TWI842036B - Laser processing platform - Google Patents

Abstract

The laser processing platform of the invention is electrically connected to and controlled by a control device of a laser processing equipment, and includes a lifting mechanism, a carrier, two pressure plate assemblies and two driving mechanisms. The lifting mechanism can be installed in the laser processing equipment, the carrier is connected to the lifting mechanism, the pressure plate assembly is pivoted on the left and right sides of the carrier, and the driving mechanism is respectively connected to the two pressure plate assemblies. When the vacuum adsorption device of the laser processing equipment When an object to be processed is placed on the carrier from top to bottom, since the two pressure plate assemblies are installed on the left and right sides of the carrier and are driven to open by the driving mechanism without causing obstruction, there is no need to install an additional moving mechanism in the invention, which can simplify the structure and reduce costs. In addition, the pressure plate assembly presses the left and right sides of the object to be processed to flatten it, so it can accommodate objects to be processed of different lengths.

Description

Laser processing platform

A laser processing platform, in particular, a platform installed in a laser processing device, having a carrier, and capable of using two pressure plate assemblies to press and flatten the object to be processed on the carrier for laser processing.

When manufacturing electronic parts, after multiple electronic components are set on a printed circuit board, the printed circuit board will be packaged so that the majority of electronic components are covered by the packaging layer, that is, a plate-shaped object to be processed will be formed. The object to be processed will then be laser processed and printed by a laser processing device to print the product number or identification barcode on the packaging layer on the surface of each electronic component.

Among them, since the material properties of the printed circuit board, electronic components and packaging layer in the object to be processed are different, the object to be processed will be bent due to the influence of thermal expansion and contraction. At this time, if the object to be processed is directly lasered, the printing accuracy will decrease. Therefore, a flattening device is used in the laser processing equipment to flatten the object to be processed. The flattening device includes a carrier and a pressing frame located above the carrier. The object to be processed is placed on the carrier. The laser processing equipment controls the pressing frame of the flattening device to move from top to bottom, so that the two sides of the object to be processed are pressed by the pressing frame and the carrier to flatten it, and then the object to be processed is laser printed by the laser.

In an automated production line, when placing the workpiece on the carrier, since the workpiece is curved, if the curved workpiece is transported horizontally by a conveyor belt, the workpiece is easily stuck on the conveyor belt or falls off the conveyor belt, resulting in a problem of poor transportation. Therefore, compared with transporting the workpiece to the carrier by a conveyor belt, placing the workpiece on the carrier from top to bottom by a vacuum adsorption device has better positioning accuracy. However, The pressing frame of the leveling device is located above the carrier. Therefore, when the vacuum adsorption device places the object to be processed on the carrier, the leveling device must first move the pressing frame from its original position through another moving mechanism. After the vacuum adsorption device puts down the object to be processed, the pressing frame is moved back to its original position through the mechanism for leveling. This makes the structure of the leveling device more complicated, resulting in increased costs and a larger volume. There is still room for improvement.

The main purpose of this invention is to provide a laser processing platform, hoping to improve the current laser processing equipment, where the vacuum adsorption device used to place the object to be processed and the pressing frame of the leveling device used to level the object to be processed both move from top to bottom, resulting in overlapping and interference of the moving range, and the leveling device needs to move the pressing frame away through a moving mechanism, resulting in a more complicated structure of the leveling device, resulting in increased costs and a larger volume.

To achieve the above-mentioned purpose, the laser processing platform of the invention can be electrically connected to a control device and can place a workpiece to be processed. The laser processing platform includes: a lifting mechanism, which includes a base, a lifting drive and a lifting moving part. The lifting drive is arranged on the base and electrically connected to the control device. The lifting moving part is connected to the lifting drive; a carrier, which is connected to the lifting moving part and defines a working surface. The workpiece to be processed can be placed on the working surface. The carrier has a vacuum suction part extending downward from the working surface. The vacuum suction part is electrically connected to the control device. The carrier is formed with at least one detection opening that passes through the upper and lower sides and the working surface; two pressure plate assemblies, the two pressure plate assemblies are pivotally arranged The two pressure plate assemblies are arranged on the left and right sides of the working surface of the carrier, and the two pressure plate assemblies are arranged opposite to each other; and two driving mechanisms, the two driving mechanisms are respectively arranged at the two ends of the carrier, and are respectively electrically connected to the control device, each driving mechanism is respectively connected to the two pressure plate assemblies, and the two driving mechanisms can drive the two pressure plate assemblies to pivot, so that the two pressure plate assemblies press the work surface. The object to be processed, wherein each driving mechanism comprises a pivot driving member and a driving member, the pivot driving member is arranged on the carrier and connected to the driving member, and the two ends of the driving member can be connected to the two pressure plate assemblies respectively. The pivot driving member of each driving mechanism is electrically connected to the control device and can drive the driving member to move to drive the two pressure plate assemblies to pivot.

