the input section 20. The storage section 30 placed in the input section 20 stores the substrate W that has not been processed by the substrate processing device 100. Here, two storage sections 30 are placed on two stages 22 respectively.

Each of the plurality of storage sections 30 stores a plurality of substrates W. Each substrate W is stored in the storage section 30 in a horizontal position. The storage section 30 is, for example, a FOUP (Front Opening Unified Pod).

The storage section 30 placed on the removal section 50 stores the substrate W processed by the substrate processing device 100. The removal section 50 includes a plurality of loading tables 52. Two storage sections 30 are placed on two loading tables 52 respectively. The removal section 50 stores the processed substrate W in the storage section 30 and removes it together with the storage section 30.

The buffer unit BU is arranged adjacent to the input part 20 and the removal part 50. The buffer unit BU lifts the storage part 30 placed in the input part 20 together with the substrate W, and places the storage part 30 on a shelf (not shown). In addition, the buffer unit BU receives the processed substrate W and stores it in the storage part 30, and places the storage part 30 on a shelf. A handover mechanism 40 is arranged in the buffer unit BU.

The handover mechanism 40 delivers the receiving section 30 between the input section 20 and the removal section 50 and the rack. In addition, the handover mechanism 40 delivers only the substrate W to the first conveying device CTC. That is, the handover mechanism 40 delivers a group of substrates W to the first conveying device CTC.

After receiving the unprocessed plurality of substrates W from the handover mechanism 40, the first conveyor CTC changes the posture of the plurality of substrates W from the horizontal posture to the vertical posture, and transfers the plurality of substrates W to the second conveyor WTR. In addition, after receiving the processed plurality of substrates W from the second conveyor WTR, the first conveyor CTC changes the posture of the plurality of substrates W from the vertical posture to the horizontal posture, and transfers the substrates W to the handover mechanism 40.

The second transport device WTR can move from the third substrate processing device 100C to the second substrate processing device 100B along the length direction of the substrate processing system 10. The second transport device WTR can move the substrate W group into and out of the first substrate processing device 100A, the second substrate processing device 100B and the third substrate processing device 100C.

The control device 180 controls various operations of the substrate processing system 10. Specifically, the control device 180 controls the transfer mechanism 40, the first transport device CTC, the second transport device WTR, and the substrate processing device 100.

The control device 180 includes a control unit 182 and a memory unit 184. The control unit 182 has a processor. The control unit 182 has, for example, a central processing unit. Alternatively, the control unit 182 may also have a general-purpose computer.

The memory unit 184 stores data and computer programs. The data includes process data. The process data includes information showing a plurality of processes. Each of the plurality of processes specifies the processing content and processing sequence of the substrate W.

The memory unit 184 includes a main memory device and an auxiliary memory device. The main memory device is, for example, a semiconductor memory. The auxiliary memory device is, for example, a semiconductor memory and/or a hard disk. The memory unit 184 may also include a removable medium. The memory unit 184 is equivalent to an example of a non-temporary computer-readable memory medium.

The memory unit 184 stores a computer program with a preset sequence. The substrate processing device 100 operates according to the sequence specified by the computer program. The control unit 182 executes the computer program stored in the memory unit 184 to perform substrate processing operations. The processor of the control unit 182 controls the transfer mechanism 40, the first transport device CTC, the second transport device WTR, and the substrate processing device 100 by executing the computer program stored in the memory unit 184.

The above has been described with reference to the drawings while explaining the implementation forms of the present invention. However, the present invention is not limited to the above implementation forms and can be implemented in various forms without departing from the scope of its main purpose. In addition, various inventions can be formed by appropriately combining multiple components disclosed in the above implementation forms. For example, some components can be deleted from all the components shown in the implementation forms. Furthermore, components across different implementation forms can also be appropriately combined. For easy understanding, the drawings are schematically displayed with each component as the main body. The thickness, length, number, spacing, etc. of each component shown in the drawings are made for the convenience of making the drawings, and there are situations that are different from the actual ones. In addition, the materials, shapes, dimensions, etc. of the various components shown in the above-mentioned implementation forms are only examples and are not particularly limited. Various changes can be made within the scope of the effects of the present invention.

[Industrial availability]

The present invention is suitable for use in substrate processing devices and substrate processing methods.

