KR20230117520A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

The present invention provides a substrate processing apparatus and a substrate processing method. A substrate processing method includes a step of acquiring substrate information, a step of selecting any one of a liquid exchange process and a concentration adjustment process, and when the liquid exchange process is selected in the selection process, the treatment liquid in the treatment tank In a first treatment liquid adjustment step of discharging at least a part of the treatment liquid in the treatment tank from the treatment tank and supplying sulfuric acid and hydrogen peroxide solution to the treatment tank when a predetermined condition is not satisfied, and the selection step a second treatment liquid adjustment step of adjusting the concentration of the treatment liquid in the treatment tank while circulating the treatment liquid in the treatment tank through a pipe connected to the treatment tank when the concentration adjustment step is selected; and the first treatment and immersing the substrate in the treatment liquid of the treatment tank while circulating the treatment liquid of the treatment tank adjusted in the liquid adjustment step or the second treatment liquid adjustment step through a pipe connected to the treatment tank.

Description

Substrate processing apparatus and substrate processing method {SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD}

The present invention relates to a substrate processing apparatus and a substrate processing method.

Substances generated in a manufacturing process of a semiconductor device may adhere to the surface of a substrate to be processed, for example, a semiconductor wafer (hereinafter referred to as a wafer). Since these substances deteriorate the characteristics of the semiconductor device, cleaning of the wafer surface is performed using a plurality of types of chemicals in order to remove these substances.

The SPM liquid is used for cleaning the wafer surface. The SPM liquid is a mixed liquid of sulfuric acid and hydrogen peroxide solution. The SPM liquid is also used as a chemical liquid for oxidizing a substrate from which devices have been separated, in addition to stripping the resist remaining on the surface of the wafer and removing residue from the substrate after ashing the resist. The SPM liquid is, for example, a single-wafer type processing device that supplies a chemical solution to the surface of a wafer held on a rotary table while rotating it, as well as a batch type processing device that simultaneously immerses a plurality of wafers in a processing tank filled with a chemical solution to perform cleaning. It is also used in the processing unit of

When wafers are processed using an SPM liquid in a batch type substrate processing apparatus, for example, several tens of wafers are immersed in an SPM liquid generally heated to 100 ° C. to 130 ° C., and after a predetermined time has elapsed, the wafer is taken out, By repeating the operation of immersing the next wafer, a plurality of wafers are continuously processed. In such a continuous process, since the SPM liquid in the treatment tank adheres to the surface of the wafer and part of it escapes to the outside of the treatment tank, the liquid level is lowered. Therefore, sulfuric acid and hydrogen peroxide solution are replenished to the SPM liquid at a predetermined timing.

In addition, it is known that hydrogen peroxide is a relatively unstable substance. Since hydrogen peroxide decomposes over time to produce water, for example, even if sulfuric acid and hydrogen peroxide water are replenished in accordance with a decrease in the liquid level, the sulfuric acid concentration in the SPM liquid decreases over time. . When the sulfuric acid concentration is lowered, the ability to remove contaminants is lowered, so wafer processing using this treatment tank is periodically stopped to replace the entire amount of the SPM liquid in the treatment tank, resulting in a decrease in processing efficiency and/or This causes an increase in the amount of consumption of the chemical solution and an accompanying increase in the cost of the chemical solution. For this reason, in a batch-type substrate processing apparatus, suppression of the deterioration of the removal ability of a contaminant is being studied (patent document 1).

In the substrate processing apparatus of Patent Literature 1, sulfuric acid is replenished on the downstream side of the heater in the circulation passage. Patent Literature 1 describes that by replenishing sulfuric acid on the downstream side of the heater in the circulation passage, direct heating of hydrogen peroxide and carosic acid, which are considered to effectively contribute to the removal of contaminants, and decomposition from proceeding are suppressed.

Japanese Patent Publication No. 2011-114305

In the substrate processing apparatus of Patent Literature 1, the SPM concentration in the processing tank is constantly adjusted regardless of the type of substrate. However, depending on the type of substrate, some substrates can be appropriately treated without strictly adjusting the SPM concentration in the treatment tank. Therefore, there are cases in which sulfuric acid and hydrogen peroxide solution are unnecessarily used.

The present invention has been made in view of the above problems, and its object is to provide a substrate processing apparatus and a substrate processing method capable of avoiding excessive use of sulfuric acid and hydrogen peroxide water.

According to one aspect of the present invention, in a substrate processing method, in a processing tank storing a processing liquid containing sulfuric acid and hydrogen peroxide, the substrate is immersed in the processing liquid to process the substrate. The substrate processing method includes a step of acquiring substrate information indicating information on the substrate before immersing the substrate in the processing liquid in the processing tank; and adjusting the processing liquid based on the substrate information. A process of selecting any one of a liquid exchange process and a concentration adjustment process as an adjustment process, and when the liquid exchange process is selected in the selection process, when the treatment liquid in the treatment tank does not satisfy a predetermined condition, the A first treatment liquid adjustment step of discharging at least a part of the treatment liquid of the treatment tank from the treatment tank and supplying sulfuric acid and hydrogen peroxide to the treatment tank to adjust the treatment liquid of the treatment tank; When the concentration adjustment step is selected, a second treatment liquid adjustment step of adjusting the concentration of the treatment liquid in the treatment tank while circulating the treatment liquid in the treatment tank through a pipe connected to the treatment tank, and the first treatment liquid and immersing the substrate in the treatment liquid of the treatment tank while circulating the treatment liquid of the treatment tank adjusted in the adjustment step or the second treatment solution adjustment step through a pipe connected to the treatment tank.

In one embodiment, in the step of obtaining the substrate information, when the substrate information indicates that an ashing treatment has been performed on the resist of the substrate, in the step of selecting, the liquid exchange step is selected, and the substrate In the process of obtaining information, when the substrate information indicates either that ion implantation has been performed into the resist of the substrate or that the substrate is element-isolated, in the step of selecting, the concentration adjustment choose a process

In one embodiment, in the first treatment liquid adjustment step, when the treatment liquid in the treatment tank satisfies a predetermined condition, the treatment liquid in the treatment tank is not discharged.

In one embodiment, the first processing liquid adjustment step may include adjusting an amount of the processing liquid discharged from the processing bath based on a time elapsed after immersing the substrate in the processing liquid of the processing bath before immersing the substrate. Including the process of setting

In one embodiment, the second treatment liquid adjusting step includes a step of adjusting the hydrogen peroxide concentration of the treatment liquid based on a measurement result of a concentration sensor for measuring the concentration of the treatment liquid in the treatment tank.

In one embodiment, the second treatment liquid adjustment step includes supplying hydrogen peroxide to the treatment tank to increase the hydrogen peroxide concentration of the treatment liquid of the treatment tank before immersing the substrate in the treatment liquid of the treatment tank. and a step of lowering the concentration of hydrogen peroxide in the treatment liquid in the treatment tank after immersing the substrate in the treatment liquid in the treatment tank.

According to another aspect of the present invention, a substrate processing apparatus includes a treatment tank storing a treatment liquid containing sulfuric acid and hydrogen peroxide, a circulation unit having a pipe through which the treatment liquid in the treatment tank circulates, and the treatment liquid in the treatment tank. a drainage unit for discharging the liquid; a treatment liquid supply unit for supplying sulfuric acid and hydrogen peroxide to the treatment tank; a substrate holding unit for holding a substrate and immersing the substrate in the treatment liquid in the treatment tank; A control unit for controlling the processing liquid supply unit and the substrate holding unit. The control unit may adjust the processing liquid based on substrate information representing information about the substrate before immersing the substrate in the processing liquid in the processing tank, wherein the processing liquid is adjusted according to one of a liquid exchanging process and a concentration adjusting process. When the liquid exchange process is selected, the control unit discharges at least a part of the treatment liquid in the treatment tank from the treatment tank when the treatment liquid in the treatment tank does not satisfy a predetermined condition; The drainage unit and the treatment liquid supply unit are controlled so that the treatment liquid supply unit supplies the sulfuric acid and the hydrogen peroxide solution to the treatment tank to perform a first treatment liquid adjustment step of adjusting the treatment liquid in the treatment tank, and the concentration When the adjustment process is selected, the control unit circulates the treatment liquid in the treatment tank through the pipe of the circulation unit to perform a second treatment liquid adjustment process of adjusting the concentration of the treatment liquid, and Controls the treatment liquid supply unit, wherein the control unit circulates the treatment liquid in the treatment tank adjusted in the first treatment liquid adjustment step or the second treatment liquid adjustment step through the pipe of the circulation unit to perform the treatment process The circulation part and the substrate holding part are controlled so as to immerse the substrate in the treatment liquid of the bath.

According to the present invention, excessive use of sulfuric acid and hydrogen peroxide can be avoided.

1 : (a) and (b) are schematic perspective views of the substrate processing apparatus of this embodiment.
2 is a schematic diagram of the substrate processing apparatus of the present embodiment.
3 is a schematic block diagram of the substrate processing apparatus of the present embodiment.
4 is a flowchart of the substrate processing method of the present embodiment.
5 : (a) - (c) are schematic diagrams for demonstrating the liquid exchange process in the substrate processing method of this embodiment.
6 is a graph showing changes over time in the concentration of sulfuric acid and the concentration of hydrogen peroxide in the treatment tank during the liquid exchange step in the substrate processing method of the present embodiment.
7 is a flow chart in the case where a liquid exchanging step in the substrate processing method of the present embodiment is selected.
8 : (a) - (c) are schematic diagrams which show the density adjustment process in the substrate processing method of this embodiment.
9 is a graph showing changes over time in the concentration of sulfuric acid and the concentration of hydrogen peroxide in the treatment tank during concentration adjustment in the substrate processing method of the present embodiment.
10 (a) and (b) are graphs showing changes over time in the concentration of sulfuric acid and the concentration of hydrogen peroxide in the treatment tank in the substrate processing method of the present embodiment.
11 is a flow chart in the case where the concentration adjustment step in the substrate processing method of the present embodiment is selected.
12 is a flowchart of the substrate processing method of the present embodiment.
13 is a schematic diagram of a substrate processing system provided with the substrate processing apparatus of the present embodiment.

Hereinafter, embodiments of a substrate processing apparatus and a substrate processing method according to the present invention will be described with reference to the drawings. In addition, the same reference numerals are attached to the same or equivalent parts in the drawings, and description is not repeated. In addition, in this specification, in order to facilitate understanding of the invention, the X-axis, Y-axis, and Z-axis that are orthogonal to each other are described in some cases. Typically, the X and Y axes are parallel in the horizontal direction, and the Z axis is parallel in the vertical direction.

Referring to Fig. 1, an embodiment of a substrate processing apparatus 100 according to the present invention will be described. 1(a) and 1(b) are schematic perspective views of the substrate processing apparatus 100 of the present embodiment. 1( a ) shows the substrate processing apparatus 100 before putting the substrate W into the processing tank 110 . 1( b ) shows the substrate processing apparatus 100 after the substrate W is put into the processing tank 110 .

The substrate processing apparatus 100 processes a substrate W. The substrate processing apparatus 100 processes the substrate W to perform at least one of etching, surface treatment, oxidation treatment, characterization, treatment film formation, removal of at least a part of the film, and cleaning of the substrate W. .