The laser processing platform of this invention can be installed in a laser processing device, and is electrically connected to and controlled by the control device of the laser processing device. The two driving mechanisms drive the two pressure plate assemblies to pivot toward the working surface, and can press and level the object to be processed placed on the working surface of the carrier. The laser processing platform has the following advantages:

1. Simplify the structure: When the object to be processed is to be moved to the carrier of the laser processing platform through a vacuum adsorption device in the laser processing equipment, since the two pressure plate assemblies are respectively located on the left and right sides of the working surface and can be pivoted and opened through the two driving mechanisms, it will not hinder the vacuum adsorption device from placing the object to be processed on the working surface from top to bottom. The position of the two pressure plate assemblies does not need to be moved, so there is no need to install a separate moving mechanism, which can effectively simplify the structure and reduce costs. In addition, the two driving mechanisms and the two pressure plate assemblies are both installed on the carrier, so the overall volume can be reduced, and the laser processing equipment can achieve a compact configuration design.

2. The size range of the objects to be processed is wider: Since the two pressure plate assemblies used to flatten the objects to be processed in the laser processing platform are located on the left and right sides of the working surface of the platform, and the objects to be processed are flattened by pressing the left and right sides, and there is no structure for flattening at both ends of the platform, but space is left, so it can be used with objects to be processed of different lengths. The design of the pressure plate assembly to press and flatten the objects to be processed by pivoting can also allow the thickness of the objects to be processed to vary within a certain range, thereby improving the applicable range of the laser processing platform.

3. Can improve laser printing accuracy: The base of the lifting mechanism is installed in the laser processing equipment. When the object to be processed is placed on the working surface of the carrier and pressed and leveled, the visual positioning device of the laser processing equipment can locate the electronic components on the object to be processed through the detection opening of the carrier. At this time, the laser processing equipment can control the lifting drive of the lifting mechanism to move the carrier up and down, so that the position of the object to be processed on the carrier can match the focal length position of the laser of the laser processing equipment, thereby improving the laser printing accuracy and quality.

10: Lifting mechanism

11: Base

12: Lifting drive

13: Lifting and moving parts

14: Guide rail

15: Lead screw

20: Carrier

21: Working surface

22: Vacuum suction unit

221: Vacuum nozzle

23: Detect opening

24: Shaft fixing parts

30: Pressure plate assembly

31: Pressed plate

311: Gap

32: pivot

33: Articulated gear

40: Driving mechanism

41: Pivot drive

42: Driving parts

421: Drive gear

50: Objects to be processed

60:Laser

70: Visual positioning device

Figure 1: A three-dimensional schematic diagram of a preferred embodiment of the laser processing platform of this invention.

Figure 2: A three-dimensional schematic diagram from another perspective of a preferred embodiment of the laser processing platform of this invention.

Figure 3: A front view of the laser processing platform for this creation.

Figure 4: A side view of the laser processing platform for this invention.

Figure 5: A top view of the laser processing platform for this creation.

Figure 6: A schematic diagram of the A-A partial section of Figure 5.

Figure 7: A partial side view of the driving mechanism of the laser processing platform of this invention.

Figure 8: A top-down view of the work surface of the carrier of the laser processing platform of this invention with the object to be processed placed on it.

Figure 9: A schematic diagram of a partial cross-section of the side view of the work surface of the carrier of the laser processing platform of this invention with the object to be processed placed on it.

Please refer to Figures 1 to 5, which are a preferred embodiment of the laser processing platform of the present invention, which can be electrically connected to a control device. As shown in Figure 8, the laser processing platform can place a to-be-processed object 50. The laser processing platform includes a lifting mechanism 10, a carrier 20, two pressure plate assemblies 30 and two driving mechanisms 40. The laser processing platform can be installed in a laser processing device and electrically connected to and controlled by the control device of the laser processing device. The to-be-processed object 50 is preferably in the shape of a plate.

As shown in Figures 1 to 4, the lifting mechanism 10 includes a base 11, a lifting drive 12 and a lifting moving member 13. The lifting drive 12 is disposed on the base 11 and electrically connected to the control device. The lifting moving member 13 is connected to the lifting drive 12. The lifting drive 12 can drive the lifting moving member 13 to move up and down relative to the base 11.

