TW202406656A - Laser machining platform that comprises an elevation mechanism, a carrier table, two press-down plate assemblies, and two drive mechanisms - Google Patents

Abstract

A laser machining platform of the present invention is electrically connected with and controlled by a control device of a laser machining equipment, and comprises an elevation mechanism, a carrier table, two press-down plate assemblies, and two drive mechanisms. The elevation mechanism is mounted in the laser machining equipment. The carrier table is connected to the elevation mechanism. The press-down plate assemblies are pivotally connected to two, left and right, sides of the carrier table. The drive mechanisms are respectively connected to the two press-down plate assemblies. When a vacuum suction-attachment device of the laser machining equipment places, from an upper side toward a lower side, a workpiece on the carrier table, due to being mounted on the two, left and right, sides of the carrier table and driven by the drive mechanisms to open, the two press-down plate assemblies do not cause hinderance, so that there is no need to additionally install a moving mechanism in the present invention. Therefore, the structure can be simplified and the cost can be reduced. Further, the press-down plate assemblies press down two, left and right, sides of the workpiece to flatten it and thus can be used with workpieces having various lengths.

Description

Laser processing platform

A laser processing platform, especially a platform installed in a laser processing equipment and having a carrier platform, and can use two pressure plate assemblies to press and level the object to be processed on the carrier platform for laser processing .

When manufacturing electronic parts, after multiple electronic components are placed on a printed circuit board, the printed circuit board will be encapsulated so that the majority of the electronic components are covered by the encapsulation layer, thereby forming a plate-shaped object to be processed. The object to be processed is then laser processed and printed by a laser of a laser processing equipment, so that the product number or identification barcode is printed on the packaging layer on the surface of each electronic component.

Among them, since the printed circuit boards, electronic components and packaging layers in the object to be processed have different material properties, the object to be processed will be bent due to thermal expansion and contraction. If the object to be processed is directly lasered, the printing accuracy will decrease. Therefore, in the laser processing equipment today, a leveling device is used to level the object to be processed. The leveling device includes A carrier and a pressing frame located above the carrier. The object to be processed will be placed on the carrier. The laser processing equipment then controls the pressing frame of the leveling device from above. Move downward so that both sides of the object to be processed are pressed by the pressing frame and the stage to level it, and then the object to be processed is laser printed through the laser.

In an automated production line, when the object to be processed is placed on the carrier, since the object to be processed is curved, if the bent and deformed object to be processed is transported horizontally through the conveyor belt, the object to be processed will be The object to be processed is easily stuck on the conveyor belt, or easily falls off the conveyor belt, causing problems in transportation. Therefore, compared with transporting the object to be processed to the carrier through the conveyor belt, it is A vacuum adsorption device places the object to be processed on the stage from top to bottom with better positioning accuracy. However, the pressing frame of the leveling device is located above the stage, so when When the vacuum adsorption device wants to place the object to be processed on the stage, the leveling device must first move the pressing frame from the original position through another moving mechanism. After the vacuum adsorption device After the device puts down the object to be processed, the pressing frame is moved back to the original position through the mechanism device for leveling. This causes the structure of the leveling device to be more complex, resulting in increased costs and a larger occupied volume. big, but there is still room for improvement.

The main purpose of this invention is to provide a laser processing platform, hoping to improve the vacuum adsorption device used to place the object to be processed and the leveling device used to level the object to be processed in today's laser processing equipment. The pressing frames all move from top to bottom, causing overlap and interference in the movement range, and the leveling device needs to move the pressing frame through a moving mechanism, making the structure of the leveling device more complex. , resulting in increased cost and larger size.

In order to achieve the purpose disclosed above, the laser processing platform of this invention can be electrically connected to a control device and can place an object to be processed. The laser processing platform includes: A lifting mechanism, which includes a base, a lifting driving member and a lifting moving member. The lifting driving member is provided on the base and is electrically connected to the control device. The lifting moving member is connected to the lifting driving member; A carrier is connected to the lifting and moving member and defines a working surface on which the object to be processed can be placed. The carrier has a vacuum suction part extending downward from the working surface. The suction part is electrically connected to the control device, and the stage is formed with at least one detection opening penetrating the upper and lower sides and the working surface; Two pressure plate assemblies, the two pressure plate assemblies are pivoted on the left and right sides of the working surface of the platform, and the two pressure plate assemblies are arranged oppositely; and Two driving mechanisms are respectively provided at both ends of the stage and are electrically connected to the control device respectively. Each driving mechanism is connected to the two pressure plate assemblies respectively. The two driving mechanisms can drive the pivot of the two pressure plate assemblies. Rotate so that the two pressing plate assemblies press the object to be processed on the working surface.