The substrate W has a thin plate shape. Typically, the substrate W has a thin substantially disk shape. The substrate W may be, for example, a semiconductor wafer, a substrate for a liquid crystal display, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disk, a substrate for a magnetic disk, a magneto-optical disk. A substrate for a photomask, a substrate for a photomask, a ceramic substrate, a substrate for a solar cell, and the like.

The substrate processing apparatus 100 is a batch type substrate processing apparatus. The substrate processing apparatus 100 collectively processes a plurality of substrates W. Typically, the substrate processing apparatus 100 processes a plurality of substrates W in units of lots. For example, one lot consists of 25 substrates W.

As shown in FIG. 1(a) , the substrate processing apparatus 100 includes a processing tank 110, a substrate holding unit 120, and a processing liquid supply unit 130. The processing tank 110 stores a processing liquid for processing the substrate W. The treatment liquid is a mixed liquid containing sulfuric acid and aqueous hydrogen peroxide. The treatment liquid supply unit 130 supplies the treatment liquid to the treatment tank 110 . For example, the treatment liquid supply unit 130 supplies sulfuric acid and hydrogen peroxide solution to the treatment tank 110 , respectively. For example, sulfuric acid and hydrogen peroxide are mixed in the treatment tank 110 to produce a treatment liquid. However, the sulfuric acid and the hydrogen peroxide solution supplied from the treatment liquid supply unit 130 may be mixed before reaching the treatment tank 110 to generate the treatment liquid.

The substrate holding part 120 holds the substrate W. The normal direction of the main surface of the substrate W held by the substrate holding portion 120 is parallel to the Y direction. A plurality of substrates W are arranged in a row along the Y direction. The plurality of substrates W are arranged substantially parallel to each other in the horizontal direction. In addition, each normal line of the plurality of substrates W extends in the Y direction, and each of the plurality of substrates W extends substantially parallel to the X and Z directions.

Typically, the substrate holding unit 120 gathers and holds a plurality of substrates W. Here, the substrate holding part 120 holds the substrates W lined up along the Y-direction. The substrate holding part 120 moves the substrate W while holding the substrate W. For example, the substrate holding part 120 moves vertically upward or vertically downward along the vertical direction while holding the substrate W.

Specifically, the substrate holding part 120 includes a lifter. The substrate holder 120 moves vertically upward or vertically downward while holding the plurality of substrates W. As shown in FIG. When the substrate holder 120 moves vertically downward, the plurality of substrates W held by the substrate holder 120 are immersed in the treatment liquid L stored in the treatment tank 110 .

In FIG. 1( a ) , the substrate holding part 120 is located above the treatment tank 110 . The substrate holder 120 descends vertically downward (Z direction) while holding the plurality of substrates W. In this way, a plurality of substrates W are put into the treatment tank 110 .

As shown in FIG. 1( b ) , when the substrate holder 120 descends to the treatment tank 110 , the plurality of substrates W are immersed in the treatment liquid in the treatment tank 110 . The substrate holding unit 120 immerses the plurality of substrates W aligned at predetermined intervals in the treatment liquid stored in the treatment tank 110 .

The treatment tank 110 has a double tank structure. The treatment tank 110 includes an inner tank 112 and an outer tank 114 . The outer shell 114 surrounds the inner shell 112 . Both the inner tub 112 and the outer tub 114 have upper openings that open upward.

Each of the inner tank 112 and the outer tank 114 stores the treatment liquid. A plurality of substrates W are put into the inner tub 112 . In detail, a plurality of substrates W held by the substrate holder 120 are put into the inner tub 112 . The plurality of substrates W are immersed in the treatment liquid of the inner tub 112 by being put into the inner tub 112 .

The substrate holding part 120 includes a main body plate 122 and a holding bar 124 . The main body plate 122 is a plate extending in the vertical direction (Z direction). The holding rod 124 extends from one main surface of the body plate 122 in a horizontal direction (Y direction). 1(a) and 1(b), three holding rods 124 extend from one main surface of the body plate 122 in the horizontal direction. In a state where the plurality of substrates W are aligned at predetermined intervals, the lower edges of each substrate W are brought into contact with each other by a plurality of holding rods 124 to hold them in an upright position (upright position).

The substrate holder 120 may further include a lifting unit 126 . The elevating unit 126 has a downward position (a position shown in FIG. 1(b) ) where the plurality of substrates W held by the holding rod 124 are located in the treatment tank 110, and the holding rod 124 The main body plate 122 is moved up and down between an upper position (a position shown in FIG. 1(a) ) where a plurality of substrates W held therein are positioned above the treatment tank 110 . Therefore, by moving the body plate 122 to a lower position by the lifting unit 126, the plurality of substrates W held on the holding rod 124 are immersed in the processing liquid.

A plurality of substrates W are held by a plurality of holding rods 124 . Specifically, the plurality of substrates W are held in an upright position (vertical position) by the plurality of holding rods 124 as the lower edge of each substrate W abuts against the plurality of holding rods 124. . More specifically, the plurality of substrates W held by the substrate holder 120 are aligned along the Y direction at intervals. For this reason, the plurality of substrates W are arranged in a row along the Y direction. Further, each of the plurality of substrates W is held by the substrate holder 120 in a posture substantially parallel to the XZ plane.

The elevating unit 126 elevates the body plate 122 and the holding rod 124 . The elevating unit 126 lifts the main body plate 122 and the holding rod 124 so that the main body plate 122 and the holding rod 124 can move vertically upward or vertically downward while holding the plurality of substrates W. go to The elevating unit 126 has a driving source and an elevating mechanism, and the elevating mechanism is driven by the driving source to raise and lower the body plate 122 and the holding bar 124 . The driving source includes, for example, a motor. The lifting mechanism includes, for example, a lock and pinion mechanism or a ball screw.

More specifically, the lifting unit 126 raises and lowers the substrate holder 120 between the treatment position (the position shown in Fig. 1(b)) and the retract position (the position shown in Fig. 1(a)). As shown in FIG. 1( b ), when the substrate holder 120 moves vertically downward (Z direction) to the processing position while holding the plurality of substrates W, the plurality of substrates W It is put into the inner tank 112. Specifically, a plurality of substrates W held by the substrate holding portion 120 are moved into the inner tub 112 . As a result, the plurality of substrates W are immersed in the treatment liquid in the inner tub 112 and treated by the treatment liquid. On the other hand, as shown in FIG. 1(a) , when the substrate holder 120 is moved to the retracted position, the plurality of substrates W held by the substrate holder 120 are moved upward of the inner tub 112. It moves and is pulled up from the treatment liquid.

Next, referring to Figs. 1 and 2, the substrate processing apparatus 100 of the present embodiment will be described. 2 is a schematic diagram of the substrate processing apparatus 100 of the present embodiment.

As shown in FIG. 2 , the substrate processing apparatus 100 includes a treatment tank 110, a substrate holding unit 120, a processing liquid supply unit 130, a circulation unit 140, and a liquid drainage unit 150. and a control device 180. The control device 180 controls the substrate holding unit 120 , the treatment liquid supply unit 130 , the circulation unit 140 and the liquid drainage unit 150 .

The treatment tank 110 stores the treatment liquid L. The substrate holding part 120 holds the substrate W. The substrate holding part 120 includes a lifter. By means of the substrate holding unit 120 , a plurality of substrates W can be collectively immersed in the processing liquid L stored in the processing tank 110 .

The treatment liquid supply unit 130 supplies the treatment liquid to the treatment tank 110 . The processing liquid supply unit 130 includes a sulfuric acid supply unit 132 and a hydrogen peroxide supply unit 134 . The sulfuric acid supply unit 132 supplies sulfuric acid to the treatment tank 110 . The hydrogen peroxide supply unit 134 supplies hydrogen peroxide water to the treatment tank 110 .

As described above, hydrogen peroxide decomposes over time to produce water. For this reason, in order to keep the concentration of the treatment liquid in the treatment tank 110 constant, the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide solution to the treatment tank 110 . Typically, the amount of sulfuric acid per unit time supplied from the sulfuric acid supply unit 132 is greater than the amount of hydrogen peroxide solution per unit time supplied from the hydrogen peroxide supply unit 134 . For example, the ratio of the supply amount (volume) of sulfuric acid and the supply amount (volume) of hydrogen peroxide solution is 5:1 to 10:1.

The circulation unit 140 circulates the treatment liquid L stored in the treatment tank 110 . When the circulation unit 140 circulates the treatment liquid L in the treatment tank 110, the treatment liquid is heated to a predetermined temperature. In addition, when the circulation unit 140 circulates the treatment liquid L in the treatment tank 110, the treatment liquid can be filtered to remove impurities from the treatment liquid.

The drain unit 150 discharges the treatment liquid L stored in the treatment tank 110 . The treatment liquid in the treatment tank 110 can be discharged by the discharge unit 150 . In addition, the drainage unit 150 discharges the treatment liquid L stored in the treatment tank 110, and the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide water to the treatment tank 110. ), the treatment liquid L stored in the treatment tank 110 can be exchanged for a new treatment liquid.

As described above, the treatment tank 110 stores the treatment liquid L. The treatment liquid L is a mixed liquid of sulfuric acid and hydrogen peroxide solution. In the treatment liquid L, the sulfuric acid concentration (mass concentration) is 80% or more and 90% or less, and the hydrogen peroxide concentration (mass concentration) is 0.8% or more and 2.0% or less.

Here, the treatment tank 110 has a double tank structure. The treatment tank 110 has an inner tank 112 and an outer tank 114 . The inner tub 112 and the outer tub 114 each have an upper opening that opens upward. The inner tank 112 stores the processing liquid L and is configured to accommodate a plurality of substrates W. The outer shell 114 is formed on the outer surface of the upper opening of the inner shell 112 . The height of the upper edge of the outer shell 114 is higher than the height of the upper edge of the inner shell 112 .

The treatment tank 110 further includes a lid 116 . The cover 116 can be opened and closed with respect to the upper opening of the inner tub 112 . When the cover 116 is closed, the cover 116 can block the upper opening of the inner tub 112 .

The cover 116 has a casement door part 116a and a casement door part 116b. The hinged door portion 116a is located on one side of the X-direction of the upper opening of the inner tub 112 . The hinged door portion 116a is disposed near the upper edge of the inner tub 112 and can be opened and closed with respect to the upper opening of the inner tub 112 . The casement door part 116b is located on the other side of the X direction of the upper opening of the inner tub 112. The hinged door portion 116b is disposed near the upper edge of the inner tub 112 and can be opened and closed with respect to the upper opening of the inner tub 112 . The inner tank 112 of the treatment tank 110 can be blocked by closing the hinged door portion 116a and the hinged door portion 116b to cover the upper opening of the inner tub 112 .

The substrate holding part 120 holds the substrate W. The substrate holder 120 moves vertically upward or vertically downward while holding the substrate W. When the substrate holder 120 moves vertically downward, the substrate W held by the substrate holder 120 is immersed in the processing liquid L stored in the inner tub 112 .