The lifting mechanism 10 includes two guide rails 14 and a lead screw 15. The two guide rails 14 are spaced and vertically arranged on the base 11. The lead screw 15 is vertically pivoted on the base 11 and is located between the two guide rails 14. The lifting drive 12 is connected to the lead screw 15. The lifting moving member 13 is movably arranged on the two guide rails 14 and the lead screw 15. The lifting driving member 12 drives the lead screw 15 to rotate so that the lifting moving member 13 moves up and down relative to the base 11.

As shown in Figures 1, 4 and 5, the carrier 20 is connected to the lifting and moving part 13 and defines a working surface 21, on which the object to be processed 50 can be placed. The carrier 20 has a vacuum suction part 22 extending downward from the working surface 21, and the vacuum suction part 22 is electrically connected to the control device. The carrier 20 is formed with at least one detection opening 23 that passes through the upper and lower sides and the working surface 21. The vacuum suction part 22 is connected to an external vacuum device and can be controlled by the control device to absorb the object to be processed 50 on the working surface 21.

Preferably, the vacuum suction part 22 of the carrier 20 has a plurality of vacuum suction nozzles 221, and the vacuum suction part 22 is located in the center of the working surface 21. The carrier 20 includes two detection openings 23, and the two detection openings 23 are respectively located on both sides of the vacuum suction part 22. The design of the vacuum suction part 22 being located in the center of the working surface 21 can improve the stability of the object 50 being fixedly adsorbed by the vacuum suction part 22.

As shown in Figures 1, 2 and 5, the two pressure plate assemblies 30 are pivotally arranged on the left and right sides of the working surface 21 of the carrier 20, and the two pressure plate assemblies 30 are arranged opposite to each other.

As shown in FIG. 5 , the laser processing platform defines an X direction, and each pressing plate assembly 30 includes a pressing plate component 31 and a pivot 32. The pivots 32 of the two pressing plate components 30 are pivoted on the left and right sides of the working surface 21 of the carrier 20 along the X direction. The pressing plate component 31 of each pressing plate assembly 30 is connected to the corresponding pivot 32 and can be used to press the object 50 to be processed on the working surface 21.

In addition, the carrier 20 includes four rotating shaft fixing parts 24. Two rotating shaft fixing parts 24 are respectively provided on the left and right sides of the working surface 21 of the carrier 20, and the two rotating shaft fixing parts 24 form a pair. The pivot axis 32 of each pressure plate assembly 30 corresponds to and penetrates a pair of the rotating shaft fixing parts 24, thereby improving the stability of the pressure plate assembly 30 installed on the carrier 20 and improving the smoothness of the pivot rotation of the pressure plate assembly 30.

In addition, the plurality of vacuum nozzles 221 of the vacuum suction part 22 of the carrier 20 are arranged at intervals along the X direction, so that the suction position of the vacuum suction part 22 sucking the object 50 to be processed is parallel to the pressing position of the two pressure plate assemblies 30 pressing the object 50 to be processed, thereby further improving the leveling and fixing effects.

As shown in Figures 1 to 5, the two driving mechanisms 40 are respectively arranged at the two ends of the carrier 20 and are respectively electrically connected to the control device. Each driving mechanism 40 is respectively connected to the two pressure plate assemblies 30. The two driving mechanisms 40 can drive the two pressure plate assemblies 30 to pivot, so that the two pressure plate assemblies 30 press the workpiece 50 on the working surface 21. The two driving mechanisms 40 operate simultaneously and drive the two pressure plate assemblies 30 to pivot from the two ends of the two pressure plate assemblies 30 at the same time, which can improve the stability of the pivoting.

Each driving mechanism 40 includes a pivot drive 41 and a driver 42. The pivot drive 41 is disposed on the carrier 20 and connected to the driver 42. Both ends of the driver 42 can be connected to the two pressure plate assemblies 30. The pivot drive 41 of each driving mechanism 40 is electrically connected to the control device and can drive the driver 42 to move to drive the two pressure plate assemblies 30 to pivot. Each pivot drive 41 is preferably a pneumatic cylinder and connected to an external pneumatic device.

In addition, as shown in Figures 6 and 7, each pressure plate assembly 30 includes two pivot gears 33, which are respectively arranged at the two ends of the pivot shaft 32 of the pressure plate assembly 30. The two ends of the driving member 42 of each driving mechanism 40 have a driving gear 421, and each driving gear 421 of the driving member 42 corresponds to and engages with the pivot gear 33 at one end of the pivot shaft 32 of each pressure plate assembly 30. The driving gear 421 cooperates with the pivot gear 33 to improve the transmission efficiency and the stability of rotation.