The laser processing platform of this invention can be installed in a laser processing equipment, and is electrically connected and controlled by the control device of the laser processing equipment. The two driving mechanisms drive the two platen assemblies toward the working surface. Pivoting can press and flatten the object to be processed placed in the working surface of the stage, wherein the laser processing platform has the following advantages: 1. The structure can be simplified: When the object to be processed is to be moved to the stage of the laser processing platform through a vacuum adsorption device in the laser processing equipment, since the two platen components are respectively located on The left and right sides of the working surface can be pivoted and opened through the two driving mechanisms without blocking the vacuum adsorption device from placing the object to be processed on the working surface from top to bottom. The two pressure plate assemblies The position does not need to be moved, so there is no need to install an additional moving mechanism, which can effectively streamline the structure and reduce costs. Moreover, the two driving mechanisms and the two pressure plate assemblies are installed on the stage, so the overall volume can be reduced and the Laser processing equipment is designed to achieve compact configuration. 2. Applicable to a wide range of sizes of objects to be processed: Because the two pressure plate assemblies used to level the objects to be processed in the laser processing platform are located on the left and right sides of the working surface of the stage, and are The object to be processed is flattened by pressing the left and right sides, and the two ends of the platform are not provided with a structure for leveling, leaving space, so it can be used with the objects to be processed of different lengths and sizes. , and the design of the pressure plate assembly to press and level the object to be processed by pivoting can also allow the thickness of the object to be processed to change within a certain range, thereby increasing the applicable range of the laser processing platform. 3. Can improve the accuracy of laser printing: the base of the lifting mechanism is installed in the laser processing equipment. When the object to be processed is placed on the working surface of the stage and pressed flat, The visual positioning device of the laser processing equipment can position the electronic components on the object to be processed through the detection opening of the stage. At this time, the laser processing equipment can then control the lifting drive of the lifting mechanism. The component is actuated, so that the lifting and moving component drives the stage to move up and down, so that the position of the object to be processed on the stage can match the focal length position of the laser of the laser processing equipment, and the laser can be lifted. Printing accuracy and quality.

Please refer to Figures 1 to 5, which is a preferred embodiment of the laser processing platform of this invention. It can be electrically connected to a control device. As shown in Figure 8, the laser processing platform can place an object to be processed. 50. The laser processing platform includes a lifting mechanism 10, a carrier 20, two pressure plate assemblies 30 and two driving mechanisms 40. The laser processing platform can be installed in a laser processing equipment and electrically connected. And controlled by the control device of the laser processing equipment, the object to be processed 50 is preferably in a plate shape.

As shown in FIGS. 1 to 4 , the lifting mechanism 10 includes a base 11 , a lifting driving member 12 and a lifting moving member 13 . The lifting driving member 12 is provided on the base 11 and is electrically connected to the control unit. device, the lifting moving part 13 is connected to the lifting driving part 12, wherein the lifting driving part 12 can drive the lifting moving part 13 to move up and down relative to the base 11.

The lifting mechanism 10 includes two guide slide rails 14 and a lead screw 15. The two guide slide rails 14 are spaced apart and vertically provided on the base 11. The lead screw 15 is vertically pivoted on the base 11. , and is located between the two guide slide rails 14, the lifting driving member 12 is connected to the lead screw 15, the lifting moving member 13 is movably disposed on the two guide slide rails 14 and the lead screw 15, and passes through the The lifting driving member 12 drives the lead screw 15 to rotate so that the lifting moving member 13 moves up and down relative to the base 11 .

As shown in Figures 1, 4 and 5, the carrier 20 is connected to the lifting and moving member 13, and defines a working surface 21. The object to be processed 50 can be placed on the working surface 21. The carrier 20 It has a vacuum suction part 22 extending downward from the working surface 21. The vacuum suction part 22 is electrically connected to the control device. The stage 20 is formed with at least one detection opening 23 penetrating the upper and lower sides and the working surface 21. , the vacuum suction part 22 is connected to an external vacuum device, and can be controlled by the control device to suck the object to be processed 50 on the working surface 21 .