The substrate holding part 120 includes a main body plate 122 and a holding bar 124 . The main body plate 122 is a plate extending in the vertical direction (Z direction). The holding rod 124 extends from one main surface of the body plate 122 in a horizontal direction (Y direction). Here, three holding rods 124 extend from one main surface of the body plate 122 in the Y direction. The plurality of substrates W are in a standing position (vertical posture) is maintained.

The substrate holder 120 may further include a lifting unit 126 . The lifting unit 126 has a processing position (a position shown in FIG. 2 ) in which the substrate W held by the substrate holding part 120 is located in the inner tub 112 and a position where the substrate W held by the substrate holding part 120 The body plate 122 is raised and lowered between a retracted position (not shown) where the substrate W is located above the inner tub 112. Therefore, when the body plate 122 is moved to the processing position by the lifting unit 126, the plurality of substrates W held on the holding bar 124 are immersed in the processing liquid. In this way, the processing of the substrate W is performed.

The sulfuric acid supply unit 132 includes a pipe 132a and a valve 132b. From one end of the pipe 132a, sulfuric acid is discharged into the treatment tank 110. The pipe 132a is connected to a sulfuric acid supply source. A valve 132b is disposed on the pipe 132a. The supply of sulfuric acid to the treatment tank 110 can be controlled by the valve 132b. When the valve 132b is opened under the control of the controller 180, the sulfuric acid passing through the pipe 132a is supplied to the treatment tank 110. In the treatment tank 110, sulfuric acid is mixed with the treatment liquid in the treatment tank 110.

For example, sulfuric acid discharged from the pipe 132a is supplied to the inner tank 112 . When the processing liquid overflows from the upper edge of the inner tub 112, the overflowing processing liquid is collected by the outer tub 114 and recovered. Here, sulfuric acid is discharged into the inner tank 112 . In the inner tank 112, one end of a pipe 132a for supplying sulfuric acid to the inner tank 112 from the sulfuric acid supply unit 132 may be disposed.

The hydrogen peroxide supply unit 134 includes a pipe 134a and a valve 134b. From one end of the pipe 134a, hydrogen peroxide water is discharged to the treatment tank 110. The pipe 134a is connected to a hydrogen peroxide solution supply source. A valve 134b is disposed in the pipe 134a. Supply of the hydrogen peroxide solution to the treatment tank 110 can be controlled by the valve 134b. When the valve 134b is opened under the control of the controller 180, the hydrogen peroxide water that has passed through the pipe 134a is supplied to the treatment tank 110. In the treatment tank 110, the hydrogen peroxide solution is mixed with the treatment liquid in the treatment tank 110.

For example, hydrogen peroxide water discharged from the pipe 134a is supplied to the inner tank 112 . When the treatment liquid overflows from the upper edge of the inner tank 112, the overflowing treatment liquid is received by the outer tank 114 and recovered. Here, the hydrogen peroxide solution is discharged to the inner tank 112 . In the inner tank 112, one end of a pipe 134a for supplying hydrogen peroxide solution to the inner tank 112 from the hydrogen peroxide supply unit 134 may be disposed.

The circulation section 140 includes a pipe 141 , a pump 142 , a filter 143 , a heater 144 , an adjustment valve 145 , a valve 146 , and a circulating fluid supply pipe 148 . The pump 142, the filter 143, the heater 144, the regulating valve 145, and the valve 146 are arranged from the upstream to the downstream of the pipe 141 in this order.

The pipe 141 guides the treatment liquid discharged from the treatment tank 110 back to the treatment tank 110 . In detail, the upstream end of the pipe 141 is located in the outer tank 114, and the downstream end of the pipe 141 is located in the inner tank 112. The downstream end of the pipe 141 is connected to the circulating fluid supply pipe 148 located in the inner tank 112 .

The pump 142 sends the treatment liquid from the pipe 141 to the circulating fluid supply pipe 148 . The filter 143 filters the processing liquid flowing through the pipe 141 . The filter 143 filters and removes foreign substances such as particles in the treatment liquid flowing through the pipe 141 .

The heater 144 heats the processing liquid flowing through the pipe 141 . The temperature of the treatment liquid is adjusted by the heater 144 . The heater 144 heats the treatment liquid flowing through the pipe 141 and adjusts the treatment temperature to a treatment temperature (eg, about 100°C to 120°C). The heater 144 may be capable of measuring the temperature of the processing liquid while heating the processing liquid. In this case, the heater 144 has a temperature measuring part while having a heating part.

The control valve 145 adjusts the opening of the pipe 141 to adjust the flow rate of the treatment liquid supplied to the circulating fluid supply pipe 148 . The control valve 145 adjusts the flow rate of the processing liquid. The control valve 145 includes a valve body (not shown) having a valve seat formed therein, a valve body that opens and closes the valve seat, and an actuator (not shown) that moves the valve body between an open position and a closed position. include The same is true for other regulating valves. The valve 146 opens and closes the pipe 141 . In addition, you may omit the regulating valve 145. In this case, the flow rate of the processing liquid supplied to the circulating liquid supply pipe 148 is adjusted by the control of the pump 142 .

The circulating fluid supply pipe 148 is disposed in the inner tank 112 . Here, the circulating fluid supply pipe 148 is disposed at the bottom of the inner tank 112 of the treatment tank 110 . The circulating fluid supply pipe 148 is disposed within the treatment fluid L stored in the inner tank 112 . The circulating fluid supply pipe 148 supplies the circulated treatment fluid to the inner tank 112 .

The drain unit 150 includes a drain pipe 151 , a valve 152 , a drain pipe 153 , a valve 154 , and a valve 155 . The treatment liquid in the inner tub 112 is discharged through the drain pipe 151 and the valve 152 . The treatment liquid in the outer tank 114 is discharged by the drain pipe 153, the valve 154 and the valve 155.

A drain pipe 151 is connected to the bottom wall of the inner tub 112 . A valve 152 is disposed in the drain pipe 151 . The valve 152 is opened and closed by the control device 180 . When the valve 152 is opened, the processing liquid stored in the inner tub 112 passes through the drain pipe 151 and is discharged to the outside. The discharged treatment liquid is sent to a drainage treatment device (not shown) and treated.

A drain pipe 153 is connected to the pipe 141 . Here, the drain pipe 153 is connected to the pipe 141 downstream of the pump 142 . In the pipe 141, a valve 154 is disposed downstream of the connection with the drain pipe 153. A valve 155 is located in the drain pipe 153. By opening the valve 154 and closing the valve 155, the treatment liquid in the treatment tank 110 can pass through the pipe 141 and return to the treatment tank 110, and the treatment liquid in the treatment tank 110 can cycle In addition, by closing the valve 154 and opening the valve 155, the treatment liquid in the treatment tank 110 can be discharged through the pipe 141 and the drain pipe 153.

In addition, in FIG. 2, one control valve 145 and one valve 146 are shown in order to avoid drawing being excessively complicated, but at least one of the control valve 145 and the valve 146 is plural. may be formed.

Control device 180 is configured using, for example, a microcomputer. The control device 180 has an arithmetic unit such as a central processing unit (CPU), a storage unit such as a fixed memory device, a hard disk drive, and an input/output unit. A program to be executed by the arithmetic unit is stored in the storage unit.

Next, with reference to Figs. 1 to 3, an embodiment of the substrate processing apparatus 100 according to the present invention will be described. 3 is a schematic block diagram of the substrate processing apparatus 100 of the present embodiment.

As shown in FIG. 3 , the control device 180 includes a control unit 182 and a storage unit 184 . The control unit 182 controls the operation of each unit of the substrate processing apparatus 100 .

The control unit 182 includes a processor. The processor has, for example, a central processing unit (CPU). Alternatively, the processor may have a general-purpose arithmetic unit.

The storage unit 184 stores data and computer programs. The storage unit 184 includes a main storage device and an auxiliary storage device. The main memory device is, for example, a semiconductor memory. The secondary storage device is, for example, a semiconductor memory and/or a hard disk drive. The storage unit 184 may contain removable media. The processor of the control unit 182 executes the computer program stored in the storage unit 184 to execute the substrate processing method.

The control device 180 controls the substrate holding unit 120, the sulfuric acid supply unit 132, the hydrogen peroxide supply unit 134, the circulation unit 140, and the liquid drainage unit 150 according to a predetermined program. In detail, the control device 180 controls operations of the elevating unit 126, the pump 142, the filter 143, the heater 144, and the like. In addition, the control device 180 controls the opening and closing operations of the valve 132b, the valve 134b, the valve 146, the valve 152, the valve 154, and the valve 155. In addition, the control device 180 controls the opening adjustment operation of the adjustment valve 145 .

The substrate processing apparatus 100 has a concentration sensor 162 . The concentration sensor 162 measures the concentration of sulfuric acid and the concentration of hydrogen peroxide in the treatment liquid in the treatment tank 110 .

For example, the concentration sensor 162 is attached to the treatment tank 110 . The concentration sensor 162 measures a value representing the specific gravity of the treatment liquid stored in the treatment tank 110 . The concentration sensor 162 measures the back pressure of the treatment tank 110 .

For example, the tip of the concentration sensor 162 is disposed at a predetermined depth from the treatment liquid surface of the treatment tank 110 . In the concentration sensor 162, gas is supplied to the tip of the concentration sensor 162 to form bubbles in the treatment liquid of the treatment tank 110. Thus, the liquid pressure of the processing liquid stored in the processing tank 110 is detected as gas pressure at the front end of the concentration sensor 162 disposed at a position at a predetermined depth from the liquid surface of the processing tank 110 . As the gas, nitrogen gas is typically used. By measuring the relationship between the gas pressure and the concentration of sulfuric acid and hydrogen peroxide in the treatment liquid in advance and creating a look-up table indicating the relationship between the gas pressure and the treatment liquid in advance, the specific gravity of the treatment liquid can be determined according to the gas pressure at which gas bubbles are formed. can be measured.

In addition, the control unit 182 functions as a substrate information acquisition unit 182a and a processing liquid adjustment process selection unit 182b by executing a computer program stored in the storage unit 184 . To this end, the control unit 182 includes a substrate information acquisition unit 182a and a processing liquid adjustment process selection unit 182b.

The substrate information acquisition unit 182a acquires substrate information representing information on the substrate W before the substrate processing apparatus 100 processes the substrate W. The substrate information may indicate processing performed before the substrate W is carried into the substrate processing apparatus 100 .

The treatment liquid adjustment process selector 182b selects which one of the liquid exchange process and the concentration adjustment process to be performed as the treatment liquid adjustment process for adjusting the treatment liquid in the treatment tank 110 . The treatment liquid adjustment process selector 182b selects either the liquid exchange process or the concentration adjustment process based on the substrate information. The liquid exchange process and the concentration adjustment process will be described later.

In addition, the control unit 182 functions as a processing liquid information acquisition unit 182c by executing a computer program stored in the storage unit 184. For this reason, the control unit 182 includes a processing liquid information acquisition unit 182c. The processing liquid information acquisition unit 182c acquires processing liquid information indicating information on the processing liquid of the processing tank 110 . For example, the processing liquid information acquisition unit 182c acquires processing liquid information based on the measurement result of the concentration sensor 162 .