As shown in FIG. 7 , when the pivot drive member 41 of the drive mechanism 40 drives the corresponding driven member 42 to move upward, the driven member 42 drives the left and right pressure plate assemblies 30 to rotate away from the center of the carrier 20 through the left and right driving gears 421, so that the two pressure plate assemblies 30 are opened; and when the pivot drive member 41 drives the corresponding driven member 42 to move upward, the driven member 42 drives the left and right pressure plate assemblies 30 to rotate away from the center of the carrier 20 through the left and right driving gears 421, so that the two pressure plate assemblies 30 are opened. When the driving member 42 moves downward, the two pressure plate assemblies 30 will rotate toward the center of the carrier 20, and the end of the pressure plate member 31 of the pressure plate assembly 30 will rotate to exceed a horizontal reference plane formed by the pivot 32 of the two pressure plate assemblies 30, thereby increasing the downward pressure provided by the pressure plate member 31, thereby improving the pressure leveling effect.

As shown in Figures 8 and 9, the base 11 of the lifting mechanism 10 of the laser processing platform of the present invention is installed in the laser processing equipment, a laser 60 of the laser processing equipment is located above the carrier 20, and a visual positioning device 70 of the laser processing equipment is located below the carrier 20. The laser processing equipment can absorb and move a to-be-processed object 50 through a vacuum adsorption device, and place it from top to bottom on the working surface 21 of the carrier 20. The control device can control the operation of the vacuum adsorption part 22 of the carrier 20, so that the plurality of vacuum suction nozzles 221 of the vacuum adsorption part 22 adsorb the bottom side of the to-be-processed object 50.

Next, the control device controls the pivot drive member 41 of the two drive mechanisms 40 to operate, so that the pressure plate members 31 and the pivot 32 of the two pressure plate assemblies 30 rotate toward the working surface 21, that is, toward the center of the carrier 20. The pressure plate members 31 of the two pressure plate assemblies 30 will press the left and right sides of the object to be processed 50 respectively, and cooperate with the vacuum suction part 22 to flatten the object to be processed 50. When the vacuum suction device is removed, the visual positioning device 70 can detect the bottom of the electronic component on the object to be processed 50 through the detection opening 23 of the carrier 20 to locate the electronic component, and then perform laser printing through the laser 60.

Among them, the pressure plate components 31 of each pressure plate assembly 30 are spaced apart to form a plurality of notches 311, and the notches 311 can cooperate with the suction nozzle position of the vacuum adsorption device, so that the vacuum adsorption device can be moved away after the two pressure plate assemblies 30 press and fix the object to be processed 50, thereby improving the pressing and leveling effect, and reserving space for reading the number of the object to be processed 50, or for identification marks for direction identification.

Among them, since the electronic components on the object to be processed 50 are often arranged in an array, only one detection opening 23 is required on the carrier 20 to be positioned. By designing the carrier 20 with two detection openings 23, the visual positioning device 70 can be positioned in accordance with different configurations of the electronic components on the object to be processed 50, thereby improving the positioning accuracy. In addition, the control device of the laser processing equipment controls the lifting drive 12 of the lifting mechanism 10 to operate, so that the lifting moving member 13 drives the carrier 20 to move up and down, so that the position of the object to be processed 50 on the carrier 20 can be matched with the focal length position of the laser 60, thereby improving the laser printing accuracy and quality.

Furthermore, since the two pressure plate assemblies 30 are respectively located on the left and right sides of the working surface 21 of the carrier 20 and can be pivoted and opened through the two driving mechanisms 40, they will not hinder the vacuum adsorption device from placing the object 50 to be processed on the carrier 20 from top to bottom. Therefore, the position of the two pressure plate assemblies 30 does not need to be moved, and there is no need to install a moving mechanism for movement, which can effectively simplify the structure and reduce costs. Moreover, the two driving mechanisms 40 and the two pressure plate assemblies 30 are both installed on the carrier 20, so the overall volume can be reduced, and the laser processing equipment can achieve a compact configuration design.

In addition, since the two pressure plate assemblies 30 used to flatten the object 50 in the laser processing platform are located on the left and right sides of the working surface 21 of the carrier 20, and the object 50 is flattened by pressing the left and right sides, and the two ends of the carrier 20 are not provided with a structure for flattening and space is left, it can be used with objects 50 of different lengths. The design of the pressure plate assembly 30 to flatten the object 50 by pivoting can also allow the thickness of the object 50 to vary within a certain range, so that the size range of the object 50 to be processed applicable to the laser processing platform is wider, effectively improving the scope of application.