S10,S20,S30,S40,S50A,S50B: Steps

Claims (7)

A substrate processing method is provided, wherein the substrate is processed by immersing the substrate in a processing liquid containing sulfuric acid and hydrogen peroxide in a processing tank, and the method comprises the following steps: Before immersing the substrate in the processing liquid in the processing tank, obtaining substrate information showing information related to the substrate; Based on the substrate information, selecting either a liquid replacement step or a concentration adjustment step as a processing liquid adjustment step for adjusting the processing liquid; The first treatment liquid adjustment step, when the liquid replacement step is selected in the above-mentioned selection step, when the treatment liquid in the above-mentioned treatment tank does not meet the specific conditions, at least a part of the treatment liquid in the above-mentioned treatment tank is discharged from the above-mentioned treatment tank, and sulfuric acid and hydrogen peroxide are supplied to the above-mentioned treatment tank to adjust the treatment liquid in the above-mentioned treatment tank; The second treatment liquid adjustment step, when the concentration adjustment step is selected in the above-mentioned selection step, the concentration of the treatment liquid in the above-mentioned treatment tank is adjusted while the treatment liquid in the above-mentioned treatment tank is circulated through the pipe connected to the above-mentioned treatment tank; and The processing liquid in the processing tank adjusted in the first processing liquid adjustment step or the second processing liquid adjustment step is circulated through the pipe connected to the processing tank, while the substrate is immersed in the processing liquid in the processing tank. The substrate processing method of claim 1, wherein In the step of obtaining the substrate information, when the substrate information shows that the anti-etching agent of the substrate has been subjected to ashing treatment, the liquid replacement step is selected in the selection step; In the step of obtaining the substrate information, when the substrate information shows that the anti-etching agent of the substrate has been subjected to ion implantation and the substrate has been subjected to component separation, the concentration adjustment step is selected in the selection step. A substrate processing method as claimed in claim 1 or 2, wherein in the first processing liquid adjustment step, when the processing liquid in the processing tank meets specific conditions, the processing liquid in the processing tank is not discharged. The substrate processing method of claim 1 or 2, wherein the first processing liquid adjustment step includes the following steps: before immersing the substrate, the amount of the processing liquid discharged from the processing tank is set based on the time elapsed since the substrate was immersed in the processing liquid in the processing tank. The substrate processing method of claim 1 or 2, wherein the second processing liquid adjustment step includes the following steps: adjusting the hydrogen peroxide concentration of the processing liquid based on the measurement result of the concentration sensor for measuring the concentration of the processing liquid in the processing tank. The substrate processing method of claim 1 or 2, wherein the second processing liquid adjustment step comprises the following steps: supplying hydrogen peroxide water to the processing tank in a manner of increasing the hydrogen peroxide concentration of the processing liquid in the processing tank before immersing the substrate in the processing liquid in the processing tank; and reducing the hydrogen peroxide concentration of the processing liquid in the processing tank after immersing the substrate in the processing liquid in the processing tank. A substrate processing device, comprising: a processing tank storing a processing liquid including sulfuric acid and hydrogen peroxide; a circulation unit having a pipe for circulating the processing liquid in the processing tank; a drainage unit discharging the processing liquid in the processing tank; a processing liquid supply unit supplying sulfuric acid and hydrogen peroxide to the processing tank; a substrate holding unit holding a substrate and immersing the substrate in the processing liquid in the processing tank; and a control unit controlling the circulation unit, the drainage unit, the processing liquid supply unit and the substrate holding unit; and Before immersing the substrate in the treatment liquid in the treatment tank, the control unit selects either a liquid replacement step or a concentration adjustment step as a treatment liquid adjustment step for adjusting the treatment liquid based on substrate information that displays information related to the substrate; When the liquid replacement step is selected, the control unit controls the liquid discharge unit and the treatment liquid supply unit in a manner of performing the first treatment liquid adjustment step, and when the treatment liquid in the treatment tank does not meet a specific condition, the first treatment liquid adjustment step discharges at least a portion of the treatment liquid in the treatment tank from the treatment tank, and causes the treatment liquid supply unit to supply the sulfuric acid and the hydrogen peroxide solution to the treatment tank to adjust the treatment liquid in the treatment tank; When the concentration adjustment step is selected, the control unit controls the circulation unit and the processing liquid supply unit in a manner of performing the second processing liquid adjustment step, and the second processing liquid adjustment step allows the processing liquid in the processing tank to circulate through the piping of the circulation unit while adjusting the concentration of the processing liquid; The control unit controls the circulation unit and the substrate holding unit in a manner of immersing the substrate in the processing liquid in the processing tank while allowing the processing liquid in the processing tank adjusted in the first processing liquid adjustment step or the second processing liquid adjustment step to circulate through the piping of the circulation unit.