Next, with reference to FIGS. 1-4, the substrate processing method of this embodiment is demonstrated. 4 is a flowchart of the substrate processing method of the present embodiment.

As shown in FIG. 4 , in step S10 , substrate information representing information on a substrate to be processed by the substrate processing apparatus 100 is obtained. For example, the board information acquisition unit 182a acquires board information from the storage unit 184 .

For example, the substrate information indicates processing performed on the substrate W before being carried into the substrate processing apparatus 100 . As an example, the substrate information indicates that an ashing treatment was performed on a resist before the substrate W was carried into the substrate processing apparatus 100 . Alternatively, the substrate information indicates that ion implantation has been performed on the resist before the substrate W is carried into the substrate processing apparatus 100 . Alternatively, the substrate information indicates that the substrate W is in a state before element separation and oxidation treatment.

In step S20, a processing liquid adjustment step is selected. The controller 182 selects either the liquid exchange process or the concentration adjustment process as the treatment liquid adjustment process based on the substrate information. For example, the treatment liquid adjustment process selector 182b selects either the liquid exchange process or the concentration adjustment process.

For example, when the substrate W is a substrate that can be appropriately processed even when the concentration range of the processing liquid required to appropriately treat the target substrate to be processed by the substrate processing apparatus 100 is set relatively loosely. , the control unit 182 selects the liquid exchange process as the treatment liquid adjustment process. As an example, in the case of treating a substrate to remove residues from a substrate that has undergone an ashing treatment for resist, the substrate can be appropriately treated even if the concentration range of the treatment liquid is set relatively loosely. For this reason, when the substrate is a substrate subjected to an ashing treatment for the resist, the controller 182 selects the liquid exchange step.

On the other hand, when the substrate W is a substrate that cannot be appropriately processed unless the concentration range of the processing liquid required to appropriately process the target substrate is set relatively narrow, the control unit 182 determines the concentration as the processing liquid adjustment step. Choose an adjustment process. As an example, when the substrate W has a resist subjected to ion implantation, unless the concentration range of the treatment liquid is set relatively strictly, the resist cannot be properly removed or separated. For this reason, when the substrate W is a substrate having a resist on which ion implantation has been performed, the control unit 182 selects a concentration adjustment step.

Alternatively, in the case of oxidizing a substrate separated from elements, the substrate cannot be properly processed unless the concentration range of the treatment liquid is set relatively strictly. For this reason, when the substrate W is a substrate to be oxidized after element separation, the controller 182 selects a concentration adjustment step.

In this way, the controller 182 selects one of the liquid exchange step and the concentration adjustment step for the treatment liquid in the treatment tank 110 based on the substrate information. Typically, before a target substrate arrives at the substrate processing apparatus 100, the control unit 182 selects a processing liquid adjustment step based on substrate information.

When the liquid exchange process is selected in step S20, the process proceeds to step S30. On the other hand, when the concentration adjustment step is selected in step S20, the process proceeds to step S40.

In step S30, a liquid exchange process is performed. The treatment liquid in the treatment tank 110 is adjusted by the liquid exchange step. In this specification, the adjustment of the treatment liquid when the liquid exchange step is selected is sometimes referred to as the first treatment liquid adjustment step.

In this case, it is determined whether or not the treatment liquid in the treatment tank 110 satisfies the standard. The standard may be set based on the sulfuric acid concentration and/or hydrogen peroxide concentration of the treatment liquid in the treatment tank 110 .

Alternatively, the criterion may be set based on the time after liquid exchange of the treatment liquid in the treatment tank 110 . Alternatively, the criterion may be set based on the number of lots of substrates W processed after exchanging the treatment liquid in the treatment tank 110 . The criterion may be set based on the elapsed time since the previous substrate was immersed in the treatment liquid of the treatment tank 110 .

When the treatment liquid in the treatment tank 110 satisfies the standard, the treatment liquid in the treatment tank 110 is not discharged. However, even in this case, in order to maintain the hydrogen peroxide concentration due to the decomposition of the hydrogen peroxide solution, the hydrogen peroxide supply unit 134 may continuously supply the hydrogen peroxide solution to the treatment tank 110 in a constant amount.

Meanwhile, when the treatment liquid in the treatment tank 110 does not satisfy the standard, the treatment liquid in the treatment tank 110 is at least partially exchanged. In this case, at least a part of the treatment liquid in the treatment tank 110 is discharged, and on the other hand, the treatment liquid is supplied to the treatment tank 110 .

When the treatment liquid in the treatment tank 110 is discharged, for example, the treatment liquid in the outer tank 114 is discharged. In this case, the controller 182 drives the pump 142 to open the valve 155 and close the valve 154 . In this way, the treatment liquid in the outer tank 114 can be discharged. Also, the treatment liquid in the inner tank 112 is discharged. For example, the controller 182 discharges the treatment liquid from the inner tub 112 by opening the valve 152 .

In addition, the treatment liquid is supplied to the treatment tank 110 . In this case, the treatment liquid supply unit 130 supplies the treatment liquid to the treatment tank 110 . For example, the sulfuric acid supply unit 132 supplies sulfuric acid to the treatment tank 110 . The hydrogen peroxide supply unit 134 supplies hydrogen peroxide water to the treatment tank 110 . In this way, the treatment liquid in the treatment tank 110 is adjusted. The sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 respectively supply sulfuric acid and hydrogen peroxide solution at a ratio such that the treatment liquid containing the sulfuric acid and hydrogen peroxide solution supplied from the treatment tank 110 has a predetermined concentration. In this case, the reaction between sulfuric acid and hydrogen peroxide increases the temperature of the treatment liquid.

Alternatively, the processing liquid may be heated while being circulated by driving the pump 142 and the heater 144 so that the processing liquid maintains a predetermined temperature. In this case, the heater 144 heats the processing liquid as needed. For example, when the temperature of the processing liquid is lower than a predetermined temperature, the heater 144 heats the processing liquid to rise to a predetermined temperature. On the other hand, when the temperature of the treatment liquid rises higher than a predetermined temperature due to the reaction between sulfuric acid and hydrogen peroxide, the heater 144 stops heating the treatment liquid so as to lower the temperature of the treatment liquid. Next, the process proceeds to step S50A.

In step S50A, the substrate W is immersed in the treatment liquid of the treatment bath 110 . After that, the substrate W is taken out of the treatment liquid in the treatment tank 110 . As described above, the substrate processing is finished.

In step S40, a concentration adjustment process is performed. The treatment liquid in the treatment tank 110 is adjusted by the concentration adjustment step. In this specification, the adjustment of the treatment liquid when the concentration adjustment step is selected is sometimes referred to as the second treatment solution adjustment step.

In this case, the concentration of the treatment liquid in the treatment tank 110 is adjusted. For example, the concentration of hydrogen peroxide in the treatment liquid of the treatment tank 110 is adjusted. As an example, the concentration of hydrogen peroxide in the treatment liquid of the treatment tank 110 is increased.

Alternatively, the concentration of sulfuric acid in the treatment liquid of the treatment tank 110 is adjusted. As an example, the concentration of sulfuric acid in the treatment liquid of the treatment tank 110 is increased.

Typically, the treatment liquid supply unit 130 supplies the treatment liquid to the treatment tank 110 . For example, the sulfuric acid supply unit 132 supplies sulfuric acid to the treatment tank 110 . The hydrogen peroxide supply unit 134 supplies hydrogen peroxide water to the treatment tank 110 . The sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 respectively supply sulfuric acid and hydrogen peroxide solution at a ratio such that the treatment liquid containing the sulfuric acid and hydrogen peroxide solution supplied from the treatment tank 110 has a predetermined concentration.

For example, when the concentration of hydrogen peroxide in the treatment liquid of the treatment tank 110 is increased, the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 increase the ratio of hydrogen peroxide water to the treatment tank 110. Sulfuric acid and hydrogen peroxide water are supplied so that the hydrogen peroxide concentration increases.

In this case, the treatment liquid in the treatment tank 110 is circulated. Here, too, the processing liquid may be heated while being circulated by driving the pump 142 and the heater 144 so that the processing liquid maintains a predetermined temperature.

The control unit 182 supplies sulfuric acid and hydrogen peroxide solution until the concentration of sulfuric acid and/or hydrogen peroxide measured by the concentration sensor 162 reaches a predetermined concentration. In addition, the control unit 182 supplies sulfuric acid and hydrogen peroxide so that the concentration of sulfuric acid and/or hydrogen peroxide measured by the concentration sensor 162 maintains a predetermined concentration. In this way, the control unit 182 may use the concentration sensor 162 to adjust the sulfuric acid concentration and/or the hydrogen peroxide concentration by feedback control. In addition, the concentration adjustment is performed immediately before the substrate W is immersed in the treatment tank 110, and it is preferable not to perform the concentration adjustment when the substrate W is not immersed in the treatment tank 110 for a predetermined period of time. do. Next, the process proceeds to step S50B.

In step S50B, the substrate is immersed in the processing liquid in which the concentration of hydrogen peroxide has been adjusted. After that, the substrate W is taken out of the treatment liquid in the treatment tank 110 . As described above, the substrate processing is finished.

According to this embodiment, the substrate is treated with the adjusted treatment liquid in different aspects depending on the substrate W. For example, when a substrate to be processed in the substrate processing apparatus 100 can be treated with a treatment liquid adjusted to a relatively loose concentration range, the treatment liquid in the treatment tank 110 is adjusted in a liquid exchange step. . In this way, the treatment liquid in the treatment tank 110 is exchanged only when the criteria are not satisfied. Therefore, the replacement frequency of the treatment liquid in the treatment tank 110 can be suppressed, and the cost required for the treatment liquid can be reduced. In addition, when it is necessary to process the substrate to be processed in the substrate processing apparatus 100 with a processing liquid adjusted to a relatively strict concentration range, the processing liquid in the processing tank 110 is adjusted in the concentration adjustment step. In this way, when the substrate is not carried in, it is possible to appropriately process the loaded substrate while avoiding maintaining the treatment liquid in the treatment tank 110 in a state in which the concentration is adjusted. Therefore, according to the present embodiment, excessive use of sulfuric acid and hydrogen peroxide can be avoided depending on the substrate W.

Next, with reference to FIGS. 1 to 5 , a liquid exchanging step of the substrate processing apparatus 100 according to the present embodiment will be described. 5(a) to 5(c) are schematic diagrams for explaining a liquid exchange step in the substrate processing method of the present embodiment.

As shown in Fig. 5(a), the treatment liquid is stored in the treatment tank 110. Here, a fixed amount of treatment liquid is stored in each of the inner tank 112 and the outer tank 114 . As described above, the treatment liquid overflowing from the inner tank 112 flows into the outer tank 114 . The quantity of the inner tank 112 is set to the maximum amount of the container of the inner tank 112.

The quantity of the outer tank 114 is set to an amount smaller than the maximum amount of the container in the outer tank 114. When more treatment liquid than the prescribed amount flows into the outer tank 114, the control unit 182 drives the pump 142 to discharge the treatment liquid from the outer tank 114 to the outside.