Preferably, the vacuum suction part 22 of the stage 20 has a plurality of vacuum suction nozzles 221. The vacuum suction part 22 is located in the center of the working surface 21. The stage 20 includes two detection openings 23. The openings 23 are respectively located on both sides of the vacuum suction part 22. Through the design of the vacuum suction part 22 being located in the center of the working surface 21, the stability of the object to be processed 50 being fixedly adsorbed by the vacuum suction part 22 can be improved.

As shown in FIG. 1 , FIG. 2 and FIG. 5 , the two pressure plate assemblies 30 are pivoted on the left and right sides of the working surface 21 of the carrier 20 , and the two pressure plate assemblies 30 are arranged oppositely.

Among them, as shown in Figure 5, the laser processing platform defines an Pivoted on the left and right sides of the working surface 21 of the carrier 20, the pressing plate member 31 of each pressing plate assembly 30 is connected to the corresponding pivot 32 and can be used to press the object to be processed 50 on the working surface 21. .

In addition, the stage 20 includes four rotating shaft fixing parts 24. Two rotating shaft fixing parts 24 are respectively provided on the left and right sides of the working surface 21 of the carrying platform 20, and the two rotating shaft fixing parts 24 form a pair. The pivot 32 of the pressure plate assembly 30 corresponds to and penetrates the pair of rotating shaft fixing members 24, thereby improving the stability of the pressure plate assembly 30 being installed on the carrier 20 and improving the pivoting of the pressure plate assembly 30. the fluency.

In addition, the plurality of vacuum suction nozzles 221 of the vacuum suction part 22 of the stage 20 are arranged at intervals along the The pressing positions of the object to be processed 50 are parallel, further improving the leveling and fixing effects.

As shown in FIGS. 1 to 5 , the two driving mechanisms 40 are respectively disposed at both ends of the stage 20 and are electrically connected to the control device respectively. Each driving mechanism 40 is respectively connected to the two pressure plate assemblies 30 . The driving mechanism 40 can drive the two pressure plate assemblies 30 to pivot, so that the two pressure plate assemblies 30 press the object to be processed 50 on the working surface 21, and operate simultaneously through the two driving mechanisms 40, and at the same time from the two pressure plate assemblies. The two ends of 30 drive the two pressure plate assemblies 30 to pivot respectively, which can improve the stability of the pivot.

Each driving mechanism 40 includes a pivot driving member 41 and a driving member 42 respectively. The pivot driving member 41 is disposed on the stage 20 and connected to the driving member 42. The two ends of the driving member 42 can be connected respectively. In the two pressure plate assemblies 30, the pivot driving member 41 of each driving mechanism 40 is electrically connected to the control device, and can drive the driving member 42 to move to drive the two pressure plate assemblies 30 to pivot. Part 41 is preferably a pneumatic cylinder and connected to an external pneumatic device.

In addition, as shown in FIGS. 6 and 7 , each pressure plate assembly 30 includes two pivot gears 33 respectively. The two pivot gears 33 are respectively disposed at both ends of the pivot shaft 32 of the pressure plate assembly 30 . Each driving mechanism Both ends of the driving member 42 of the driving member 40 are respectively provided with a driving rack 421. Each driving rack 421 of the driving member 42 corresponds to and engages the pivot gear 33 at one end of the pivot shaft 32 of each pressure plate assembly 30. The cooperation between the driving rack 421 and the pivot gear 33 can improve transmission efficiency and rotational stability.

As shown in Figure 7, when the pivot driving member 41 of the driving mechanism 40 drives the corresponding driving member 42 to move upward, the driving member 42 will drive the pressure plates on the left and right sides respectively through the driving racks 421 on the left and right sides. The assembly 30 rotates in a direction away from the center of the stage 20, causing the two pressure plate assemblies 30 to open; and when the pivot driving member 41 drives the corresponding driving member 42 to move downward, the two pressure plate assemblies 30 will move toward the The platform 20 rotates in the center direction, and the end of the pressure plate member 31 of the pressure plate assembly 30 will rotate to exceed a horizontal reference plane formed by the pivots 32 of the two pressure plate assemblies 30. Lifting the pressure plate member 31 provides The force of downward pressure improves the leveling effect.

As shown in Figures 8 and 9, the base 11 of the lifting mechanism 10 of the laser processing platform of the present invention is installed in the laser processing equipment, and one of the lasers 60 of the laser processing equipment is located on the carrier. Above the stage 20, a visual positioning device 70 of the laser processing equipment is located below the stage 20. The laser processing equipment can suck and move an object to be processed 50 through a vacuum adsorption device, and by Placed on the working surface 21 of the stage 20 from top to bottom, the control device can control the operation of the vacuum suction part 22 of the stage 20 so that the plurality of vacuum suction nozzles 221 of the vacuum suction part 22 adsorb the to-be-processed The bottom side of object 50.