In summary, the laser processing platform of the invention can be installed in the laser processing equipment, and is electrically connected to and controlled by the control device of the laser processing equipment. Since the two pressure plate assemblies 30 are installed on the left and right sides of the carrier 20, they will not prevent the vacuum adsorption device from placing the object 50 to be processed on the carrier 20, which can effectively simplify the structure of the laser processing equipment and reduce costs. The carrier 20 is moved up and down by the lifting mechanism 10, so that the carrier 20 matches the focal length position of the laser 60, thereby improving the laser printing accuracy.

10: Lifting mechanism

11: Base

12: Lifting drive

13: Lifting and moving parts

14: Guide rail

15: Lead screw

20: Carrier

21: Working surface

22: Vacuum suction unit

221: Vacuum nozzle

23: Detect opening

24: Shaft fixing parts

30: Pressure plate assembly

31: Pressed plate

311: Gap

32: pivot

33: Articulated gear

40: Driving mechanism

42: Driving parts

421: Drive gear

Claims (8)

A laser processing platform, which can be electrically connected to a control device and can place a to-be-processed object, the laser processing platform comprises: a lifting mechanism, which comprises a base, a lifting drive and a lifting moving member, the lifting drive is arranged on the base and electrically connected to the control device, the lifting moving member is connected to the lifting drive; a carrier, which is connected to the lifting moving member and defines a working surface, the working surface can place the to-be-processed object, the carrier has a vacuum suction part extending downward from the working surface, the vacuum suction part is electrically connected to the control device, and the carrier is formed with at least one detection opening that passes through the upper and lower sides and the working surface; two pressure plate assemblies, the two pressure plate assemblies are pivotally arranged on the carrier The two pressure plate assemblies are arranged on the left and right sides of the working surface of the platform, and the two pressure plate assemblies are arranged opposite to each other; and two driving mechanisms, the two driving mechanisms are respectively arranged at the two ends of the platform and are respectively electrically connected to the control device, each driving mechanism is respectively connected to the two pressure plate assemblies, and the two driving mechanisms can drive the two pressure plate assemblies to pivot, so that the two pressure plate assemblies press the waiting material on the working surface The processing object, wherein each driving mechanism comprises a pivot driving member and a driving member, the pivot driving member is arranged on the carrier and connected to the driving member, and the two ends of the driving member can be connected to the two pressure plate assemblies respectively. The pivot driving member of each driving mechanism is electrically connected to the control device and can drive the driving member to move to drive the two pressure plate assemblies to pivot. The laser processing platform as described in claim 1, wherein the laser processing platform defines an X direction, each pressure plate assembly comprises a pressure plate component and a pivot axis, the pivot axes of the two pressure plate components are pivoted on the left and right sides of the working surface of the carrier along the X direction, and the pressure plate component of each pressure plate assembly is connected to the corresponding pivot axis. The laser processing platform as described in claim 1, wherein the vacuum suction portion is located in the center of the working surface, and the carrier includes two detection openings, and the two detection openings are respectively located on both sides of the vacuum suction portion. The laser processing platform as described in claim 2, wherein the vacuum suction portion is located in the center of the working surface, and the carrier includes two detection openings, and the two detection openings are respectively located on both sides of the vacuum suction portion. A laser processing platform as described in claim 4, wherein the vacuum suction portion of the carrier has a plurality of vacuum suction nozzles, and the plurality of vacuum suction nozzles are arranged at intervals along the X direction. A laser processing platform as described in claim 2, 4 or 5, wherein the pressure plate components of each pressure plate assembly are spaced apart to form a plurality of notches. As described in claim 6, the laser processing platform, wherein each driving mechanism comprises a pivot driving member and a driving member, the pivot driving member is arranged on the carrier and connected to the driving member, the two ends of the driving member can be connected to the two pressure plate assemblies, the pivot driving member of each driving mechanism is electrically connected to the control device, and can drive the driving member to move to drive the two pressure plate assemblies to pivot. A laser processing platform as described in claim 7, wherein each pressure plate assembly comprises two pivot gears, respectively, and the two pivot gears are respectively arranged at the two ends of the pivot shaft of the pressure plate assembly, and the two ends of the driving member of each driving mechanism respectively have a driving gear, and each driving gear of the driving member respectively corresponds to and engages with the pivot gear at one end of the pivot shaft of each pressure plate assembly.

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