As shown in Fig. 5(b), the treatment liquid in the treatment tank 110 is discharged. For example, when discharging the treatment liquid from the inner tub 112, the controller 182 opens the valve 152 to discharge the treatment liquid from the inner tub 112.

Further, when discharging the treatment liquid in the outer tank 114, the control unit 182 closes the valve 154 and opens the valve 155 while driving the pump 142, thereby discharging the treatment liquid in the outer tank 114. emits

The amount of the treatment liquid discharged from the treatment tank 110 may be set according to the elapsed time since the previous liquid exchange. For example, when the time elapsed since the previous liquid exchange was relatively long, the amount of the treatment liquid discharged from the treatment tank 110 is set to be relatively large. Conversely, when the time elapsed since the previous liquid exchange is relatively short, the amount of the treatment liquid discharged from the treatment tank 110 is set to be relatively small.

Alternatively, the amount of the treatment liquid discharged from the treatment tank 110 may be set according to the elapsed time since the previous substrate was immersed. When the time elapsed after immersing the former substrate is relatively long, the amount of the treatment liquid discharged from the treatment tank 110 is set to be relatively large. Conversely, when the time elapsed after immersing the former substrate is relatively short, the amount of the treatment liquid discharged from the treatment tank 110 is set to be relatively small.

Typically, when the treatment liquid is discharged from the treatment tank 110, the treatment liquid in the treatment tank 110 is not circulated. However, the treatment liquid may be discharged from the treatment tank 110 while circulating the treatment liquid in the treatment tank 110 .

As shown in FIG. 5( c ), the treatment liquid supply unit 130 supplies the treatment liquid to the treatment tank 110 . In detail, the sulfuric acid supply unit 132 supplies sulfuric acid to the treatment tank 110 . In addition, the hydrogen peroxide supply unit 134 supplies hydrogen peroxide water to the treatment tank 110 . In this case, the control unit 182 controls the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 so that the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide solution to the treatment tank 110, respectively.

After the treatment liquid is supplied to the treatment tank 110 , the treatment liquid in the treatment tank 110 circulates through the circulation unit 140 . For example, the control unit 182 drives the pump 142 to open the control valve 145 and the valve 146, and opens the valve 154 and closes the valve 155, so that the treatment tank 110 The treatment liquid of circulates from the treatment tank 110 to the treatment tank 110 through the pipe 141 . In addition, the control unit 182 heats the treatment liquid flowing through the pipe 141 by driving the heater 144 .

At this time, in order to maintain the treatment liquid in the treatment tank 110, the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 may supply sulfuric acid and hydrogen peroxide solution to the treatment tank 110. The ratio of the amounts of the sulfuric acid supplied from the sulfuric acid supply unit 132 and the hydrogen peroxide solution supplied from the hydrogen peroxide supply unit 134 is the same as before liquid exchange.

As described above, the treatment liquid in the treatment tank 110 can be adjusted by liquid exchange. According to the present embodiment, the treatment liquid in the treatment tank 110 can be partially discharged and the treatment liquid can be supplied to the treatment tank 110 . For this reason, the processing liquid in the processing bath 110 can be quickly adjusted to processing conditions suitable for substrate processing. In addition, since the treatment liquid in the treatment tank 110 is not completely destroyed, the substrate treatment cost can be reduced.

Next, with reference to FIGS. 1 to 6 , a liquid exchanging step in the substrate processing method of the present embodiment will be described. 6 is a graph showing changes over time in the concentration of sulfuric acid and the concentration of hydrogen peroxide in the treatment tank 110 during the liquid exchange step in the substrate processing method of the present embodiment. In Fig. 6, the line Lsp represents the change in sulfuric acid concentration over time. The line Lhp represents the time change of the hydrogen peroxide concentration.

As shown by the line Lsp, before the liquid exchange period Pp, the sulfuric acid concentration is substantially constant. However, strictly speaking, the sulfuric acid concentration gradually decreases with the passage of time. This is because the hydrogen peroxide water reacts with sulfuric acid in the treatment tank 110 to decompose to produce water.

During the liquid exchange period Pp, the treatment liquid in the treatment tank 110 is at least partially discharged. Also, in the liquid exchange period Pp, sulfuric acid and hydrogen peroxide water are newly supplied to the treatment tank 110. Typically, after discharge of the treatment liquid in the treatment tank 110 is started, a new treatment liquid is supplied to the treatment tank 110 . However, discharge and supply of the treatment liquid in the treatment tank 110 may be performed at an arbitrary timing.

After the liquid exchange period Pp, the sulfuric acid concentration increases compared to before the liquid exchange period Pp. After that, the sulfuric acid concentration gradually decreases with the passage of time.

As shown by the line Lhp, before the liquid exchange period Pp, the hydrogen peroxide concentration is substantially constant. However, strictly speaking, the hydrogen peroxide concentration gradually decreases with the passage of time. This is because the hydrogen peroxide water reacts with sulfuric acid in the treatment tank 110 to decompose to produce water.

After completion of the liquid exchange period Pp, the hydrogen peroxide concentration increases compared to before the liquid exchange period Pp. After that, the hydrogen peroxide concentration decreases with the passage of time.

6 , before and after the liquid exchange period Pp, the treatment liquid in the treatment tank 110 is heated while being circulated through the circulation unit 160 . Also during the liquid exchange period Pp, the treatment liquid in the treatment tank 110 may be heated while being circulated through the circulation unit 160 .

Next, referring to Figs. 1 to 7, the substrate processing method of the present embodiment will be described. 7 is a flowchart in the case where a liquid exchange step is selected in the substrate processing method of the present embodiment.

As shown in FIG. 7 , in step S102 , it is determined whether or not the substrate W to be processed by the substrate processing apparatus 100 is a target substrate for the liquid exchange process. For example, when the substrate W is a substrate obtained by ashing resist, the control unit 182 determines that the substrate W is a target substrate for the liquid exchange process. Typically, before a substrate reaches the substrate processing apparatus 100, the control unit 182 determines whether the substrate W is a target substrate.

When the substrate W is not the target substrate (NO in step S102), the process returns to step S102. On the other hand, if the substrate W is the target substrate (YES in step S102), the process proceeds to step S104.

In step S104, it is determined whether or not the treatment liquid in the treatment tank 110 satisfies a predetermined criterion. A predetermined criterion is set as an index indicating that the substrate W can be appropriately treated without adjusting the treatment liquid in the treatment tank 110 . When the treatment liquid in the treatment tank 110 satisfies a predetermined standard, the treatment liquid in the treatment tank 110 is not discharged. On the other hand, when the treatment liquid in the treatment tank 110 does not satisfy a predetermined standard, the treatment liquid in the treatment tank 110 is discharged and adjusted.

A predetermined criterion may be set based on the concentration of the treatment liquid in the treatment tank 110 . For example, a predetermined criterion is set based on the concentration of hydrogen peroxide in the treatment liquid of the treatment tank 110 . For example, when the concentration of hydrogen peroxide in the treatment liquid in the treatment tank 110 is equal to or greater than a predetermined value, the controller 182 determines that a predetermined standard is satisfied. On the other hand, when the concentration of hydrogen peroxide in the treatment liquid of the treatment tank 110 is lower than a predetermined value, the control unit 182 determines that the predetermined standard is not satisfied.

When the treatment liquid in the treatment tank 110 satisfies the predetermined criteria (YES in step S104), the process proceeds to step S112. On the other hand, when the treatment liquid in the treatment tank 110 does not satisfy the predetermined criterion (NO in step S104), the process proceeds to step S106.

In step S106, the treatment liquid in the treatment tank 110 is discharged. At least a part of the treatment liquid accumulated in the treatment tank 110 is discharged. The control unit 182 drives the pump 142 to open the valve 154 and close the valve 155 to discharge the treatment liquid from the outer tank 114 . Further, the controller 182 discharges the treatment liquid from the inner tub 112 by opening the valve 152 .

In step S108, the treatment liquid is supplied to the treatment tank 110. The treatment liquid supply unit 130 supplies the treatment liquid to the treatment tank 110 . Under the control of the control unit 182, the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide solution to the treatment tank 110.

In step S110, the supply of the treatment liquid to the treatment tank 110 is stopped. Under the control of the control unit 182, the supply of sulfuric acid and hydrogen peroxide from the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 to the treatment tank 110 is stopped.

In step S112, the treatment liquid is heated while circulating the treatment liquid in the treatment tank 110. Under the control of the controller 182, the pump 142 is driven to open the regulating valve 145 and the valve 146, and the valve 154 is opened and the valve 155 is closed, so that the treatment tank 110 The treatment liquid circulates from the treatment tank 110 to the treatment tank 110 through the pipe 141 . In addition, under the control of the controller 182, the heater 144 heats the processing liquid flowing through the pipe 141.

In step S114, it is determined whether or not the temperature of the processing liquid is a predetermined temperature. When the temperature of the treatment liquid is not the predetermined temperature (NO in step S114), the process returns to step S112. On the other hand, if the temperature of the processing liquid is the predetermined temperature (YES in step S114), the process proceeds to step S116.

In step S116, the substrate W is immersed in the treatment liquid of the treatment tank 110. Typically, the substrate holding part 120 descends toward the treatment tank 110 while holding the substrate W, and immerses the substrate W in the treatment liquid of the treatment tank 110 . At this time, the treatment liquid supply unit 130 does not need to supply sulfuric acid and hydrogen peroxide solution to the treatment tank 110 . Alternatively, with respect to the treatment liquid of the treatment tank 110 , the treatment liquid supply unit 130 may supply only the hydrogen peroxide solution to the treatment tank 110 . In any case, it is preferable to heat the treatment liquid in the treatment tank 110 while circulating the treatment liquid in the treatment tank 110 by driving the heater 144 together with the pump 142 .

After that, the substrate W is pulled up from the treatment tank 110 . Typically, the substrate W is carried out of the substrate processing apparatus 100 .

In step S118, it is determined whether the substrate W to be processed next by the substrate processing apparatus 100 is a target substrate. Typically, before the next substrate arrives at the substrate processing apparatus 100, the control unit 182 determines whether or not the substrate W is a target substrate.

When the next substrate W is not the target substrate (NO in step S118), the process ends. On the other hand, if the next substrate W is the target substrate (YES in step S118), the process proceeds to step S120.

In step S120, it is determined whether or not the treatment liquid in the treatment tank 110 satisfies a predetermined criterion. A predetermined criterion is set in the same way as in step S104.

When the treatment liquid in the treatment tank 110 does not satisfy the predetermined criterion (NO in step S120), the process returns to step S106. On the other hand, when the treatment liquid in the treatment tank 110 satisfies the predetermined criteria (YES in step S120), the process returns to step S116. Also in this case, the treatment liquid supply unit 130 does not need to supply sulfuric acid and hydrogen peroxide solution to the treatment liquid of the treatment tank 110 . Alternatively, the treatment liquid supply unit 130 may supply only the hydrogen peroxide solution to the treatment liquid of the treatment tank 110 . In any case, it is preferable to heat the treatment liquid in the treatment tank 110 while circulating the treatment liquid in the treatment tank 110 by driving the heater 144 together with the pump 142 .