Then, the control device controls the pivot driving member 41 of the two driving mechanisms 40 to operate, so that the pressing plate member 31 and the pivot shaft 32 of the two pressing plate assemblies 30 are respectively directed toward the working surface 21 , that is, toward the center of the stage 20 Rotate, the pressure plate parts 31 of the two pressure plate assemblies 30 will respectively press the left and right sides of the object to be processed 50, and cooperate with the vacuum suction part 22 to level the object to be processed 50. When the vacuum suction device After being removed, the visual positioning device 70 can detect the bottom of the electronic component on the object to be processed 50 through the detection opening 23 of the stage 20 to position the electronic component, and then use the laser 60 Perform laser printing jobs.

Among them, the pressure plate member 31 of each pressure plate assembly 30 is formed with a plurality of notches 311 at intervals. The notches 311 can match the position of the suction nozzle of the vacuum adsorption device, so that the vacuum adsorption device can wait for the two pressure plate assemblies 30 to be pressed and fixed. The object to be processed 50 is moved away after being described, thereby improving the compression and leveling effect, and leaving a space for reading the serial number of the object to be processed 50, or for identifying marks for direction identification.

Among them, since the electronic components on the object to be processed 50 are often arranged in an array, only one detection opening 23 can be positioned on the stage 20, and the stage 20 has two detection openings 23. The design enables the visual positioning device 70 to coordinate with the different configurations of the electronic components on the object to be processed 50 for positioning, thereby improving the positioning accuracy. In addition, the control device of the laser processing equipment then controls the lifting When the lifting driving member 12 of the mechanism 10 is activated, the lifting moving member 13 drives the stage 20 to move up and down, so that the position of the object to be processed 50 on the stage 20 can match the focal length position of the laser 60 , thereby improving the accuracy and quality of laser printing.

Furthermore, since the two pressure plate assemblies 30 are respectively located on the left and right sides of the working surface 21 of the stage 20 and can be pivoted and opened through the two driving mechanisms 40, they will not block the vacuum adsorption device from top to bottom. The object to be processed 50 is placed on the stage 20 , so the position of the two platen assemblies 30 does not need to be moved, and there is no need to install an additional moving mechanism for movement, which can effectively simplify the structure and reduce costs. , and the two driving mechanisms 40 and the two platen assemblies 30 are both installed on the stage 20, so the overall volume can be reduced, and the laser processing equipment can achieve a compact configuration design.

In addition, since the two pressure plate assemblies 30 in the laser processing platform for leveling the object to be processed 50 are located on the left and right sides of the working surface 21 of the stage 20, and press the left and right sides to press the left and right sides. The object to be processed 50 is flat, and the two ends of the platform 20 are not provided with a flattening structure and leave space, so it can be used with the objects to be processed 50 of different lengths and sizes, and the pressing plate The design of the component 30 to press and flatten the object to be processed 50 by pivoting can also allow the thickness of the object to be processed 50 to vary within a certain range, making the laser processing platform suitable for the size of the object to be processed 50 The scope is wider, effectively improving the scope of application.

To sum up, the laser processing platform of the present invention can be installed in the laser processing equipment, and is electrically connected and controlled by the control device of the laser processing equipment, because the two platen components 30 are installed On the left and right sides of the stage 20, the object to be processed 50 is placed on the stage 20 without blocking the vacuum adsorption device, which can effectively simplify the structure of the laser processing equipment, and can The cost is reduced, and the lift mechanism 10 is used to move the stage 20 up and down so that the stage 20 matches the focal length position of the laser 60, thereby improving the laser printing accuracy.