In the present embodiment, when the treatment liquid in the treatment tank 110 satisfies a predetermined standard as described above, the substrate W is immersed without discharging the treatment liquid. On the other hand, when the treatment liquid in the treatment tank 110 does not satisfy a predetermined standard, at least a part of the treatment liquid in the treatment tank 110 is discharged, and sulfuric acid and hydrogen peroxide solution are newly supplied to treat the treatment tank 110 ) at least partially exchange the treatment liquid. In this way, it is possible to reduce the number of liquid exchanges of the treatment liquid and suppress an increase in the cost of the treatment liquid.

As described above, with reference to FIGS. 5 to 7 , the liquid exchanging step and the flow when the liquid exchanging step is selected in the substrate processing method of the present embodiment have been described. In addition, the concentration adjustment step in the substrate processing method of the present embodiment is performed as follows.

Next, with reference to Figs. 1 to 8, the concentration adjustment step in the substrate processing method of the present embodiment will be described. 8(a) to 8(c) are schematic diagrams for explaining the concentration adjustment step in the substrate processing method of the present embodiment.

As shown in Fig. 8(a), the state of the treatment liquid in the treatment tank 110 is maintained. Here, a fixed amount of treatment liquid is stored in each of the inner tank 112 and the outer tank 114 . For example, the treatment liquid in the treatment tank 110 is maintained in a constant state by being circulated and heated.

For example, the treatment liquid in the treatment tank 110 is maintained at a sulfuric acid concentration of 75% or more and 90% or less, a hydrogen peroxide concentration of 0.8% or more and 2.0% or less, and a temperature of 100°C or more and 140°C or less. As an example, the treatment liquid held in the treatment tank 110 has a sulfuric acid concentration of 82%, a hydrogen peroxide concentration of 1.0%, and a temperature of 110°C.

Under the control of the controller 182, the temperature of the treatment liquid in the treatment tank 110, the concentration of sulfuric acid in the treatment liquid, and the concentration of hydrogen peroxide in the treatment liquid are maintained. Specifically, the sulfuric acid supply unit 132 supplies a predetermined amount of sulfuric acid to the treatment tank 110, and the hydrogen peroxide supply unit 134 supplies a predetermined amount of hydrogen peroxide solution to the treatment tank 110. In addition, the heater 144 heats the processing liquid with a certain amount of electric power.

As shown in Fig. 8(b), the concentration of the treatment liquid in the treatment tank 110 is adjusted. At this time, the ratio of the amounts of the sulfuric acid supplied from the sulfuric acid supply unit 132 and the hydrogen peroxide solution supplied from the hydrogen peroxide supply unit 134 is changed. For example, the concentration of the treatment liquid in the treatment bath 110 is adjusted immediately before the substrate W is immersed in the treatment liquid in the treatment bath 110 .

Here, the concentration of hydrogen peroxide is increased while maintaining the concentration of sulfuric acid in the treatment liquid of the treatment tank 110 . In this case, the control unit 182 controls the hydrogen peroxide supply unit 134 to increase the supply amount of the hydrogen peroxide solution until the concentration of hydrogen peroxide in the treatment liquid in the treatment tank 110 increases. Also, the control unit 182 controls the sulfuric acid supply unit 132 to supply sulfuric acid to such an extent that the concentration of sulfuric acid in the treatment liquid in the treatment tank 110 is maintained.

As an example, the treatment liquid held in the treatment tank 110 has a sulfuric acid concentration of 82%, a hydrogen peroxide concentration of 1.4%, and a temperature of 110°C.

Thereafter, the control unit 182 immerses the substrate W in the treatment liquid of the treatment tank 110 and performs processing in the treatment tank 110 until the substrate W is lifted up from the treatment liquid of the treatment tank 110. The temperature of the liquid, the concentration of sulfuric acid in the treatment liquid, and the concentration of hydrogen peroxide in the treatment liquid are maintained. Specifically, the sulfuric acid supply unit 132 supplies a predetermined amount of sulfuric acid to the treatment tank 110, and the hydrogen peroxide supply unit 134 supplies a predetermined amount of hydrogen peroxide solution to the treatment tank 110. In addition, the heater 144 heats the processing liquid with a certain amount of electric power.

After lifting the substrate W from the treatment liquid in the treatment tank 110, the control unit 182 changes the temperature of the treatment liquid in the treatment tank 110, the concentration of sulfuric acid in the treatment liquid, and the concentration of hydrogen peroxide in the treatment liquid. . Typically, the controller 182 changes any one of the temperature of the treatment liquid in the treatment tank 110, the concentration of sulfuric acid in the treatment liquid, and the concentration of hydrogen peroxide in the treatment liquid in a state before the substrate W is immersed. .

As shown in Fig. 8(c), the state of the treatment liquid in the treatment tank 110 is returned. Here, the concentration of hydrogen peroxide is reduced while maintaining the concentration of sulfuric acid in the treatment liquid of the treatment tank 110 . In this case, the controller 182 controls the hydrogen peroxide supply unit 134 to decrease the amount of hydrogen peroxide water supplied until the concentration of hydrogen peroxide in the treatment liquid in the treatment tank 110 decreases. Also, the control unit 182 controls the sulfuric acid supply unit 132 to supply sulfuric acid to such an extent that the concentration of sulfuric acid in the treatment liquid in the treatment tank 110 is maintained. At this time, the ratio of the amounts of the sulfuric acid supplied from the sulfuric acid supply unit 132 and the hydrogen peroxide solution supplied from the hydrogen peroxide supply unit 134 is changed again.

As an example, the treatment liquid held in the treatment tank 110 has a sulfuric acid concentration of 82%, a hydrogen peroxide concentration of 1.0%, and a temperature of 110°C.

After that, the controller 182 maintains the temperature of the treatment liquid in the treatment tank 110, the concentration of sulfuric acid in the treatment liquid, and the concentration of hydrogen peroxide in the treatment liquid. Specifically, the sulfuric acid supply unit 132 supplies a predetermined amount of sulfuric acid to the treatment tank 110, and the hydrogen peroxide supply unit 134 supplies a predetermined amount of hydrogen peroxide solution to the treatment tank 110. In addition, the heater 144 heats the processing liquid with a certain amount of electric power.

Next, with reference to Figs. 1 to 9, the concentration adjustment step in the substrate processing method of the present embodiment will be described. 9 is a graph showing changes over time in the sulfuric acid concentration and the hydrogen peroxide concentration in the treatment tank 110 during the concentration adjustment step in the substrate processing method of the present embodiment. In Fig. 9, the line Lsc represents the change in sulfuric acid concentration over time. The line Lhc represents the time change of the hydrogen peroxide concentration.

As indicated by the line Lsc, before the concentration adjustment period Pc, the sulfuric acid concentration is maintained at the target concentration Tsb. However, strictly speaking, the sulfuric acid concentration fluctuates with respect to the target concentration Tsb with the passage of time. This is because the sulfuric acid supply unit 132 supplies sulfuric acid to the treatment tank 110 intermittently based on the measurement result of the concentration sensor 162 . Here, when the sulfuric acid concentration decreases to reach the target concentration Tsb, the sulfuric acid supply unit 132 supplies a predetermined amount of sulfuric acid to the treatment tank 110 . For this reason, the sulfuric acid concentration temporarily increases from the target concentration Tsb.

During the liquid exchange period Pp in the concentration adjustment period Pc, sulfuric acid and hydrogen peroxide water serving as new treatment liquids are supplied to the treatment tank 110. Typically, the concentration adjustment period Pc is a period immediately before the substrate W is immersed in the treatment liquid of the treatment tank 110 .

Here, the sulfuric acid concentration is maintained at the target concentration Tsb even after the concentration adjustment period Pc compared to before the concentration adjustment period Pc. Also in this case, strictly speaking, the sulfuric acid concentration fluctuates with respect to the target concentration Tsb with the passage of time.

On the other hand, as indicated by the line Lhc, before the concentration adjustment period Pc, the hydrogen peroxide concentration is maintained at the target concentration Tob1. However, strictly speaking, the hydrogen peroxide concentration fluctuates with respect to the target concentration Tob1 with the lapse of time. This is because the hydrogen peroxide supply unit 134 supplies the hydrogen peroxide solution to the treatment tank 110 intermittently. Also here, when the hydrogen peroxide concentration decreases to reach the target concentration Tob1, the hydrogen peroxide supply unit 134 supplies a predetermined amount of hydrogen peroxide solution to the treatment tank 110. For this reason, the hydrogen peroxide concentration temporarily increases from the target concentration Tob1.

The hydrogen peroxide concentration increases after the concentration adjustment period Pc compared to before the concentration adjustment period Pc. This is because the target concentration of the hydrogen peroxide solution was changed from the target concentration Tob1 to the target concentration Tob2 by concentration adjustment. However, strictly speaking, the hydrogen peroxide concentration fluctuates with respect to the target concentration Tob2 with the lapse of time. As described above, it is because the hydrogen peroxide supply unit 134 supplies the hydrogen peroxide solution to the treatment tank 110 intermittently.

Thereafter, when the plan to immerse the substrate W in the treatment liquid of the treatment tank 110 has elapsed after a predetermined period of time, the target concentration of hydrogen peroxide returns from the target concentration Tob2 to the target concentration Tob1.

Next, with reference to Figs. 1 to 10, an embodiment of the substrate processing apparatus 100 according to the present invention will be described. 10(a) is a graph showing a change in sulfuric acid concentration in the treatment tank 110 over time in the substrate processing method of the present embodiment, and FIG. It is a graph showing the time change of hydrogen peroxide concentration in (110).

As shown in Fig. 10 (a), the sulfuric acid concentration fluctuates with respect to the target concentration Ts. This is because the sulfuric acid supply unit 132 supplies sulfuric acid to the treatment tank 110 intermittently based on the measurement result of the concentration sensor 162 .

Specifically, when the sulfuric acid supply unit 132 stops the supply of sulfuric acid for a specific period of time, the sulfuric acid concentration gradually decreases with the passage of time. When the concentration sensor 162 measures that the sulfuric acid concentration has reached the lower limit Tsd, the control unit 182 controls the sulfuric acid supply unit 132 so that the sulfuric acid supply unit 132 supplies a predetermined amount of sulfuric acid to the treatment tank 110. do. In addition, the amount of sulfuric acid supplied by the sulfuric acid supply unit 132 is set so that the sulfuric acid concentration measured by the concentration sensor 162 does not exceed the upper limit Tsu. Therefore, the sulfuric acid concentration fluctuates with respect to the target concentration Ts with the lapse of time.

As shown in Fig. 10(b), the hydrogen peroxide concentration fluctuates with respect to the target concentration Th. This is because the hydrogen peroxide supply unit 134 supplies hydrogen peroxide water to the treatment tank 110 intermittently based on the measurement result of the concentration sensor 162 .

Specifically, when the hydrogen peroxide supply unit 134 stops supply of hydrogen peroxide water for a specific period of time, the hydrogen peroxide concentration gradually decreases with the lapse of time. When the concentration sensor 162 measures that the hydrogen peroxide concentration has reached the lower limit Thd, the control unit 182 controls the hydrogen peroxide supply unit 134 so that the hydrogen peroxide supply unit 134 supplies a predetermined amount of hydrogen peroxide solution to the treatment tank 110. Control. In addition, the amount of hydrogen peroxide water supplied by the hydrogen peroxide supplier 134 is set so that the hydrogen peroxide concentration measured by the concentration sensor 162 does not exceed the upper limit Thu. Therefore, the hydrogen peroxide concentration fluctuates with respect to the target concentration Th with the lapse of time.

In addition, as shown in Fig. 10 (a) and Fig. 10 (b), the sulfuric acid concentration and the hydrogen peroxide concentration may be feedback-controlled with respect to the target concentration. Feedback control is preferably performed in the concentration adjustment step. However, feedback control may be performed in the liquid exchange process.

Next, with reference to Figs. 1 to 11, the concentration adjustment step in the substrate processing method of the present embodiment will be described. 11 is a flow chart in the case where the concentration adjustment step in the substrate processing method of the present embodiment is selected.

As shown in FIG. 11 , in step S202, the state of the treatment liquid in the treatment tank 110 is maintained. The control unit 182 maintains the temperature of the treatment liquid in the treatment tank 110, the sulfuric acid concentration, and the hydrogen peroxide concentration of the treatment liquid. Based on the result of the concentration sensor 162, the control unit 182 controls the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 so that the concentrations of sulfuric acid and hydrogen peroxide in the treatment liquid reach predetermined values, respectively. In addition, the control unit 182 controls the heater 144 so that the processing liquid maintains a predetermined temperature based on the temperature measured by the heater 144 .

In step S204, it is determined whether or not the substrate W to be processed by the substrate processing apparatus 100 is a target substrate to be subjected to concentration adjustment. Typically, before a substrate reaches the substrate processing apparatus 100, the control unit 182 determines whether the substrate W is a target substrate.

For example, when the substrate W is a substrate having a resist on which ion implantation has been performed, the controller 182 determines that the substrate W is a target substrate for concentration adjustment. Alternatively, if the substrate W is a substrate to be subjected to oxidation treatment after device separation, the control unit 182 determines that the substrate W is a target substrate for concentration adjustment.

When the substrate W is not the target substrate (NO in step S204), the process returns to step S202. On the other hand, if the substrate W is the target substrate (YES in step S204), the process proceeds to step S206.

In step S206, the concentration of hydrogen peroxide in the treatment liquid in the treatment tank 110 is increased. Typically, the control unit 182 controls the hydrogen peroxide supply unit 134 to increase the supply amount of the hydrogen peroxide solution until the concentration of hydrogen peroxide in the treatment liquid in the treatment tank 110 increases. Also, the control unit 182 controls the sulfuric acid supply unit 132 to supply sulfuric acid to such an extent that the concentration of sulfuric acid in the treatment liquid in the treatment tank 110 is maintained.

In step S208, it is determined whether or not the concentration adjustment of the processing liquid has been completed. When the hydrogen peroxide concentration increases and the concentration sensor 162 indicates a predetermined value, the concentration adjustment of the treatment liquid is finished.

If the adjustment of the processing liquid has not ended (NO in step S208), the process returns to step S206. On the other hand, when the adjustment of the processing liquid is completed (YES in step S208), the process proceeds to step S210.

In step S210, the state of the treatment liquid in the treatment tank 110 is maintained. The controller 182 maintains the temperature of the treatment liquid in the treatment tank 110, the concentration of sulfuric acid in the treatment liquid, and the concentration of hydrogen peroxide in the treatment liquid. Specifically, the sulfuric acid supply unit 132 supplies a predetermined amount of sulfuric acid to the treatment tank 110, and the hydrogen peroxide supply unit 134 supplies a predetermined amount of hydrogen peroxide solution to the treatment tank 110. In addition, the heater 144 heats the processing liquid with a certain amount of electric power.

In step S212, the substrate W is immersed in the treatment liquid of the treatment tank 110. Typically, the substrate W is carried into the substrate processing apparatus 100 and is immersed in the processing liquid of the processing tank 110 . After that, the substrate W is carried in from the substrate processing apparatus 100 . After that, the process proceeds to step S214.

In step S214, the substrate processing apparatus 100 determines whether there is a substrate W to be processed next, and whether the substrate W is a target substrate. Typically, before the next substrate arrives at the substrate processing apparatus 100, the control unit 182 determines the presence or absence of the next substrate W and whether or not the next substrate W is a target substrate.

If there is no next substrate W, or if the next substrate W is not the target substrate (NO in step S214), the process proceeds to step S216. On the other hand, if there is a next substrate W and the substrate W is the target substrate (YES in step S214), the process returns to step S210.

In step S216, the hydrogen peroxide concentration of the treatment liquid in the treatment tank 110 is lowered. Typically, the control unit 182 controls the hydrogen peroxide supply unit 134 to decrease the amount of hydrogen peroxide water supplied until the concentration of hydrogen peroxide in the treatment liquid in the treatment tank 110 decreases. Also, the control unit 182 controls the sulfuric acid supply unit 132 to supply sulfuric acid to such an extent that the concentration of sulfuric acid in the treatment liquid in the treatment tank 110 is maintained.

In step S218, it is determined whether or not the concentration adjustment of the processing liquid has been completed. When the concentration of hydrogen peroxide decreases and the concentration sensor 162 indicates a predetermined value, the concentration adjustment of the treatment liquid ends.

If the processing liquid adjustment has not ended (NO in step S218), the process returns to step S216. On the other hand, when the adjustment of the processing liquid is completed (YES in step S218), the process proceeds to step S220.

In step S220, the state of the treatment liquid in the treatment tank 110 is maintained. The controller 182 maintains the temperature of the treatment liquid in the treatment tank 110, the concentration of sulfuric acid in the treatment liquid, and the concentration of hydrogen peroxide in the treatment liquid. Specifically, the sulfuric acid supply unit 132 supplies a predetermined amount of sulfuric acid to the treatment tank 110, and the hydrogen peroxide supply unit 134 supplies a predetermined amount of hydrogen peroxide solution to the treatment tank 110. In addition, the heater 144 heats the processing liquid with a certain amount of electric power.

According to this embodiment, the concentration of the treatment liquid in the treatment tank 110 is adjusted as described above. According to this embodiment, immediately before immersing the substrate W in the treatment tank 110, the treatment liquid in the treatment tank 110 is adjusted to a concentration suitable for processing the substrate W. For this reason, when the substrate is not the object of concentration adjustment, it is not necessary to adjust the concentration of the treatment liquid in the treatment tank 110, and excessive use of the hydrogen peroxide solution can be avoided.

9 and 11, as an example of concentration adjustment, the hydrogen peroxide concentration is increased when the substrate W is the target substrate, but the present embodiment is not limited to this. When the substrate W is a target substrate, the sulfuric acid concentration may be increased.

In the flowchart shown in Fig. 4, the processing liquid adjustment step is selected based on substrate information representing information about the substrate performed before the substrate processing apparatus 100 processes the substrate, but the present embodiment is not limited to this. don't The processing liquid adjustment step may be selected based on the substrate information and other information.

Next, referring to Figs. 1 to 12, the substrate processing method of the present embodiment will be described. 12 is a flowchart of the substrate processing method of the present embodiment.

As shown in FIG. 12 , in step S10 , substrate information about the substrate W to be processed by the substrate processing apparatus 100 is acquired. For example, the board information acquisition unit 182a acquires board information from the storage unit 184 .

In step S10A, treatment liquid information indicating the state of the treatment liquid in the treatment tank 110 is acquired. The treatment liquid information may indicate any one of the concentration of sulfuric acid, the concentration of hydrogen peroxide, and the temperature in the treatment liquid of the treatment tank 110 . For example, the concentration sensor 162 measures the concentration of sulfuric acid and the concentration of hydrogen peroxide in the treatment liquid in the treatment tank 110 . Also, the heater 144 measures the temperature of the processing liquid. The processing liquid information acquisition unit 182c acquires processing liquid information from the concentration sensor 162 and/or the heater 144 .

In step S20, a processing liquid adjustment step is selected. Based on the substrate information and the treatment liquid information, the control unit 182 selects whether to adjust the treatment liquid in the treatment tank 110 to a liquid exchange process or a concentration adjustment process. Typically, before the substrate W arrives at the substrate processing apparatus 100, the control unit 182 selects the processing liquid adjustment step based on the substrate information and the processing liquid information.

For example, based on the substrate information, a target value of the treatment liquid in the treatment tank 110 is set. For example, a target concentration of sulfuric acid, a target concentration of hydrogen peroxide, and a target temperature in the treatment liquid of the treatment bath 110 are set according to the treatment performed on the substrate W before being loaded into the substrate treatment apparatus 100 .

The treatment liquid adjustment process selector 182b selects a treatment liquid adjustment process. For example, the treatment liquid adjustment process selector 182b selects the target sulfuric acid concentration, the target hydrogen peroxide concentration, and the target temperature set based on the substrate information, and the treatment liquid in the treatment tank 110 indicated by the treatment liquid information. The processing liquid adjustment step is selected from the difference between the sulfuric acid concentration, the target hydrogen peroxide concentration, and the target temperature. For example, when the difference is relatively large, the processing liquid adjustment process selector 182b selects the liquid exchange process as the processing liquid adjustment process. On the other hand, when the difference is relatively small, the treatment liquid adjustment process selector 182b selects the concentration adjustment process as the treatment liquid adjustment process.

When the liquid exchange process is selected in step S20, the process proceeds to step S30. On the other hand, when the concentration adjustment step is selected in step S20, the process proceeds to step S40.

In step S30, a liquid exchange process is performed. The treatment liquid in the treatment tank 110 is adjusted by the liquid exchange step. As described above, it is determined whether or not the treatment liquid in the treatment tank 110 satisfies the standard. When the treatment liquid satisfies the criteria, the treatment liquid in the treatment tank 110 is not discharged. When the treatment liquid does not satisfy the standard, the treatment liquid in the treatment tank 110 is discharged and sulfuric acid and hydrogen peroxide solution are newly supplied to the treatment tank 110 . After that, the process proceeds to step S50A.

In step S50A, the substrate W is immersed in the treatment liquid of the treatment bath 110 . After that, the substrate W is taken out of the treatment liquid in the treatment tank 110 . As described above, the substrate processing is finished.

In step S40, a concentration adjustment process is performed. In this case, the concentration of the treatment liquid in the treatment tank 110 is adjusted. Next, the process proceeds to step S50B.

In step S50B, the substrate is immersed in the treatment liquid in the treatment bath 110 . After that, the substrate W is taken out of the treatment liquid in the treatment tank 110 . As described above, the substrate processing is finished.

According to the present embodiment, the treatment solution adjustment step is selected taking not only the substrate information but also the treatment solution information into consideration. For this reason, the substrate W can be appropriately processed in consideration of the time required for adjusting the processing liquid.

In addition, in the description above with reference to FIGS. 1 to 12 , the substrate W was processed by one substrate processing apparatus 100 for the purpose of avoiding excessive complexity of the invention, but the present embodiment Not limited. The substrate W may be processed by two or more substrate processing apparatuses 100 .