10:Lifting mechanism 11: base 12: Lifting drive parts 13:Lifting moving parts 14:Guide slide rail 15: Lead screw 20: Carrier platform 21:Working surface 22: Vacuum suction part 221: Vacuum nozzle 23: Detection opening 24:Rotating shaft fixing piece 30: Pressure plate assembly 31: Pressure plate parts 311: Gap 32:Pivot 33: Pivot gear 40:Driving mechanism 41: Pivot drive 42:Driving parts 421:Driving rack 50: Materials to be processed 60:Laser 70:Visual positioning device

Figure 1: is a three-dimensional schematic diagram of a preferred embodiment of the laser processing platform of this invention. Figure 2 is a schematic three-dimensional view from another perspective of a preferred embodiment of the laser processing platform of this invention. Figure 3: Schematic diagram of the front view of the laser processing platform of this creation. Figure 4: A schematic side view of the laser processing platform of this creation. Figure 5: A top-down plan view of the laser processing platform of this creation. Figure 6: A schematic diagram of the partial section A-A in Figure 5. Figure 7: This is a partial side plan view of the driving mechanism of the laser processing platform of this invention. Figure 8: A top-down plan view of the work surface of the laser processing platform of this invention where the objects to be processed are placed. Figure 9: A partial cross-sectional side view of the work surface of the laser processing platform of this invention where the objects to be processed are placed.

10:Lifting mechanism

11: base

12: Lifting drive parts

13:Lifting moving parts

14:Guide slide rail

15: Lead screw

20: Carrier platform

21:Working surface

22: Vacuum suction part

221: Vacuum nozzle

23: Detection opening

24:Shaft fixing piece

30: Pressure plate assembly

31: Pressure plate parts

311: Gap

32:Pivot

33: Pivot gear

40:Driving mechanism

42:Driving parts

421:Driving rack

Claims (9)

A laser processing platform that can be electrically connected to a control device and can place an object to be processed. The laser processing platform includes: A lifting mechanism, which includes a base, a lifting driving member and a lifting moving member. The lifting driving member is provided on the base and is electrically connected to the control device. The lifting moving member is connected to the lifting driving member; A carrier is connected to the lifting and moving member and defines a working surface on which the object to be processed can be placed. The carrier has a vacuum suction part extending downward from the working surface. The suction part is electrically connected to the control device, and the stage is formed with at least one detection opening penetrating the upper and lower sides and the working surface; Two pressure plate assemblies, the two pressure plate assemblies are pivoted on the left and right sides of the working surface of the platform, and the two pressure plate assemblies are arranged oppositely; and Two driving mechanisms are respectively provided at both ends of the stage and are electrically connected to the control device respectively. Each driving mechanism is connected to the two pressure plate assemblies respectively. The two driving mechanisms can drive the pivot of the two pressure plate assemblies. Rotate so that the two pressing plate assemblies press the object to be processed on the working surface. The laser processing platform of claim 1, wherein the laser processing platform defines an X direction, each platen assembly includes a platen member and a pivot, and the pivots of the two platen assemblies are along the X direction respectively. The pivots are installed on the left and right sides of the working surface of the platform, and the pressure plate parts of each pressure plate assembly are connected to the corresponding pivot shafts. The laser processing platform of claim 1, wherein the vacuum suction part is located in the center of the working surface, and the stage includes two detection openings, and the two detection openings are respectively located on both sides of the vacuum suction part. . The laser processing platform of claim 2, wherein the vacuum suction part is located in the center of the working surface, and the stage includes two detection openings, and the two detection openings are respectively located on both sides of the vacuum suction part. . The laser processing platform as claimed in claim 4, wherein the vacuum suction part of the stage has a plurality of vacuum suction nozzles, and the plurality of vacuum suction nozzles are arranged at intervals along the X direction. The laser processing platform as described in claim 2, 4 or 5, wherein the pressure plate members of each pressure plate assembly are formed with a plurality of notches at intervals. The laser processing platform according to any one of claims 1 to 5, wherein each driving mechanism includes a pivot driving member and a driving member, and the pivot driving member is disposed on the stage and connected to the driving member. , both ends of the driving member can be connected to the two pressure plate assemblies respectively, and the pivot driving member of each driving mechanism is electrically connected to the control device respectively, and can drive the driving member to move to drive the two pressure plate assemblies to pivot. The laser processing platform as described in claim 6, wherein each driving mechanism includes a pivot driving member and a driving member. The pivot driving member is disposed on the stage and connected to the driving member. The two driving members are The ends can be connected to the two pressure plate assemblies respectively, and the pivot driving part of each driving mechanism is electrically connected to the control device respectively, and can drive the driving part to move to drive the two pressure plate assemblies to pivot. The laser processing platform of claim 8, wherein each pressure plate assembly includes two pivot gears, and the two pivot gears are respectively disposed at both ends of the pivot shaft of the pressure plate assembly, and the driving member of each driving mechanism Each end of the driving member has a driving rack, and each driving rack of the driving member corresponds to and meshes with the pivot gear at one end of the pivot shaft of each pressure plate assembly.

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