Next, with reference to FIG. 13, the substrate processing system 10 provided with the substrate processing apparatus 100 of this embodiment is demonstrated. 13 is a schematic diagram of the substrate processing system 10 provided with the substrate processing apparatus 100 of this embodiment. The substrate processing system 10 shown in FIG. 13 includes a first substrate processing apparatus 100A to a third substrate processing apparatus 100C.

As shown in FIG. 13 , the substrate processing system 10 includes an input unit 20, a plurality of storage units 30, a transfer/receive mechanism 40, a dispensing unit 50, and a buffer unit (BU). ), a first transport device (CTC), a second transport device (WTR), a plurality of substrate processing devices 100, and a control device 180.

The plurality of substrate processing apparatuses 100 include a first substrate processing apparatus 100A, a second substrate processing apparatus 100B, and a third substrate processing apparatus 100C. The 1st substrate processing apparatus 100A, the 2nd substrate processing apparatus 100B, and the 3rd substrate processing apparatus 100C are arrange|positioned side by side in one direction. For example, the 1st substrate processing apparatus 100A, the 2nd substrate processing apparatus 100B, and the 3rd substrate processing apparatus 100C are adjacent to the conveyance path of the 1st conveyance apparatus CTC, and the 1st conveyance apparatus From the vicinity of the conveyance path of (CTC), the first substrate processing apparatus 100A, the second substrate processing apparatus 100B, and the third substrate processing apparatus 100C are arranged in this order.

Here, the first substrate processing apparatus 100A to the third substrate processing apparatus 100C store a processing liquid containing sulfuric acid and hydrogen peroxide solution. Substrates W subjected to different treatments may be put into each of the first substrate processing apparatus 100A to the third substrate processing apparatus 100C.

The substrate W to be processed in the substrate processing apparatus 100 is carried in from the input unit 20 . The injection unit 20 includes a plurality of placement tables 22 . The substrate W processed by the substrate processing apparatus 100 is carried out from the delivery unit 50 . The dispensing unit 50 includes a plurality of placement tables 52 .

In the input unit 20, a storage unit 30 accommodating the substrate W is placed. The storage unit 30 placed in the input unit 20 accommodates a substrate W that has not been processed by the substrate processing apparatus 100 . Here, the two accommodating parts 30 are respectively mounted on the two mounting tables 22 .

Each of the plurality of accommodating portions 30 accommodates a plurality of substrates W. Each board|substrate W is accommodated in the accommodating part 30 in a horizontal posture. The storage unit 30 is, for example, a FOUP (Front Opening Unified Pod).

The accommodating part 30 placed in the dispensing part 50 accommodates the substrate W processed by the substrate processing apparatus 100 . The dispensing unit 50 includes a plurality of placement tables 52 . The two accommodating parts 30 are respectively mounted on the two mounting tables 52 . The dispensing unit 50 stores the processed substrates W in the accommodating unit 30 and dispenses the processed substrates W for each accommodating unit 30 .

The buffer unit BU is disposed adjacent to the input unit 20 and the dispensing unit 50 . The buffer unit BU receives the housing unit 30 placed in the input unit 20 for each substrate W and places the housing unit 30 on a shelf (not shown). Further, the buffer unit BU receives the processed substrate W and stores it in the storage section 30, and also places the storage section 30 on the shelf. In the buffer unit BU, a transmission/reception mechanism 40 is disposed.

The transfer/receipt mechanism 40 transfers/receives the storage unit 30 between the input unit 20 and the dispensing unit 50 and the shelf. In addition, the transfer mechanism 40 transfers only the substrate W with respect to the first conveying device CTC. In short, the transfer mechanism 40 transfers lots of substrates W with respect to the first conveying device CTC.

After receiving a lot of unprocessed substrates W from the transfer/receive mechanism 40, the first conveying device CTC converts the postures of the plurality of substrates W from a horizontal posture to a vertical posture, The board|substrate W of this is passed to the 2nd conveyance apparatus WTR. In addition, after receiving a lot of processed substrates W from the second transfer device WTR, the first conveying device CTC converts the posture of the plurality of substrates W from a vertical posture to a horizontal posture, , the lot of substrates W is passed to the transfer/receive mechanism 40 .

The second transfer device WTR is movable from the third substrate processing device 100C to the second substrate processing device 100B along the longitudinal direction of the substrate processing system 10 . The second transfer device WTR can carry in and out lots of substrates W from the first substrate processing device 100A, the second substrate processing device 100B, and the third substrate processing device 100C.

The control device 180 controls various operations of the substrate processing system 10 . In detail, the control apparatus 180 controls the transfer/receive mechanism 40, the 1st conveyance apparatus CTC, the 2nd conveyance apparatus WTR, and the substrate processing apparatus 100.

The control device 180 includes a control unit 182 and a storage unit 184 . Control unit 182 has a processor. The control unit 182 has, for example, a central processing arithmetic unit. Alternatively, the control unit 182 may have a general-purpose arithmetic unit.

The storage unit 184 stores data and computer programs. Data includes recipe data. Recipe data includes information indicating a plurality of recipes. Each of the plurality of recipes defines the processing content and processing sequence of the substrate W.

The storage unit 184 includes a main storage device and an auxiliary storage device. The main memory device is, for example, a semiconductor memory. The secondary storage device is, for example, a semiconductor memory and/or a hard disk drive. The storage unit 184 may contain removable media. The storage unit 184 corresponds to an example of a non-transitory computer-readable storage medium.

In the storage unit 184, computer programs whose order is determined in advance are stored. The substrate processing apparatus 100 operates according to a procedure determined by a computer program. The control unit 182 executes a computer program stored in the storage unit 184 to perform a substrate processing operation. The processor of the control unit 182 executes the computer program stored in the storage unit 184 to transmit/receive mechanisms 40, the first transfer unit (CTC), the second transfer unit (WTR), and the substrate processing unit. (100) to control.

As mentioned above, embodiment of this invention was described referring drawings. However, the present invention is not limited to the above embodiments, and can be implemented in various aspects without departing from the gist thereof. In addition, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above-described embodiment. For example, some components may be deleted from all components shown in the embodiments. Further, components from different embodiments may be appropriately combined. In the drawings, for ease of understanding, each constituent element is schematically shown as a main body, and the thickness, length, number, spacing, etc. of each constituent element shown may be different from the actual one for convenience of drawing. In addition, the material, shape, size, etc. of each component shown in the above-described embodiment are examples and are not particularly limited, and various changes are possible within a range that does not substantially deviate from the effects of the present invention.

The present invention is preferably used for a substrate processing apparatus and a substrate processing method.

10: Substrate handling system
100: substrate processing device
110: treatment tank
112: housekeeper
114: Outlaw
120: substrate holding unit
130: treatment liquid supply unit
180: control device
182: control unit
184: storage unit
W: Substrate

Claims (7)

A substrate processing method in which a substrate is treated by immersing a substrate in the processing liquid in a processing tank storing a processing liquid containing sulfuric acid and hydrogen peroxide, comprising:
acquiring substrate information indicating information on the substrate before immersing the substrate in the processing liquid in the processing tank;
a process of selecting one of a liquid exchange process and a concentration adjustment process as a treatment liquid adjustment process for adjusting the treatment liquid based on the substrate information;
When the liquid exchange step is selected in the selection process, when the treatment liquid in the treatment tank does not satisfy a predetermined condition, at least a part of the treatment liquid in the treatment tank is discharged from the treatment tank, and the treatment A first treatment liquid adjustment step of adjusting the treatment liquid in the treatment tank by supplying sulfuric acid and hydrogen peroxide to the tank;
When the concentration adjustment step is selected in the selection step, a second treatment liquid adjustment step of adjusting the concentration of the treatment liquid in the treatment tank while circulating the treatment liquid in the treatment tank through a pipe connected to the treatment tank class,
a step of immersing the substrate in the treatment liquid of the treatment tank while circulating the treatment liquid of the treatment tank adjusted in the first treatment solution adjustment step or the second treatment solution adjustment step through a pipe connected to the treatment tank;
Including, a substrate processing method. According to claim 1,
In the step of obtaining the substrate information, when the substrate information indicates that an ashing treatment has been performed on the resist of the substrate, in the step of selecting, the liquid exchange step is selected;
In the step of obtaining the substrate information, when the substrate information indicates either that ion implantation has been performed into the resist of the substrate or that the substrate is decoupled, in the step of selecting, the A substrate processing method for selecting a concentration adjustment step. According to claim 1 or 2,
In the first treatment liquid adjustment step, when the treatment liquid in the treatment tank satisfies a predetermined condition, the treatment liquid in the treatment tank is not discharged. According to claim 1 or 2,
The first treatment liquid adjusting step includes a step of setting an amount of the treatment liquid discharged from the treatment tank based on a time elapsed after immersing the substrate in the treatment liquid of the treatment tank before immersing the substrate. To, the substrate processing method. According to claim 1 or 2,
The second treatment liquid adjusting step includes a step of adjusting the hydrogen peroxide concentration of the treatment liquid based on a measurement result of a concentration sensor for measuring the concentration of the treatment liquid in the treatment tank. According to claim 1 or 2,
In the second processing liquid adjustment step,
supplying hydrogen peroxide solution to the treatment tank to increase the hydrogen peroxide concentration of the treatment solution of the treatment tank before immersing the substrate in the treatment solution of the treatment tank;
a step of lowering the concentration of hydrogen peroxide in the treatment liquid in the treatment tank after immersing the substrate in the treatment liquid in the treatment tank;
Including, a substrate processing method. A treatment tank for storing a treatment liquid containing sulfuric acid and hydrogen peroxide;
a circulation unit having a pipe through which the treatment liquid in the treatment tank circulates;
a drainage unit for discharging the treatment liquid from the treatment tank;
A treatment liquid supply unit for supplying sulfuric acid and hydrogen peroxide to the treatment tank;
a substrate holding portion holding a substrate and immersing the substrate in the treatment liquid in the treatment tank;
A control unit controlling the circulation unit, the drainage unit, the treatment liquid supply unit, and the substrate holding unit.
to provide,
The control unit may adjust the processing liquid based on substrate information representing information about the substrate before immersing the substrate in the processing liquid in the processing tank, wherein the processing liquid is adjusted according to one of a liquid exchanging process and a concentration adjusting process. choose something,
When the liquid exchanging process is selected, the control unit discharges at least a part of the treatment liquid in the treatment tank from the treatment tank when the treatment liquid in the treatment tank does not satisfy a predetermined condition, and supplies the treatment liquid. controlling the drainage unit and the treatment liquid supply unit to perform a first treatment liquid adjustment step of supplying the sulfuric acid and the hydrogen peroxide solution to the treatment tank to adjust the treatment liquid in the treatment tank;
When the concentration adjustment step is selected, the control unit performs a second treatment liquid adjustment step of adjusting the concentration of the treatment liquid while circulating the treatment liquid in the treatment tank through the pipe of the circulation unit. control the unit and the treatment liquid supply unit;
The control unit circulates the treatment liquid of the treatment tank adjusted in the first treatment liquid adjustment step or the second treatment liquid adjustment step through the pipe of the circulation unit, while circulating the substrate in the treatment liquid of the treatment tank. A substrate processing apparatus that controls the circulation portion and the substrate holding portion so as to be immersed.